EP0394932B1 - Photothermal inspection method, arrangement for its working out, and utilisation of the method - Google Patents
Photothermal inspection method, arrangement for its working out, and utilisation of the method Download PDFInfo
- Publication number
- EP0394932B1 EP0394932B1 EP90107682A EP90107682A EP0394932B1 EP 0394932 B1 EP0394932 B1 EP 0394932B1 EP 90107682 A EP90107682 A EP 90107682A EP 90107682 A EP90107682 A EP 90107682A EP 0394932 B1 EP0394932 B1 EP 0394932B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- laser
- light signals
- mirror
- light
- material sample
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title claims abstract description 53
- 238000007689 inspection Methods 0.000 title 1
- 239000000463 material Substances 0.000 claims abstract description 86
- 230000003287 optical effect Effects 0.000 claims abstract description 38
- 230000008878 coupling Effects 0.000 claims abstract description 36
- 238000010168 coupling process Methods 0.000 claims abstract description 36
- 238000005859 coupling reaction Methods 0.000 claims abstract description 36
- 230000005855 radiation Effects 0.000 claims description 26
- 239000000835 fiber Substances 0.000 claims description 13
- 230000005540 biological transmission Effects 0.000 claims description 12
- 238000012360 testing method Methods 0.000 claims description 12
- 238000000576 coating method Methods 0.000 claims description 8
- 230000000694 effects Effects 0.000 claims description 7
- 238000002834 transmittance Methods 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 5
- 230000032798 delamination Effects 0.000 claims description 3
- 230000001066 destructive effect Effects 0.000 claims description 3
- 238000012545 processing Methods 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 2
- 230000007797 corrosion Effects 0.000 claims description 2
- 238000005260 corrosion Methods 0.000 claims description 2
- 230000003628 erosive effect Effects 0.000 claims description 2
- 229910001092 metal group alloy Inorganic materials 0.000 claims description 2
- 239000007769 metal material Substances 0.000 claims description 2
- 238000010422 painting Methods 0.000 claims description 2
- 239000004033 plastic Substances 0.000 claims description 2
- 229920003023 plastic Polymers 0.000 claims description 2
- 238000004886 process control Methods 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- 238000004154 testing of material Methods 0.000 claims description 2
- 238000011144 upstream manufacturing Methods 0.000 claims 6
- 230000003750 conditioning effect Effects 0.000 claims 2
- 238000005266 casting Methods 0.000 claims 1
- 230000001143 conditioned effect Effects 0.000 claims 1
- 230000010354 integration Effects 0.000 claims 1
- 229910052779 Neodymium Inorganic materials 0.000 abstract description 3
- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical compound [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 abstract description 3
- 230000009977 dual effect Effects 0.000 abstract 2
- 239000013307 optical fiber Substances 0.000 description 9
- 238000005259 measurement Methods 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 238000001514 detection method Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000002349 favourable effect Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 2
- 230000002745 absorbent Effects 0.000 description 2
- 239000002250 absorbent Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 230000010363 phase shift Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 230000003595 spectral effect Effects 0.000 description 2
- PFNQVRZLDWYSCW-UHFFFAOYSA-N (fluoren-9-ylideneamino) n-naphthalen-1-ylcarbamate Chemical compound C12=CC=CC=C2C2=CC=CC=C2C1=NOC(=O)NC1=CC=CC2=CC=CC=C12 PFNQVRZLDWYSCW-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 description 1
- 229910001634 calcium fluoride Inorganic materials 0.000 description 1
- 239000000112 cooling gas Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000013305 flexible fiber Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- -1 indium-antimonide compound Chemical class 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000011514 reflex Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 150000003346 selenoethers Chemical class 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
- 238000001931 thermography Methods 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/72—Investigating presence of flaws
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
- G01B21/02—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
- G01B21/08—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness for measuring thickness
- G01B21/085—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness for measuring thickness using thermal means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/171—Systems in which incident light is modified in accordance with the properties of the material investigated with calorimetric detection, e.g. with thermal lens detection
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
- G01J2001/4242—Modulated light, e.g. for synchronizing source and detector circuit
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/171—Systems in which incident light is modified in accordance with the properties of the material investigated with calorimetric detection, e.g. with thermal lens detection
- G01N2021/1714—Photothermal radiometry with measurement of emission
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/62—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
- G01N21/71—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light thermally excited
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2201/00—Features of devices classified in G01N21/00
- G01N2201/10—Scanning
- G01N2201/105—Purely optical scan
- G01N2201/1053—System of scan mirrors for composite motion of beam
Definitions
- the invention relates to a method for testing the properties of materials after the photothermal Effect such as are known from EP-A-105078, US-A-3,803,413 or WO-A-8200891.
- EP-A1-0 105 078 discloses a device for carrying out the described method for examining the properties of absorbent materials according to the photothermal effect, in which the laser waves from a stationary or quasi-stationary laser to a test head that can be optically coupled to the material sample can be transported using flexible fiber optic cables.
- the IR light signals can also be transported from the test head to an infrared detector arranged remotely from the test head via flexible optical waveguide cables.
- the measuring head itself contains housing-internal beam-guiding means, specifically at the input of the laser beams and at the output of the IR light signals, here a focusing lens each, and also a coupling mirror arranged in the beam path of both lenses, designed as a dichroic mirror 1) .
- a crystal rod in particular made of sapphire, is arranged in the light path common to the laser beams and the IR light signals, and this rod is followed by a focusing lens which focuses the laser radiation on the material sample or receives the IR light signals from it.
- the optical fibers represent a sensitive element in the material examination; they also attenuate the laser radiation or IR light signals they carry.
- the invention has for its object a method for Examining the properties of materials after the photothermal To create effect with which without the line the laser waves via optical fibers from an external stationary or quasi-stationary laser to the measuring head and without one Connection from an external infrared light detector to the measuring head can be managed via fiber optic cables.
- a another object of the invention is the management of Laser beam from the laser light source on the one hand to the material sample on the other hand, as well as the guidance of the IR light signals from the To design material sample to the infrared light detector so that beam paths are as short as possible and the possibility is opened to couple a second laser light source.
- the method can also be used to determine Material structures, material parameters, such as density, Conductivity, degree of hardness, and to determine material conditions.
- Another advantageous use is in the measurement of Layer thicknesses, coverings, surface qualities, for example Surface roughness, and for measuring the adhesion of coatings.
- a special use of the method extends to Searching for clues, e.g. for fingerprints.
- the procedure is according to Another use also suitable for tracking and uncovering counterfeits, e.g. for banknotes, paintings, metal alloys, Coins, ceramics and antique furniture.
- the invention further relates to an advantageous device according to claim 23 to carry out the method according to method claims 1 to 17 which explained the subject of claim 1 Underlying task.
