EP0499100B1 - Manufacturing process of ready-made resistors - Google Patents

Manufacturing process of ready-made resistors Download PDF

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Publication number
EP0499100B1
EP0499100B1 EP92101601A EP92101601A EP0499100B1 EP 0499100 B1 EP0499100 B1 EP 0499100B1 EP 92101601 A EP92101601 A EP 92101601A EP 92101601 A EP92101601 A EP 92101601A EP 0499100 B1 EP0499100 B1 EP 0499100B1
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EP
European Patent Office
Prior art keywords
ptc element
bearing
ptc
leads
elements
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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EP92101601A
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German (de)
French (fr)
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EP0499100A3 (en
EP0499100A2 (en
Inventor
Peter Hofsäss
Original Assignee
Erbengemeinschaft Peter Hofsaess Hofsaess U Hofsaess Mp Hofsaess Dp Hofsaess Hp Hofsaess Cr Hofsaess Bm
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Application filed by Erbengemeinschaft Peter Hofsaess Hofsaess U Hofsaess Mp Hofsaess Dp Hofsaess Hp Hofsaess Cr Hofsaess Bm filed Critical Erbengemeinschaft Peter Hofsaess Hofsaess U Hofsaess Mp Hofsaess Dp Hofsaess Hp Hofsaess Cr Hofsaess Bm
Priority to EP95105563A priority Critical patent/EP0677855B1/en
Publication of EP0499100A2 publication Critical patent/EP0499100A2/en
Publication of EP0499100A3 publication Critical patent/EP0499100A3/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C17/00Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/28Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C1/00Details
    • H01C1/14Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/1406Terminals or electrodes formed on resistive elements having positive temperature coefficient
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49082Resistor making
    • Y10T29/49085Thermally variable
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49082Resistor making
    • Y10T29/49101Applying terminal

