EP0443483B1 - Lötverfahren für die Befestigung eines Elementes, wie z.B. eines hybriden Schaltkreissubstrats auf einer wärmeableitenden Unterlage - Google Patents

Lötverfahren für die Befestigung eines Elementes, wie z.B. eines hybriden Schaltkreissubstrats auf einer wärmeableitenden Unterlage Download PDF

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Publication number
EP0443483B1
EP0443483B1 EP91102264A EP91102264A EP0443483B1 EP 0443483 B1 EP0443483 B1 EP 0443483B1 EP 91102264 A EP91102264 A EP 91102264A EP 91102264 A EP91102264 A EP 91102264A EP 0443483 B1 EP0443483 B1 EP 0443483B1
Authority
EP
European Patent Office
Prior art keywords
hybrid circuit
substrate
fixing
pattern
heat dissipating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP91102264A
Other languages
English (en)
French (fr)
Other versions
EP0443483A1 (de
Inventor
Jacques Chave
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alstom Holdings SA
Original Assignee
GEC Alsthom SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GEC Alsthom SA filed Critical GEC Alsthom SA
Publication of EP0443483A1 publication Critical patent/EP0443483A1/de
Application granted granted Critical
Publication of EP0443483B1 publication Critical patent/EP0443483B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0373—Conductors having a fine structure, e.g. providing a plurality of contact points with a structured tool
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09681—Mesh conductors, e.g. as a ground plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to a soldering method, applicable in particular to the fixing of a hybrid circuit substrate to a heat sink support.
  • This heat dissipation is obtained by fixing, generally by soldering, the substrate of the hybrid circuit to a heat sink support, generally made of copper.
  • FIG. 1 Such an assembly is shown in section in FIG. 1, where the substrate of the hybrid circuit, the heat sink support and the components carried by this circuit are marked 1, 2, 3 respectively.
  • solder paste is generally used which is spread over one of the faces of one or the other of the elements to be brazed, coming opposite the other element.
  • the face of the hybrid circuit substrate coming opposite the heat sink support is also previously metallized in order to ensure the resistance of the soldering. In the previously known methods, this metallization is carried out uniformly over the entire surface of the face considered.
  • the subject of the present invention is a method of fixing by brazing which makes it possible to avoid this drawback.
  • the subject of the present invention is a soldering method for fixing an element such as a hybrid circuit substrate to a heat sink support, method comprising a prior metallization carried out on said element, essentially characterized in that said metallization is performed according to a pattern discontinuous, such that the dimensions of the non-metallized areas are reduced to dimensions that do not present a risk of deterioration of said element in operation.
  • this pattern 4 is produced on the face of the substrate of the hybrid circuit coming opposite the heat sink support 2.
  • This pattern consists in this case of a repeating pattern, more particularly of a grid 4, the meshes of which are sufficiently tightened in order to correctly ensure the heat transfer function between the substrate of the hybrid circuit and the heat sink support.
  • the non-metallized areas of this pattern can have dimensions from 1 to 9 mm2, and metallized lines such as 6 can have a width of the order of mm.
  • This pattern can be obtained, for example, by Palladium-Silver screen printing, the thickness of the layer thus obtained being of the order of ten microns.
  • the pattern 4 makes it possible to locate in a predetermined manner the formation of air pockets at the time of brazing, and to reduce these air pockets to dimensions presenting no risk of deterioration of the hybrid circuit in operation.
  • the shape of the pattern 4 and its dimensions may vary depending on the applications.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Claims (3)

  1. Lötverfahren zur Befestigung eines Elements, z.B. eines Substrats eines Hybrid-Schaltkreises an einem wärmeableitenden Träger, wobei zuerst dieses Element metallisiert wird, um die Haftung der Lötschicht zu sichern, dadurch gekennzeichnet, daß die Metallisierung gemäß einem unterbrochenen Muster (4) durchgeführt wird, derart, daß die Größe der nicht metallisierten Bereiche (5) ausreichend gering ist, um die Gefahr einer Beschädigung des Elements im Betrieb auszuschließen.
  2. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß das Muster repetitiv ist.
  3. Verfahren nach Anspruch 2, dadurch gekennzeichnet, daß das Muster ein Gitter ist.
EP91102264A 1990-02-23 1991-02-18 Lötverfahren für die Befestigung eines Elementes, wie z.B. eines hybriden Schaltkreissubstrats auf einer wärmeableitenden Unterlage Expired - Lifetime EP0443483B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9002277 1990-02-23
FR9002277A FR2658977A1 (fr) 1990-02-23 1990-02-23 Procede de brasage, pour la fixation d'un element tel qu'un substrat de circuit hybride a un support dissipateur thermique.

Publications (2)

Publication Number Publication Date
EP0443483A1 EP0443483A1 (de) 1991-08-28
EP0443483B1 true EP0443483B1 (de) 1993-04-07

Family

ID=9394077

Family Applications (1)

Application Number Title Priority Date Filing Date
EP91102264A Expired - Lifetime EP0443483B1 (de) 1990-02-23 1991-02-18 Lötverfahren für die Befestigung eines Elementes, wie z.B. eines hybriden Schaltkreissubstrats auf einer wärmeableitenden Unterlage

Country Status (3)

Country Link
EP (1) EP0443483B1 (de)
DE (1) DE69100058T2 (de)
FR (1) FR2658977A1 (de)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3031912A1 (de) * 1980-08-23 1982-04-01 Brown, Boveri & Cie Ag, 6800 Mannheim Anordnung zur potentialunabhaengigen waermeabfuehrung
GB8324839D0 (en) * 1983-09-16 1983-10-19 Lucas Ind Plc Mounting carrier for microelectronic silicon chip
US4603374A (en) * 1984-07-03 1986-07-29 Motorola, Inc. Packaging module for a semiconductor wafer

Also Published As

Publication number Publication date
DE69100058T2 (de) 1993-07-15
EP0443483A1 (de) 1991-08-28
DE69100058D1 (de) 1993-05-13
FR2658977A1 (fr) 1991-08-30

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