- laser light sources are relatively lower Power and small size can be used because the External and / or internal measurement head attenuation of the laser beams through the optical fibers and their coupling mechanism and coupling optics are omitted.
- a diode pumped Neodymium / YAG laser with a wavelength of 1064 nm, which is invisible Emits light in the near infrared range which has a power of only 0.35 W, with a combined Degree of transmission and reflection for the laser beam of 82.9% could be achieved.
- a very precise beam guidance which is in the sense of a Improves accuracy and sensitivity.
- a pilot laser which is preferred a diode laser, also of low power, which e.g. in the visible red light range with a wavelength of 670 nm and emits a power of 3 mW.
- the pilot beam For coupling the pilot beam is a cheap version in which the laser beam, which initially runs axially parallel to the pilot beam, over two Deflecting mirrors connected in series are deflected by 90 ° each is, after the second deflection of the laser beam and Pilot beam are on the same light path, i.e., the second Deflecting mirror is especially for this purpose as a dichroic mirror form which of the laser beam on its reflective side in his further ray path and that on his the other side receives the pilot beam and this like a permeable Windows lets through practically without loss.
- the pilot beam is very advantageous for adjusting the measuring head, by e.g. a red spot of light on the material sample is thrown and now after this red light spot the scan zone can be chosen.
- the second Deflecting mirror i.e. within the common light path for Pilot and laser beam to arrange an optics that together with the optics arranged directly at the laser output are expanded optics forms which advantageously parallel on a short beam path Laser light generated.
- the expansion optics therefore consists of a Laser output side first optics, which show the beam divergence increased, and the aforementioned, the second deflecting mirror downstream second optics, which parallelizes the laser light.
- This expansion optic is then optically connected Coupling mirror, from which the laser beam and the pilot beam over the scanner arrangement in the axis of the laser beam end light-guiding optics are thrown.
- the latter is a lens or a lens system with special properties, which the Laser beam (and of course the pilot beam) in the direction transmits or transmits to the material sample. In the opposite direction, this lens system leaves the IR light signals through.
- A is suitable for this purpose Zinc selenide glass with a coating on the front.
- This front coating has the task of IR light transmission to improve in a certain spectral range e.g. in the range 2 - 5 ⁇ m. By a different interpretation (lens shape, However, it is also the choice of material and coating) possible to extend this improvement to a larger area especially the range 8 - 12 ⁇ m ("second IR window").
- the measuring head points in the beam axis of the coupling mirror and of the first scanner arrangement - towards that of the material sample seen arriving IR light signals - a downstream IR deflecting mirror on which the IR light signals e.g. through 90 ° through a deflection mirror connected downstream Forwards the infrared lens to the at least one infrared detector, the infrared lens the IR light signals on the Focused receiving surfaces of the IR detector mentioned.
- the named IR deflecting mirror can have a normal design, if it only serves to reflect the IR light signals that from the material sample to the scanner arrangement and the coupling mirror be sent to him.
- IR radiation can also be injected by a Additional unit in the case of the radiographic test via its internal mirror system is fed, then it is appropriate execute and arrange this IR deflecting mirror so that it in Regarding the second light path as a translucent window acts and in relation to the first IR light path as a mirror.
- the laser light source is expediently one Assigned expansion optics for the laser beam.
- the scanner arrangement preferably has two scanner mirrors, which of associated Drives are moved so that a scanner mirror the beam deflection in the x direction and the other the Beam deflection in the y direction is used.
- the measuring head can - as already indicated - by a Additional unit can be added, which - for material samples sufficient wall thickness behind the material sample is positioned and from the back of the material sample emitted IR radiation or corresponding IR light signals receives and has an internal deflection mirror system, which the IR light signals in the IR beam path of the actual Sensor sends or reflects.
- FIG. 1 shows in three blocks the essential elements of the method for examining the properties of absorbent materials, in this case material sample B, after the photothermal effect and the device for carrying it out.
- the measuring head A highlighted by a black border, is designed as an integral laser measuring head. It contains a directly modulated, diode-pumped neodymium / YAG laser FL, which emits in the 1064 nm wavelength range, ie in the invisible near IR range, and has an output of approx. 0.35 W.
- This laser light source FL hereinafter abbreviated as laser, is indicated schematically by a square.
- a diverging optic 1 the laser beam passes f 1 to a dielectric mirror 4a which the laser beam f 1 by 90 ° in the direction of a scanning mirror arrangement 5 deflects. From this, the laser beam passes through a light-guiding optic 6 at the end of the laser beam, shown as a convex lens, which also forms the exit window for the laser radiation f 1 of the measuring head A and the entry window for the IR light signals, focused on the front surface bl of the material sample B, namely at a measuring point b2. Above the material sample B, two coordinate axes ⁇ x and ⁇ y are shown in FIG.
- the beam and scan path patterns preferably run in horizontal or vertical meanders or in spiral paths, as indicated schematically. Other spot and scan path patterns are possible, e.g. B. concentric circles.
- the two coordinate axes ⁇ x and ⁇ y are dashed and framed by a line 9, which can be a scan zone, for example. Due to the incident laser radiation, which can be modulated according to a certain pulse-pause ratio, and in the respective measuring point a quantity of heat that has an energy of, for example, 2.
- 10 -5 Ws corresponds to, generated, the material sample B emits IR light signals out of phase - ⁇ f 3 .
- the minus sign is intended to symbolize the direction opposite to the incident laser radiation f 1 .
- These IR light signals are emitted to the light-guiding optics 6 and let them pass, because this is what is referred to as double optics in the following, which transmits and focuses the laser radiation f 1 in the direction of the material sample B and which preferably favors in the opposite direction emits IR light signals.
- This double optics 6 preferably has a coating on its front which acts as a window for a spectral range of 2-5 ⁇ m in the infrared range, but practically does not transmit the laser light with its wavelength of 1.064 ⁇ m in the beam direction of the IR light signals.
- this double optic 6 consists of Zn selenide glass and / or Ca fluoride and / or Ba fluoride.
- the IR radiation - ⁇ f 3 transmitted through the double optics 6 is first thrown onto the scanner mirror arrangement 5 and from there onto a semi-transparent coupling mirror 4a, which is designed as a dichroic mirror which reflects in the direction of the laser beam f 1 , but in the opposite direction acts as a window that is transparent to the IR light signals.
- Double optics 6 and coupling mirror 4a act as a decoupling element for the emitted IR light signals.
- the IR light signals are thrown from the coupling mirror 4a onto an IR deflecting mirror 4b which is optically connected to it and which deflects the IR light signals, for example by 90 °, and directs them to the IR objective 7.
