EP0546137B1 - Electrically insulating elements for plasma display panels and a method for producing same - Google Patents

Electrically insulating elements for plasma display panels and a method for producing same Download PDF

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Publication number
EP0546137B1
EP0546137B1 EP92912967A EP92912967A EP0546137B1 EP 0546137 B1 EP0546137 B1 EP 0546137B1 EP 92912967 A EP92912967 A EP 92912967A EP 92912967 A EP92912967 A EP 92912967A EP 0546137 B1 EP0546137 B1 EP 0546137B1
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organic compound
display according
anyone
electrodes
temperature
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German (de)
French (fr)
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EP0546137A1 (en
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Guy Baret
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Thales Electron Devices SA
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Thomson Tubes Electroniques
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J11/00Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
    • H01J11/10AC-PDPs with at least one main electrode being out of contact with the plasma
    • H01J11/12AC-PDPs with at least one main electrode being out of contact with the plasma with main electrodes provided on both sides of the discharge space
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J11/00Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
    • H01J11/20Constructional details
    • H01J11/34Vessels, containers or parts thereof, e.g. substrates
    • H01J11/38Dielectric or insulating layers

Definitions

  • the invention relates to display screens of the plasma panel type, and more particularly to the electrically insulating elements used in these devices.
  • Plasma panels are flat display screens that operate on the principle of luminescent discharges in a gas. They include two insulating tiles, joined together so as to define a calibrated space between them. This space is formed in a sealed manner at the periphery of the slabs in order to form a gas space.
  • the electrical discharges in the gas are obtained using electrodes to which electrical voltages are applied.
  • the electrodes can be distributed on either side of the gas space: in this case most often an array of electrodes is carried by a slab and at least one other array of electrodes is carried by the other slab.
  • the two networks are orthogonal to each other, and an elementary cell or pixel is defined at each intersection of electrodes.
  • the electrodes can also be arranged on the same side with respect to the gas space, that is to say be carried by the same slab.
  • the alternative panels have the advantage of presenting a memory effect which makes it possible to address the useful information only to the pixels whose state one wishes to change (on or off) on the other pixels, the state of the latter is simply maintained by repetition of alternating electrical discharges, called maintenance discharges.
  • This memory effect is obtained by electrically isolating the electrodes from the discharge gas, by covering with a dielectric layer on which accumulate the charged particles generated by the discharge in the gas.
  • the article in IBM Technical Disclosure Bulletin Volume 24 No 1B of June 1981 gives the structure of plasma panels of the alternative type.
  • the electrodes are covered with a dielectric layer, in particular in alumina or magnesia, which is itself protected against ion bombardment by a second layer, for example in magnesia.
  • Such discharge barriers can also be used in "PAPs” whose cells or pixels are formed at the crossing of only two electrodes, and their presence is practically essential in “PAPs” of the “continuous” type.
  • the discharge barriers can be constituted by pieces forming shims, called spacers, which define the height of the gas space.
  • FIG. 1 shows a plasma panel of the type with two crossed electrodes to define a cell or pixel.
  • the figure is a sectional view parallel to one of these two electrodes.
  • the panel 1 comprises two tiles 2, 3 each carrying an array of electrodes.
  • the slabs 2, 3 constitute substrates, they commonly have a thickness E1 of the order of 1 to 6 mm.
  • the first panel 2 carries a first network of electrodes Y1 to Yn parallel.
  • the second panel 3 carries a second array of parallel electrodes represented by an electrode X (shown parallel to the plane of the figure) orthogonal to the electrodes Y1 to Yn.
  • the electrodes Y1 to Yn are covered with a dielectric layer 4, the thickness E2 of which is commonly of the order of 20 to 30 micrometers.
  • the dielectric layer 4 is covered by a protective layer 5 often made of Mg0, the thickness of which is very small, of the order of 0.2 micrometers.
  • the electrodes X of the second network are covered by a second dielectric layer 6 having substantially the same thickness E2 as the first.
  • This second dielectric layer is itself covered with a second protective layer 7 similar to the first 5.
  • ends 8 of the electrode X, not covered by the dielectric layer 6, constitute sockets contact.
  • the two tiles 2, 3 are intended to be assembled so as to provide between them a space 10 which must contain a gas, neon for example, at a pressure of for example 500 mb.
  • the panel 1 has sealing joints 11 arranged at the periphery of one of the slabs, the second slab 3 for example.
  • the height H1 of the gas space 10 is defined using spacers 12 called spacers, arranged at the periphery of a slab, of the first slab 2 for example.
  • the spacers 12 are produced on the first dielectric layer 4, and in the bringing together of the two slabs 2, 3, these spacers must come into abutment on the second protective layer 7 these conditions are taken into account to define the height H2 of these spacers 12 in order to give the gas space the desired height H1, height H1 (of the gas space) which is commonly of the order of 100 micrometers.
  • the sealing joints 11 generally consist of a glass with a low melting point (between 380 ° C. and 450 ° C.). They have a height H3 such that, taking into account the surface on which they are arranged (surface of the second dielectric layer in the example), it is necessary to crush them to bring the spacers 12 into abutment on the second slab 3 , so as to thus seal the gas space 10.
  • the quality of operation of the "PAP" can be degraded if the height H1 of the gas space shows too great variations.
  • central spacers 15 it is also possible to use such central spacers 15 to further perform a separation barrier function between the discharges of contiguous pixels.
  • Each pixel being defined in the area of intersection of electrodes X and Y, it is known to produce such central spacers 15, with a parallelepiped shape for example and to arrange them so as to surround each pixel.
  • the separators or barriers 12, 15 are generally made of mineral glass: walls of mineral glass are formed in several intermediate layers by successive screen printing. These successive serigraphs are followed by a final baking to densify and harden the material.
  • the layers produced by successive screen prints are difficult to superimpose with precision: thus for a layer whose width is for example 50 micrometers, it it is not uncommon for it to overflow 10 micrometers from the previous layer, so that finally these partitions or barriers have variable widths, the dimensions of which are difficult to control. This further results in a degradation of the operation of the plasma panel.
  • the temperature can reach, for example, 530 ° C. to 600 ° C. This may result in degradation of the glass which forms the slabs 2, 3 and / or degradation of the conductive deposits which form the electrodes. For example, the glass softens and loses its flatness if it does not rest on a perfectly flat support.
