EP0395051A3 - Leiterplattensteckverbinder zur Oberflächenmontage - Google Patents

Leiterplattensteckverbinder zur Oberflächenmontage Download PDF

Info

Publication number
EP0395051A3
EP0395051A3 EP19900107935 EP90107935A EP0395051A3 EP 0395051 A3 EP0395051 A3 EP 0395051A3 EP 19900107935 EP19900107935 EP 19900107935 EP 90107935 A EP90107935 A EP 90107935A EP 0395051 A3 EP0395051 A3 EP 0395051A3
Authority
EP
European Patent Office
Prior art keywords
circuit board
printed
contact elements
board connector
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP19900107935
Other languages
English (en)
French (fr)
Other versions
EP0395051A2 (de
EP0395051B1 (de
Inventor
Peter Dipl.-Ing. Klimke
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wincor Nixdorf International GmbH
Original Assignee
Siemens AG
Wincor Nixdorf International GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Wincor Nixdorf International GmbH filed Critical Siemens AG
Publication of EP0395051A2 publication Critical patent/EP0395051A2/de
Publication of EP0395051A3 publication Critical patent/EP0395051A3/de
Application granted granted Critical
Publication of EP0395051B1 publication Critical patent/EP0395051B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7005—Guiding, mounting, polarizing or locking means; Extractors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit

Landscapes

  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
  • Connections Arranged To Contact A Plurality Of Conductors (AREA)

Abstract

Der Isolierkörper eines Leiterplattensteckverbinders ist vor einer Stirnfläche einer Leiterplatte derart befestigt, daß erste und zweite Kontaktelemente oberhalb bzw. unterhalb der Leiterplattenebene angeordnet sind. Dritte Kontaktelemente be­ finden sich in einem Zwischenbereich etwa in Höhe der Stirn­ fläche. Die ersten und zweiten Kontaktelemente sind mit Kon­ taktierungsflächen an der Ober- bzw. Unterseite der Leiterplat­ te über flexible Leiterstücke verbunden. Die dritten Kontakt­ elemente weisen starre Lötfahnen auf, die an weiteren Kontak­ tierungsoberflächen an der Oberseite der Leiterplatte befestigt sind.
EP90107935A 1989-04-28 1990-04-26 Leiterplattensteckverbinder zur Oberflächenmontage Expired - Lifetime EP0395051B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE8905434U DE8905434U1 (de) 1989-04-28 1989-04-28
DE8905434U 1989-04-28

Publications (3)

Publication Number Publication Date
EP0395051A2 EP0395051A2 (de) 1990-10-31
EP0395051A3 true EP0395051A3 (de) 1991-09-25
EP0395051B1 EP0395051B1 (de) 1994-10-12

Family

ID=6838816

Family Applications (1)

Application Number Title Priority Date Filing Date
EP90107935A Expired - Lifetime EP0395051B1 (de) 1989-04-28 1990-04-26 Leiterplattensteckverbinder zur Oberflächenmontage

Country Status (3)

Country Link
EP (1) EP0395051B1 (de)
AT (1) ATE112896T1 (de)
DE (2) DE8905434U1 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10029925C1 (de) * 2000-06-17 2002-01-10 Harting Kgaa Leiterplattensteckverbindung
JP2003045519A (ja) * 2001-07-19 2003-02-14 Molex Inc ライトアングル型の電気コネクタ
DE202012002352U1 (de) 2011-05-17 2012-04-18 Erni Electronics Gmbh Anordnung aus Steckverbinder und Leiterplatte
CN110137721B (zh) * 2018-02-09 2021-01-26 巧连科技股份有限公司 电连接器结构

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3315217A (en) * 1965-03-19 1967-04-18 Elco Corp Connector for thin film circuits
DE2525864A1 (de) * 1975-06-10 1976-12-30 Siemens Ag Anordnung zur erhoehung der kontaktanzahl bei steckverbindern von steckbaren flachbaugruppen
EP0278869A2 (de) * 1987-02-09 1988-08-17 Augat Inc. Kontaktführungsplan für Leiterplatte
EP0286440A2 (de) * 1987-04-09 1988-10-12 RAYCHEM CORPORATION (a Delaware corporation) Verbinderanordnung

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3315217A (en) * 1965-03-19 1967-04-18 Elco Corp Connector for thin film circuits
DE2525864A1 (de) * 1975-06-10 1976-12-30 Siemens Ag Anordnung zur erhoehung der kontaktanzahl bei steckverbindern von steckbaren flachbaugruppen
EP0278869A2 (de) * 1987-02-09 1988-08-17 Augat Inc. Kontaktführungsplan für Leiterplatte
EP0286440A2 (de) * 1987-04-09 1988-10-12 RAYCHEM CORPORATION (a Delaware corporation) Verbinderanordnung

Also Published As

Publication number Publication date
DE59007421D1 (de) 1994-11-17
DE8905434U1 (de) 1990-08-23
EP0395051A2 (de) 1990-10-31
EP0395051B1 (de) 1994-10-12
ATE112896T1 (de) 1994-10-15

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