- the double optics 6 By appropriate design of the double optics 6 or by designing an optical system consisting of optics for visible light and for IR light, it is also possible to "run" the IR detection at a time interval that can be adjusted via the local distance from the laser excitation in order to detect a defined depth zone of the sample or to illuminate it - if its wall thickness is not too great - in such a way that it emits or emits IR light signals from its rear.
- 6 glasses are preferably used for the double optics, the properties of which are designed such that the effect of a collective lens is achieved both for the laser beams f 1 and for the IR radiation - ⁇ f 3 .
- the aperture of the double optics 6 for example by changing the structure and arrangement of the optical elements, a proportion of the IR light signals emitted by the material sample B that is adapted to the measurement purpose can be enlarged and directed to the IR detector.
- the function of the double optics 6 can in principle be replaced by holographic / optical elements.
- the IR light signals pass through the coupling mirror 4a and the deflection mirror 4b, the latter deflecting the signals mentioned by, for example, 90 °, onto the IR lens 7, which focuses the IR light signals onto the receiving surfaces 8a of the IR detector 8.
- the IR lens 7 consists, for example, of calcium fluoride, or Ge or Si.
- the IR detector which converts the incoming IR light signals into corresponding electrical signals, consists for example of an indium-antimonide compound and has a detection area of approx. 50 - 100 ⁇ m in diameter. Its signal / noise ratio is most favorable at a working temperature of approx. 100 K. This temperature is approximately achieved by cooling with nitrogen.
- a corresponding detector cooling unit is indicated at 10; the corresponding cooling gas supply and discharge line is designated 11.
- the IR detector is cooled in particular with a Joule-Thomson cooling (using N 2 ).
- a Stirling cooler based on the Stirling engine principle can also be used.
- the electrical signals generated in the IR detector pass through a signal line 12 to one arranged inside the measuring head A.
- Preamplifier 13 small size, and from the output of Preamplifiers 13 are the pre-amplified electrical ones IR light signals analog signals via the signal line 14 an electronic amplifier stage, in particular a lock-in amplifier 15 forwarded, the latter within one portable electronic cabinet unit C is housed.
- the modulation of the laser beam f 1 can be achieved via the electrical circuit of the laser; a separate modulator or chopper is then not required.
- Amplifier stage 15 is e.g. a digital lock-in amplifier (DLI).
- DPI digital lock-in amplifier
- thermography in which the temporal largely constant temperature is detected
- photothermal measuring method the amplitude and phase of the Temperature modulation determined.
- the phase shift results derive from the time delay with which the maximum Surface temperature compared to the time of excitation is measured.
- the phase shift is done with the lock-in amplifier certainly.
- This amplifier 15 has signal directions with a module 16 "device control", and this control module 16 is again electrically and electronically interconnected with an integral electrical signal processing and storage unit 17 with Screen or monitor 18.
- the unit 17 is in particular a Personal computer (PC).
- PC Personal computer
- the transportable electronic cabinet unit C includes means 15, 17 for electronic Signal processing, storage and display of electrical at least one IR light detector 8 supplied Signals and second means 16 for controlling the measuring head A.
- These include: At least one electronic amplifier stage 15 and an associated electronic computing unit 17, further that between the amplifiers 13, 15 and the electronic Computer unit 17 turned on control module 16.
- On the Screen 18 shows the IR light signals collected and processed data presented.
- the control module 16 generates the control signals for setting the Laser beam characteristics for the Laser FL, such as pulse-pause ratio and beam power, beam path pattern, and scan path pattern as well as scan speed.
- the electronic cabinet unit C and the integral measuring head A only by a highly flexible electrical cable C1 (cf. FIGS. 3 and 4) a relatively large range with one another connected. This also means that the electronic cabinet unit C possible, measuring points in wide range can be reached.
- Figure 1 with 19 are an electrical signal line between the amplifier 15 and the laser FL and designated 20 one further electrical signal line for controlling the mirror scanner arrangement 5 of corresponding signal output terminals of the personal computer or the computing unit 17.
- a cable for supplying the measuring head A with electrical Energy not shown separately. Such a power supply cable but is in the flexible connection cable C1 Figure 3 and Figure 4 included.
- the mirror scanner arrangement 5 which consists of two scanners, can be seen more clearly -Mirrors 5a, 5b, which are optically connected in series, the scanner mirror 5a is mounted adjustably about the axis of rotation 21 and the scanner mirror 5b is rotatably mounted about the axis of rotation 22, so that the scanner mirror 5a on it thrown laser beam f 1 in the direction ⁇ x and the scanner mirror 5b adjusts the laser beam thrown onto it in the direction ⁇ y (cf. FIG. 11).
- a housing 23 for the laser FL is indicated in its outline and a pilot laser DL structurally combined with this housing 23 in the form of a diode laser, from which a pilot beam f 2 takes its exit, which enters the beam path via the second deflecting mirror 2b of the laser beam f 1 is injected.
- the beams f 1 (laser beam) and f 2 (pilot beam) initially run parallel to one another.
- the laser beam f 1 is deflected twice by 90 ° by the two successively connected first and second deflection mirrors 2a, 2b, and after the second deflection (after the second deflection mirror 2b), both beams f 1 and f 2 collide with one another.
- the second deflection mirror 2b is designed to couple in the pilot beam f 2 as a dichroic mirror which reflects the laser beam f 1 with its reflection side, but at the same time allows the pilot beam f 2 arriving from the other side to pass through as a transparent window. Both beams f 1 , f 2 then pass through the expansion optics 3 and reach the dielectric mirror 4a.
- the pilot laser DL is only switched on when the scan zone 9 (FIG. 1) is to be defined. The pilot beam f 2 thus arrives (when the laser FL is not yet working and the pilot laser DL is switched on) via the dielectric coupling mirror 4a and the scanner mirror arrangement 5 through the double optics 6 on the material sample and thereby generates a red dot, for example.
- the pilot laser DL should preferably continue to be operated so that the actual measurement process can be followed when it starts after the laser FL is switched on.
- a number of desk-type bearing elements for the above-described optics are indicated in a kind of phantom representation and are generally designated by 24.
- the laser beam f 1 and the pilot beam f 2 and the beam of the IR light signals emitted by the material sample are highlighted by means of reinforced lines.
- the beam paths of all three beam types are common between the coupling mirror 4a and the double optics 6; only IR radiation exists in front of the coupling mirror 4a up to the IR detector 8.
- (+) the beam direction is in the direction of the material sample and (-) the direction of the IR light signals emitted by the material sample.
- the following table provides a clear summary of the properties of the individual optics as well as the optical conditions for the three beam types f 1 , f 2 and - ⁇ f 3 and also shows in the right column the degrees of transmission of the optics and the reflectance of the mirrors for the laser radiation f 1 on. Multiplying the values in the right column gives a resulting combined (first) transmittance and reflection factor for the laser beam f 1 of 0.829 and 82.9%.