Definitions

  • the invention relates to a method for producing assembled resistors, in particular for use on coil windings, such as for electric motors, two opposite side faces of a PTC element being electrically connected to connecting wires.
  • Resistors with PTC elements are used to monitor electrotechnical devices, in particular to monitor coil windings, such as those of electric motors or the like. with which electrical connection wires are connected.
  • the resistors are partially wrapped in close thermal contact with the electrical device, such as the coil, for example by the coil winding wire.
  • the connecting wires are soldered directly to the PTC elements, which are provided with a solderable metallic contact surface, such as a vapor-deposited silver coating.
  • the connecting wires are usually soldered by hand.
  • the invention is therefore based on the object of providing a method of the type mentioned at the outset which enables economical and inexpensive manufacture of such assembled resistors.
  • this object is achieved by a method of the type mentioned at the outset, which is characterized in that support and cover surfaces for the PTC elements are punched out on a metallic carrier tape, that a PTC element is placed and fastened on each support surface in such a way that the cover surface is bent over the PTC element, the support and cover surfaces are provided with connecting wires, and the cover and support surfaces are separated from the rest of the carrier tape.
  • a Resistor assembled in this way differs from the known resistors in that, on opposite end faces of the PTC element, metal plates (support and cover surfaces) are soldered, which have protruding approaches to the PTC element, to which the connecting wires are fastened.
  • the method according to the invention provides that the PTC elements, which form individual parts which are difficult to handle by hand, are held and conveyed by a quasi-endless carrier tape during the assembly process - at least until the PTC elements are connected to connecting wires, which then can in turn be strapped in a manner known per se, whereupon the further automatic conveying can take place in a defined form and with a defined relative spacing of the PTC elements through the straps engaging on the connecting wires.
  • the PTC elements are kept defined and all machining and processing operations in stations of a processing device can be carried out fully automatically.
  • the PTC elements can be fed to the endless carrier belt from a vibrating pot either via a slide with a locking slide.
  • the slide ends immediately in front of the support surface for a PTC element on the carrier tape. If such a support surface has been conveyed in front of the slide, the locking slide can release a PTC element so that it can slide onto the support surface. The others are then held back by the slide or corresponding slide.
  • Positioning pins can be provided which center the PTC element on the support surface.
  • grippers can be provided, which grip the PTC elements and place them on the support surface.
  • a cover surface is brought over it, so that the PTC element is delimited in a sandwich-like manner by the support surface and cover surface. If solder was previously applied to the support and cover surface, the PTC elements can now be soldered to the support and cover surface. PTC elements are also used here, which are provided with a metallic contact. The soldering can be done by high frequency. The PTC elements are then firmly connected to the carrier tape and are therefore conveyed through this to the further processing and processing stations.
  • protruding approaches for fixing the connecting wires are punched out from the support and cover surface. This facilitates the attachment, preferably welding, of the connection wires to the support and cover surface for the production of electrical connection contacts to the PTC element.
  • edges of the approaches are bent perpendicular to them.
  • the cover surface comes to lie flat on the PTC element can be provided in advance that the cover surface is first bent from the plane of the carrier tape, while maintaining its parallel extension to it, before it is bent over the PTC element.
  • the offset of the top surface to the level of the carrier tape essentially corresponds to the thickness of the PTC element.
  • the approaches to which the connecting wires are later attached show their usefulness, in particular if they are aligned parallel to one another, but are arranged offset from one another in plan view.
  • contact pins can be pressed against the lugs in parallel from top to bottom. This makes it possible to guide the carrier tape through the thermal bath in a horizontal orientation. It is not necessary for a contact pin to pass through the bottom of the temperature bath tub from below is performed, which would require difficult sealing. Furthermore, it is also not necessary to connect the carrier tape in any way in order to bring it in a vertical direction, so that contact pins could run in a horizontal direction from both sides against the support surface and the top surface. A connection of the carrier tape or vertical conveyance of the carrier tape at least over partial areas would also be associated with problems, among other things due to the inherent rigidity of the carrier tape.
  • PTC elements identified as faulty in the above checking step can then be removed from the carrier tape and thus eliminated by providing a punching device at a corresponding clock step distance from the testing device and the number of conveying cycles corresponding to the distance later the corresponding PTC element by punching the connecting tab from the carrier tape is eliminated.
  • a single connecting wire can be attached to each of the approaches on the support and top surface.
  • two or more PTC elements can also be connected in series.
  • one end of a piece of wire is connected to the top surface of the first PTC element and the other end of the piece of wire is connected to the contact surface of the immediately following PTC element and that the contact surface of the first PTC element and the top surface of the second PTC element are each provided with individual wires or that for the series connection of three PTC elements in each case the first end of a connecting wire with the top surface of a preceding PTC element and the second end of the connecting wire in each case with the immediately following PTC element. element are connected and that the contact surface of the first PTC element and the top surface of the third PTC element are provided with individual connecting wires.
  • the ready-made resistors are conveyed for further processing, which may consist in that the PTC elements connected to the support and cover surface and provided with connecting wires are provided with an insulation layer, in particular by the fact that the PTC elements connected to the support and cover surface Elements can be provided with a powder coating. Furthermore, a shrink sleeve can be pushed on and shrunk on.
  • the method according to the invention for producing assembled resistors for use on coil windings, such as for electric motors, is based on an endless carrier tape 1 made of thin sheet metal. Support surfaces 2 and cover surfaces 3 for PTC elements 4 are punched out of the carrier tape, the surfaces 2.3 still being held on a narrow holding strip 6 via connecting sections 7, 8 extending therefrom (method step A). On the cover and support surface 2, 3 extend essentially tangentially lugs 9, 11 for the later reception and fixing of connecting wires.
  • Openings 12 are also punched out of the holding strip 6, by means of which, during further processing, an exact positioning of the holding strip 6 and thus also of the cover and support surfaces 2, 3 can be effected.
  • edges 13 (FIGS. 2a, b) of the projections 9, 11 are bent upward in the plan view of FIG. 1.
  • the top surface 3 is displaced approximately as far from the plane of the carrier tape 6, but still lying parallel to it, as corresponds to the thickness of the PTC element 4.
  • Cover and support surface 2, 3 can furthermore be plate-shaped or bowl-shaped, as can be seen in FIG. 2b, so that edges 14 are formed which can encompass and center the PTC element 4 around its circumference.
  • solder 16 is applied to the support and cover surface 2, 3.
  • a PTC element in the form of a PTC pill is placed on the soldered support surface.
  • the PTC elements can be conveyed on a vibrating pot 17 and either taken over by a gripper and placed on the support surface 2 or conveyed to the support surfaces 2 by means of a slide and an exposed stop.
  • positioning pins 18 can be provided in addition to the contact surface 2, which, when a new contact surface 2 comes into their area, are moved upwards and hold the PTC element 4 between them.
  • step E the tab 7 carrying the top surface 3 is bent over in such a way that the top surface 3 is brought exactly over the PTC element 4. The result of this step is shown on the one hand in FIGS.
  • the PTC element 4 and the support and cover surface 2, 3 are soldered to the previously applied solder 16.
  • the soldering is preferably carried out at high frequency, that is to say by means of a high-frequency generator.
  • the PTC element 4 has been fastened in this way to the support surface 2 and thus also the cover surface 3 has been fixed via the PTC element 4
  • its carrier tab 7 can be separated from the carrier tape 6, for example at the point indicated by 19 (FIG. 2b). This takes place in method step G.
  • the support surface 2 with the carrier tape 6 and the cover surface 3 are electrically separated from one another, so they no longer form a short-circuit connection.
  • step I degreasing and finally (step J) cutting off defective PTC elements, the deficiency being determined in the above-mentioned test process.
  • the lugs 9, 11 are then provided with corresponding connecting wires 23, 24 (FIG. 3).
  • a plurality of PTC elements 4 are to be interconnected in series, for example two PTC elements in a twin circuit or three PTC elements in a triplet circuit, as shown in FIG. 3, the connection ends 26, 27 of a U -shaped wire 23 connected on the one hand to the shoulder 11 of the cover part 3 of a PTC element (end 27) and on the other hand (end 26) to the shoulder 9 of the support part 2.
  • the wire ends 26, 27 are preferably welded to the lugs 9, 11 (step K1). In step K1 'it can be seen how three successive PTC elements are connected in series with one another by two U-shaped connecting wires.
  • step K2 the individual connecting strands 24 are attached to the free lugs 9 and 11, respectively.
  • the connecting wires 23 are prepared in such a way that they are pulled off a wire reel, first a sufficient stripping of the front wire end takes place at a front end in a stripping block 28, and then the wire is conveyed further along two aligned grippers 29 which can be pivoted relative to one another. After the required wire length has been reached, the wire piece 23 is separated from the remaining wire and stripping is also carried out at the rear end (26).
  • the grippers 29 pivot against one another and thereby bend the piece of wire 23 into the U-shape shown at the beginning of FIG. 3, in which the start (27) and end 26 of the wire reach the parallel orientation shown.
  • connection wires 23, 24 After the connection wires 23, 24 have been attached, they are preferably taped, for example sandwiched between two adhesive tapes, which can be done in a conventional manner (step L). After the connecting wires 23, 24 and then the PTC elements are held by the belts 31, the PTC elements can be completely separated from the carrier tape 6 by a complete separation at 32 (FIG. 2b) (step M).
  • the resistors produced in this way can now be fed to further processing steps.
  • Coating can be carried out, for example casting or powder coating.
  • step N the initially horizontally conveyed resistors 33 are pivoted through 90 °, so that the connecting wires point upwards.
  • step N the initially horizontally conveyed resistors 33 are pivoted through 90 °, so that the connecting wires point upwards.
  • step O the belt 31 is passed between rollers 34, 36 which are provided in pairs and are perpendicular to one another.
  • the resistors 33 are passed through a powder bath.
  • the adherence of the powder is then melted by heat that can be generated by a radiator 37, cools down again and forms a tight coating (step O).
  • step O a shrink cap 38 can be pushed over the resistors 33.
  • step P an endless hose 39
  • step Q possibly closed in its free end and provided with a label
  • step S so that the shrink cap 38 tightly envelops the resistor 33.
  • step S the shrink cap 38 tightly envelops the resistor 33.
  • the connecting wires 23, 24

Abstract

In order to manufacture completely ready-made (that is to say provided with connecting wires) self-stabilising resistors having PTC elements as active parts, such as those resistors especially on coil windings, such as those used by electric motors, the invention provides a method according to which bearing surfaces and covering surfaces for the PTC elements are stamped out on a metallic supporting strip, a PTC element is placed on each bearing surface and is attached, the covering surface being bent over the PTC element, the bearing surfaces and covering surfaces being provided with connecting wires, and the covering surfaces and bearing surfaces being separated from the remaining supporting strip.

Description

Die Erfindung betrifft ein Verfahren zum Herstellen konfektionierter Widerstände, insbesondere zum Einsatz an Spulenwicklungen, wie für Elektromotoren, wobei zwei gegenüberliegende Seitenflächen eines PTC-Elements elektrisch mit Anschlußdrähten verbunden werden.The invention relates to a method for producing assembled resistors, in particular for use on coil windings, such as for electric motors, two opposite side faces of a PTC element being electrically connected to connecting wires.

In diesem Zusammenhang ist es aus dem Dokument JP-A-59 063 536 bekannt, ein Temperaturmeßbauteil zu fertigen, in dem ein Trägerband mit einer Auflagefläche und einer Deckelfläche verwendet wird, zwischen denen das Temperaturmeßelement aufgenommen wird.In this context, it is known from document JP-A-59 063 536 to manufacture a temperature measuring component in which a carrier tape with a bearing surface and a cover surface is used, between which the temperature measuring element is received.

