EP0439546A1 - Process and device for soldering the leads of smd components - Google Patents

Process and device for soldering the leads of smd components

Info

Publication number
EP0439546A1
EP0439546A1 EP89912626A EP89912626A EP0439546A1 EP 0439546 A1 EP0439546 A1 EP 0439546A1 EP 89912626 A EP89912626 A EP 89912626A EP 89912626 A EP89912626 A EP 89912626A EP 0439546 A1 EP0439546 A1 EP 0439546A1
Authority
EP
European Patent Office
Prior art keywords
circuit board
connections
recesses
smd components
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP89912626A
Other languages
German (de)
French (fr)
Inventor
Sven-Heiko MÜLLER
Wilhelm Spreitzer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of EP0439546A1 publication Critical patent/EP0439546A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09472—Recessed pad for surface mounting; Recessed electrode of component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09909—Special local insulating pattern, e.g. as dam around component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0568—Resist used for applying paste, ink or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the invention relates to a method for soldering the connections of SMD components on a circuit board
  • soldering the connections with the associated conductor tracks on the circuit board problems often arise in the form of poor or even open solder joints.
  • One reason for this is the non-compliance with the flatness of the connections of the SMD components, i.e. the connections are not exactly on the same level. If the solder paste is e.g. applied to the printed circuit boards by screen printing, a maximum solder paste thickness of approximately 220 ⁇ is possible. If the flatness deviation of individual connections compared to the other connections now exceeds this dimension, they are either poorly soldered or not soldered at all.
  • SMD components must not slip during the entire soldering process. Since they are simply placed on the printed circuit boards, particularly light components with few connections are at risk. The importance of this problem is increasing because the trend in the development of SMD components is towards smaller and lighter designs.
  • the object of the invention is therefore to find a method for soldering the connections of SMD components, in which flawless soldering points are always achieved even with larger deviations in the flatness of the connections.
  • very small and light SMD components should also be prevented from slipping.
  • the basic idea of the invention is that a surface structure is produced on the printed circuit board such that each of the connections of the SMD components when placed on the cable terplatte is placed in a designated recess. These recesses are located at the points where the connections are to be soldered. At the bottom of these depressions are those points of the conductor tracks on the circuit board with which the connections are to be soldered. These depressions are filled with solder / solder paste before the SMD components are placed on them.
  • Such a surface structure practically prevents slipping after the SMD components have been put in place, since it is no longer possible to simply slide sideways.
  • the respective component would first have to be lifted with its connections out of the recesses in order to be able to slip laterally.
  • the surface structure is formed by a molded part.
  • This molded part is attached to the circuit board, for example by gluing, and has recesses at the points where the connections of the SMD components are to be soldered.
  • the molded part is, for example, a plate or a film made of an insulating material that can withstand the temperatures of approximately 250 * that occur during soldering.
  • a separate molded part can also be provided for one or more SMD components.
  • the surface structure may also be achieved on a planar printed circuit board characterized 'in that the appropriate wells drilled, milled or etched, or caused by some other mechanical working.
  • the surface structure can also be achieved already during the manufacture of the printed circuit board itself, for example by spraying the printed circuit board.
  • FIG. 1 shows an SMD component with associated molded part and a printed circuit board in a spatial representation and
  • FIG. 2 shows a side view of the parts from FIG. 1.
  • FIG. 1 shows an arbitrary SMD component 3 with a plurality of connections in the form of connecting pins 31.
  • a molded part 2 is a thin plate made of insulating material, which has a series of recesses 21, which are assigned to the connection pins 31 of the SMD component 3 in terms of number and spatial arrangement.
  • the molded part 2 also has a cutout 22 which is intended to accommodate the body of the SMD component 3. This recess 22 must be present when the body of the SMD component 3 lies in the same plane as its connecting pins 31.
  • the molded part 2 is now first glued onto the printed circuit board 1 in such a way that the recesses 21 each form a depression with the contact surfaces 12 as the bottom. These wells are then filled with solder. Then the SMD component 3 is put on, its connecting pins 31 being placed in the recesses. The SMD component 3 is thus automatically correctly positioned, i.e. its pins 31 are assigned to the corresponding contact surfaces 12. Slipping of the SMD component 3 is prevented by the fact that the connecting pins 31 are held by the side edges of the depressions.
  • FIG. 2 shows an elevation of the attached SMD component 3 on the printed circuit board 1 with the molded part 2, the recesses 21 of which are filled with solder 211.

