EP0395051A2 - Surface mounted printed circuit board connector - Google Patents

Surface mounted printed circuit board connector Download PDF

Info

Publication number
EP0395051A2
EP0395051A2 EP19900107935 EP90107935A EP0395051A2 EP 0395051 A2 EP0395051 A2 EP 0395051A2 EP 19900107935 EP19900107935 EP 19900107935 EP 90107935 A EP90107935 A EP 90107935A EP 0395051 A2 EP0395051 A2 EP 0395051A2
Authority
EP
European Patent Office
Prior art keywords
circuit board
contact elements
printed circuit
contact
connector according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP19900107935
Other languages
German (de)
French (fr)
Other versions
EP0395051A3 (en
EP0395051B1 (en
Inventor
Peter Dipl.-Ing. Klimke
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wincor Nixdorf International GmbH
Original Assignee
Siemens AG
Wincor Nixdorf International GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Wincor Nixdorf International GmbH filed Critical Siemens AG
Publication of EP0395051A2 publication Critical patent/EP0395051A2/en
Publication of EP0395051A3 publication Critical patent/EP0395051A3/en
Application granted granted Critical
Publication of EP0395051B1 publication Critical patent/EP0395051B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7005—Guiding, mounting, polarizing or locking means; Extractors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit

Definitions

  • the invention relates to a printed circuit board connector for surface mounting with a plurality of contact elements arranged in an essentially cuboid insulating body and with connecting means for electrically connecting the contact elements to contacting surfaces located on a printed circuit board.
  • PCB connectors for surface mounting are already available in different versions.
  • a connector for SMD technology in which the contact elements have specially designed contact legs that protrude from a strip-shaped insulating body. These contact legs extend to the contacting surfaces on the printed circuit board.
  • the contact elements of the known connector are arranged, for example, in three rows of contact elements one above the other, each of the rows of contact elements containing a large number of individual contact elements lying next to one another.
  • the contact legs leave the insulating body in a direction running parallel to the circuit board and are then angled towards the circuit board. They end in contact stamps which are provided for a soldered connection to the contacting surfaces arranged on the printed circuit board.
  • a row of contacting surfaces is assigned to each row of contact elements on the printed circuit board in such a way that the contact legs of each row of contact elements run without crossing to the contact legs of the respective other rows of contact elements.
  • the arrangement of the contacting surfaces in several rows requires a relatively large amount of space for connecting the contact legs on the printed circuit board, particularly in the case of multi-row plug connectors.
  • the object of the present invention is therefore to provide a circuit board connector according to the preamble of claim 1, with which the edge region of a circuit board can be optimally used for the connection of a large number of contact elements and also contact elements with a very low electrical contact resistance are available.
  • a printed circuit board connector designed according to the invention allows an arrangement of contacting surfaces on both sides of a printed circuit board, the thickness of the printed circuit board being insignificant, since the flexibility of the printed circuit boards allows the printed circuit board connector designed according to the invention to be adapted to different printed circuit board thicknesses.
  • FIG. 1 shows the front F of a printed circuit board connector SV designed according to the invention.
  • the end faces of a large number of contact elements can be seen in the rectangular area of the front side F.
  • the circuit board connector SV is mounted in front of an end face SF of a printed circuit board L, the course of which is indicated on both sides of the front side F shown.
  • the plurality of contact elements K are arranged in rows running parallel to the circuit board level.
  • the circuit board connector SV is attached to the front side SF of the circuit board L in such a way that several rows (in the example five rows) of contact elements K1 are arranged above the circuit board level and several rows of contact elements K2 are arranged below the circuit board level. Between these contact elements K1, K2, which are arranged above and below the circuit board level, there are two rows of contact elements K3 approximately at the level of the end face SF of the circuit board L.
  • a contact element SK designed for current transmission which in the example shown is designed as a three-lamella contact spring for contacting a vertically standing contact knife (not shown) on both sides.
  • FIG. 2 shows a cross section through the central region (section line II-II in FIG. 1) of the printed circuit board connector according to FIG. 1 together with the associated edge region of the printed circuit board L.
  • the insulating housing I of the circuit board connector SV is arranged in front of the end face SF of the circuit board L at a right angle to the circuit board level.
  • the contact elements K1, K2, K3 run parallel to the circuit board level and penetrate the insulating body I from its front side FS to the rear side RS, which runs parallel to the end face SF of the circuit board L at a short distance in front of the latter.
  • the contact elements K1, K2 located above and below the circuit board level protrude on the rear side RS of the insulating housing I with their contacting needles KN from the insulating housing I.
  • the contact elements K3 located at the end face SF have rigid solder lugs LO, which likewise protrude from the insulating housing I on the rear side RS and rest on the upper side OS of the printed circuit board L.
  • the contact elements K3 arranged in front of the end face SF of the printed circuit board are designed as double contacts DK with two electrically connected individual contacts lying one above the other.
  • a circuit foil LF nestles against the rear side RS of the insulating housing I, which forms a loop SL towards the circuit board L and ends parallel to the circuit board level on the upper and lower side OS, US of the circuit board L.
  • the contacting needles KN protruding from the insulating housing I in the horizontal direction are passed through plated-through holes (not shown) on the conductor foil LF and soldered to associated conductor tracks (not shown).
  • the conductor foil LF is reinforced with a stiffening plate V.
  • the contacting surfaces WK for the rigid soldering lugs LF of the contact elements K3 located in the intermediate area are arranged directly on the edge of the top side of the printed circuit board OS.
  • the contacting surfaces KO for the connection of the circuit foils LF are arranged on the upper side OS and on the lower side US of the circuit board L. These contacting surfaces KO lie on the top and bottom of the circuit board L in a single row (not visible) parallel to the edge of the circuit board L.
  • the conductor tracks (not visible) on the conductor foils LF are soldered to the contacting surfaces KO.
  • FIG. 3 shows a cross section through a side part ST of the printed circuit board connector SV according to FIG. 1 (section line III-III).
  • the two side parts ST of the circuit board connector SV are designed as a flange for mechanically attaching the insulating body I to the circuit board L.
  • Two superimposed contact elements SK designed for current transmission are integrated in each flange.
  • contact elements SK are each provided with a contact extension KF, which is provided for resting on associated contacting surfaces of the printed circuit board L.
  • a contact element SK is provided for the current transmission for the upper side and one for the lower side of the circuit board.
  • the contact element SK provided for the underside of the circuit board is accommodated in the insulating body I in a contact chamber KK, which allows the contact element SK and its contact extension KF to be displaced in a direction perpendicular to the circuit board plane.
  • the flange is fastened to the printed circuit board L with two screws S, which are electrically insulated from the contacting extensions KF.