  • Another method for making spacers (which in this case does not additionally fulfill the discharge barrier function) consists in depositing a dense network of calibrated glass beads, regularly arranged between the electrodes.
  • the precision on the diameter of the balls is insufficient to obtain that the greatest number of balls are in contact at the same time with the two slabs or substrates.
  • the general structure shown in the figure is the same, the difference being that in this case the dielectric layers 4, 6 and the protective layers 5, 7 do not exist, so that the electrodes X, Y1 to Yn are in contact with the gas contained in the gas space 10.
  • the glass begins to react with the conductive or dielectric layers deposited on its surface, and in particular with the materials constituting the electrodes.
  • this vitreous dielectric offers the advantage of very good mechanical and chemical stability, during the subsequent step of sealing the plasma panel, which step requires temperatures of at least 400 ° C.
  • the invention proposes to produce these elements from materials whose implementation work does not require exposing the entire plasma panel to a temperature much higher than that required in the sealing step.
  • the invention proposes to produce at least one dielectric layer disposed between the gas space and electrodes in a polymerizable organic compound, and thermostable for temperatures equal to or lower than the sealing temperature of the plasma panel in which it went up.
  • the resulting advantage is that the highest temperature imposed on the plasma panel is that necessary to effect the sealing.
  • Spacers and / or discharge barriers can also be produced in a polymerizable organic compound and this compound can be photosensitive, which makes it possible to engrave it in a simple manner by conventional photolithography processes, and to obtain any type of pattern with a excellent resolution and uniform thickness.
  • the invention therefore relates to a plasma panel as defined in claim 1.
  • the invention further relates to a method for producing such electrically insulating elements.
  • the plasma panel 1 comprises two panels 2, 3 each carrying an array of electrodes X, Y1 to Yn, so that these electrodes are arranged on either side of the gas space 10 formed between the slabs 2, 3.
  • at least one dielectric layer 4, 6 is required interposed between each network of electrodes and the gas space 10, ie at least two dielectric layers.
  • the invention proposes to produce them with a thermostable polymerizable organic compound.
  • the basic organic compound can be a solution in a suitable solvent (xylene or metacresol for example) of a dianhydride and a diamine (the formulas of which are given below) for obtaining a polyimide: diamine: NH2 - AR2 - NH2 where AR1 and AR2 are aromatic chains.
  • a suitable solvent xylene or metacresol for example
  • diamine the formulas of which are given below
  • the organic compound can be deposited by the usual methods of depositing so-called “thick" layers, for example the following methods: spinner, spray (projection), soaking, roller or screen printing; conventionally in itself, the viscosity of the product can be adapted to the method used by varying the fraction of polymer in the solvent.
  • the final polymerization temperature should preferably be greater than or equal to the temperature of the panel sealing step. For example, a layer of final thickness of approximately 5 micrometers of polyphenylquinoxaline polymerized at 410 ° C for 10 minutes, will no longer evolve chemically and mechanically during a sealing step at 400 ° C.
  • the step of sealing a PAP is the step in which the two slabs 2, 3 are brought together, to obtain the desired height H1 of the gas space 10, and in which deforms the sealing joints 11 to make the seal.
  • organic compound can be loaded with mineral and / or metallic compounds, for example in order to modify the dielectric constant and / or to modify the color thereof.
  • the relative dielectric constant Er of the organic compounds used can be between 2 and 4 for the pure compound (for example a polyimide) and it can be increased to reach values greater than 10.
  • the thicknesses can vary from less than 1 micrometer to several tens of micrometers, depending on the dielectric capacity desired by the layer.
  • the possible color of the final deposit can also be adjusted by adding an organic dye or a mineral compound. Black or white deposits can also be obtained in this way.
  • thermostable organic compound as defined above, can be polymerized at relatively low temperatures, so as not to cause deformation of the substrate. glass or slab 2, 3, nor degrade the other layers deposited on this substrate. In particular, the organic compound does not react with the electrode material (ITO, metal, etc.).
  • the organic compound allows a homogeneous covering of the electrodes and therefore supports high electric fields without showing any phenomenon of electrical breakdown.
  • the invention applies as well to the case where the dielectric layers are produced along continuous surfaces as in the case of discontinuous surfaces.
  • a polymerizable organic compound similar to that indicated above for the dielectric layers, can constitute the basic material for the production of the spacers and barriers 12, 15.
  • the organic compound can be loaded with mineral and / or metallic compounds, in order to vary the viscosity and / or the color and / or the resistance to crushing after polymerization.
  • the organic compound can be spread on the substrate or slab 2, 3 by usual methods similar to those mentioned above for the dielectric layers (spin, spray, screen printing, etc.).
  • Photosensitive organic compounds are commercially available.
  • the exposure and photogravure phase occurs after the last deposit has dried, and before polymerization or following partial polymerization of the organic compound.
  • the polymerization of the organic compound is obtained by exposing it to a heat treatment and / or by exposure to ultraviolet rays, in a manner in itself conventional.
  • the photo-imageable nature of the organic compound makes it possible to impart, simply and securely, to the spacers and barriers 12, 15, the desired dimensions as well as the desired positions in particular relative to the electrodes X, Y1 to Yn.
  • This characteristic is particularly advantageous in the case of barriers 15 whose width L, relative to the pitch P of the cells, must remain relatively small, and whose position between the cells is also important.
  • spacers or barriers 12, 15 thus produced are thermostable and do not tend to creep: it is therefore possible to obtain ratios of height H2 to width L (H1 / L) greater than 1, for heights H2 greater than 200 micrometers .
  • the invention can be applied to the production of any electrically insulating element carried by a PAP slab, whether the latter is of the continuous or alternative type, monochrome or polychrome, whatever the distribution of the electrodes relative to the gas space. , and regardless of the number of electrodes used to define a cell.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Gas-Filled Discharge Tubes (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

Plasma display panel type screens, and in particular electrically insulating elements such as spacers (12, 15) and/or dielectric layers (4,6) made of a polymerizable organic compound, are provided and enable the highest temperature to which the plasma display panels are subjected during manufacture to be lower than the sealing temperature of said panels.

Description

L'invention concerne les écrans de visualisation du type panneaux à plasma, et plus particulièrement des éléments électriquement isolants utilisés dans ces dispositifs.The invention relates to display screens of the plasma panel type, and more particularly to the electrically insulating elements used in these devices.