Abstract

Selon un procédé de soudage des connexions de composants (3) pour montage en surface sur une carte de circuits imprimés (1), on forme sur la carte de circuits imprimés (1) une structure en surface telle que des dépressions sont situées aux endroits où les connexions doivent être soudées. Les composants (3) pour montage en surface sont posés avec leurs connexions (31) dans les dépressions remplies de soudure.According to a method of welding the component connections (3) for surface mounting on a printed circuit board (1), a surface structure is formed on the printed circuit board (1) such that depressions are located at the places where the connections must be soldered. The components (3) for surface mounting are placed with their connections (31) in the depressions filled with solder.

Description

Verfahren zum Anlöten der Anschlüsse von SMD-BauteilenProcess for soldering the connections of SMD components
Die Erfindung betrifft ein Verfahren zum Anlöten der Anschlüsse von SMD-Bauteilen auf einer LeiterplatteThe invention relates to a method for soldering the connections of SMD components on a circuit board
Beim Verlöten der Anschlüsse mit den zugehörigen Leiterbahnen auf der Leiterplatte treten oft Probleme in Form von schlechten oder sogar offenen Lötstellen auf. Ein Grund dafür liegt in der nicht eingehaltenen Planität der Anschlüsse der SMD-Bauteile, d.h. die Anschlüsse liegen nicht exakt in derselben Ebene. Wird die Lotpaste z.B. im Siebdruckverfahren auf die Leiterplatten aufgebracht, so ist eine maximale Lotpastenstärke von ungefähr 220 μ möglich. Übersteigt nun die Planitätsabweichung einzel¬ ner Anschlüsse gegenüber den anderen Anschlüssen dieses Maß, so werden diese entweder schlecht oder gar nicht verlötet.When soldering the connections with the associated conductor tracks on the circuit board, problems often arise in the form of poor or even open solder joints. One reason for this is the non-compliance with the flatness of the connections of the SMD components, i.e. the connections are not exactly on the same level. If the solder paste is e.g. applied to the printed circuit boards by screen printing, a maximum solder paste thickness of approximately 220 μ is possible. If the flatness deviation of individual connections compared to the other connections now exceeds this dimension, they are either poorly soldered or not soldered at all.
Ein weiteres Problem ist, daß die SMD-Bauteile während des ge¬ samten Lötvorganges nicht verrutschen dürfen. Da sie dabei ein¬ fach auf die Leiterplatten aufgesetzt sind, sind besonders leichte Bauteile mit wenig Anschlüssen gefährdet. Die Bedeutung dieses Problems nimmt zu, da der Trend bei der Entwicklung der SMD-Bauteile zu immer kleineren und leichteren Bauformen geht.Another problem is that the SMD components must not slip during the entire soldering process. Since they are simply placed on the printed circuit boards, particularly light components with few connections are at risk. The importance of this problem is increasing because the trend in the development of SMD components is towards smaller and lighter designs.
Die Aufgabe der Erfindung besteht deshalb darin, ein Verfahren zum Anlöten der Anschlüsse von SMD-Bauteilen zu finden, bei dem auch bei größeren Planitätsabweichungen der Anschlüsse immer einwandfreie Lötstellen erreicht werden. Außerdem soll auch ein Verrutschen sehr kleiner und leichter SMD-Bauteile sicher ver¬ hindert werden.The object of the invention is therefore to find a method for soldering the connections of SMD components, in which flawless soldering points are always achieved even with larger deviations in the flatness of the connections. In addition, very small and light SMD components should also be prevented from slipping.