Abstract

The insulating body of a printed-circuit board connector is mounted in front of an end face of a printed-circuit board in such a manner that first and second contact elements are arranged respectively above and below the plane of the printed-circuit board. Third contact elements are located in an intermediate region approximately at the height of the end face. The first and second contact elements are connected via flexible conductor pieces to contacting surfaces on the upper and lower side respectively of the printed-circuit board. The third contact elements have rigid solder tabs which are mounted on further contacting surfaces on the upper side of the printed-circuit board. <IMAGE>

Description

Die Erfindung betrifft einen Leiterplattensteckverbinder zur Oberflächenmontage mit einer Vielzahl von in einem, im wesent­lichen quaderförmigen Isolierkörper angeordneten Kontaktelemen­ten und mit Anschlußmitteln zur elektrischen Verbindung der Kontaktelemente mit auf einer Leiterplatte befindlichen Kontak­tierungsoberflächen.The invention relates to a printed circuit board connector for surface mounting with a plurality of contact elements arranged in an essentially cuboid insulating body and with connecting means for electrically connecting the contact elements to contacting surfaces located on a printed circuit board.

Solche Leiterplattensteckverbinder für die Oberflächenmontage gibt es bereits in verschiedenen Ausführungen. So ist z.B. aus "Elektronik-Entwicklung 6/85, Seite 8" ein Steckverbinder für die SMD-Technik bekannt, bei dem die Kontaktelemente speziell ausgebildete Kontaktbeine aufweisen, die aus einem leistenför­migen Isolierkörper herausragen. Diese Kontaktbeine reichen bis zu den Kontaktierungsoberflächen auf der Leiterplatte.Such PCB connectors for surface mounting are already available in different versions. For example, from "Electronics Development 6/85, page 8" a connector for SMD technology is known, in which the contact elements have specially designed contact legs that protrude from a strip-shaped insulating body. These contact legs extend to the contacting surfaces on the printed circuit board.

Die Kontaktelemente des bekannten Steckverbinders sind z.B. in drei Kontaktelementereihen übereinander angeordnet, wobei jede der Kontaktelementereihen eine Vielzahl von einzelnen nebenein­anderliegenden Kontaktelementen enthält. Die Kontaktbeine ver­lassen den Isolierkörper in einer parallel zur Leiterplatte verlaufenden Richtung und sind danach zur Leiterplatte hin ab­gewinkelt. Sie enden in Kontaktstempeln, die für eine Lötver­bindung mit den auf der Leiterplatte angeordneten Kontaktie­rungsoberflächen vorgesehen sind. Jeder Kontaktelementenreihe ist auf der Leiterplatte eine Reihe von Kontaktierungsoberflä­chen so zugeordnet, daß die Kontaktbeine jeder Kontaktelemen­tenreihe kreuzungsfrei zu den Kontaktbeinen der jeweiligen an­deren Kontaktelementereihen verlaufen.The contact elements of the known connector are arranged, for example, in three rows of contact elements one above the other, each of the rows of contact elements containing a large number of individual contact elements lying next to one another. The contact legs leave the insulating body in a direction running parallel to the circuit board and are then angled towards the circuit board. They end in contact stamps which are provided for a soldered connection to the contacting surfaces arranged on the printed circuit board. A row of contacting surfaces is assigned to each row of contact elements on the printed circuit board in such a way that the contact legs of each row of contact elements run without crossing to the contact legs of the respective other rows of contact elements.