Zur Überwachung elektrotechnischer Geräte, wie insbesondere zur Überwachung von Spulenwicklungen, wie solchen von Elektromotoren oder dergleichen, werden Widerstände eingesetzt, die PTC-Elemente aufweisen, mit denen elektrische Anschlußdrähte verbunden sind. Die Widerstände werden in engem Wärmekontakt mit dem elektrischen Gerät, wie der Spule gebracht, beispielsweise teilweise von dem Spulenwicklungsdraht umwickelt. Um Temperaturveränderungen über einen größeren Bereich der Spule feststellen zu können werden derartige Widerstände in Reihe geschaltet vorgesehen und an verschiedenen Stellen der Wicklung angebracht. In der Regel sind die Anschlußdrähte unmittelbar mit den PTC-Elementen verlötet, die hierzu mit einer lötbaren metallischen Kontaktfläche, wie einer aufgedampften Silberbeschichtung, versehen sind. Die Anschlußdrähte werden in der Regel in Handarbeit festgelötet. Dies ist aufwendig, insbesondere, wenn äußerst kleine PTC-Elemente verwendet werden, die Höhen von weniger als 2 mm und ebenfalls Durchmesser von weniger als 5 mm bis zu lediglich 3 mm hin aufweisen. Auch die weitere Konfektionierung erfolgt in Handarbeit; so werden Schrumpfhülsen in Handarbeit hergestellt. Die Erstellungskosten sind daher erheblich.Resistors with PTC elements are used to monitor electrotechnical devices, in particular to monitor coil windings, such as those of electric motors or the like. with which electrical connection wires are connected. The resistors are partially wrapped in close thermal contact with the electrical device, such as the coil, for example by the coil winding wire. In order to be able to determine temperature changes over a larger area of the coil, such resistors are provided connected in series and attached to different points of the winding. As a rule, the connecting wires are soldered directly to the PTC elements, which are provided with a solderable metallic contact surface, such as a vapor-deposited silver coating. The connecting wires are usually soldered by hand. This is complex, especially when extremely small PTC elements are used, which have heights of less than 2 mm and also diameters of less than 5 mm down to only 3 mm. Further assembly is also done by hand; so shrink sleeves are made by hand. The creation costs are therefore considerable.

Der Erfindung liegt daher die Aufgabe zugrunde, ein Verfahren der eingangs genannten Art zu schaffen, welches eine ökonomische und preiswerte Herstellung derartiger konfektionierter Widerstände ermöglicht.The invention is therefore based on the object of providing a method of the type mentioned at the outset which enables economical and inexpensive manufacture of such assembled resistors.

Erfindungsgemäß wird die genannte Aufgabe durch ein Verfahren der eingangs genannten Art gelöst, welches dadurch gekennzeichnet ist, daß an einem metallischen Trägerband Auflage- und Deckflächen für die PTC-Elemente ausgestanzt werden, daß auf jeder Auflagefläche ein PTC-Element aufgelegt und befestigt wird, daß die Deckfläche über das PTC-Element gebogen wird, daß Auflage- und Deckflächen mit Anschlußdrähten versehen werden und daß Deck- und Auflageflächen vom restlichen Trägerband getrennt werden. Ein derart konfektionierter Widerstand unterscheidet sich von den bekannten Widerständen dadurch, daß auf gegenüberliegenden Stirnseiten des PTC-Elements Blechplättchen (Auflage- und Deckflächen) aufgelötet sind, die das PTC-Element überragende Ansätze aufweisen, an denen die Anschlußdrähte befestigt sind.According to the invention, this object is achieved by a method of the type mentioned at the outset, which is characterized in that support and cover surfaces for the PTC elements are punched out on a metallic carrier tape, that a PTC element is placed and fastened on each support surface in such a way that the cover surface is bent over the PTC element, the support and cover surfaces are provided with connecting wires, and the cover and support surfaces are separated from the rest of the carrier tape. A Resistor assembled in this way differs from the known resistors in that, on opposite end faces of the PTC element, metal plates (support and cover surfaces) are soldered, which have protruding approaches to the PTC element, to which the connecting wires are fastened.

Mit der Erfindung wird ein Verfahren geschaffen, welches eine weitgehend automatisierte und damit maschinelle Herstellung derartier konfektionierter Widerstände ermöglicht und damit den Einsatz von Handarbeit reduzieren bzw. nahezu eliminieren läßt.With the invention, a method is created which enables a largely automated and therefore mechanical production of such assembled resistors and thus reduces or almost eliminates the use of manual labor.

Das erfindungsgemäße Verfahren sieht hierzu vor, daß die PTC-Elemente, die an sich einzelne schwer handbearbeitbare Teile bilden, während des Konfektionierungsprozesses durch ein Quasi-Endlos-Trägerband gehalten und gefördert werden - zumindestens bis die PTC-Elemente mit Anschlußdrähten verbunden sind, die dann wiederum in an sich bekannter Weise gegurtet werden können, woraufhin die weitere automatische Förderung in definierter Form und mit definiertem Relativabstand der PTC-Elemente durch die an den Anschlußdrähten angreifenden Gurte erfolgen kann.For this purpose, the method according to the invention provides that the PTC elements, which form individual parts which are difficult to handle by hand, are held and conveyed by a quasi-endless carrier tape during the assembly process - at least until the PTC elements are connected to connecting wires, which then can in turn be strapped in a manner known per se, whereupon the further automatic conveying can take place in a defined form and with a defined relative spacing of the PTC elements through the straps engaging on the connecting wires.