Les panneaux à plasma (ou en abrégé "PAP") sont des écrans plats de visualisation qui fonctionnent suivant le principe des décharges luminescentes dans un gaz. Ils comprennent deux dalles isolantes, assemblées l'une à l'autre de manière à définir entre elles un espace calibré. Cet espace est formé de façon étanche à la périphérie des dalles afin de former un espace gazeux.Plasma panels (or abbreviated as "PAP") are flat display screens that operate on the principle of luminescent discharges in a gas. They include two insulating tiles, joined together so as to define a calibrated space between them. This space is formed in a sealed manner at the periphery of the slabs in order to form a gas space.

Les décharges électriques dans le gaz sont obtenues à l'aide d'électrodes auxquelles sont appliqués des tensions électriques. Les électrodes peuvent être distribuées de part et d'autre de l'espace gazeux : dans ce cas le plus souvent un réseau d'électrodes est portée par une dalle et au moins un autre réseau d'électrodes est portée par l'autre dalle. Les deux réseaux sont orthogonaux l'un par rapport à l'autre, et une cellule élémentaire ou pixel est définie à chaque croisement d'électrodes. Mais les électrodes peuvent aussi être disposées d'un même côté par rapport à l'espace gazeux, c'est-à-dire être portées par une même dalle.The electrical discharges in the gas are obtained using electrodes to which electrical voltages are applied. The electrodes can be distributed on either side of the gas space: in this case most often an array of electrodes is carried by a slab and at least one other array of electrodes is carried by the other slab. The two networks are orthogonal to each other, and an elementary cell or pixel is defined at each intersection of electrodes. However, the electrodes can also be arranged on the same side with respect to the gas space, that is to say be carried by the same slab.

Il existe différents types de panneaux à plasma, notamment les panneaux du type fonctionnant en tension continue et les panneaux dits "alternatifs". Les panneaux alternatifs ont l'avantage de présenter un effet de mémoire qui permet d'adresser l'information utile seulement aux pixels dont on souhaite changer l'état (allumé ou éteint) sur les autres pixels, l'état de ces derniers est simplement entretenu par répétition de décharges électriques alternées, appelées décharges d'entretien. Cet effet de mémoire est obtenu en isolant électriquement les électrodes du gaz de décharge, en les recouvrant d'une couche diélectrique sur laquelle s'accumulent les particules chargées engendrées par la décharge dans le gaz.There are different types of plasma panels, in particular panels of the type operating with direct voltage and so-called "alternative" panels. The alternative panels have the advantage of presenting a memory effect which makes it possible to address the useful information only to the pixels whose state one wishes to change (on or off) on the other pixels, the state of the latter is simply maintained by repetition of alternating electrical discharges, called maintenance discharges. This memory effect is obtained by electrically isolating the electrodes from the discharge gas, by covering with a dielectric layer on which accumulate the charged particles generated by the discharge in the gas.

L'article d'IBM Technical Disclosure Bulletin Volume 24 No 1B de juin 1981 donne la structure de panneaux à plasma de type alternatif. Les électrodes sont recouvertes d'une couche diélectrique notamment en alumine ou magnésie, elle-même protégée contre le bombardement ionique par une seconde couche par exemple en magnésie.The article in IBM Technical Disclosure Bulletin Volume 24 No 1B of June 1981 gives the structure of plasma panels of the alternative type. The electrodes are covered with a dielectric layer, in particular in alumina or magnesia, which is itself protected against ion bombardment by a second layer, for example in magnesia.

On trouve une explication du fonctionnement d'un panneau de type alternatif dans un article de G.W.DICK publié dans PROCEEDING OF THE SID, volume 27/3 1986, pages 183-187. La structure décrite dans ce document se rapporte plus particulièrement à une structure du type à entretien coplanaire. Dans ce type de panneau on utilise trois électrodes pour définir un pixel: deux électrodes parallèles et coplanaires réalisent les décharges d'entretien dans chaque pixel; les électrodes coplanaires sont croisées avec des électrodes dites d'adressage, dont la fonction généralement est uniquement de réaliser l'adressage en coopération avec l'une des électrodes coplanaires. Il est à noter que le document ci-dessus cité mentionne en outre l'utilisation de barrières de décharges dont la fonction est de séparer les décharges produites dans des cellules contiguës.An explanation of how an alternative type panel works can be found in an article by G.W.DICK published in PROCEEDING OF THE SID, volume 27/3 1986, pages 183-187. The structure described in this document relates more particularly to a structure of the coplanar maintenance type. In this type of panel, three electrodes are used to define a pixel: two parallel and coplanar electrodes carry out the maintenance discharges in each pixel; the coplanar electrodes are crossed with so-called addressing electrodes, the function of which is generally only to carry out the addressing in cooperation with one of the coplanar electrodes. It should be noted that the above-mentioned document also mentions the use of discharge barriers, the function of which is to separate the discharges produced in contiguous cells.

De telles barrières de décharge peuvent être utilisées aussi dans les "PAP" dont les cellules ou pixels sont formées au croisement de seulement deux électrodes, et leur présence est pratiquement indispensable dans les "PAP" du type "continu".Such discharge barriers can also be used in "PAPs" whose cells or pixels are formed at the crossing of only two electrodes, and their presence is practically essential in "PAPs" of the "continuous" type.

Quel que soit le type de "PAP", les barrières de décharges peuvent être constituées par des pièces formant cales d'épaisseur, appelées espaceurs, qui définissent la hauteur de l'espace gazeux.Whatever the type of "PAP", the discharge barriers can be constituted by pieces forming shims, called spacers, which define the height of the gas space.

La fonction de tels espaceurs est illustrée par la figure qui montre un panneau à plasma du type à deux électrodes croisées pour définir une cellule ou pixel. La figure est une vue en coupe parallèle à l'une de ces deux électrodes.The function of such spacers is illustrated by the figure which shows a plasma panel of the type with two crossed electrodes to define a cell or pixel. The figure is a sectional view parallel to one of these two electrodes.

Le panneau 1 comprend deux dalles 2, 3 portant chacune un réseau d'électrodes. Les dalles 2, 3 constituent des substrats, elles ont couramment une épaisseur E1 de l'ordre de 1 à 6 mm.The panel 1 comprises two tiles 2, 3 each carrying an array of electrodes. The slabs 2, 3 constitute substrates, they commonly have a thickness E1 of the order of 1 to 6 mm.