Durch die Anordnung der Kontaktierungsoberflächen in mehreren Reihen wird insbesondere bei mehrreihigen Steckverbindern ver­hältnismäßig viel Platz zum Anschluß der Kontaktbeine auf der Leiterplatte benötigt.The arrangement of the contacting surfaces in several rows requires a relatively large amount of space for connecting the contact legs on the printed circuit board, particularly in the case of multi-row plug connectors.

Aus der deutschen Patentschrift DE-PS 35 44 125 ist ein Steck­verbinder für die SMD-Technik bekannt, bei dem mehrere Kontakt­elementereihen an eine einzige Reihe von Kontaktierungsoberflä­chen angeschlossen sind. Dies wird mit Hilfe eines kurzen Lei­terstückes, z.B. in Form eines Flachbandkabels erreicht, das an einem Ende mit den Kontaktelementen verbunden ist und mit dem anderen Ende benachbart zu den Kontaktierungsoberflächen auf der Leiterplatte endet.From the German patent DE-PS 35 44 125 a connector for SMD technology is known in which several rows of contact elements are connected to a single row of contacting surfaces. This is done using a short ladder section, e.g. achieved in the form of a ribbon cable, which is connected at one end to the contact elements and ends at the other end adjacent to the contacting surfaces on the circuit board.

Das zwischen den Kontaktelementen und den Kontaktieroberflächen eingefügte Leiterstück erhöht bei diesem Steckverbinder den elektrischen Übergangswiderstand der Kontaktelemente, weshalb sich dieser Steckverbinder nur für Verbindungen mit geringer Strombelastung der Kontaktelemente eignet.The conductor piece inserted between the contact elements and the contacting surfaces increases the electrical contact resistance of the contact elements in this connector, which is why this connector is only suitable for connections with a low current load on the contact elements.

Aufgabe der vorliegenden Erfindung ist es daher, einen Leiter­plattensteckverbinder gemäß dem Oberbegriff des Schutzanspruchs 1 anzugeben, mit dem der Randbereich einer Leiterplatte für den Anschluß einer großen Anzahl von Kontaktelemente optimal ausge­nutzt werden kann und auch Kontaktelemente mit einem sehr ge­ringen elektrischen Übergangswiderstand zur Verfügung stehen.The object of the present invention is therefore to provide a circuit board connector according to the preamble of claim 1, with which the edge region of a circuit board can be optimally used for the connection of a large number of contact elements and also contact elements with a very low electrical contact resistance are available.

Gelöst wird diese Aufgabe erfindungsgemäß durch die im kenn­zeichnenden Teil des Schutzanspruchs 1 angegebenen Merkmale.This object is achieved according to the invention by the features specified in the characterizing part of protection claim 1.

Ein erfindungsgemäß ausgebildeter Leiterplattensteckverbinder erlaubt eine Anordnung von Kontaktierungsoberflächen an beiden Seiten einer Leiterplatte, wobei die Dicke der Leiterplatte un­wesentlich ist, da die Flexibilität der Leiterstücke eine An­passung des erfindungsgemäß ausgebildeten Leiterplattensteck­verbinders an unterschiedliche Leiterplattendicken erlaubt.A printed circuit board connector designed according to the invention allows an arrangement of contacting surfaces on both sides of a printed circuit board, the thickness of the printed circuit board being insignificant, since the flexibility of the printed circuit boards allows the printed circuit board connector designed according to the invention to be adapted to different printed circuit board thicknesses.

Vorteilhafte Weiterbildungen der Erfindung sind in den Unteran­sprüchen angegeben.Advantageous developments of the invention are specified in the subclaims.

Ein Ausführungsbeispiel der Erfindung wird im folgenden anhand der Zeichnung näher erläutert.An embodiment of the invention is explained below with reference to the drawing.

Dabei zeigen

  • FIG 1 einen erfindungsgemäß ausgebildeten Leiterplattensteck­verbinder in Frontansicht,
  • FIG 2 einen Querschnitt durch den Leiterplattensteckverbinder nach FIG 1 entlang der Schnittlinie II-II,
  • FIG 3 einen Querschnitt durch den Leiterplattensteckverbinder nach FIG 1 entlang der Schnittlinie III-III.
Show
  • 1 shows a printed circuit board connector designed according to the invention in front view,
  • 2 shows a cross section through the circuit board connector according to FIG. 1 along the section line II-II,
  • 3 shows a cross section through the circuit board connector according to FIG 1 along the section line III-III.