- FIGs 3 and 4 are the same parts to Figure 1 with the provided with the same reference numerals.
- the portable measuring head A with cooling slots 25 for removing the Heat loss provided he is on platform 26 a tripod 27 and arranged with a flexible cable C1 the electronic cabinet unit C connected.
- Figure 5 shows the double optics 6 on the front Al of the measuring head A, the Coupling mirror 4a and the IR deflection mirror 4b and the scanner mirror arrangement 5.
- Figure 6 shows the drive 5bl for one scanner mirror 5b and the other scanner mirror 5a to see, as well as the double optics 6.
- Figure 7 shows in their Outlined the laser FL with its expansion optics 1, the two him downstream deflection mirror 2a, 2b, the coupling mirror 4a, the IR deflecting mirror 4b (which is circular in the drawing is) and the second optics 3, which are part of the expanding optics is.
- FIG. 8 shows the snapshot of a scan zone, enlarged, namely, micro-pores found in creep stresses Pipelines.
- FIG. 9 shows that an energy supply unit is attached to the measuring head A.
- AO can be attached so that no power supply cable to the measuring head must be relocated.
- This supply unit AO can contain rechargeable batteries.
- Figure 10 shows that there is a separate, at the actual Measuring head attachable unit A2 is possible, relatively thin-walled Material samples B 'on the radiated from their back
- IR radiation which via the IR optics 26, the two deflecting mirrors 27, 28 and a further IR optic 29 via an entry window 30 of the measuring head A onto the deflecting mirror 4b from the back.
- This deflecting mirror 4b is a dichroic mirror for this application, where then the further beam path to the IR lens 7 and IR detector 8 is as explained with reference to Figure 2.
- a method is implemented in which the material sample B 'is illuminated on a front side with the laser beam f 1 in accordance with an illumination path pattern.
- the IR light signals - ⁇ f 4 emitted from the back of the material sample B' can now be scanned in accordance with a scanning path pattern.
- This can e.g. B. happen so that the deflecting mirrors 27, 28 are designed as scanner mirrors, which are deflected according to the scanner mirrors 5a, 5b according to Figure 2 synchronously with them in the x or y direction by small amounts by motor.
- the union takes place at the IR deflecting mirror 4b.
- a space 31 is provided between the measuring head A and the additional unit for inserting the thin-walled material sample B '.
- the IR light signal - ⁇ f 4 received by the additional unit A2 via the IR optics 26 is deflected by two 90 ° through a first housing-sealing light-conducting optics 29 from the additional unit into the intermediate space 31 and from there via a second housing-sealing optics 30 into the internal beam path of the IR light signals - ⁇ f 3 of the measuring head A.
- This has the advantage that a single IR detector 8 is sufficient. In special cases, however, a separate IR detector can be assigned to the additional unit A2, so that a material sample B 'can be examined practically simultaneously from both sides.
- the additional unit A2 can also be designed so that it can be swung in and out with respect to the axis of the laser beam f 1 , so that the measuring head A is suitable either for surface examinations or for radiographic examinations of thin-walled material samples.
- Optical fibers for the laser light must be so-called monomode fibers. They act like a waveguide, which means that the rays pass through the core practically in a straight line. The coherence properties of the laser light are not or only slightly impaired. This requires a core diameter of a few ⁇ m, i.e. a few thousandths of a millimeter.
- Such a fiber is required to enable diffraction-limited focusing and, consequently, high lateral resolution.
- the disadvantages of single-mode fibers are a complex coupling mechanism and optics between the laser and the fiber entrance, as well as the high coupling losses that still arise. As measured in the laboratory under optimal conditions, they are 30 to 40%, in practical use, however, they are 50%. Compared to this, the attenuation losses in the fiber are relatively low (30 dB / km at 488 nm, 2 dB / km at 1064 nm).
- the thermal microscope according to the present invention a collinear arrangement (match of laser and IR path between dichroic mirror 4a and double optics or scan lens 6) before, which with fiber optic technology is not can be realized since an IR optical fiber is not simultaneously Single mode fiber for the laser wavelength can be.
- the others would be disadvantageous Transmission losses and the low mechanical resilience of IR fibers.
- very good resulting transmission and reflection levels of at least 60% can be achieved with the thermal microscope according to the invention, both for the light path of the laser beam f 1 and the light path of the emitted IR light signals - ⁇ f 3 .
- the first resulting degree of transmission and reflection for the laser beam f 1 can, even with good quality of the optics and coatings used, be in a range between 60 and 85% and is preferably at least 80%.
- the corresponding values for the IR beam are somewhat lower, but are quite comparable with the favorable transmission and reflection levels that can be achieved for the laser beam f 1 .
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Lasers (AREA)
Abstract
Description
Die Erfindung bezieht sich auf ein Verfahren zum Untersuchen der Eigenschaften von Materialien nach dem photothermischen Effekt, wie sie etwa aus EP-A-105078, US-A-3,803,413 oder auch WO-A-8200891 bekannt sind.The invention relates to a method for testing the properties of materials after the photothermal Effect such as are known from EP-A-105078, US-A-3,803,413 or WO-A-8200891.
Das Grundprinzip von photothermischen Untersuchungs- oder Meßverfahren
basiert auf der Bestrahlung einer Prüfoberfläche mit
Licht, insbesondere mit Laserlicht, und Auswertung der dadurch
in den oberflächen-nächsten Schichten erzeugten Wärmesignale.
Dabei wird die Tatsache genutzt, daß ein im Verhältnis zu
seiner Umgebung erwärmter Körper immer bestrebt ist, dieses
Mehr an Wärme abzugeben: Der Körper gibt Wärme in Form von
Infrarot-Strahlung ab. Das Verfahren ist grundsätzlich auch
dann anwendbar, wenn die Temperatur der Umgebung höher ist als
die des Prüflings, weil es auf die Temperaturverteilung an der
Prüfling-Oberfläche ankommt. Durch Messung der vom Prüfling
emittierten Infrarot-(IR-) Lichtsignale können Tiefeninformationen
und Informationen über die Materialbeschaffenheit der
Oberfläche gewonnen werden, z.B. können ermittelt werden:
Änderungen der Schichtdicken von Oberflächen, aber auch Risse,
Einschlüsse und Delaminationen, dies alles naturgemäß zerstörungs-
und berührungsfrei. Die Erfindung geht von den grundsätzlich
bekannten Verfahrensschritten aus, mit einer intensiven
Lichtquelle, insbesondere einem Laser, die Oberfläche der
Materialprobe zu bestrahlen, wobei der Strahl bei einer Reihe
von photothermischen Untersuchungsverfahren moduliert, d.h.,
insbesondere periodisch unterbrochen wird. Das Laserlicht wird
an der Oberfläche teilweise in Wärme umgewandelt. Diese Wärme
dringt in die Materialprobe ein. Ein Charakteristikum für das
aus emittierten IR-Lichtsignalen gebildete Meßsignal ist, wie
weit die Wärme eindringt. Dies hängt zum einen von der periodischen
Bestrahlungsdauer ab, diese wird durch die Modulationsfrequenz
bestimmt, zum anderen von den Materialeigenschaften
Wärmeleitfähigkeit, spezifische Wärme und Dichte. Die letztgenannten
drei Parameter werden zu einer physikalischen Größe,
der thermischen Diffusionslänge µS, zusammengefaßt. Sie gibt
direkt die Eindringtiefe der Wärmewellen an. Es gilt
- ω =
- Kreisfrequenz der Modulation des intensitätsmodulierten Laserstrahls
- a =
- Temperaturleitfähigkeit, wobei für a gilt:
- a =
- k/ ρ · c, mit
- c =
- spezifische Wärme
- ρ =
- Dichte
- k =
- Wärmeleitfähigkeit des Prüflings.