Hierdurch werden die PTC-Elemente definiert gehalten und es können dadurch sämtliche Be- und Verarbeitungsvorgänge in Stationen einer Bearbeitungsvorrichtung vollautomatisch durchgeführt werden. Die Zuführung der PTC-Elemente zu dem Endlos-Trägerband kann aber aus einem Rütteltopf entweder über eine Rutsche mit einem Sperrschieber erfolgen. Die Rutsche endet unmittelbar vor der Auflagefläche für ein PTC-Element am Trägerband. Wenn eine derartige Auflagefläche vor die Rutsche gefördert wurde kann der Sperrschieber ein PTC-Element freigeben, so daß dieses auf die Auflagefläche rutschen kann. Die weiteren werden dann durch den Schieber bzw. entsprechende Schieber zurückgehalten. Es können Positionierstifte vorgesehen sein, die das PTC-Element auf der Auflagefläche zentrieren. Oder es können in alternativer Weise Greifer vorgesehen sein, die die PTC-Elemente ergreifen und auf der Auflagefläche absetzen. Nach dem Aufsetzen eines PTC-Elements auf einer Aufnahme- oder Auflagefläche wird eine Deckfläche über dieses gebracht, so daß das PTC-Element von Auflage- und Deckfläche sandwichartig eingegrenzt ist. Wenn vorher auf Auflage- und Deckfläche Lot aufgebracht wurde kann nun ein Verlöten der PTC-Elemente mit der Auflage- und der Deckfläche erfolgen. Es werden auch hier PTC-Elemente verwendet, die mit einer metallischen Kontaktierung versehen sind. Das Verlöten kann durch Hochfrequenz erfolgen. Anschließend sind die PTC-Elemente fest mit dem Trägerband verbunden und werden daher durch dieses zu den weiteren Ver- und Bearbeitungsstationen gefördert.As a result, the PTC elements are kept defined and all machining and processing operations in stations of a processing device can be carried out fully automatically. However, the PTC elements can be fed to the endless carrier belt from a vibrating pot either via a slide with a locking slide. The slide ends immediately in front of the support surface for a PTC element on the carrier tape. If such a support surface has been conveyed in front of the slide, the locking slide can release a PTC element so that it can slide onto the support surface. The others are then held back by the slide or corresponding slide. Positioning pins can be provided which center the PTC element on the support surface. Or, alternatively, grippers can be provided, which grip the PTC elements and place them on the support surface. After a PTC element has been placed on a receiving or support surface, a cover surface is brought over it, so that the PTC element is delimited in a sandwich-like manner by the support surface and cover surface. If solder was previously applied to the support and cover surface, the PTC elements can now be soldered to the support and cover surface. PTC elements are also used here, which are provided with a metallic contact. The soldering can be done by high frequency. The PTC elements are then firmly connected to the carrier tape and are therefore conveyed through this to the further processing and processing stations.

In bevorzugter Ausgestaltung kann vorgesehen sein, daß von Auflage- und Deckfläche sich forterstreckende Ansätze zur Festlegung der Anschlußdrähte ausgestanzt werden. Hierdurch wird das Befestigen, vorzugsweise Verschweißen, der Anschlußdrähte an der Auflage- und Deckfläche zur Herstellung von elektrischen Anschlußkontakten zu dem PTC-Element erleichtert. Um die Anschlußdrähte vor der festen Verbindung mit Auflage- und Deckfläche, insbesondere an deren Ansätzen, zu positionieren kann in bevorzugter weiterer Ausgestaltung vorgesehen sein, daß Ränder der Ansätze senkrecht zu diesen abgebogen werden.In a preferred embodiment, it can be provided that protruding approaches for fixing the connecting wires are punched out from the support and cover surface. This facilitates the attachment, preferably welding, of the connection wires to the support and cover surface for the production of electrical connection contacts to the PTC element. In order to position the connecting wires in front of the fixed connection to the support and cover surface, in particular at their approaches, it can be provided in a preferred further embodiment that edges of the approaches are bent perpendicular to them.

Damit beim Überbiegen der Deckfläche, die ebenso wie die Auflagefläche aus dem Trägerband ausgestanzt wurde, mit diesem aber noch durch Laschen fest verbunden ist, die Deckfläche flach auf dem PTC-Element zum Aufliegen kommt kann vorab vorgesehen sein, daß die Deckfläche zunächst, bevor sie über das PTC-Element gebogen wird, aus der Ebene des Trägerbandes unter Beibehaltung ihrer parallelen Erstreckung zu diesem abgebogen wird. Der Versatz der Deckfläche zur Ebene des Trägerbandes entspricht dabei im wesentlichen der Stärke des PTC-Elements.So that when the cover surface is bent over, which, like the support surface, has been punched out of the carrier tape but is still firmly connected to it by tabs, the cover surface comes to lie flat on the PTC element can be provided in advance that the cover surface is first bent from the plane of the carrier tape, while maintaining its parallel extension to it, before it is bent over the PTC element. The offset of the top surface to the level of the carrier tape essentially corresponds to the thickness of the PTC element.

Gemäß einer Weiterbildung ist vorgesehen, daß nach dem festen Verbinden von PTC-Element mit Auflage- und Deckfläche zunächst lediglich letztere vom restlichen Trägerband getrennt wird. Trotz Trennung der Deckfläche vom Trägerband wird diese weiterhin festgehalten, da sie mit dem PTC-Element fest verbunden ist. Durch dieses Vorgehen sind Auflagefläche und Deckfläche elektrisch voneinander getrennt. Es kann dann in weiterer bevorzugter Ausgestaltung vorgesehen werden, daß nach einer elektrischen Trennung von Auflage- und Deckfläche eine elektrische Prüfung des PTC-Elements durchgeführt wird. Eine wesentliche Prüfung der verwendeten PTC-Elemente besteht darin, daß diese unter Einsatz-Temperaturbedingungen hinsichtlich ihrer Leitfähigkeit bzw. ihres elektrischen Widerstandes überprüft werden. Es ist daher vorgesehen, daß zur Prüfung des PTC-Elements am Trägerband durch ein temperiertes Bad, insbesondere ein Ölbad, geführt wird. Zur elektrischen Kontaktierung werden Kontaktstifte gegen Deck- und Auflagefläche gebracht. Auch hier zeigen die Ansätze, an denen später die Anschlußdrähte befestigt werden, ihren Nutzen, insbesondere wenn sie zwar parallel zueinander ausgerichtet sind, aber in Draufsicht versetzt zueinander angeordnet sind. In diesem Falle können nämlich Kontaktstifte parallel von oben nach unten gegen die Ansätze gedrückt werden. Hierdurch wird es möglich, das Trägerband in horizontaler Ausrichtung durch das Temperaturbad zu führen. Es ist nicht notwendig, daß ein Kontaktstift von unten durch den Boden der Temperaturbadwanne geführt wird, was eine schwierige Abdichtung erfordern würde. Weiterhin ist auch nicht notwendig, daß Trägerband in irgendeiner Weise zu verbinden um es in eine senkrechte Richtung zu bringen, damit Kontaktstifte in horizontaler Richtung von beiden Seiten gegen Auflage- und Deckfläche fahren könnten. Auch ein Verbinden des Trägerbandes oder eine senkrechte Förderung desselben zumindestens über Teilbereiche wäre mit Problemen verbunden, unter anderem aufgrund der Eigensteifigkeit des Trägerbandes.According to a development, it is provided that after the PTC element has been firmly connected to the support and cover surface, only the latter is initially separated from the rest of the carrier tape. Despite separating the top surface from the carrier tape, this is still held because it is firmly connected to the PTC element. This procedure electrically separates the contact surface and the top surface. It can then be provided in a further preferred embodiment that an electrical test of the PTC element is carried out after an electrical separation of the support and cover surfaces. An essential test of the PTC elements used is that they are checked under operating temperature conditions with regard to their conductivity or their electrical resistance. It is therefore provided that the PTC element is checked on the carrier tape by a tempered bath, in particular an oil bath. For electrical contacting, contact pins are brought against the top and contact surfaces. Here, too, the approaches to which the connecting wires are later attached show their usefulness, in particular if they are aligned parallel to one another, but are arranged offset from one another in plan view. In this case, contact pins can be pressed against the lugs in parallel from top to bottom. This makes it possible to guide the carrier tape through the thermal bath in a horizontal orientation. It is not necessary for a contact pin to pass through the bottom of the temperature bath tub from below is performed, which would require difficult sealing. Furthermore, it is also not necessary to connect the carrier tape in any way in order to bring it in a vertical direction, so that contact pins could run in a horizontal direction from both sides against the support surface and the top surface. A connection of the carrier tape or vertical conveyance of the carrier tape at least over partial areas would also be associated with problems, among other things due to the inherent rigidity of the carrier tape.