In FIG 1 ist die Frontseite F eines erfindungsgemäß ausgebilde­ten Leiterplattensteckverbinders SV dargestellt. In der recht­eckigen Fläche der Frontseite F sind die Stirnseiten einer Vielzahl von Kontaktelementen ersichtlich. Der Leiterplatten­steckverbinder SV ist vor einer Stirnfläche SF einer Leiter platte L angebracht, deren Verlauf zu beiden Seiten der gezeig­ten Frontseite F angedeutet ist.1 shows the front F of a printed circuit board connector SV designed according to the invention. The end faces of a large number of contact elements can be seen in the rectangular area of the front side F. The circuit board connector SV is mounted in front of an end face SF of a printed circuit board L, the course of which is indicated on both sides of the front side F shown.

Die Vielzahl von Kontaktelementen K sind in zur Leiterplatten­ebene parallel verlaufenden Reihen angeordnet. Wie aus der Zeichnung zu ersehen ist, ist der Leiterplattensteckverbinder SV so an der Stirnseite SF der Leiterplatte L befestigt, daß mehrere Reihen (im Beispiel fünf Reihen) von Kontaktelementen K1 oberhalb der Leiterplattenebene und mehrere Reihen von Kon­taktelementen K2 unterhalb der Leiterplattenebene angeordnet sind. Zwischen diesen ober- und unterhalb der Leiterplattenebe­ne angeordneten Kontaktelementen K1, K2 liegen zwei Reihen von Kontaktelementen K3 etwa in Höhe der Stirnfläche SF der Leiter­platte L.The plurality of contact elements K are arranged in rows running parallel to the circuit board level. As can be seen from the drawing, the circuit board connector SV is attached to the front side SF of the circuit board L in such a way that several rows (in the example five rows) of contact elements K1 are arranged above the circuit board level and several rows of contact elements K2 are arranged below the circuit board level. Between these contact elements K1, K2, which are arranged above and below the circuit board level, there are two rows of contact elements K3 approximately at the level of the end face SF of the circuit board L.

In den vier Ecken der Frontseite F ist je ein zur Stromüber­tragung ausgebildetes Kontaktelement SK vorhanden, das in dem gezeigten Beispiel als dreilamellige Kontaktfeder zum beidsei­tigen Kontaktieren eines vertikal stehenden Kontaktmessers (nicht dargestellt) ausgebildet ist.In the four corners of the front side F there is a contact element SK designed for current transmission, which in the example shown is designed as a three-lamella contact spring for contacting a vertically standing contact knife (not shown) on both sides.

In FIG 2 ist ein Querschnitt durch den mittleren Bereich (Schnittlinie II-II in FIG 1) des Leiterplattensteckverbinders nach FIG 1 zusammen mit dem zugehörigen Randbereich der Leiter­platte L dargestellt.2 shows a cross section through the central region (section line II-II in FIG. 1) of the printed circuit board connector according to FIG. 1 together with the associated edge region of the printed circuit board L.

Das Isoliergehäuse I des Leiterplattensteckverbinders SV ist vor der Stirnfläche SF der Leiterplatte L in rechtem Winkel zur Leiterplattenebene angeordnet. Die Kontaktelemente K1, K2, K3 verlaufen parallel zur Leiterplattenebene und durchdringen den Isolierkörper I von seiner Frontseite FS zur Rückseite RS, die parallel zur Stirnfläche SF der Leiterplatte L in geringem Ab­stand vor dieser verläuft. Die ober- und unterhalb der Leiter­plattenebene befindlichen Kontaktelemente K1, K2 ragen an der Rückseite RS des Isoliergehäuses I mit ihren Kontaktiernadeln KN aus dem Isoliergehäuse I heraus.The insulating housing I of the circuit board connector SV is arranged in front of the end face SF of the circuit board L at a right angle to the circuit board level. The contact elements K1, K2, K3 run parallel to the circuit board level and penetrate the insulating body I from its front side FS to the rear side RS, which runs parallel to the end face SF of the circuit board L at a short distance in front of the latter. The contact elements K1, K2 located above and below the circuit board level protrude on the rear side RS of the insulating housing I with their contacting needles KN from the insulating housing I.

Die in Höhe der Stirnfläche SF befindlichen Kontaktelemente K3 weisen starre Lötfahnen LO auf, die ebenfalls an der Rückseite RS aus dem Isoliergehäuse I herausragen und an der Oberseite OS der Leiterplatte L aufliegen.The contact elements K3 located at the end face SF have rigid solder lugs LO, which likewise protrude from the insulating housing I on the rear side RS and rest on the upper side OS of the printed circuit board L.