- ω =
- Angular frequency of the modulation of the intensity-modulated laser beam
- a =
- Thermal conductivity, where for a:
- a =
- k / ρ · c, with
- c =
- Specific heat
- ρ =
- density
- k =
- Thermal conductivity of the test object.
Durch die EP-A1-0 105 078 ist eine Einrichtung zur Durchführung des geschilderten Verfahrens zum Untersuchen der Eigenschaften von absorptionsfähigen Materialien nach dem photothermischen Effekt bekannt, bei welcher von einem stationären oder quasi-stationären Laser die Laserwellen zu einem an die Materialprobe optisch ankoppelbaren Prüfkopf mittels flexibler Lichtwellenleiterkabel transportierbar sind. Außerdem können von dem Prüfkopf die IR-Lichtsignale zu einem entfernt vom Prüfkopf angeordneten Infrarot-Detektor ebenfalls über flexible Lichtwellenleiterkabel transportiert werden. Der Meßkopf selbst enthält gehäuse-interne strahlführende Mittel, und zwar am Eingang der Laserstrahlen und am Ausgang der IR-Lichtsignale, hier je eine Fokussier-linse, ferner einen im Strahlenweg beider Linsen angeordneten Koppelspiegel, ausgebildet als dichroitischer Spiegel 1). Weiterhin ist in dem für die Laserstrahlen und die IR-Lichtsignale gemeinsamen Lichtweg eine Kristallstange, insbesondere aus Saphir bestehend, angeordnet und dieser Stange nachgeschaltet eine Fokussierlinse, welche die Laserstrahlung auf die Materialprobe fokussiert bzw. von dieser die IR-Lichtsignale empfängt. Die Lichtwellenleiter stellen bei der Materialuntersuchung ein empfindliches Element dar; außerdem dämpfen sie die in ihnen transportierte Laserstrahlung bzw. die IR-Lichtsignale.EP-A1-0 105 078 discloses a device for carrying out the described method for examining the properties of absorbent materials according to the photothermal effect, in which the laser waves from a stationary or quasi-stationary laser to a test head that can be optically coupled to the material sample can be transported using flexible fiber optic cables. In addition, the IR light signals can also be transported from the test head to an infrared detector arranged remotely from the test head via flexible optical waveguide cables. The measuring head itself contains housing-internal beam-guiding means, specifically at the input of the laser beams and at the output of the IR light signals, here a focusing lens each, and also a coupling mirror arranged in the beam path of both lenses, designed as a dichroic mirror 1) . Furthermore, a crystal rod, in particular made of sapphire, is arranged in the light path common to the laser beams and the IR light signals, and this rod is followed by a focusing lens which focuses the laser radiation on the material sample or receives the IR light signals from it. The optical fibers represent a sensitive element in the material examination; they also attenuate the laser radiation or IR light signals they carry.
Der Erfindung liegt die Aufgabe zugrunde, ein Verfahren zum Untersuchen der Eigenschaften von Materialien nach dem photothermischen Effekt zu schaffen, mit welchem ohne die Leitung der Laserwellen über Lichtwellenleiter von einem externen stationären oder quasi-stationären Laser zu dem Meßkopf und ohne eine Verbindung von einem externen Infrarotlicht-Detektor zu dem Meßkopf über Lichtwellenleiterkabel ausgekommen werden kann. Eine weitere Aufgabe der Erfindung besteht darin, die Führung des Laserstrahls von der Laserlichtquelle einerseits bis zur Materialprobe andererseits sowie die Führung der IR-Lichtsignale von der Materialprobe zum Infrarotlicht-Detektor so zu gestalten, daß sich möglichst kurze Strahlwege ergeben und die Möglichkeit eröffnet ist, eine zweite Laserlichtquelle einzukoppeln.The invention has for its object a method for Examining the properties of materials after the photothermal To create effect with which without the line the laser waves via optical fibers from an external stationary or quasi-stationary laser to the measuring head and without one Connection from an external infrared light detector to the measuring head can be managed via fiber optic cables. A another object of the invention is the management of Laser beam from the laser light source on the one hand to the material sample on the other hand, as well as the guidance of the IR light signals from the To design material sample to the infrared light detector so that beam paths are as short as possible and the possibility is opened to couple a second laser light source.
Die gestellte Aufgabe wird bei dem eingangs genannten Verfahren zum Untersuchen der Eigenschaften von Materialien nach dem photothermischen Effekt durch die Verfahrensmerkmale gemäß Anspruch 1 gelöst. The task is in the procedure mentioned above to investigate the properties of materials after the photothermal Effect achieved by the process features according to claim 1.
Vorteilhafte Weiterbildungen dieses Verfahrens nach der Erfindung sind in den Patentansprüchen 2 bis 17 sowie 39 angegeben.Advantageous developments of this method according to the invention are specified in claims 2 to 17 and 39.
Gegenstand der Erfindung sind auch mehrere vorteilhafte Verwendungen dieses Verfahrens gemäß den Patentansprüchen 18 bis 22. So kann das Verfahren nach der Erfindung verwendet werden im Rahmen der zerstörungsfreien Werkstoffprüfung zur Detektion von Materialinhomogenitäten, Materialfehlern, Delaminationen sowie Korrosions- und Erosionserscheinungen, zum Beispiel zur
- Detektion von Zeitstandschädigungen, in Form von Cavities in metallischen Werkstoffen,
- zur Kontrolle auf Fehler an
- Elektrobauteilen, wie Chips, Halbleitern, Solarzellen,
- Lötstellen,
- Erzeugnissen der Papierindustrie auf Dicke, Faserverteilung, Haftung,
- Erzeugnissen der Kunststoffindustrie auf Porositäten, Faser- verteilung und Orientierung und
- zur Prozeßkontrolle.