La première dalle 2 porte un premier réseau d'électrodes Y1 à Yn parallèles. La seconde dalle 3 porte un second réseau d'électrodes parallèles représenté par une électrode X (représentée parallèle au plan de la figure) orthogonale aux électrodes Y1 à Yn.The first panel 2 carries a first network of electrodes Y1 to Yn parallel. The second panel 3 carries a second array of parallel electrodes represented by an electrode X (shown parallel to the plane of the figure) orthogonal to the electrodes Y1 to Yn.

Sur la première dalle 2, les électrodes Y1 à Yn (vues suivant leur section) sont recouvertes d'une couche diélectrique 4, dont l'épaisseur E2 est couramment de l'ordre de 20 à 30 micromètres.On the first plate 2, the electrodes Y1 to Yn (seen according to their section) are covered with a dielectric layer 4, the thickness E2 of which is commonly of the order of 20 to 30 micrometers.

La couche diélectrique 4 est couverte par une couche de protection 5 souvent en Mg0 dont l'épaisseur est très faible, de l'ordre 0,2 micromètre.The dielectric layer 4 is covered by a protective layer 5 often made of Mg0, the thickness of which is very small, of the order of 0.2 micrometers.

Sur la seconde dalle 3, les électrodes X du second réseau sont couvertes par une seconde couche diélectrique 6 ayant sensiblement une même épaisseur E2 que la première. Cette seconde couche diélectrique est elle-même couverte d'une seconde couche de protection 7 semblable à la première 5. Sur la seconde dalle 3, des extrémités 8 de l'électrode X, non couvertes par la couche diélectrique 6, constituent des prises de contact.On the second panel 3, the electrodes X of the second network are covered by a second dielectric layer 6 having substantially the same thickness E2 as the first. This second dielectric layer is itself covered with a second protective layer 7 similar to the first 5. On the second slab 3, ends 8 of the electrode X, not covered by the dielectric layer 6, constitute sockets contact.

Les deux dalles 2, 3 sont destinées à être assemblées de manière à ménager entre elles un espace 10 devant contenir un gaz, du néon par exemple, à une pression de par exemple 500 mb.The two tiles 2, 3 are intended to be assembled so as to provide between them a space 10 which must contain a gas, neon for example, at a pressure of for example 500 mb.

A cet effet le panneau 1 comporte des joints de scellement 11 disposés à la périphérie de l'une des dalles, la seconde dalle 3 par exemple. La hauteur H1 de l'espace gazeux 10 est définie à l'aide d'entretoises 12 appelées espaceurs, disposés à la périphérie d'une dalle, de la première dalle 2 par exemple. Dans l'exemple représenté, les espaceurs 12 sont réalisés sur la première couche diélectrique 4, et dans le rapprochement l'une de l'autre des deux dalles 2, 3, ces espaceurs doivent venir en butée sur la seconde couche de protection 7 ces conditions sont prises en compte pour définir la hauteur H2 de ces espaceurs 12 en vue de conférer à l'espace gazeux la hauteur H1 désirée, hauteur H1 (de l'espace gazeux) qui est couramment de l'ordre de 100 micromètres.To this end, the panel 1 has sealing joints 11 arranged at the periphery of one of the slabs, the second slab 3 for example. The height H1 of the gas space 10 is defined using spacers 12 called spacers, arranged at the periphery of a slab, of the first slab 2 for example. In the example shown, the spacers 12 are produced on the first dielectric layer 4, and in the bringing together of the two slabs 2, 3, these spacers must come into abutment on the second protective layer 7 these conditions are taken into account to define the height H2 of these spacers 12 in order to give the gas space the desired height H1, height H1 (of the gas space) which is commonly of the order of 100 micrometers.

Les joints de scellement 11 sont constitués généralement en un verre à bas point de fusion (entre 380°C et 450°C). Ils comportent une hauteur H3 telle que, en tenant compte de la surface sur laquelle elles sont disposées (surface de la seconde couche diélectrique dans l'exemple), il soit nécessaire de les écraser pour amener les espaceurs 12 en butée sur la seconde dalle 3, de manière à assurer ainsi l'étanchéité de l'espace gazeux 10.The sealing joints 11 generally consist of a glass with a low melting point (between 380 ° C. and 450 ° C.). They have a height H3 such that, taking into account the surface on which they are arranged (surface of the second dielectric layer in the example), it is necessary to crush them to bring the spacers 12 into abutment on the second slab 3 , so as to thus seal the gas space 10.

La qualité du fonctionnement du "PAP" peut être dégradée si la hauteur H1 de l'espace gazeux accuse des variations trop importante. Pour éviter ce défaut il est connu de disposer, entre les espaceurs ou séparateurs périphériques 12 et jusque dans des positions centrales, de secondes entretoises 15 ou espaceurs centraux ayant une même épaisseur H2 que les premiers espaceurs 12 périphériques.The quality of operation of the "PAP" can be degraded if the height H1 of the gas space shows too great variations. To avoid this defect, it is known to have, between the peripheral spacers or separators 12 and even in central positions, second spacers 15 or central spacers having the same thickness H2 as the first peripheral spacers 12.

On peut utiliser aussi de tels espaceurs centraux 15 pour réaliser en outre, une fonction de barrière de séparation entre les décharges de pixels contigus.It is also possible to use such central spacers 15 to further perform a separation barrier function between the discharges of contiguous pixels.

Chaque pixel étant défini dans la zone d'intersection d'électrodes X et Y, il est connu de réaliser de tels espaceurs centraux 15, avec une forme parallépipédique par exemple et de les disposer de manière à entourer chaque pixel.Each pixel being defined in the area of intersection of electrodes X and Y, it is known to produce such central spacers 15, with a parallelepiped shape for example and to arrange them so as to surround each pixel.

Ces séparateurs remplissent alors à la fois une fonction d'espaceur et une fonction de barrière de séparation des décharges.These separators then fulfill both a spacer function and a discharge separation barrier function.