Die vor der Stirnfläche SF der Leiterplatte angeordneten Kon­taktelemente K3 sind als Doppelkontakte DK mit zwei übereinan­der liegenden elektrisch verbundenen Einzelkontakten ausge­führt. Oberhalb und unterhalb der Leiterplattenebene schmiegt sich an die Rückseite RS des Isoliergehäuses I jeweils eine Leiterfolie LF an, die zur Leiterplatte L hin eine Schleife SL bildet und parallel zur Leiterplattenebene an der Ober- bzw. Unterseite OS, US der Leiterplatte L endet.The contact elements K3 arranged in front of the end face SF of the printed circuit board are designed as double contacts DK with two electrically connected individual contacts lying one above the other. Above and below the circuit board level, a circuit foil LF nestles against the rear side RS of the insulating housing I, which forms a loop SL towards the circuit board L and ends parallel to the circuit board level on the upper and lower side OS, US of the circuit board L.

Die in horizontaler Richtung aus dem Isoliergehäuse I herausra­genden Kontaktierungsnadeln KN sind durch Durchkontaktierun­gen (nicht ersichtlich) auf der Leiterfolie LF hindurchgeführt und mit zugeordneten Leiterbahnen (nicht ersichtlich) verlötet. Zur Erhöhung der Stabilität im Bereich der Kontaktierungsnadeln KN ist die Leiterfolie LF mit einer Versteifungsplatte V ver­stärkt.The contacting needles KN protruding from the insulating housing I in the horizontal direction are passed through plated-through holes (not shown) on the conductor foil LF and soldered to associated conductor tracks (not shown). To increase the stability in the area of the contacting needles KN, the conductor foil LF is reinforced with a stiffening plate V.

Unmittelbar am Rand der Leiterplattenoberseite OS sind die Kon­taktierungsoberflächen WK für die starren Lötfahnen LF der im Zwischenbereich befindlichen Kontaktelemente K3 angeordnet. In geringem Abstand vom Leiterplattenrand entfernt sind auf der Oberseite OS und auf der Unterseite US der Leiterplatte L die Kontaktierungsoberflächen KO für den Anschluß der Leiterfolien LF angeordnet. Diese Kontaktierungsoberflächen KO liegen auf der Ober- und der Unterseite der Leiterplatte L jeweils in einer einzigen Reihe (nicht ersichtlich) parallel zum Rand der Leiterplatte L. Die Leiterbahnen (nicht ersichtlich) auf den Leiterfolien LF sind mit den Kontaktierungsoberflächen KO ver­lötet.The contacting surfaces WK for the rigid soldering lugs LF of the contact elements K3 located in the intermediate area are arranged directly on the edge of the top side of the printed circuit board OS. At a short distance from the edge of the circuit board, the contacting surfaces KO for the connection of the circuit foils LF are arranged on the upper side OS and on the lower side US of the circuit board L. These contacting surfaces KO lie on the top and bottom of the circuit board L in a single row (not visible) parallel to the edge of the circuit board L. The conductor tracks (not visible) on the conductor foils LF are soldered to the contacting surfaces KO.

In FIG 3 ist ein Querschnitt durch ein Seitenteil ST des Lei­terplattensteckverbinders SV nach FIG 1 (Schnittlinie III-III) dargestellt. Die beiden Seitenteile ST des Leiterplattensteck­verbinders SV sind als Flansch zur mechanischen Befestigung des Isolierkörpers I an der Leiterplatte L ausgebildet. In jedem Flansch sind jeweils zwei übereinanderliegende zur Stromüber­tragung ausgebildete Kontaktelemente SK integriert.FIG. 3 shows a cross section through a side part ST of the printed circuit board connector SV according to FIG. 1 (section line III-III). The two side parts ST of the circuit board connector SV are designed as a flange for mechanically attaching the insulating body I to the circuit board L. Two superimposed contact elements SK designed for current transmission are integrated in each flange.

Diese Kontaktelemente SK sind mit je einem Kontaktierungsfort­satz KF versehen, der zur Auflage auf zugehörigen Kontaktie­rungsoberflächen der Leiterplatte L vorgesehen ist. In jedem Seitenteil ST des Leiterplattensteckverbinders SV ist ein zur Stromübertragung ausgebildetes Kontaktelement SK für die Ober­seite und eines für die Unterseite der Leiterplatte vorgesehen.These contact elements SK are each provided with a contact extension KF, which is provided for resting on associated contacting surfaces of the printed circuit board L. In each side part ST of the circuit board connector SV, a contact element SK is provided for the current transmission for the upper side and one for the lower side of the circuit board.

Das für die Unterseite der Leiterplatte vorgesehene Kontaktele­ment SK ist im Isolierkörper I in einer Kontaktkammer KK unter­gebracht, die ein Verschieben des Kontaktelementes SK und seines Kontaktierungsfortsatzes KF in einer zur Leiterplatten­ebene senkrechten Richtung erlaubt. Dadurch kann ein beidsei­tiger Anschluß, der zur Stromübertragung vorgesehenen Kontakt­elemente SK für Leiterplatten unterschiedlicher Dicke sicherge­stellt werden. Die Befestigung des Flansches an der Leiterplat­te L erfolgt mit zwei Schrauben S, die gegenüber den Kontaktie­rungsfortsätzen KF elektrisch isoliert sind.The contact element SK provided for the underside of the circuit board is accommodated in the insulating body I in a contact chamber KK, which allows the contact element SK and its contact extension KF to be displaced in a direction perpendicular to the circuit board plane. As a result, a connection on both sides of the contact elements SK provided for current transmission for printed circuit boards of different thicknesses can be ensured. The flange is fastened to the printed circuit board L with two screws S, which are electrically insulated from the contacting extensions KF.