- Detection of creep damage, in the form of cavities in metallic materials,
- to check for errors
- Electrical components such as chips, semiconductors, solar cells,
- Solder joints,
- Paper industry products on thickness, fiber distribution, adhesion,
- Products of the plastics industry on porosity, fiber distribution and orientation and
- for process control.
Das Verfahren kann auch verwendet werden zur Ermittlung von Materialstrukturen, Materialkenngrößen, wie zum Beispiel Dichte, Leitfähigkeit, Härtegrad, und zur Ermittlung von Materialzuständen.The method can also be used to determine Material structures, material parameters, such as density, Conductivity, degree of hardness, and to determine material conditions.
Eine weitere vorteilhafte Verwendung besteht in der Messung von Schichtdicken, Belegungen, Oberflächenqualitäten, zum Beispiel Rauhtiefen, und zur Messung der Haftung von Beschichtungen.Another advantageous use is in the measurement of Layer thicknesses, coverings, surface qualities, for example Surface roughness, and for measuring the adhesion of coatings.
Eine spezielle Verwendung des Verfahrens erstreckt sich auf die Spurensuche, z.B. auf Fingerabdrücke. Das Verfahren ist gemäß einer weiteren Verwendung auch geeignet zum Aufspüren und Aufdecken von Fälschungen, z.B. bei Banknoten, Gemälden, Metall-Legierungen, Münzen, Keramiken und antiken Möbeln.A special use of the method extends to Searching for clues, e.g. for fingerprints. The procedure is according to Another use also suitable for tracking and uncovering counterfeits, e.g. for banknotes, paintings, metal alloys, Coins, ceramics and antique furniture.
Gegenstand der Erfindung ist ferner eine vorteilhafte Einrichtung gemäß Patentanspruch 23 zur Durchführung des Verfahrens nach den Verfahrensansprüchen 1 bis 17 welchen die zum Gegenstand des Anspruchs 1 erläuterte Aufgabenstellung zugrundeliegt. The invention further relates to an advantageous device according to claim 23 to carry out the method according to method claims 1 to 17 which explained the subject of claim 1 Underlying task.
Vorteilhafte Weiterbildungen zum Gegenstand des Anspruchs 23
sind in den Ansprüchen 24 bis 37 angegeben, ferner eine bevorzugte
Ausführungsform eines Wärmemikroskops im nebengeordneten
Anspruch 38.Advantageous further developments on the subject matter of
Die mit der Erfindung erzielbaren Vorteile sind vor allem darin zu sehen, daß nun Laserlichtquellen verhältnismäßig geringer Leistung und kleiner Bauform eingesetzt werden können, weil die Meßkopf-externe und/oder Meßkopf-interne Dämpfung der Laserstrahlen durch die Lichtwellenleiter und ihre Einkoppelmechanik sowie Einkoppeloptik entfällt. So kann z.B. ein diodengepumpter Neodym/YAG-Laser mit einer Wellenlänge von 1064 nm, welcher unsichtbares Licht im nahen Infrarotbereich abstrahlt, verwendet werden, welcher eine Leistung von nur 0,35 W hat, wobei ein kombinierter Transmissions- und Reflexionsgrad für den Laserstrahl von 82,9 % erreicht werden konnte. Im Inneren des Meßkopfes ergibt sich eine sehr präzise Strahlführung, was im Sinne einer Verbesserung der Genauigkeit und der Empfindlichkeit wirkt. Für die Einrichtung zur Durchführung des Verfahrens nach der Erfindung ergeben sich eine Mehrzahl von vorteilhaften Ausgestaltungsmöglichkeiten. So kann in das Gehäuse des Meßkopfes ein weiterer Laser in Form eines Pilotlasers integriert werden, der bevorzugt ein Diodenlaser, ebenfalls geringer Leistung, ist, der z.B. im sichtbaren Rotlichtbereich mit einer Wellenlänge von 670 nm und einer Leistung von 3 mW abstrahlt. Zur Einkopplung des Pilotstrahls ist eine Ausführung günstig, bei der der Laserstrahl, welcher zunächst achsparallel zum Pilotstrahl verläuft, über zwei hintereinander geschaltete Umlenkspiegel um je 90° umgelenkt wird, wobei nach der zweiten Umlenkung der Laserstrahl und der Pilotstrahl auf der gleichen Lichtbahn sind, d.h., der zweite Umlenkspiegel ist hierzu insbesondere als dichroitischer Spiegel auszubilden, welcher auf seiner reflektierenden Seite den Laserstrahl in seinen weiteren Strahlenweg schickt und der auf seiner anderen Seite den Pilotstrahl empfängt und diesen wie ein durchlässiges Fenster praktisch verlustfrei durchläßt. Der Pilotstrahl ist sehr vorteilhaft zum Einjustieren des Meßkopfes, indem durch ihn z.B. ein roter Lichtfleck auf die Materialprobe geworfen wird und nun nach diesem roten Lichtfleck die Scan-Zone gewählt werden kann. Weiterhin ist es günstig, nach dem zweiten Umlenkspiegel, also innerhalb des gemeinsamen Lichtweges für Pilot- und Laserstrahl, eine Optik anzuordnen, die zusammen mit der unmittelbar am Laserausgang angeordneten Optik eine Aufweitoptik bildet, welche vorteilhaft auf kurzem Strahlweg paralleles Laserlicht erzeugt. Die Aufweitoptik besteht also aus einer Laserausgangsseitigen ersten Optik, welche die Strahldivergenz erhöht, und der vorgenannten, dem zweiten Umlenkspiegel nachgeschalteten zweiten Optik, welche das Laserlicht parallelisiert. Optisch nachgeschaltet ist dieser Aufweitoptik dann der Koppelspiegel, von dem der Laserstrahl und der Pilotstrahl über die Scanner-Anordnung in die Achse der laserstrahl-endseitigen lichtleitenden Optik geworfen werden. Letztere ist eine Linse oder ein Linsensystem besonderer Eigenschaften, welche den Laserstrahl (und natürlich auch den Pilotstrahl) in Richtung auf die Materialprobe durchläßt oder transmittiert. In der entgegengesetzten Richtung läßt dieses Linsensystem die IR-Lichtsignale durch. Geeignet für diese Zwecke ist ein Zink-Selenid-Glas mit einer frontseitigen Beschichtung. Diese frontseitige Beschichtung hat die Aufgabe, die IR-Lichtdurchlässigkeit in einem bestimmten Spektralbereich zu verbessern, z.B. im Bereich 2 - 5 µm. Durch eine andere Auslegung (Linsenform, Material und Beschichtungsauswahl) ist es jedoch auch möglich, diese Verbesserung auf einen größeren Bereich auszudehnen, insbesondere den Bereich 8 - 12 µm ("zweites IR-Fenster"). The advantages that can be achieved with the invention are above all in it to see that now laser light sources are relatively lower Power and small size can be used because the External and / or internal measurement head attenuation of the laser beams through the optical fibers and their coupling mechanism and coupling optics are omitted. For example, a diode pumped Neodymium / YAG laser with a wavelength of 1064 nm, which is invisible Emits light in the near infrared range which has a power of only 0.35 W, with a combined Degree