Cette technique est couramment utilisée, bien qu'elle présente l'inconvénient d'exiger une mise en oeuvre longue et délicate. En effet, les séparateurs ou barrières 12, 15 sont généralement réalisés en verre minéral : des murs de verre minéral sont formés en plusieurs couches intermédiaires par sérigraphies successives. Ces sérigraphies successives sont suivies d'une cuisson finale pour densifier et durcir le matériau. Les couches réalisées par sérigraphies successives sont difficiles à superposer avec précision : ainsi pour une couche dont la largeur est par exemple de 50 micromètres, il n'est pas rare qu'elle déborde de 10 micromètres de la couche précédente, de telle sorte que pour finir ces cloisons ou barrières ont des largeurs variables, dont les dimensions sont difficiles à maîtriser. Il en résulte en outre une dégradation du fonctionnement du panneau à plasma.This technique is commonly used, although it has the drawback of requiring a long and delicate implementation. Indeed, the separators or barriers 12, 15 are generally made of mineral glass: walls of mineral glass are formed in several intermediate layers by successive screen printing. These successive serigraphs are followed by a final baking to densify and harden the material. The layers produced by successive screen prints are difficult to superimpose with precision: thus for a layer whose width is for example 50 micrometers, it it is not uncommon for it to overflow 10 micrometers from the previous layer, so that finally these partitions or barriers have variable widths, the dimensions of which are difficult to control. This further results in a degradation of the operation of the plasma panel.

Un autre inconvénient de cette technique est, que lors de la cuisson finale des couches formant ces espaceurs ou barrières, la température peut atteindre par exemple 530°C à 600°C. Il peut en résulter une dégradation du verre qui forme les dalles 2, 3 et/ou une dégradation des dépôts conducteurs qui forment les électrodes. Par exemple, le verre se ramollit et perd sa planéité s'il ne repose pas sur un support lui-même parfaitement plan.Another drawback of this technique is that during the final firing of the layers forming these spacers or barriers, the temperature can reach, for example, 530 ° C. to 600 ° C. This may result in degradation of the glass which forms the slabs 2, 3 and / or degradation of the conductive deposits which form the electrodes. For example, the glass softens and loses its flatness if it does not rest on a perfectly flat support.

Une autre méthode pour réaliser des espaceurs, (qui dans ce cas ne remplissent pas en plus la fonction de barrière de décharge) consiste à déposer un réseau dense de billes de verre calibrées, régulièrement disposées entre les électrodes. Mais la précision sur le diamètre des billes est insuffisante pour obtenir que le plus grand nombre des billes soient en contact à la fois avec les deux dalles ou substrats.Another method for making spacers (which in this case does not additionally fulfill the discharge barrier function) consists in depositing a dense network of calibrated glass beads, regularly arranged between the electrodes. However, the precision on the diameter of the balls is insufficient to obtain that the greatest number of balls are in contact at the same time with the two slabs or substrates.

Pour les panneaux à plasma du type fonctionnant en courant continu, la structure générale montrée à la figure est la même, la différence étant que dans ce cas les couches diélectriques 4, 6 et les couches de protection 5, 7 n'existent pas, de sorte que les électrodes X, Y1 à Yn sont en contact avec le gaz contenu dans l'espace gazeux 10.For plasma panels of the direct current type, the general structure shown in the figure is the same, the difference being that in this case the dielectric layers 4, 6 and the protective layers 5, 7 do not exist, so that the electrodes X, Y1 to Yn are in contact with the gas contained in the gas space 10.

Dans les "PAP" du type "alternatif", la réalisation des couches diélectriques posent également des problèmes. En effet, à ce jour toutes les couches diélectriques de "PAP" type "alternatif" sont en verre minéral à bas point de fusion (530°C à 600°C), par exemple des verres d'oxyde de plomb. Ces diélectriques en verres peuvent être transparents, blancs, noirs ou colorés et présentent des constantes diélectriques relatives Er compatibles avec le fonctionnement des panneaux alternatifs (Er typiquement compris entre 10 et 30). Les couches diélectriques sont constituées de la manière suivante :

  • une poudre de verre finement broyée est mélangée à un solvant ou à une huile se décomposant à des température supérieures à 400°C ;
  • le mélange est ensuite déposé par sérigraphie, ou au trempé ou par "spray" (projection), puis séché sur le substrat ou dalle de verre et les électrodes
  • la dalle de verre est ensuite chauffée à des température supérieures à 530°C, et le mélange réagit pour former une couche vitreuse dont l'épaisseur généralement est comprise entre 20 micromètres et 30 micromètres.
In "alternative" type "PAPs", the production of dielectric layers also poses problems. Indeed, to date all the dielectric layers of "PAP" type "alternative" are mineral glass with low melting point (530 ° C to 600 ° C), for example lead oxide glasses. These glass dielectrics can be transparent, white, black or colored and have relative dielectric constants Er compatible with the operation of the alternative panels. (Er typically between 10 and 30). The dielectric layers are made up as follows:
  • finely ground glass powder is mixed with a solvent or an oil which decomposes at temperatures above 400 ° C;
  • the mixture is then deposited by screen printing, or by dipping or by "spray" (projection), then dried on the substrate or glass slab and the electrodes
  • the glass slab is then heated to temperatures above 530 ° C, and the mixture reacts to form a vitreous layer whose thickness is generally between 20 micrometers and 30 micrometers.

Lors de ce dernier traitement, un inconvénient réside dans le fait que la dalle de verre doit reposer sur une dalle rectifiée, en céramique par exemple, pour ne pas se déformer du fait que la température de transition vitreuse du verre formant le substrat ou dalle est voisine de 510°C - 520°C.During this latter treatment, a drawback lies in the fact that the glass slab must rest on a rectified slab, made of ceramic for example, so as not to be deformed because the glass transition temperature of the glass forming the substrate or slab is around 510 ° C - 520 ° C.

De plus, à ces températures, le verre commence à réagir avec les couches conductrices ou diélectriques déposées sur sa surface, et en particulier avec les matériaux constituant les électrodes.In addition, at these temperatures, the glass begins to react with the conductive or dielectric layers deposited on its surface, and in particular with the materials constituting the electrodes.

En revanche, ce diélectrique vitreux offre l'avantage d'une très bonne stabilité mécanique et chimique, lors de l'étape ultérieure de scellement du panneau à plasma, laquelle étape nécessite des températures d'au moins 400°C.On the other hand, this vitreous dielectric offers the advantage of very good mechanical and chemical stability, during the subsequent step of sealing the plasma panel, which step requires temperatures of at least 400 ° C.

On connait aussi par la demande de brevet internationale WO 90/00808 un panneau de visualisation plat à émission de champ qui comporte entre les deux dalles des espaceurs en polyimide.Also known from international patent application WO 90/00808 is a flat field emission display panel which comprises between the two panels polyimide spacers.