Die erfindungsgemäße Lösung ist im Anspruch 1 gekennzeichnet. Vorteilhafte Weiterbildungen finden sich in den Unteransprüchen.The solution according to the invention is characterized in claim 1. Advantageous further developments can be found in the subclaims.
Die Grundidee der Erfindung besteht darin, daß auf der Leiter¬ platte eine derartige Oberflächenstruktur erzeugt wird, daß je¬ der der Anschlüsse der SMD-Bauteile beim Aufsetzen auf die Lei- terplatte in eine dafür vorgesehene Vertiefung gesetzt wird. Diese Vertiefungen befinden sich an den Stellen, an denen die Anschlüsse anzulöten sind. Am Boden dieser Vertiefungen sind dann diejenigen Stellen der Leiterbahnen auf der Leiterplatte, mit denen die Anschlüsse zu verlöten sind. Diese Vertiefungen werden vor dem Aufsetzen der SMD-Bauteile mit Lot/Lotpaste ge¬ füllt.The basic idea of the invention is that a surface structure is produced on the printed circuit board such that each of the connections of the SMD components when placed on the cable terplatte is placed in a designated recess. These recesses are located at the points where the connections are to be soldered. At the bottom of these depressions are those points of the conductor tracks on the circuit board with which the connections are to be soldered. These depressions are filled with solder / solder paste before the SMD components are placed on them.
Durch eine solche Oberflächenstruktur ist ein Verrutschen nach dem Aufsetzen der.SMD-Bauteile praktisch verhindert, da ein einfaches seitliches Verrutschen nicht mehr möglich ist. Das jeweilige Bauteil müßte erst wieder mit seinen Anschlüssen aus den Vertiefungen angehoben werden, um seitlich verrutschen zu können.Such a surface structure practically prevents slipping after the SMD components have been put in place, since it is no longer possible to simply slide sideways. The respective component would first have to be lifted with its connections out of the recesses in order to be able to slip laterally.
Durch die freiwählbare Tiefe der Vertiefungen sind auch sehr große Abweichungen bei der Planität der Anschlüsse kein Problem mehr, da die Vertiefungen vollkommen mit Lot aufgefüllt werden.Due to the freely selectable depth of the recesses, very large deviations in the flatness of the connections are no longer a problem, since the recesses are completely filled with solder.
Bei bereits bestehenden planen Leiterplatten z.B. aus Keramik oder Hartgewebematerial wird die Oberflächenstruktur durch ein Formteil gebildet. Dieses Formteil wird auf der Leiterplatte z.B. durch Kleben befestigt und hat an den Stellen, an denen die Anschlüsse der SMD-Bauteile anzulöten sind Ausnehmungen. Das Formteil ist z.B. ein Plättchen oder eine Folie aus einem Isoliermaterial, das den beim Löten auftretenden Temperaturen von ungefähr 250* standhält.In the case of existing flat circuit boards, for example made of ceramic or hard tissue material, the surface structure is formed by a molded part. This molded part is attached to the circuit board, for example by gluing, and has recesses at the points where the connections of the SMD components are to be soldered. The molded part is, for example, a plate or a film made of an insulating material that can withstand the temperatures of approximately 250 * that occur during soldering.
Statt die gesamte Leiterplatten mit einem Formteil für alle SMD-Bauteile abzudecken, kann auch für ein oder mehrere SMD- Bauteile zusammen jeweils ein eigenes Formteil vorgesehen sein.Instead of covering the entire circuit board with a molded part for all SMD components, a separate molded part can also be provided for one or more SMD components.
Die Oberflachenstruktur kann auf einer planen Leiterplatte auch dadurch' erreicht werden, daß die entsprechenden Vertiefungen ausgebohrt, gefräst oder geätzt sind, bzw. durch eine sonstige mechanische Bearbeitung entstanden sind. Die Oberflächenstruktur kann ferner, bereits bei der Herstel¬ lung der Leiterplatte selbst z.B. durch Spritzen der Leiter¬ platte, erzielt werden.The surface structure may also be achieved on a planar printed circuit board characterized 'in that the appropriate wells drilled, milled or etched, or caused by some other mechanical working. The surface structure can also be achieved already during the manufacture of the printed circuit board itself, for example by spraying the printed circuit board.