Bei dem vorstehenden Überprüfungsschritt als fehlerhaft erkannte PTC-Elemente können anschließend vom Trägerband entfernt und damit eliminiert werden, indem in einem entsprechenden Taktschrittabstand von der Prüfvorrichtung eine Stanzvorrichtung vorgesehen ist und die dem Abstand entsprechende Fördertaktzahl später das entsprechende PTC-Element durch Abstanzen der Verbindungslasche vom Trägerband eliminiert wird.PTC elements identified as faulty in the above checking step can then be removed from the carrier tape and thus eliminated by providing a punching device at a corresponding clock step distance from the testing device and the number of conveying cycles corresponding to the distance later the corresponding PTC element by punching the connecting tab from the carrier tape is eliminated.

In einfacher Weise können jeweils ein einzelner Anschlußdraht an jedem der Ansätze an Auflage- und Deckfläche befestigt werden. Es können aber auch Reihenschaltungen von zwei oder mehr PTC-Elementen vorgenommen werden. Hierzu ist vorgesehen, daß vor Reihenschaltung zweier PTC-Elemente ein Ende eines Drahtstücks mit der Deckfläche des ersten PTC-Elements verbunden und das andere Ende des Drahtstücks mit der Auflagefläche des unmittelbar folgenden PTC-Elements verbunden wird und daß die Auflagefläche des ersten PTC-Elements und die Deckfläche des zweiten PTC-Elements jeweils mit Einzeldrähten versehen werden bzw. daß zur Reihenschaltung von drei PTC-Elementen jeweils das erste Ende eines Anschlußdrahtes mit der Deckfläche eines vorangehenden PTC-Elements und das zweite Ende des Anschlußdrahtes jeweils mit dem unmittelbar folgenden PTC-Element verbunden werden und daß die Auflagefläche des ersten PTC-Elements und die Deckfläche des dritten PTC-Elements mit Einzelanschlußdrähten versehen werden.In a simple manner, a single connecting wire can be attached to each of the approaches on the support and top surface. However, two or more PTC elements can also be connected in series. For this purpose, it is provided that one end of a piece of wire is connected to the top surface of the first PTC element and the other end of the piece of wire is connected to the contact surface of the immediately following PTC element and that the contact surface of the first PTC element and the top surface of the second PTC element are each provided with individual wires or that for the series connection of three PTC elements in each case the first end of a connecting wire with the top surface of a preceding PTC element and the second end of the connecting wire in each case with the immediately following PTC element. element are connected and that the contact surface of the first PTC element and the top surface of the third PTC element are provided with individual connecting wires.

Wie gesagt, kann in einem anschließenden Arbeitsschritt vorgesehen sein, daß nach Befestigen der Anschlußdrähte diese gegurtet werden.As said, it can be provided in a subsequent work step that after the connecting wires are fastened, they are taped.

Am Gurt werden die insoweit konfektionierten Widerstände zur Weiterbearbeitung gefördert, die darin bestehen kann, daß die mit Auflage- und Deckfläche verbundenen sowie mit Anschlußdrähten versehenen PTC-Elemente mit einer Isolationsschicht versehen werden, insbesondere dadurch, daß die mit Auflage- und Deckfläche verbundenen PTC-Elemente mit einer Pulverbeschichtung versehen werden. Weiterhin kann eine Schrumpfhülse aufgeschoben und aufgeschrumpft werden.On the belt, the ready-made resistors are conveyed for further processing, which may consist in that the PTC elements connected to the support and cover surface and provided with connecting wires are provided with an insulation layer, in particular by the fact that the PTC elements connected to the support and cover surface Elements can be provided with a powder coating. Furthermore, a shrink sleeve can be pushed on and shrunk on.

Weitere Vorteile und Merkmale der Erfindung ergeben sich aus den Ansprüchen aus der nachfolgenden Beschreibung in der ein Ausführungsbeispiel der Erfindung unter Bezugnahme auf die Zeichnung im einzelnen erläutert ist. Dabei zeigt:

Fig. 1
eine schematische Darstellung der ersten Arbeitsschritte des erfindungsgemäßen Verfahrens, wobei Figur 1a eine Seitenansicht auf den Eintauchvorgang des Trägerbandes darstellt;
Fig. 2a u. b
Ansichten auf PTC-Element und Auflage- und Deckfläche vor dem Abtrennen der Deckfläche vom Trägerband;
Fig. 3
weitere Verfahrensschritte des erfindungsgemäßen Verfahrens; und
Fig. 4
die Endkonfektionierung gemäß dem erfindungsgemäßen Verfahren.
Further advantages and features of the invention result from the claims from the following description in which an embodiment of the invention is explained in detail with reference to the drawing. It shows:
Fig. 1
is a schematic representation of the first steps of the method according to the invention, wherein Figure 1a is a side view of the immersion process of the carrier tape;
Fig. 2a u. b
Views of the PTC element and the support and cover surface before the cover surface has been separated from the carrier tape;
Fig. 3
further process steps of the method according to the invention; and
Fig. 4
the final assembly according to the method according to the invention.

Das erfindungsgemäße Verfahren zum Herstellen konfektionierter Widerstände zum Einsatz an Spulenwicklungen, wie für Elektromotoren, geht aus von einem endlosen Trägerband 1 aus dünnem Blech. Aus dem Trägerband werden Auflageflächen 2 und Deckflächen 3 für PTC-Elemente 4 ausgestanzt, wobei die Flächen 2.3 weiterhin an einem schmalen Haltestreifen 6 über sich von diesem forterstreckende Verbindungsabschnitte 7, 8 gehalten werden (Verfahrensschritt A). An Deck- und Auflagefläche 2, 3 erstrecken sich im wesentlichen tangential Ansätze 9, 11 zur späteren Aufnahme und Festlegung von Anschlußdrähten.The method according to the invention for producing assembled resistors for use on coil windings, such as for electric motors, is based on an endless carrier tape 1 made of thin sheet metal. Support surfaces 2 and cover surfaces 3 for PTC elements 4 are punched out of the carrier tape, the surfaces 2.3 still being held on a narrow holding strip 6 via connecting sections 7, 8 extending therefrom (method step A). On the cover and support surface 2, 3 extend essentially tangentially lugs 9, 11 for the later reception and fixing of connecting wires.