of transmission and reflection for the laser beam of 82.9% could be achieved. Inside the measuring head a very precise beam guidance, which is in the sense of a Improves accuracy and sensitivity. For the device for performing the method according to the invention there are a number of advantageous design options. So another in the housing of the measuring head Lasers can be integrated in the form of a pilot laser, which is preferred a diode laser, also of low power, which e.g. in the visible red light range with a wavelength of 670 nm and emits a power of 3 mW. For coupling the pilot beam is a cheap version in which the laser beam, which initially runs axially parallel to the pilot beam, over two Deflecting mirrors connected in series are deflected by 90 ° each is, after the second deflection of the laser beam and Pilot beam are on the same light path, i.e., the second Deflecting mirror is especially for this purpose as a dichroic mirror form which of the laser beam on its reflective side in his further ray path and that on his the other side receives the pilot beam and this like a permeable Windows lets through practically without loss. The pilot beam is very advantageous for adjusting the measuring head, by e.g. a red spot of light on the material sample is thrown and now after this red light spot the scan zone can be chosen. Furthermore, it is convenient after the second Deflecting mirror, i.e. within the common light path for Pilot and laser beam to arrange an optics that together with the optics arranged directly at the laser output are expanded optics forms which advantageously parallel on a short beam path Laser light generated. The expansion optics therefore consists of a Laser output side first optics, which show the beam divergence increased, and the aforementioned, the second deflecting mirror downstream second optics, which parallelizes the laser light. This expansion optic is then optically connected Coupling mirror, from which the laser beam and the pilot beam over the scanner arrangement in the axis of the laser beam end light-guiding optics are thrown. The latter is a lens or a lens system with special properties, which the Laser beam (and of course the pilot beam) in the direction transmits or transmits to the material sample. In the opposite direction, this lens system leaves the IR light signals through. A is suitable for this purpose Zinc selenide glass with a coating on the front. This front coating has the task of IR light transmission to improve in a certain spectral range e.g. in the range 2 - 5 µm. By a different interpretation (lens shape, However, it is also the choice of material and coating) possible to extend this improvement to a larger area especially the range 8 - 12 µm ("second IR window").
Der Meßkopf weist in der Strahlenachse des Koppelspiegels und des ersten Scanner-Anordnung - in Richtung der von der Materialprobe her ankommenden IR-Lichtsignale gesehen - einen nachgeschalteten IR-Umlenkspiegel auf, welcher die IR-Lichtsignale z.B. um 90° durch ein diesem Umlenkspiegel nachgeschaltetes Infrarotobjektiv auf den wenigstens einen Infrarot-Detektor weiterleitet, wobei das Infrarotobjektiv die IR-Lichtsignale auf die Empfangsflächen des genannten IR-Detektors fokussiert. Der genannte IR-Umlenkspiegel kann eine Normalausführung aufweisen, wenn er lediglich zur Reflexion der IR-Lichtsignale dient, die von der Materialprobe über die Scanner-Anordnung und den Koppelspiegel ihm zugeleitet werden. Soll über diesen IR-Umlenkspiegel jedoch auch IR-Strahlung eingekoppelt werden, die von einem Zusatzaggregat im Falle der Durchstrahlungsprüfung über dessen internes Spiegelsystem zugeführt wird, dann ist es zweckmäßig, diesen IR-Umlenkspiegel so auszuführen und anzuordnen, daß er in Bezug auf den zweiten Lichtweg als ein durchlässiges Fenster wirkt und im Bezug auf den ersten IR-Lichtweg als ein Spiegel.The measuring head points in the beam axis of the coupling mirror and of the first scanner arrangement - towards that of the material sample seen arriving IR light signals - a downstream IR deflecting mirror on which the IR light signals e.g. through 90 ° through a deflection mirror connected downstream Forwards the infrared lens to the at least one infrared detector, the infrared lens the IR light signals on the Focused receiving surfaces of the IR detector mentioned. The named IR deflecting mirror can have a normal design, if it only serves to reflect the IR light signals that from the material sample to the scanner arrangement and the coupling mirror be sent to him. Should be via this IR deflecting mirror however, IR radiation can also be injected by a Additional unit in the case of the radiographic test via its internal mirror system is fed, then it is appropriate execute and arrange this IR deflecting mirror so that it in Regarding the second light path as a translucent window acts and in relation to the first IR light path as a mirror.
Der Laserlichtquelle ist, wie erwähnt, zweckmäßigerweise eine Aufweitoptik für den Laserstrahl zugeordnet. Die Scanner-Anordnung weist bevorzugt zwei Scanner-Spiegel auf, welche von zugehörigen Antrieben so bewegt werden, daß der eine Scanner-Spiegel der Strahlablenkung in x-Richtung und der andere der Strahlablenkung in y-Richtung dient.As mentioned, the laser light source is expediently one Assigned expansion optics for the laser beam. The scanner arrangement preferably has two scanner mirrors, which of associated Drives are moved so that a scanner mirror the beam deflection in the x direction and the other the Beam deflection in the y direction is used.
Der Meßkopf kann noch - wie bereits angedeutet - durch ein Zusatzaggregat ergänzt werden, welches - bei Materialproben hinreichend geringer Wanddicke -hinter der Materialprobe positioniert wird und die von der Rückseite der Materialprobe emittierte IR-Strahlung bzw. entsprechende IR-Lichtsignale empfängt und über ein internes Umlenk-Spiegelsystem verfügt, welches die IR-Lichtsignale in den IR-Strahlengang des eigentlichen Meßkopfes sendet bzw. reflektiert. The measuring head can - as already indicated - by a Additional unit can be added, which - for material samples sufficient wall thickness behind the material sample is positioned and from the back of the material sample emitted IR radiation or corresponding IR light signals receives and has an internal deflection mirror system, which the IR light signals in the IR beam path of the actual Sensor sends or reflects.