En vue de répondre aux différents problèmes ci-dessus cités, posés par les éléments électriquement isolants tels que couches diélectriques et espaceurs et/ou barrières de décharge pour panneaux à plasma, l'invention propose de réaliser ces éléments en des matériaux dont la mise en oeuvre n'exige pas d'exposer l'ensemble du panneau à plasma à une température très supérieure à celle qui est nécessaire dans l'étape de scellement.In order to respond to the various problems mentioned above, posed by the electrically insulating elements such as dielectric layers and spacers and / or discharge barriers for plasma panels, the invention proposes to produce these elements from materials whose implementation work does not require exposing the entire plasma panel to a temperature much higher than that required in the sealing step.

A cette fin, l'invention propose de réaliser au moins une couche diélectrique disposée entre l'espace gazeux et des électrodes en un composé organique polymérisable, et thermostable pour des températures égales ou inférieures à la température de scellement du panneau à plasma dans lequel elle est montée.To this end, the invention proposes to produce at least one dielectric layer disposed between the gas space and electrodes in a polymerizable organic compound, and thermostable for temperatures equal to or lower than the sealing temperature of the plasma panel in which it went up.

L'avantage qui en résulte est que la température la plus élevée imposée au panneau à plasma est celle nécessaire à réaliser le scellement.The resulting advantage is that the highest temperature imposed on the plasma panel is that necessary to effect the sealing.

Des espaceurs et/ou barrières de décharge peuvent aussi être réalisés dans un composé organique polymérisable et ce composé peut être photosensible, ce qui permet de le graver de manière simple par des procédés classiques de photolithogravure, et d'obtenir tout type de motif avec une excellente résolution et une épaisseur uniforme.Spacers and / or discharge barriers can also be produced in a polymerizable organic compound and this compound can be photosensitive, which makes it possible to engrave it in a simple manner by conventional photolithography processes, and to obtain any type of pattern with a excellent resolution and uniform thickness.

L'invention concerne donc un panneau à plasma tel que défini dans la revendication 1.The invention therefore relates to a plasma panel as defined in claim 1.

L'invention concerne en outre un procédé pour la réalisation de tels éléments électriquement isolants.The invention further relates to a method for producing such electrically insulating elements.

L'invention sera mieux comprise, et les avantages qu'elle procure apparaîtront mieux à la lecture de la description qui suit, faite à titre d'exemple non limitatif en référence à l'unique figure annexée.The invention will be better understood, and the advantages which it provides will appear more clearly on reading the description which follows, given by way of nonlimiting example with reference to the single appended figure.

La figure annexée, déjà partiellement décrite, montre schématiquement un panneau à plasma auquel peut s'appliquer l'invention.The appended figure, already partially described, schematically shows a plasma panel to which the invention can be applied.

Dans l'exemple représenté à la figure, le panneau à plasma 1 comprend deux dalles 2, 3 portant chacune un réseau d'électrodes X, Y1 à Yn, de telle sorte que ces électrodes sont disposées de part et d'autre de l'espace gazeux 10 formé entre les dalles 2, 3. Dans ce cas, pour un panneau "alternatif", il faut au moins une couche diélectrique 4, 6 interposée entre chaque réseau d'électrodes et l'espace gazeux 10, soit au moins deux couches diélectriques.In the example shown in the figure, the plasma panel 1 comprises two panels 2, 3 each carrying an array of electrodes X, Y1 to Yn, so that these electrodes are arranged on either side of the gas space 10 formed between the slabs 2, 3. In this case, for an "alternative" panel, at least one dielectric layer 4, 6 is required interposed between each network of electrodes and the gas space 10, ie at least two dielectric layers.

Mais il est d'autres formes de réalisation classiques (non représentées), dans lesquelles par exemple toutes les électrodes sont disposées d'un même côté de l'espace gazeux 10, c'est-à-dire portées par la même dalle ; cette dernière est dans ce cas généralement la dalle dite "dalle arrière", c'est-à-dire celle qui est à l'opposé d'un observateur et qui généralement comporte le queusot (non représenté) qui permet d'établir dans le panneau la pression désirée (après l'étape de scellement).But there are other conventional embodiments (not shown), in which for example all of the electrodes are arranged on the same side of the gas space 10, that is to say carried by the same slab; the latter is in this case generally the so-called "rear slab", that is to say that which is opposite to an observer and which generally comprises the queusot (not shown) which makes it possible to establish in the panel the desired pressure (after the sealing step).

Quelle que soit la forme de réalisation, et le nombre des couches diélectriques telles que les couches 4, 6, l'invention propose de les réaliser on un composé organique polymérisable thermostable.Whatever the embodiment, and the number of dielectric layers such as layers 4, 6, the invention proposes to produce them with a thermostable polymerizable organic compound.

Ainsi par exemple, le composé organique de base peut être une solution dans un solvant approprié (xylène ou métacrésol par exemple) d'un dianhydride et d'un diamine (dont les formules sont données ci-après) pour l'obtention d'un polyimide :

Figure imgb0001

   diamine : NH₂ - AR₂ - NH₂
Figure imgb0002

   où AR₁ et AR₂ sont des chaines aromatiques.Thus, for example, the basic organic compound can be a solution in a suitable solvent (xylene or metacresol for example) of a dianhydride and a diamine (the formulas of which are given below) for obtaining a polyimide:
Figure imgb0001

diamine: NH₂ - AR₂ - NH₂
Figure imgb0002

where AR₁ and AR₂ are aromatic chains.

Le composé organique peut être déposé par des méthodes usuelles de dépôt des couches dites "épaisses", par exemple les méthodes suivantes : tournette, spray (projection), trempé, rouleau ou sérigraphie ; de façon en elle-même classique, la viscosité du produit peut être adaptée à la méthode utilisée en variant la fraction de polymère dans le solvant.The organic compound can be deposited by the usual methods of depositing so-called "thick" layers, for example the following methods: spinner, spray (projection), soaking, roller or screen printing; conventionally in itself, the viscosity of the product can be adapted to the method used by varying the fraction of polymer in the solvent.