Claims (10)

1. Leiterplattensteckverbinder zur Oberflächenmontage (SMD) mit einer Vielzahl von in einem, im wesentlichen quaderförmigen Isolierkörper angeordneten Kontaktelementen und mit Anschluß­mitteln zur elektrischen Verbindung der Kontaktelemente mit auf einer Leiterplatte befindlichen Kontaktierungsoberflächen, dadurch gekennzeichnet, daß der Iso­lierkörper (I) vor einer Stirnfläche (SF) der Leiterplatte (L) derart befestigt ist, daß erste und zweite Kontaktelemente (K1, K2) oberhalb bzw. unterhalb der Leiterplattenebene angeordnet sind, daß dritte Kontaktelemente (K3) in einem Zwischenbereich etwa in Höhe der Stirnfläche (SF) angeordnet sind, daß die An­schlußmittel für die ersten und zweiten Kontaktelemente (K1,K2), denen Kontaktierungsflächen (KO) an der Ober- bzw. Unterseite der Leiterplatte (L) zugeordnet sind, aus flexiblen Leiterstük­ken (LF) gebildet sind, die mit einem Ende an den Kontaktele­menten (K1,K2) und mit ihrem anderen Ende an den Kontaktie­rungsoberflächen (KO) befestigt sind und daß die dritten Kon­taktelemente (K3) als Anschlußmittel starre Lötfahnen (LO) auf­weisen, die an weiteren Kontaktierungsoberflächen (WK) an der Oberseite der Leiterplatte (L) befestigt sind.1. Printed circuit board connector for surface mounting (SMD) with a plurality of contact elements arranged in a substantially cuboid insulating body and with connection means for electrically connecting the contact elements to contacting surfaces located on a printed circuit board, characterized in that the insulating body (I) in front of an end face (SF ) the circuit board (L) is fastened such that first and second contact elements (K1, K2) are arranged above and below the circuit board level, that third contact elements (K3) are arranged in an intermediate area approximately at the height of the end face (SF) that the connection means for the first and second contact elements (K1, K2), to which contacting surfaces (KO) are assigned on the top and bottom of the circuit board (L), are formed from flexible conductor pieces (LF) which have one end on the contact elements (K1, K2) and with their other end on the contacting surfaces (KO ) are fastened and that the third contact elements (K3) have rigid solder lugs (LO) as connection means, which are fastened to further contacting surfaces (WK) on the upper side of the printed circuit board (L). 2. Leiterplattensteckverbinder nach Anspruch 1, da­durch gekennzeichnet, daß die flexiblen Leiterstücke als Leiterfolie ausgebildet sind.2. Printed circuit board connector according to claim 1, characterized in that the flexible conductor pieces are designed as a conductor foil. 3. Leiterplattensteckverbinder nach Anspruch 2, da­durch gekennzeichnet, daß die Leiterfo­lien (LF) im Anschlußbereich der ersten und zweiten Kontaktele­mente (K1,K2) jeweils senkrecht zu den Kontaktelementeachsen verlaufen und daß die ersten und zweiten Kontaktelemente (K1, K2) die Leiterfolie (LF) durchdringende Kontaktierungsnadeln (KN) aufweisen.3. Printed circuit board connector according to claim 2, characterized in that the conductor foils (LF) in the connection region of the first and second contact elements (K1, K2) each run perpendicular to the contact element axes and that the first and second contact elements (K1, K2) the conductor foil (LF ) have penetrating contacting needles (KN). 4. Leiterplattensteckverbinder nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, daß die Kontaktierungsoberflächen für die ersten, zweiten und dritten Kontaktelemente jeweils einreihig angeordnet sind.4. Printed circuit board connector according to one of the preceding claims, characterized in that the contacting surfaces for the first, second and third contact elements are each arranged in a row. 5. Leiterplattensteckverbinder nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, daß die Kontaktierungsoberflächen für die dritten Kontaktele­mente unmittelbar am Leiterplattenrand angeordnet sind.5. Printed circuit board connector according to one of the preceding claims, characterized in that the contacting surfaces for the third contact elements are arranged directly on the edge of the printed circuit board. 6. Leiterplattensteckverbinder nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, daß ober- und unterhalb der Leiterplattenebene in beiden Quer­seiten des Isolierkörpers (I) je ein zur Stromübertragung aus­gebildetes Kontaktelement (SK) angeordnet ist.6. Printed circuit board connector according to one of the preceding claims, characterized in that above and below the circuit board level in both transverse sides of the insulating body (I) a contact element (SK) designed for current transmission is arranged. 7. Leiterplattensteckverbinder nach Anspruch 6, dadurch gekennzeichnet, daß die oberhalb der Leiterplat­tenebene angeordneten zur Stromübertragung ausgebildeten Kon­taktelemente (SK) in je einem zur Befestigung des Isolierkör­pers (I) an der Leiterplatte (L) ausgebildeten Flansch inte­griert sind.7. Printed circuit board connector according to claim 6, characterized in that the arranged above the circuit board level for power transmission formed contact elements (SK) are integrated in a flange for fastening the insulating body (I) on the circuit board (L). 8. Leiterplattensteckverbinder nach Anspruch 6 oder 7, da­durch gekennzeichnet, daß die zur Strom­übertragung ausgebildeten Kontaktelemente (SK) als Anschlußmit­tel je einen stegförmig ausgebildeten Kontaktierungsfortsatz (KF) aufweisen.8. Printed circuit board connector according to claim 6 or 7, characterized in that the contact elements (SK) designed for current transmission each have a web-shaped contact extension (KF) as connection means. 9 Leiterplattensteckverbinder nach einem der Ansprüche 6 bis 8, dadurch gekennzeichnet, daß die stegförmigen Kontaktierungsfortsätze (KF) mittels zur Befesti­gung des Isolierkörpers (I) an der Leiterplatte (L) vorgesehe­ner Klemmverbindungen auf zugeordnete Kontaktierungsoberflächen gedrückt werden.9 PCB connector according to one of claims 6 to 8, characterized in that the web-shaped contact extensions (KF) by means of fastening the insulating body (I) on the circuit board (L) provided clamping connections are pressed onto associated contact surfaces. 10. Leiterplattensteckverbinder nach einem der Ansprüche 6 bis 9, dadurch gekennzeichnet, daß die unterhalb der Leiterplattenebene angeordneten zur Strom­übertragung ausgebildeten Kontaktelemente in Kontaktkammern (KK) angeordnet sind, die zur Anpassung an unterschiedliche Leiterplattendicken ein Verschieben der Kontaktelemente in einer zur Leiterplattenebene senkrechten Richtung erlaubt.10. Printed circuit board connector according to one of claims 6 to 9, characterized in that the contact elements arranged below the printed circuit board level for current transmission are arranged in contact chambers (KK) which allow the contact elements to be displaced in a direction perpendicular to the printed circuit board plane in order to adapt to different printed circuit board thicknesses.
EP90107935A 1989-04-28 1990-04-26 Surface mounted printed circuit board connector Expired - Lifetime EP0395051B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE8905434U DE8905434U1 (en) 1989-04-28 1989-04-28
DE8905434U 1989-04-28