Die Erfindung wird anhand der Figuren näher erläutert. Dabei zeigen:The invention is explained in more detail with reference to the figures. Show:
Figur 1 ein SMD-Bauteil mit zugehörigem Formteil und einer Lei¬ terplatte in räumlicher Darstellung und Figur 2 eine Seitenansicht der Teile aus Figur 1.1 shows an SMD component with associated molded part and a printed circuit board in a spatial representation and FIG. 2 shows a side view of the parts from FIG. 1.
Die Figur 1 zeigt ein beliebiges SMD-Bauteil 3 mit einer Mehr¬ zahl von Anschlüssen in Form von Anschlußstiften 31. Auf einer Leiterplatte 1 sind bereits Leiterbahnen 11 aufgebracht, die an den Stellen, an denen die Anschlußstifte 31 anzulöten sind, zu Kontaktflächen 12 vergrößert sind. Ein Formteil 2 ist ein dün¬ nes Plättchen aus Isoliermaterial, das eine Reihe von Ausneh¬ mungen 21 aufweist, die nach Zahl und räumlicher Anordnung den Anschlußstiften 31 des SMD-Bauteils 3 zugeordnet sind. Das Formteil 2 weist noch eine Aussparung 22 auf, die dazu bestimmt ist, den Körper des SMD-Bauteils 3 aufzunehmen. Diese Ausspa¬ rung 22 muß dann vorhanden sein, wenn der Körper des SMD-Bau¬ teils 3 in der gleichen Ebene liegt wie dessen Anschlußstifte 31.FIG. 1 shows an arbitrary SMD component 3 with a plurality of connections in the form of connecting pins 31. On a printed circuit board 1, conductor tracks 11 have already been applied, which are enlarged to contact areas 12 at the points at which the connecting pins 31 are to be soldered are. A molded part 2 is a thin plate made of insulating material, which has a series of recesses 21, which are assigned to the connection pins 31 of the SMD component 3 in terms of number and spatial arrangement. The molded part 2 also has a cutout 22 which is intended to accommodate the body of the SMD component 3. This recess 22 must be present when the body of the SMD component 3 lies in the same plane as its connecting pins 31.
Zum Anlöten des SMD-Bauteils 3 wird nun zuerst das Formteil 2 so auf der Leiterplatte 1 aufgeklebt, daß die Ausnehmungen 21 mit den Kontaktflächen 12 als Boden jeweils eine Vertiefung bilden. Diese Vertiefungen werden dann mit Lot gefüllt. Danach wird das SMD-Bauteil 3 aufgesetzt, wobei dessen Anschlußstifte 31 in die Vertiefungen gesetzt werden. Das SMD-Bauteil 3 ist da¬ mit automatisch richtig positioniert, d.h. seine Anschlußstifte 31 sind den entsprechenden Kontaktflächen 12 zugeordnet. Ein Verrutschen des SMD-Bauteils 3 ist dadurch verhindert, daß die Anschlußstifte 31 durch die Seitenränder der Vertiefungen gehal- ten sind.To solder the SMD component 3, the molded part 2 is now first glued onto the printed circuit board 1 in such a way that the recesses 21 each form a depression with the contact surfaces 12 as the bottom. These wells are then filled with solder. Then the SMD component 3 is put on, its connecting pins 31 being placed in the recesses. The SMD component 3 is thus automatically correctly positioned, i.e. its pins 31 are assigned to the corresponding contact surfaces 12. Slipping of the SMD component 3 is prevented by the fact that the connecting pins 31 are held by the side edges of the depressions.
In der Figur 2 ist ein Aufriß des aufgesetzten SMD-Bauteils 3 auf der geschnitten dargestellten Leiterplatte 1 mit dem Form¬ teil 2, dessen Ausnehmungen 21 mit Lot 211 gefüllt sind, ge¬ zeigt. FIG. 2 shows an elevation of the attached SMD component 3 on the printed circuit board 1 with the molded part 2, the recesses 21 of which are filled with solder 211.

