EP0437035A2 - Système de connecteur modulaire - Google Patents

Système de connecteur modulaire Download PDF

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Publication number
EP0437035A2
EP0437035A2 EP90312923A EP90312923A EP0437035A2 EP 0437035 A2 EP0437035 A2 EP 0437035A2 EP 90312923 A EP90312923 A EP 90312923A EP 90312923 A EP90312923 A EP 90312923A EP 0437035 A2 EP0437035 A2 EP 0437035A2
Authority
EP
European Patent Office
Prior art keywords
wafer
lead
rows
portions
contacts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP90312923A
Other languages
German (de)
English (en)
Other versions
EP0437035A3 (en
Inventor
David Edward Welsh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Micronas GmbH
ITT Inc
Original Assignee
Deutsche ITT Industries GmbH
ITT Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Deutsche ITT Industries GmbH, ITT Industries Inc filed Critical Deutsche ITT Industries GmbH
Publication of EP0437035A2 publication Critical patent/EP0437035A2/fr
Publication of EP0437035A3 publication Critical patent/EP0437035A3/en
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
    • H01R43/24—Assembling by moulding on contact members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
    • H01R13/405—Securing in non-demountable manner, e.g. moulding, riveting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/502—Bases; Cases composed of different pieces
    • H01R13/508—Bases; Cases composed of different pieces assembled by a separate clip or spring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections

Definitions

  • This invention relates to electrical connectors and modular connector systems incorporating such connectors and to methods of fabricating electrical connectors.
  • Aircraft and military electronic equipment is often designed to include circuit board assemblies or modules that are each formed of a plate-like metal heat sink sandwiched between a pair of circuit boards.
  • the module is connected to a back plane or mother board through an electrical connector system with one electrical connector joined to an edge of the module.
  • the connector has two rows of leads that contact two rows of electric terminals extending along the edges of the boards.
  • the connector usually must have a large number of contacts, such as more than 300, and yet the length of the connector is limited. Such a large number of contacts is accommodated by arranging them in multiple rows, such as in eight rows (i.e. four staggered rows). however, the leads extending from the contacts to the circuit boards, must lie in two parallel rows, with the leads closely spaced along the rows, such as at a spacing or pitch of 25 mil (one mil equals 0.001 inch).
  • a reliable connector having multiple leads that extend from the multiple rows of contacts into two rows of lead rear portions, which can be constructed at moderate cost, would be of considerable value.
  • the plate-like heat sink can be thermally connected to a heat dissipator such as a metal cold plate, by clamping an edge of the heat sink thereto. Such clamping may displace the heat sink and module by a small but significant amount such as 10 mil.
  • a heat dissipator such as a metal cold plate
  • clamping may displace the heat sink and module by a small but significant amount such as 10 mil.
  • an insert in the connector on which the contacts are mounted be capable of slight lateral displacement without significant stress.
  • a connector which enabled efficient "floating" of a connector insert would also be of considerable value.
  • an electrical connector comprises a wafer device of insulative material having front and rear faces, and a plurality of leads that include front portions projecting from the wafer device front face and lying in at least four rows, rear portions projecting from the wafer device rear face and having locations lying in two rows, and middle portions lying in the wafers, characterised in that the wafer device includes a pair of substantially identical wafers having adjacent edges extending primarily parallel to the rows of front lead portions with the wafer edges of the pair of wafers lying adjacent to one another, and in that the leads include a plurality of leads having middle portions moulded into each wafer, with the plurality of leads of each wafer having front portions lying in at least two rows and rear portion locations lying in a single row.
  • Each of the lead front portions projecting from the front face of a wafer may be received by a hollow rear portion of a contact that surrounds a lead front portion and which is joined thereto as by soldering.
  • Each wafer may have a forwardly projecting tower that closely surrounds the rear portion of each contact to mechanically hold the contact. The fact that the front portions of the leads are moulded into the wafer at the same time that the towers are formed, assures precise concentricity of the front lead portions and towers.
  • the wafer device assembly may be part of an insert that lies in a housing that is fixed to the circuit board assembly.
  • the insert is allowed to "float" with respect to the circuit board assembly, by providing the insert with rearwardly projecting leaf springs whose free ends bear against opposite inside surfaces of the housing.
  • the leaf springs tend to hold the insert centred in the housing, but allow the insert to shift sidewardly with respect to the housing without substantial stress on any parts of the system.
  • the invention also provides an electrical connector system incorporating a connector associated with a circuit board assembly and a method of fabricating such connectors.
  • Figure 1 illustrates a connector system 10 which includes two mateable connectors 12,14 that can be mated to connect a circuit board assembly 16 to a mother board 20.
  • the circuit assembly 16 includes two circuit boards 22,24 joined facewise by a thermally-conducting adhesive to opposite faces of a plate-like heat sink 26.
  • the connector 12 has a large number of contacts 30, socket contacts being shown, with the contacts arranged in multiple rows and columns to accommodate a large number of contacts in a connector of limited length. Complex equipment using this type of connector system usually requires more than 300 contacts in a length such as five inches.
  • the contact assembly includes an insert 32 that lies within a housing 34 which is rigidly mounted to the heat sink 26 of the circuit board assembly.
  • the mounting is accomplished through lugs 33 ( Figure 2) on the housing that straddle locations 35 on the heat sink and that are pinned to the heat sink.
  • the assembly also includes a thin metal shell 36 around the housing.
  • the insert includes a large number of leads 40 ( Figure 1) that have forward portions connected to the contacts 30 and rearward portions that engage terminals 42,43 on the circuit boards 22,24, with the terminals lying near an edge of each board.
  • FIG. 3 illustrates some details of the connector 12.
  • the insert 32 includes a wafer device 44 of insulative material and a forward insulator 46 lying on a forward face of the wafer device.
  • Each lead 40 includes a forward portion 50 connected to a contact 30, a rearward portion 52 with a location 54 that engages a terminal 42 on a circuit board such as 22, and a middle portion 56 that lies within the wafer device 44.
  • the middle portion 56 of each lead is moulded into part of the wafer device 44.
  • the contacts 30 lie in eight rows as indicated by row lines 61-68.
  • the rearward lead portions 52 lie in only two rows indicated at 70a and 72a to contact the two rows of terminals 42,43 on the two circuit boards 22,24.
  • the middle portions 56 of different leads such as 40A-40D that connect to contacts in four different rows 61-64 are bent differently so as to extend the four leads to rear lead portions that all lie in the same row 72a. 8X(It should be noted that the forward portions of leads 40A-40D do not all lie in the same column, as will be discussed below).
  • the wafer device 44 is formed of two separate wafers 74,76.
  • Each wafer has a first or outer side 74a, 76a, and a second or inner side 74b, 76b, the wafers being joined together at their inner sides or edges.
  • the inner edge of each wafer forms complimentary tongues 80 and grooves 82 between tongues.
  • a first end such as 74c of a wafer has a groove 82e closest to its end, while the opposite end 74d of the wafer has a tongue 80e closest to its end.
  • the two wafers 74,76 are identical, and can be joined at their inner edges to form the wafer device 44.
  • Each wafer such as 74 holds four rows of contacts at 61-64 and leads with rear portions lying along a single row 72. When the two wafers are joined, they provide eight rows of contacts and two rows of rear lead portions (at 72 and 70).
  • Each wafer such as 74 and the leads 40 moulded therein form a wafer assembly, there being two wafer assemblies 84,86. When joined together they form a wafer device assembly 90 which includes the wafer device 44 and all of the leads moulded into it.
  • Each wafer assembly such as 84 is formed separately from the other one 86, which makes manufacture of the apparatus much easier.
  • a large number of lead devices must be held in precise positions relative to the mould that forms the wafer 74.
  • the mould traps the rear and front portions 52,50 ( Figure 3) of each lead while a plastic material is injected into the mould to form the wafer. The fact that the mould has to position only a single row of leads, facilitates manufacture.
  • the contacts are located in columns such as 92,94,96, with each column having four contacts.
  • the first column 92 has four contacts 101,103,105 and 107, while an adjacent second column 94 has four contacts 102,104,106 and 108.