Publications (3)

Publication Number Publication Date
EP0395051A2 true EP0395051A2 (en) 1990-10-31
EP0395051A3 EP0395051A3 (en) 1991-09-25
EP0395051B1 EP0395051B1 (en) 1994-10-12

Family

ID=6838816

Family Applications (1)

Application Number Title Priority Date Filing Date
EP90107935A Expired - Lifetime EP0395051B1 (en) 1989-04-28 1990-04-26 Surface mounted printed circuit board connector

Country Status (3)

Country Link
EP (1) EP0395051B1 (en)
AT (1) ATE112896T1 (en)
DE (2) DE8905434U1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1168526A2 (en) * 2000-06-17 2002-01-02 HARTING KGaA Connector for a printed circuit board
WO2003009426A1 (en) * 2001-07-19 2003-01-30 Molex Incorporated Low-profile connector

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202012002352U1 (en) 2011-05-17 2012-04-18 Erni Electronics Gmbh Arrangement of plug connector and circuit board
CN110137721B (en) * 2018-02-09 2021-01-26 巧连科技股份有限公司 Electric connector structure

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3315217A (en) * 1965-03-19 1967-04-18 Elco Corp Connector for thin film circuits
DE2525864A1 (en) * 1975-06-10 1976-12-30 Siemens Ag Plug-in printed cct. board connector - increases number of contacts on printed circuit boards
EP0278869A2 (en) * 1987-02-09 1988-08-17 Augat Inc. Circuit board contact guide pattern
EP0286440A2 (en) * 1987-04-09 1988-10-12 RAYCHEM CORPORATION (a Delaware corporation) Connector assembly

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3315217A (en) * 1965-03-19 1967-04-18 Elco Corp Connector for thin film circuits
DE2525864A1 (en) * 1975-06-10 1976-12-30 Siemens Ag Plug-in printed cct. board connector - increases number of contacts on printed circuit boards
EP0278869A2 (en) * 1987-02-09 1988-08-17 Augat Inc. Circuit board contact guide pattern
EP0286440A2 (en) * 1987-04-09 1988-10-12 RAYCHEM CORPORATION (a Delaware corporation) Connector assembly