Auch werden aus dem Haltestreifen 6 Durchbrechungen 12 ausgestanzt, über die bei der weiteren Verarbeitung eine genaue Positionierung des Haltestreifens 6 und damit auch der Deck- und Auflageflächen 2, 3 bewirkt werden kann.Openings 12 are also punched out of the holding strip 6, by means of which, during further processing, an exact positioning of the holding strip 6 and thus also of the cover and support surfaces 2, 3 can be effected.

Anschließend erfolgt eine Prägung aus der Ebene des Trägerbandes 1 heraus (Schritt B). Zum einen werden Ränder 13 (Figuren 2a, b) der Ansätze 9, 11 in der Draufsicht der Figur 1 nach oben gebogen. Zum anderen wird die Deckfläche 3 etwa so weit aus der Ebene des Trägerbandes 6, aber weiterhin parallel zu diesem liegend versetzt, wie es der Stärke des PTC-Elements 4 entspricht. Deck- und Auflagefläche 2, 3 können weiterhin teller- oder schüsselförmig ausgebildet werden, wie dies der Figur 2b entnehmbar ist, wodurch also Ränder 14 gebildet werden, die das PTC-Element 4 um seinen Umfang hin umfassen und zentrieren können.Then embossing takes place out of the plane of the carrier tape 1 (step B). On the one hand, edges 13 (FIGS. 2a, b) of the projections 9, 11 are bent upward in the plan view of FIG. 1. On the other hand, the top surface 3 is displaced approximately as far from the plane of the carrier tape 6, but still lying parallel to it, as corresponds to the thickness of the PTC element 4. Cover and support surface 2, 3 can furthermore be plate-shaped or bowl-shaped, as can be seen in FIG. 2b, so that edges 14 are formed which can encompass and center the PTC element 4 around its circumference.

In einem weiteren Schritt C wird auf Auflage- und Deckfläche 2, 3 Lot 16 aufgetragen.In a further step C, solder 16 is applied to the support and cover surface 2, 3.

Anschließend wird auf die mit Lot versehene Auflagefläche ein PTC-Element in Form einer PTC-Pille aufgesetzt. Die PTC-Elemente können auf einem Rütteltopf 17 zugefördert und entweder von einem Greifer übernommen und auf der Auflagefläche 2 aufgesetzt werden oder aber mittels einer Rutsche und einem freilegbaren Anschlag den Auflageflächen 2 zugefördert werden. Zur Positionierung der PTC-Elemente 4 können neben der Auflagefläche 2 Positionierstifte 18 vorgesehen sein, die, wenn eine erneute Auflagefläche 2 in ihren Bereich kommt, nach oben gefahren werden und zwischen sich das PTC-Element 4 aufnehmen. Anschließend wird im Schritt E die die Deckfläche 3 tragende Lasche 7 derart umgebogen, daß die Deckfläche 3 genau über das PTC-Element 4 gebracht wird. Das Ergebnis dieses Schrittes ist in den Figuren 2a und b einmal in Draufsicht und zum anderen in Seitenansicht vergrößert dargestellt. Im nachfolgenden Schritt F erfolgt ein Verlöten von PTC-Element 4 und Auflage- sowie Deckfläche 2, 3 mit dem vorher aufgebrachten Lot 16. Das Verlöten erfolgt vorzugsweise mit Hochfrequenz, also mittels eines Hochfrequenzgenerators. Nach der derart erfolgten Befestigung des PTC-Elements 4 an der Auflagefläche 2 und damit auch Festlegung der Deckfläche 3 über das PTC-Element 4 kann dessen Trägerlasche 7 vom Trägerband 6 getrennt werden, beispielsweise bei der mit 19 angedeuteten Stelle (Figur 2b). Dies erfolgt im Verfahrensschritt G. Anschließend sind Auflagefläche 2 mit Trägerband 6 und Deckfläche 3 elektrisch voneinander getrennt, bilden also keine Kurzschlußverbindung mehr. Um die Qualität des PTC-Elements zu prüfen wird nun das Trägerband 6 über Walzen 21 (Figur 1a) zur Prüfung des Widerstands bei vorgegebener Temperatur in ein Ölbad 22 umgelenkt und der Widerstand wird über Kontaktstifte 23, die gegen die Anschlußansätze 9, 11 gefahren werden, geprüft. Im nachfolgenden Schritt I erfolgt ein Entfetten und schließlich (Schritt J) ein Abschneiden fehlerhafter PTC-Elemente, wobei die Fehlerhaftigkeit im vorstehend erwähnten Prüfvorgang festgestellt wurde.Then a PTC element in the form of a PTC pill is placed on the soldered support surface. The PTC elements can be conveyed on a vibrating pot 17 and either taken over by a gripper and placed on the support surface 2 or conveyed to the support surfaces 2 by means of a slide and an exposed stop. To position the PTC elements 4, positioning pins 18 can be provided in addition to the contact surface 2, which, when a new contact surface 2 comes into their area, are moved upwards and hold the PTC element 4 between them. Then, in step E, the tab 7 carrying the top surface 3 is bent over in such a way that the top surface 3 is brought exactly over the PTC element 4. The result of this step is shown on the one hand in FIGS. 2a and b in plan view and on the other hand in enlarged view. In the subsequent step F, the PTC element 4 and the support and cover surface 2, 3 are soldered to the previously applied solder 16. The soldering is preferably carried out at high frequency, that is to say by means of a high-frequency generator. After the PTC element 4 has been fastened in this way to the support surface 2 and thus also the cover surface 3 has been fixed via the PTC element 4, its carrier tab 7 can be separated from the carrier tape 6, for example at the point indicated by 19 (FIG. 2b). This takes place in method step G. Subsequently, the support surface 2 with the carrier tape 6 and the cover surface 3 are electrically separated from one another, so they no longer form a short-circuit connection. In order to check the quality of the PTC element, the carrier tape 6 is now placed in an oil bath 22 over rollers 21 (FIG. 1a) for checking the resistance at a predetermined temperature deflected and the resistance is checked via contact pins 23, which are moved against the connecting lugs 9, 11. In the following step I degreasing and finally (step J) cutting off defective PTC elements, the deficiency being determined in the above-mentioned test process.