Claims

Patentansprüche Claims
1. Verfahren zum Anlöten der Anschlüsse (31) von SMD-Bauteilen (3) auf einer Leiterplatte (1), d a d u r c h g e k e n n z e i c h n e t , daß auf der Leiterplatte (1) eine solche Oberflächenstruktur er¬ zeugt wird, daß zumindest an den Stellen, an denen die Anschlüs¬ se (31) anzulöten sind, Vertiefungen zur Aufnahme dieser An¬ schlüsse (31) entstehen, daß die Vertiefungen mit Lot gefüllt werden, und daß die SMD-Bauteile (3) beim Aufbringen auf die Leiterplatte (1) mit ihren Anschlüssen (31) in die Vertiefungen gesetzt wer¬ den.1. A method for soldering the connections (31) of SMD components (3) on a circuit board (1), characterized in that such a surface structure is produced on the circuit board (1) that at least at the points where the Connections (31) are to be soldered, recesses for receiving these connections (31) are created, that the recesses are filled with solder, and that the SMD components (3) are attached to the circuit board (1) with their connections ( 31) are placed in the depressions.
2. Verfahren nach Anspruch 1, d a d u r c h g e k e n n z e i c h n e t , daß die Oberflächenstruktur durch ein Formteil mit Ausnehmungen (21) gebildet wird, das auf einer Seite der Leiterplatte aufge¬ bracht wird.2. The method according to claim 1, so that the surface structure is formed by a molded part with recesses (21) which is applied to one side of the printed circuit board.
3. Verfahren nach Anspruch 2, d a d u r c h g e k e n n z e i c h n e t , daß als Formteil eine Folie aufgebracht wird.3. The method of claim 2, d a d u r c h g e k e n n z e i c h n e t that a film is applied as a molded part.
4. Verfahren nach Anspruch 3, d a d u r c h g e k e n n z e i c h n e t , daß die Folie aufgeklebt wird.4. The method of claim 3, d a d u r c h g e k e n n z e i c h n e t that the film is glued on.
5. Verfahren nach Anspruch 3, d a d u r c h g e k e n n z e i c h n e t , daß eine Folie mit Ausnehmungen (21) für mehrere SMD-Bauteile (3) einer Leiterplatte verwendet wird.5. The method of claim 3, d a d u r c h g e k e n n z e i c h n e t that a film with recesses (21) for several SMD components (3) of a circuit board is used.
6. Verfahren nach Anspruch 1, d a d u r c h g e k e n n z e i c h n e t , daß die Vertiefungen ausgehend von der Oberfläche der Leiter¬ platte (1) aus dieser ausgespart werden. 6. The method according to claim 1, characterized in that the recesses starting from the surface of the printed circuit board (1) are recessed from this.
7. Verfahren nach Anspruch 5, d a d u r c h g e k e n n z e i c h n e t , daß die Leiterplatte (1) mit den Vertiefungen gespritzt wird.7. The method according to claim 5, d a d u r c h g e k e n n z e i c h n e t that the circuit board (1) is sprayed with the wells.
8. Verfahren nach Anspruch 5, d a d u r c h g e k e n n z e i c h n e t , daß die Vertiefungen aus der Oberfläche der Leiterplatte. (1) mechanisch oder chemisch herausgearbeitet werden. 8. The method of claim 5, d a d u r c h g e k e n n z e i c h n e t that the recesses from the surface of the circuit board. (1) be worked out mechanically or chemically.
EP89912626A 1988-10-20 1989-10-20 Process and device for soldering the leads of smd components Withdrawn EP0439546A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP88117480 1988-10-20
EP88117480 1988-10-20

Publications (1)

Publication Number Publication Date
EP0439546A1 true EP0439546A1 (en) 1991-08-07

Family

ID=8199476

Family Applications (1)

Application Number Title Priority Date Filing Date
EP89912626A Withdrawn EP0439546A1 (en) 1988-10-20 1989-10-20 Process and device for soldering the leads of smd components

Country Status (2)

Country Link
EP (1) EP0439546A1 (en)
WO (1) WO1990004912A1 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04354398A (en) * 1991-05-31 1992-12-08 Internatl Business Mach Corp <Ibm> Wiring board and manufacture thereof
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