On chauffe ensuite progressivement pour évaporer lentement les solvants et polymériser. La température finale de polymérisation doit être de préférence supérieure ou égale à la température de l'étape de scellement du panneau. Par exemple, une couche d'épaisseur finale d'environ 5 micromètres de polyphénylquinoxaline polymérisée à 410°C pendant 10 minutes, n'évoluera plus chimiquement et mécaniquement pendant une étape de scellement à 400°C.Then heated gradually to slowly evaporate the solvents and polymerize. The final polymerization temperature should preferably be greater than or equal to the temperature of the panel sealing step. For example, a layer of final thickness of approximately 5 micrometers of polyphenylquinoxaline polymerized at 410 ° C for 10 minutes, will no longer evolve chemically and mechanically during a sealing step at 400 ° C.

On rappelle que l'étape de scellement d'un PAP est l'étape dans laquelle on rapproche l'une de l'autre, les deux dalles 2, 3, pour obtenir la hauteur H1 désirée de l'espace gazeux 10, et dans laquelle on déforme les joints de scellement 11 pour faire l'étanchéité.It will be recalled that the step of sealing a PAP is the step in which the two slabs 2, 3 are brought together, to obtain the desired height H1 of the gas space 10, and in which deforms the sealing joints 11 to make the seal.

Il est à noter que le composé organique peut être chargé avec des composés minéraux et/ou métalliques, en vue par exemple de modifier la constante diélectrique et/ou pour en modifier la couleur.It should be noted that the organic compound can be loaded with mineral and / or metallic compounds, for example in order to modify the dielectric constant and / or to modify the color thereof.

La constante diélectrique relative Er des composés organiques utilisés peut être comprise entre 2 et 4 pour le composé pur (par exemple un polyimide) et elle peut être augmentée pour atteindre des valeurs supérieurs à 10.The relative dielectric constant Er of the organic compounds used can be between 2 and 4 for the pure compound (for example a polyimide) and it can be increased to reach values greater than 10.

Les épaisseurs peuvent varier de moins de 1 micromètre à plusieurs dizaines de micromètres, selon la capacité diélectrique recherchée par la couche.The thicknesses can vary from less than 1 micrometer to several tens of micrometers, depending on the dielectric capacity desired by the layer.

Par exemple pour le composé organique non chargé (2<Er<4), on obtient un fonctionnement correct du "PAP" pour des épaisseurs E2 des couches diélectriques 4, 6, (après polymérisation) de l'ordre de 5 à 6 micromètres.For example, for the uncharged organic compound (2 <Er <4), correct operation of the "PAP" is obtained for thicknesses E2 of the dielectric layers 4, 6, (after polymerization) of the order of 5 to 6 micrometers.

La couleur éventuelle du dépôt final peut aussi être ajustée en ajoutant un colorant organique ou un composé minéral. Des dépôts noirs ou blancs peuvent également être obtenus de cette manière.The possible color of the final deposit can also be adjusted by adding an organic dye or a mineral compound. Black or white deposits can also be obtained in this way.

Le composé organique thermostable tel que ci-dessus défini, peut être polymérisé à des températures relativement basses, pour ne pas provoquer la déformation du substrat de verre ou dalle 2, 3, ni dégrader les autres couches déposées-sur ce substrat. En particulier, le composé organique ne réagit pas avec le matériau d'électrodes (ITO, métal, etc ...).The thermostable organic compound as defined above, can be polymerized at relatively low temperatures, so as not to cause deformation of the substrate. glass or slab 2, 3, nor degrade the other layers deposited on this substrate. In particular, the organic compound does not react with the electrode material (ITO, metal, etc.).

De plus, le composé organique permet un recouvrement homogène des électrodes et supporte donc des champs électriques élevés sans montrer de phénomène de claquage électrique.In addition, the organic compound allows a homogeneous covering of the electrodes and therefore supports high electric fields without showing any phenomenon of electrical breakdown.

Bien entendu l'invention s'applique aussi bien au cas où les couches diélectriques sont réalisées suivant des surfaces continues que dans le cas de surfaces discontinues.Of course, the invention applies as well to the case where the dielectric layers are produced along continuous surfaces as in the case of discontinuous surfaces.

Un composé organique polymérisable semblable à celui ci-dessus indiqué pour les couches diélectriques, peut constituer le matériau de base pour la réalisation des espaceurs et des barrières 12, 15.A polymerizable organic compound similar to that indicated above for the dielectric layers, can constitute the basic material for the production of the spacers and barriers 12, 15.

Comme ci-dessus, le composé organique peut être chargé par des composés minéraux et/ou métalliques, pour en faire varier la viscosité et/ou la couleur et/ou la résistance à l'écrasement après polymérisation.As above, the organic compound can be loaded with mineral and / or metallic compounds, in order to vary the viscosity and / or the color and / or the resistance to crushing after polymerization.

Le composé organique peut être étendu sur le substrat ou dalle 2, 3 par des méthodes usuelles semblables à celles citées le plus haut pour les couches diélectriques (tournette, spray, sérigraphie, etc ...).The organic compound can be spread on the substrate or slab 2, 3 by usual methods similar to those mentioned above for the dielectric layers (spin, spray, screen printing, etc.).

Plusieurs couches peuvent être nécessaires pour obtenir la hauteur H2 désirée. Dans ce cas une opération de séchage est intercalée entre chaque étape de dépôt.Several layers may be necessary to obtain the desired height H2. In this case, a drying operation is inserted between each deposition step.

Un avantage important de l'utilisation d'un composé organique pour la réalisation d'especeurs, résulte de ce que ce composé organique peut être (ou être rendu) photosensible, et se prête alors à être insolé (à travers un masque) et gravé. Un tel matériau est appelé "photo-imageable".An important advantage of the use of an organic compound for the production of spices, results from the fact that this organic compound can be (or be made) photosensitive, and then lends itself to being insulated (through a mask) and engraved . Such a material is called "photo-imageable".

On trouve dans le commerce des composés organiques photosensibles.Photosensitive organic compounds are commercially available.

Si plusieurs dépôts sont nécessaires pour obtenir la hauteur H2, il suffit d'insoler (généralement par exposition à rayonnement ultra-violet) la couche quand le dernier dépôt est effectué, puis de graver à l'aide des méthodes classiques de photogravures.If several deposits are necessary to obtain the height H2, it is sufficient to insulate (generally by exposure to ultraviolet radiation) the layer when the last deposit is made, then burn using conventional photoengraving methods.

La phase d'insolation et de photogravure intervient après séchage du dernier dépôt, et avant polymérisation ou à la suite d'une polymérisation partielle du composé organique.The exposure and photogravure phase occurs after the last deposit has dried, and before polymerization or following partial polymerization of the organic compound.