Sodann erfolgt ein Versehen der Ansätze 9, 11 mit entsprechenden Anschlußdrähten 23, 24 (Figur 3). Wenn mehrere PTC-Elemente 4 miteinander in Reihe verschaltet werden sollen, beispielsweise zwei PTC-Elemente in einer Zwillingsschaltung oder drei PTC-Elemente in einer Drillings-verschaltung, so werden, wie dies in Figur 3 dargestellt ist, die Anschlußenden 26, 27 eines U-förmig gebogenen Drahtes 23 zum einen mit dem Ansatz 11 des Deckteils 3 eines PTC-Elements (Ende 27) und zum anderen (Ende 26) mit dem Ansatz 9 des Auflageteils 2 verbunden. Die Drahtenden 26, 27 werden vorzugsweise an den Ansätzen 9, 11 festgeschweißt (Schritt K1). Im Schritt K1′ ist ersichtlich, wie drei aufeinanderfolgende PTC-Elemente durch zwei U-förmig gebogene Anschlußdrähte in Reihe miteinander geschaltet werden. Im Schritt K2 sind die einzelnen Anschlußlitzen 24 an den freien Ansätzen 9 bzw. 11 befestigt. Die Anschlußdrähte 23 werden derart vorbereitet, indem sie von einer Drahtrolle abgezogen, zunächst an einem vorderen Ende in einem Abisolierblock 28 eine hinreichende Abisolation des vorderen Drahtendes erfolgt, anschließend der Draht entlang zweier fluchtender relativ zueinander auf schwenkbare Greifer 29 weitergefördert werden. Nach Erreichen der erforderlichen Drahtlänge wird das Drahtstück 23 von dem Restdraht abgetrennt und am rückwärtigen Ende (26) ebenfalls eine Abisolation vorgenommen. Die Greifer 29 verschwenken gegeneinander und biegen dabei das Drahtstück 23 in die zu Beginn der Figur 3 dargestellte U-Form, bei der Anfang (27) und Ende 26 des Drahtes in die gezeigte Parallelausrichtung gelangen.The lugs 9, 11 are then provided with corresponding connecting wires 23, 24 (FIG. 3). If a plurality of PTC elements 4 are to be interconnected in series, for example two PTC elements in a twin circuit or three PTC elements in a triplet circuit, as shown in FIG. 3, the connection ends 26, 27 of a U -shaped wire 23 connected on the one hand to the shoulder 11 of the cover part 3 of a PTC element (end 27) and on the other hand (end 26) to the shoulder 9 of the support part 2. The wire ends 26, 27 are preferably welded to the lugs 9, 11 (step K1). In step K1 'it can be seen how three successive PTC elements are connected in series with one another by two U-shaped connecting wires. In step K2, the individual connecting strands 24 are attached to the free lugs 9 and 11, respectively. The connecting wires 23 are prepared in such a way that they are pulled off a wire reel, first a sufficient stripping of the front wire end takes place at a front end in a stripping block 28, and then the wire is conveyed further along two aligned grippers 29 which can be pivoted relative to one another. After the required wire length has been reached, the wire piece 23 is separated from the remaining wire and stripping is also carried out at the rear end (26). The grippers 29 pivot against one another and thereby bend the piece of wire 23 into the U-shape shown at the beginning of FIG. 3, in which the start (27) and end 26 of the wire reach the parallel orientation shown.

Nach Anbringen der Anschlußdrähte 23, 24 werden diese vorzugsweise gegurtet, beispielsweise zwischen zwei Klebebändern eingefaßt, was in an sich üblicher Weise erfolgen kann (Schritt L). Nachdem dann die Anschlußdrähte 23, 24 und über diese die PTC-Elemente durch die Gurte 31 gehalten werden, können die PTC-Elemente vollständig vom Trägerband 6 abgetrennt werden, indem eine vollständige Abtrennung bei 32 (Figur 2b) erfolgt (Schritt M).After the connection wires 23, 24 have been attached, they are preferably taped, for example sandwiched between two adhesive tapes, which can be done in a conventional manner (step L). After the connecting wires 23, 24 and then the PTC elements are held by the belts 31, the PTC elements can be completely separated from the carrier tape 6 by a complete separation at 32 (FIG. 2b) (step M).

Die derart hergestellten Widerstände können nun weiteren Verarbeitungsschritten zugeführt werden.The resistors produced in this way can now be fed to further processing steps.

Es kann eine Beschichtung erfolgen, beispielsweise ein Vergießen oder aber eine Pulverbeschichtung. Im letztgenannten Fall werden im Verfahrenschritt N die zunächst horizontal geförderten Widerstände 33 um 90° verschwenkt, so daß die Anschlußdrähte nach oben weisen. Dies geschieht dadurch, daß der Gurt 31 zwischen paarweise vorgesehenen Walzen 34, 36, die senkrecht zueinander stehen, hindurchgeführt wird. Die Widerstände 33 werden durch ein Pulverbad geführt. Das Haften der Pulver wird anschließend durch Wärme, die über einen Strahler 37 erzeugt werden kann, aufgeschmolzen, kühlt wieder ab und bildet eine dichte Beschichtung (Schritt O). Schließlich kann über die Widerstände 33 noch eine Schrumpfkappe 38 geschoben werden. Diese wird von einem Endlosschlauch 39 abgetrennt (Schritt P), gegebenenfalls in ihrem freien Ende geschlossen und mit einer Kennzeichnung versehen (Schritt Q). Sie kann hierbei an einem Kreisförderer 39 gefördert werden. Anschließend wird sie einfach auf die Widerstände 33 aufgeschoben (Schritt R), woraufhin sich im Schritt S schließlich noch ein Schrumpfvorgang anschließen kann, so daß die Schrumpfkappe 38 den Widerstand 33 dicht umhüllt. Schließlich können noch die Anschlußdrähte 23, 24 gekürzt werden.Coating can be carried out, for example casting or powder coating. In the latter case, in step N the initially horizontally conveyed resistors 33 are pivoted through 90 °, so that the connecting wires point upwards. This takes place in that the belt 31 is passed between rollers 34, 36 which are provided in pairs and are perpendicular to one another. The resistors 33 are passed through a powder bath. The adherence of the powder is then melted by heat that can be generated by a radiator 37, cools down again and forms a tight coating (step O). Finally, a shrink cap 38 can be pushed over the resistors 33. This is separated from an endless hose 39 (step P), possibly closed in its free end and provided with a label (step Q). It can be promoted on a circular conveyor 39. Then she is simply on the Resistors 33 pushed on (step R), whereupon a shrinking process can finally follow in step S, so that the shrink cap 38 tightly envelops the resistor 33. Finally, the connecting wires 23, 24 can be shortened.