  • the rows of contacts are staggered, in that a second contact 102 lies on a row line 62 that extends between first and third contact rows 61,63.
  • some contacts in the first and third rows 61,63 lie in first and third columns 92,96, while contacts in the second and fourth rows 62,64 lie in a column 94 halfway between the first and third columns.
  • the first column 92 which lies nearest the first end 74c of a wafer contains contacts in the first and third rows 61,63 while a last column of contacts 110 on the same wafer contains contacts 112,114 in the second and fourth rows 62,64.
  • the leads have four different configurations on each wafer.
  • the lead middle portions 56 form transitions between the single row of rear lead portion 52 and the multiple row front lead portions 50.
  • the lead includes a front portion 50 with an axis 119 lying concentric with a contact, a first middle portion 120 extending in a longitudinal direction x parallel to a row, and a second middle portion 122 extending in a longitudinally direction y parallel to a column.
  • the rear end of the middle portion lies at 124 where it merges with the top of the rearward lead portion 52.
  • a next lead 40C has a first middle portion 126 which extends only parallel to the column direction.
  • Another lead 40D is a mirror image of the first one 40A, while a lead 40B is a mirror image of 40C.
  • This arrangement results in the lead rear portions 52 lying in a row such as 70, at a spacing or pitch B which is one half the spacing or pitch C of the columns of contacts. It also may*p781 beed that the rear of the middle lead portions (at 128 in Figure 4) are bent to extend at an incline in the x direction, in order to align the rear lead portions of the two rows of leads.
  • Figure 5 illustrates the manner in which a contact 30 is connected to a lead front portion 50.
  • the wafer 76 is moulded to include a tower 130 which is in the form of a tube that projects forwardly from a front face 132 of the wafer.
  • the tower 130 is of a size to closely surround a rearward portion 134 of the contact.
  • the contact has a hollow rear portion that surrounds the lead forward portion 50.
  • a sleeve 136 of solderable material is placed around the lead front portion 50 prior to inserting the contact 30 into the tower 130. After all contacts are inserted, the wafer device assembly is heated to melt the sleeve 136, so it flows onto the contact and lead front portion to electrically connect them.
  • Other connection schemes can be resorted to, such as coating portions of the contacts and/or lead forward portions with solderable material or applying solder after the contacts are installed.
  • the axis 119 of the lead forward portion 50 and the axis of the tower 130 can be maintained precisely concentric, because the lead forward portion is held in the same mould which moulds the tower. This assures that when the contact 30 is installed, it will fit into the space between the tower and lead forward portion, and around the sleeve 136. It may be noted that the contact 30 is often provided with a protective hood 142.
  • the forward insulator 46 lies over the forward face of the wafer 76 and closely holds the hood 142.
  • the forward insulator 46 and wafer device 44 together form an insulator assembly 145.
  • the connector is constructed by forming multiple leads 40 on a carrier (not shown) attached to the rear ends of the leads, and deforming the middle portions of the leads.
  • a row of leads is placed in a mould, with the front portions of the leads precisely held, and a plastic material is moulded around the middle portions of the leads to form a wafer assembly.
  • the rear portions of the leads which originally extended in straight lines in line with portion 124, are bent to the configuration shown in Figure 3.
  • the contacts 30 are installed on the front faces of the wafer assembly. Two identical wafer assemblies are joined to form a wafer device assembly.
  • the forward insulator 46 is then installed over the front face of the assembly on which the contacts have been installed, to form the insert 32.
  • the insert is then installed in the connector housing 34.
  • the rear lead portions are spread apart and slid onto the faces of the circuit board 22,24 to contact the terminals 42,43 on the circuit boards.
  • the heat sink 26 ( Figure 1) of the circuit board assembly 16 may then be clamped as by clamp mechanism 140 against a heat dissipating apparatus 142.
  • the circuit board assembly and the connector housing 34 may be sidewardly displaced by a small distance such as by 0.010 inch. If the insert, including the contacts, were also to be displaced by this amount, then there could be stresses in the housing, wafer, and contacts, if the mating connector resists sideward shifting. To avoid such high stresses, the insert is mounted in the manner shown in Figure 3, where it can be seen that the insert 32 has a pair of centering springs 150,152 at is opposite sides.
  • the springs are of largely leaf spring construction, in that they include an elongated resiliently bendable member. The springs extend primarily in rearward and forward directions.
  • Each centering spring has an inner end 154 mounted on and part of the insert insulator and a free outer end 156 that is biased against an inside surface 160 on the connector housing 34.
  • the springs lie at opposite sides of the insert and tend to centre the insert within the housing. However, if the insert is held against sideward movement as by a mating connector, the housing can move sidewardly relative to the insert by additional deflection of the one of the springs and release of some of the deflection of the opposite spring.
  • the housing walls include wide front portions 162 and narrower rearward portions 164 against which the spring free ends bear.
  • the housing also has angled wall portions such as 166 which gradually compress the springs as the insert is inserted in a rearward direction into the housing.
  • the connector also includes latches 170 ( Figure 2) that hold the insert in place, but allow the insert to be removed by inserting a special tool that deflects the latches toward each other to allow the insert to be pulled forwardly out of the housing. It can be seen in Figure 2, that each insert 32 includes springs 150A, 150B near its opposite ends, and includes latches 170 at its opposite ends.
  • Figure 8 illustrates another arrangement, wherein pin type contacts 180 are installed, instead of a socket type.
  • the wafer 182 includes a tower 184 surrounding each lead front portion 186 and lying concentric with the axis 190 of the lead front portion.
  • the contact has a hollow rearward portion 192 that is closely received within the tower 184 and which receives the lead front portion 186.
  • the inside of the contact rear portion can be coated with solderable material which, when heated, joins to the lead front portion.
  • the invention provides a connector which has leads that connect multiple rows of contacts to two rows of terminals on a circuit board assembly, which can be constructed at relatively low cost.
  • the connector includes an insert with a wafer device assembly that includes two substantially identical wafer assemblies.
  • Each wafer assembly includes leads whose rearward portions extend in a single row, and whose forward portions lie in multiple rows to connect to contacts lying in multiple rows.
  • the centre portions of the leads are moulded into a wafer which has a side or edge which can be joined to an identical wafer.
  • Each wafer is moulded with a forwardly projecting tower concentric with the axis of the forward portion of a lead, to precisely hold a hollow rear portion of a contact between them.
  • Each insert includes elongated centering springs extending in a rearward direction, with free ends bearing against an inside wall of a housing, to centre the insert within the housing but allow the housing to move sidewardly slightly without applying large stresses to parts of the connector.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
EP19900312923 1990-01-11 1990-11-28 Modular connector system Ceased EP0437035A3 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US46358690A 1990-01-11 1990-01-11
US463586 1990-01-11