La polymérisation du composé organique est obtenue en l'exposant à un traitement thermique et/ou par insolation aux rayons ultra-violets, d'une façon en elle-même classique.The polymerization of the organic compound is obtained by exposing it to a heat treatment and / or by exposure to ultraviolet rays, in a manner in itself conventional.

L'ensemble des opérations peut être répété pour réaliser des espaceurs ou des barrières multicouches.All of the operations can be repeated to make spacers or multilayer barriers.

Les opérations ci-dessus décrites peuvent être effectuées simultanément pour tous les espaceurs faisant en outre office de barrière de décharge ou non.The operations described above can be carried out simultaneously for all the spacers which also act as a discharge barrier or not.

Mais ces opérations peuvent aussi être répétées en particulier pour obtenir une géométrie et/ou des propriétés mécaniques ou optiques variables dans l'épaisseur de l'espaceur formant barrière ou non. Ceci est indiqué notamment quand on veut réaliser certaines barrières avec des hauteurs plus faibles, en vue du conditionnement des cellules (notamment circulation du gaz entre les cellules).However, these operations can also be repeated in particular to obtain a variable geometry and / or mechanical or optical properties in the thickness of the spacer forming a barrier or not. This is indicated in particular when it is desired to produce certain barriers with lower heights, with a view to conditioning the cells (in particular circulation of gas between the cells).

Le caractère photo-imageable du composé organique permet de conférer de façon simple et sure, aux espaceurs et barrières 12, 15, les dimensions voulues ainsi que les positions désirées notamment par rapport aux électrodes X, Y1 à Yn.The photo-imageable nature of the organic compound makes it possible to impart, simply and securely, to the spacers and barriers 12, 15, the desired dimensions as well as the desired positions in particular relative to the electrodes X, Y1 to Yn.

Cette caractéristique est particulièrement intéressante dans le cas des barrières 15 dont la largeur L, par rapport au pas P des cellules, doit rester relativement faible, et dont la position entre les cellules est également importante.This characteristic is particularly advantageous in the case of barriers 15 whose width L, relative to the pitch P of the cells, must remain relatively small, and whose position between the cells is also important.

En outre des espaceurs ou barrière 12, 15 ainsi réalisés sont thermostables et n'ont pas tendance à fluer : on peut donc obtenir des rapports hauteur H2 sur largeur L (H1/L) supérieurs à 1, pour des hauteurs H2 supérieures à 200 micromètres.In addition, spacers or barriers 12, 15 thus produced are thermostable and do not tend to creep: it is therefore possible to obtain ratios of height H2 to width L (H1 / L) greater than 1, for heights H2 greater than 200 micrometers .

La possibilité de superposer des couches intermédiaires pour obtenir une couche finale ayant la hauteur H2 désirée, permet de réaliser des empilements dans lesquels au moins une couche intermédiaire, la première réalisée par exemple, est colorée (avec une épaisseur faible de l'ordre de un à quelques micromètres) en vue d'augmenter le contraste optique présenté par le PAP.The possibility of superimposing intermediate layers to obtain a final layer having the height H2 desired, makes it possible to produce stacks in which at least one intermediate layer, the first produced for example, is colored (with a thin thickness of the order of one to a few micrometers) in order to increase the optical contrast presented by the PAP.

L'invention peut s'appliquer à la réalisation de tout élément électriquement isolant porté par une dalle de PAP, que ce dernier soit du type continu ou alternatif, monochrome ou polychrome, quelle que soit la répartition des électrodes par rapport à l'espace gazeux, et quel que soit le nombre d'électrodes utilisées pour définir une cellule.The invention can be applied to the production of any electrically insulating element carried by a PAP slab, whether the latter is of the continuous or alternative type, monochrome or polychrome, whatever the distribution of the electrodes relative to the gas space. , and regardless of the number of electrodes used to define a cell.

Claims (11)

  1. Display of the plasma screen-type comprising two plates (2, 3) at least one of which supports electrodes (X, Y1 to Yn), said plates (2, 3) being assembled such that a space (10) is formed between these two plates, said space having the purpose of forming a gaseous space the tightness of which is accomplished by an operation called potting, with at least one dielectric layer (4, 6) being disposed between said gaseous space (10) and said electrodes (X, Y1 to Yn), characterized in that said layer (4, 6) is made of a polymerizable organic compound.
  2. Display according to claim 1, characterized in that it comprises at least one spacer (12, 15) defining the height (H1) of said gaseous space (10), also made of a polymerizable organic compound.
  3. Display according to claim 1 or claim 2, characterized in that it comprises at least one discharge barrier (15) made of a polymerizable organic compound.
  4. Display according to anyone of the preceding claims, characterized in that said polymerizable organic compound is obtained from a mixture of monomers.
  5. Display according to anyone of the preceding claims, characterized in that said polymerizable organic compound is of polyimide.
  6. Display according to anyone of the preceding claims, characterized in that said organic compound is thermostable up to a temperature at least equal to a temperature produced during said potting operation.
  7. Display according to anyone of the preceding claims, characterized in that said organic compound is photosensitive.
  8. Display according to anyone of the preceding claims, characterized in that said organic compound is polymerizable at a temperature inferior or substantially equal to a temperature causing a softening of at least one plate (2, 3).
  9. Display according to anyone of the preceding claims, characterized in that said organic compound is charged with mineral and/or metallic products or compounds.
  10. Process for the manufacture of a display according to anyone of claims 1 to 9, characterized in that it consists in stabilizing said organic compound by insulation against ultra-violet rays.
  11. Process for the manufacture of a display according to anyone of claims 1 to 9, characterized in that it consists in stabilizing said organic compound by exposing it to a temperature comprised between the temperature produced during the step of potting and a temperature of softening of at least one of said plates (2, 3).
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FR9108004A FR2678424A1 (en) 1991-06-27 1991-06-27 ELECTRICALLY INSULATING ELEMENTS FOR PLASMA PANELS AND METHOD FOR PRODUCING SUCH ELEMENTS.
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WO1993000698A1 (en) 1993-01-07
DE69204632D1 (en) 1995-10-12
JP3270045B2 (en) 2002-04-02
EP0546137A1 (en) 1993-06-16
DE69204632T2 (en) 1996-02-08
JPH06500891A (en) 1994-01-27
US5336121A (en) 1994-08-09

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