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1168526A2 (en) * 2000-06-17 2002-01-02 HARTING KGaA Connector for a printed circuit board
EP1168526A3 (en) * 2000-06-17 2004-01-21 HARTING KGaA Connector for a printed circuit board
WO2003009426A1 (en) * 2001-07-19 2003-01-30 Molex Incorporated Low-profile connector

Also Published As

Publication number Publication date
ATE112896T1 (en) 1994-10-15
DE59007421D1 (en) 1994-11-17
EP0395051A3 (en) 1991-09-25
DE8905434U1 (en) 1990-08-23
EP0395051B1 (en) 1994-10-12

Similar Documents

Publication Publication Date Title
DE3909263C2 (en)
DE3639367C2 (en)
DE69824211T2 (en) Surface mount connector with integrated circuit board assembly
DE3544838C2 (en)
DE60024212T2 (en) RF Edge Connectors
DE2455619A1 (en) CONNECTOR ARRANGEMENT
DE3618470A1 (en) PLUG COUPLING
DE602004000243T2 (en) Connector in which the crosstalk is suppressed by a ground contact
DE3116410C2 (en)
DE3624883C2 (en)
DE3345701A1 (en) Electrical switching apparatus having an end connecting plate which supports plug parts
DE2419735B2 (en) Electric formwork beam
DE60224860T2 (en) Terminal block and cable connector
EP0395051B1 (en) Surface mounted printed circuit board connector
DE3731413C2 (en)
DE6607308U (en) SWITCH ASSEMBLY WITH A CONTACT CONNECTION TO A PRINTED CIRCUIT
DE2901678B1 (en) Distributor for small telephone exchanges
EP0087126A1 (en) Push connector for printed circuit boards
DE2810575A1 (en) PRINTED ELECTRIC CIRCUIT BOARD
EP0410427B1 (en) Plug-in connection for circuit boards
DE4328426A1 (en) Plug-in base with soldered circuit board
DE3209699C2 (en) Universal circuit board
DE8428437U1 (en) Circuit hybrid for electronic circuits
DE2811204A1 (en) DEVICE FOR ELECTRICAL CONNECTION TO THE CIRCUITS OF A PRESSURE CIRCUIT CARD IN THE AREA OF THE FRONT, FREE EDGE OF THE CARD
DE3340975A1 (en) DEVICE FOR DETACHABLE INSTALLATION OF SEVERAL CIRCUIT BOARDS

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): AT BE CH DE FR GB IT LI NL

17P Request for examination filed

Effective date: 19901205

PUAL Search report despatched

Free format text: ORIGINAL CODE: 0009013

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: SIEMENS NIXDORF INFORMATIONSSYSTEME AG

AK Designated contracting states

Kind code of ref document: A3

Designated state(s): AT BE CH DE FR GB IT LI NL

RAP3 Party data changed (applicant data changed or rights of an application transferred)

Owner name: SIEMENS NIXDORF INFORMATIONSSYSTEME AG

17Q First examination report despatched

Effective date: 19940328

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AT BE CH DE FR GB IT LI NL

REF Corresponds to:

Ref document number: 112896

Country of ref document: AT

Date of ref document: 19941015

Kind code of ref document: T

REF Corresponds to:

Ref document number: 59007421

Country of ref document: DE

Date of ref document: 19941117

ITF It: translation for a ep patent filed

Owner name: STUDIO JAUMANN

GBT Gb: translation of ep patent filed (gb section 77(6)(a)/1977)

Effective date: 19941221

ET Fr: translation filed
PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: AT

Payment date: 19950324

Year of fee payment: 6

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: BE

Payment date: 19950419

Year of fee payment: 6

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LI

Effective date: 19950430

Ref country code: CH

Effective date: 19950430

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: NL

Payment date: 19950430

Year of fee payment: 6

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed
REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 19960322

Year of fee payment: 7

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 19960422

Year of fee payment: 7

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: AT

Effective date: 19960426

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BE

Effective date: 19960430

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 19960620

Year of fee payment: 7

BERE Be: lapsed

Owner name: SIEMENS NIXDORF INFORMATIONSSYSTEME A.G.

Effective date: 19960430

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: NL

Effective date: 19961101

NLV4 Nl: lapsed or anulled due to non-payment of the annual fee

Effective date: 19961101

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GB

Effective date: 19970426

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 19970426

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 19971231

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 19980101

REG Reference to a national code

Ref country code: FR

Ref legal event code: ST

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES;WARNING: LAPSES OF ITALIAN PATENTS WITH EFFECTIVE DATE BEFORE 2007 MAY HAVE OCCURRED AT ANY TIME BEFORE 2007. THE CORRECT EFFECTIVE DATE MAY BE DIFFERENT FROM THE ONE RECORDED.

Effective date: 20050426