Claims (18)

  1. Method for manufacturing finished resistors (33), particularly for use on coil windings such as for electric motors, whereby two opposing lateral faces of a PTC element (4) are electrically connected to leads (23, 24), characterized in that on a metallic carrier strip bearing and top surfaces (2, 3) for the PTC elements (4) are being punched out, that on each bearing surface (2) a PTC element (4) is being placed and fixed, that the top surface (3) is being bent over the PTC element (4), that the bearing and contact surfaces (2, 3) are being provided with leads (23, 24), and that the top and bearing surfaces (2, 3) are being separated from the remaining carrier strip (1).
  2. Method according to claim 1, characterized by the step of punching lugs (9, 11) extending from the bearing and top surfaces (2, 3) for fixing the leads (23, 24).
  3. Method according to claim 1 or 2, characterized by the step of bending edges (13) of the lugs (9, 11) away perpendicular thereto.
  4. Method according to any of claims 1 - 3, characterized by the step of bending the top surface (3), before being bent over the PTC element (4), out of the plane of the carrier strip (1) while maintaining the parallel orientation thereto.
  5. Method according to any of claims 1 - 4, characterized by the step of connecting the PTC elements (4) to the bearing and top surfaces (2, 3) by soldering.
  6. Method according to claim 5, characterized by the step of applying prior to the placement of the PTC elements (4) on the bearing surface (2) solder (16) to the latter and to the top surface (3).
  7. Method according to any of the preceding claims, characterized by the step of after having fixedly connected the PTC element (4) to the bearing and top surfaces (2, 3) separating initially only the latter from the remaining carrier strip (1).
  8. Method according to any of the preceding claims, characterized by the step of electrical checking of the PTC element (4) after electrical separation of bearing and top surfaces (2, 3).
  9. Method according to claim 8, characterized by the step of passing the PTC element (4) on the carrier strip (1) through a thermostatic bath, particularly an oil bath (22), for testing the PTC element (4).
  10. Method according to claim 8 or 9, characterized by the step of eliminating faulty PTC elements (4) by separating them from the carrier strip (1).
  11. Method according to any of the preceding claims, characterized by the step of connecting the leads (23, 24) to the bearing and top surfaces (2, 3), particulary to the lugs (9, 11), by welding.
  12. Method according to any of the preceding claims, characterized in that for a serial connection of two PTC elements (4) one end (26) of a wire portion is being connected to the top surface (3) of the first PTC element (4) and the other end (27) of the wire portion is being connected with the bearing surface (2) of the directly following PTC element (4) and that the bearing surface (2) of the first PTC element (4) and the top surface (3) of the second PTC element (4) are each being provided with single wires (23, 24).
  13. Method according to any of the preceding claims, characterized in that for a serial connection of three PTC elements (4) each the first end (26) of a lead is being connected with the top surface (3) of the immediately preceding PTC element (4) and the second end (27) of the lead is each being connected to the bearing surface (2) of the subsequently following PTC element (4) and that the bearing surface (2) of the first PTC element (4) and the top surface (3) of the third PTC element (4) are being provided with single wires (23, 24).
  14. Method according to any of the preceding claims, characterized by the step of connecting the leads (23, 24) to a belt after fixing the leads.
  15. Method according to claim 14, characterized by the step of separating the resistors (33) produced thus far completely from the carrier strip (1).
  16. Method according to any of the preceding claims, characterized by the step of providing the PTC elements (4) connected to the bearing and top surfaces (2, 3) and provided with leads (23, 24) with an insulating layer.
  17. Method according to claim 16, characterized by the step of providing the PTC elements (4) connected to the bearing and top surfaces (2, 3) with a powder coating.
  18. Method according to any of the preceding claims, characterized by the step of engaging and shrunking a shrink-on sleeve (38, 39) onto the PTC elements (4) connected to the bearing and top surfaces (2, 3) and provided with leads (23, 24).
EP92101601A 1991-02-15 1992-01-31 Manufacturing process of ready-made resistors Expired - Lifetime EP0499100B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP95105563A EP0677855B1 (en) 1991-02-15 1992-01-31 Resistor

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4104709A DE4104709A1 (en) 1991-02-15 1991-02-15 METHOD FOR PRODUCING MADE-UP SELF-STABLIZING RESISTORS AND SUCH A RESISTANT
DE4104709 1991-02-15

Related Child Applications (2)

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EP95105563A Division EP0677855B1 (en) 1991-02-15 1992-01-31 Resistor
EP95105563.1 Division-Into 1992-01-31

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EP0499100A2 EP0499100A2 (en) 1992-08-19
EP0499100A3 EP0499100A3 (en) 1993-04-21
EP0499100B1 true EP0499100B1 (en) 1996-05-08

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EP92101601A Expired - Lifetime EP0499100B1 (en) 1991-02-15 1992-01-31 Manufacturing process of ready-made resistors
EP95105563A Expired - Lifetime EP0677855B1 (en) 1991-02-15 1992-01-31 Resistor

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EP95105563A Expired - Lifetime EP0677855B1 (en) 1991-02-15 1992-01-31 Resistor

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US (1) US5239745A (en)
EP (2) EP0499100B1 (en)
JP (1) JP3270097B2 (en)
AT (2) ATE162332T1 (en)
DE (3) DE4104709A1 (en)

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US5835004A (en) * 1995-04-21 1998-11-10 Raychem Corporation Electrical devices and assemblies
GB9613216D0 (en) * 1996-06-25 1996-08-28 Bowthorpe Components Ltd Thermistor device
WO1998044516A1 (en) * 1997-03-27 1998-10-08 Littelfuse, Inc. Resettable automotive circuit protection device
US6058004A (en) * 1997-09-08 2000-05-02 Delaware Capital Formation, Inc. Unitized discrete electronic component arrays
US6091317A (en) * 1998-07-06 2000-07-18 Ford Motor Company Temperature sensor assembly
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EP3080967B1 (en) 2013-12-11 2021-10-13 Ademco Inc. Building automation control systems
US10488062B2 (en) 2016-07-22 2019-11-26 Ademco Inc. Geofence plus schedule for a building controller
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Also Published As

Publication number Publication date
ATE137883T1 (en) 1996-05-15
EP0677855B1 (en) 1998-01-14
DE59209141D1 (en) 1998-02-19
DE59206205D1 (en) 1996-06-13
ATE162332T1 (en) 1998-01-15
DE4104709A1 (en) 1992-08-20
EP0499100A3 (en) 1993-04-21
JP3270097B2 (en) 2002-04-02
US5239745A (en) 1993-08-31
JPH05226121A (en) 1993-09-03
EP0677855A1 (en) 1995-10-18
EP0499100A2 (en) 1992-08-19

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