Publications (2)

Publication Number Publication Date
EP0437035A2 true EP0437035A2 (fr) 1991-07-17
EP0437035A3 EP0437035A3 (en) 1991-11-06

Family

ID=23840606

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19900312923 Ceased EP0437035A3 (en) 1990-01-11 1990-11-28 Modular connector system

Country Status (1)

Country Link
EP (1) EP0437035A3 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0918379A2 (fr) * 1997-11-24 1999-05-26 Thomas & Betts International, Inc. Couvercle pour un connecteur monté sur le bord d'un circuit imprimé
CN108448306A (zh) * 2018-02-12 2018-08-24 北京小米移动软件有限公司 Usb连接结构和具有该usb连接结构的电子设备

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4447109A (en) * 1982-06-04 1984-05-08 Western Electric Company, Inc. Connector pin
DE8630076U1 (fr) * 1986-11-10 1987-01-15 Siemens Ag, 1000 Berlin Und 8000 Muenchen, De
EP0286440A2 (fr) * 1987-04-09 1988-10-12 RAYCHEM CORPORATION (a Delaware corporation) Assemblage connecteur
US4884335A (en) * 1985-06-21 1989-12-05 Minnesota Mining And Manufacturing Company Surface mount compatible connector system with solder strip and mounting connector to PCB

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4447109A (en) * 1982-06-04 1984-05-08 Western Electric Company, Inc. Connector pin
US4884335A (en) * 1985-06-21 1989-12-05 Minnesota Mining And Manufacturing Company Surface mount compatible connector system with solder strip and mounting connector to PCB
DE8630076U1 (fr) * 1986-11-10 1987-01-15 Siemens Ag, 1000 Berlin Und 8000 Muenchen, De
EP0286440A2 (fr) * 1987-04-09 1988-10-12 RAYCHEM CORPORATION (a Delaware corporation) Assemblage connecteur

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0918379A2 (fr) * 1997-11-24 1999-05-26 Thomas & Betts International, Inc. Couvercle pour un connecteur monté sur le bord d'un circuit imprimé
EP0918379A3 (fr) * 1997-11-24 2001-02-07 Thomas & Betts International, Inc. Couvercle pour un connecteur monté sur le bord d'un circuit imprimé
CN108448306A (zh) * 2018-02-12 2018-08-24 北京小米移动软件有限公司 Usb连接结构和具有该usb连接结构的电子设备

Also Published As

Publication number Publication date
EP0437035A3 (en) 1991-11-06

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