Im folgenden werden anhand mehrerer in der Zeichnung dargestellter Ausführungsbeispiele zunächst eine Einrichtung zur Durchführung des Verfahrens nach der Erfindung, sodann das Verfahren selbst sowie weitere Vorteile und Einzelheiten erläutert. In der Zeichnung zeigen in zum Teil vereinfachter, schematischer Darstellung:
- FIG 1
- eine Einrichtung nach der Erfindung, aufgegliedert in die rechts dargestellte Materialprobe, den in der Mitte dargestellten Meßkopf und die im linken Teil gezeigten transportable elektronische Schrankeinheit, wobei eine Blockschaltbild-Darstellung gewählt ist;
- FIG 2
- in isometrischer Darstellung einer Computergraphik das Innere des Meßkopfes in detaillierterer Darstellung der strahlführenden Mittel;
- FIG 3
- die Außenansicht auf eine Einrichtung nach der Erfindung in fotografischer Perspektive, wobei in Abwandlung zu FIG 1 die elektronische Schrankeinheit nicht in Turmbauweise, sondern in Flachbauweise angeordnet ist;
- FIG 4
- den Gegenstand nach FIG 3 mit einer in Turmbauweise angeordneten Schrankeinheit;
- FIG 5
- eine Ansicht des portablen Meßkopfes von oben;
- FIG 6
- eine Darstellung des Meßkopfes bei Betrachtung in Richtung A' von FIG 3 bzw. FIG 4;
- FIG 7
- einen Schnitt nach der Schnittebene VII-VII aus FIG 5 und
- FIG 8
- ein Diagramm, welches auf dem Farbmonitor der elektronischen Schrankeinheit dargestellt wurde, wobei die Länge der Abszissenachse des Diagramms 300 µm und die Ordinatenachse 400 µm repräsentiert und wobei Mikroporen verschiedener Größe dargestellt sind, welche an zeitstandsbeanspruchten Rohrleitungen festgestellt wurden;
- FIG 9
- schematisch in Draufsicht den Meßkopf in einer Abwandlung mit angebauter Stromversorgungseinheit und
- FIG 10
- eine weitere Abwandlung des Meßkopfes in Draufsicht schematisch, wobei ein Zusatzaggregat zur Ausmessung von Materialproben relativ geringer Wanddicke an den eigentlichen Meßkopf angebaut ist;
- FIG 11
- perspektivisch-schematisch drei verschiedene Anstrahl- und Abtast-Bahnmuster, die mittels x-/y-Ablenkung verwirklicht werden können.
- FIG. 1
- a device according to the invention, divided into the material sample shown on the right, the measuring head shown in the middle and the portable electronic cabinet unit shown in the left part, a block diagram representation being selected;
- FIG 2
- in an isometric representation of a computer graphic, the interior of the measuring head in a more detailed representation of the beam guiding means;
- FIG 3
- the external view of a device according to the invention in a photographic perspective, the electronic cabinet unit being arranged in a flat construction, not in a tower construction, in a modification of FIG. 1;
- FIG 4
- the object of Figure 3 with a tower unit arranged cabinet unit;
- FIG 5
- a view of the portable measuring head from above;
- FIG 6
- a representation of the measuring head when viewed in the direction A 'of FIG 3 or 4;
- FIG 7
- a section along the section plane VII-VII of Figure 5 and
- FIG 8
- a diagram, which was shown on the color monitor of the electronic cabinet unit, the length of the axis of abscissas of the diagram representing 300 microns and the ordinate axis of 400 microns and showing micropores of different sizes, which were found on pipeline stressed pipes;
- FIG. 9
- schematically in plan view of the measuring head in a modification with attached power supply unit and
- FIG 10
- a further modification of the measuring head in plan view schematically, wherein an additional unit for measuring material samples of relatively small wall thickness is attached to the actual measuring head;
- FIG 11
- perspective-schematic three different beam and scanning path patterns that can be realized by means of x / y deflection.
Figur 1 zeigt in drei Blöcken die wesentlichen Elemente des
Verfahrens zum Untersuchen der Eigenschaften von absorptionsfähigen
Materialien, in diesem Falle der Materialprobe B, nach dem
photothermischen Effekt und der Einrichtung zu seiner Durchführung.
Der Meßkopf A, durch schwarze Umrandung hervorgehoben, ist als
integraler Lasermeßkopf ausgeführt. Er enthält einen direkt modulierten,
diodengepumpten Neodym/YAG-Laser FL, der im Wellenlängenbereich
1064 nm, d.h. im unsichtbaren nahen IR-Bereich,
abstrahlt, und eine Leistung von ca. 0,35 W aufweist. Diese
Laserlichtquelle FL, im folgenden abgekürzt als Laser bezeichnet,
ist durch ein Quadrat schematisch angedeutet. Über eine
Aufweitoptik 1 gelangt der Laserstrahl f1 zu einem dielektrischen
Spiegel 4a, welcher den Laserstrahl f1 um 90° in Richtung
auf eine Scanner-Spiegelanordnung 5 umlenkt. Von dieser gelangt
der Laserstrahl über eine laserstrahl-endseitige lichtleitende
Optik 6, dargestellt als eine Konvex-Linse, welche zugleich das
Austrittsfenster für die Laserstrahlung f1 des Meßkopfes A und
das Eintrittsfenster für die IR-Lichtsignale bildet, fokussiert
auf die Frontfläche bl der Materialprobe B, und zwar in einem
Meßpunkt b2. Oberhalb der Materialprobe B sind in Figur 11
zwei Koordinatenachsen ± x und ± y dargestellt, welche das
Ablenksystem zur Strahlablenkung oder Meßpunktabtastung gemäß
einem Anstrahl-Bahnmuster bzw. einem entsprechenden Abtast-Bahnmuster
für die emittierte IR-Strahlung symbolisieren
sollen. Das Anstrahl- und das Abtastbahnmuster verlaufen
vorzugsweise in horizontalen oder vertikalen Mäandern oder in
spiraligen Bahnen, wie schematisch angedeutet. Auch andere
Anstrahl- und Abtast-Bahnmuster sind möglich, z. B. konzentrische
Kreise. Die beiden Koordinatenachsen ± x und ± y
sind gestrichelt umrahmt von einer Linie 9, welche z.B. eine
Scan-Zone sein kann. Aufgrund der auftreffenden Laserstrahlung,
welche nach einem bestimmten Puls-Pausen-Verhältnis moduliert
sein kann und im jeweiligen Meßpunkt eine Wärmemenge, die eine
Energie von z.B. 2 . 10-5 Ws entspricht, erzeugt, emittiert die
Materialprobe B zeitlich phasenverschoben IR-Lichtsignale - Δ f3.
Das Minus-Vorzeichen soll die zu der auftreffenden Laserstrahlung
f1 entgegengesetzte Richtung symbolisieren. Diese IR-Lichtsignale
werden zur lichtleitenden Optik 6 emittiert und von
dieser durchgelassen, denn es handelt sich um eine im folgenden
als Doppeloptik bezeichnete Optik, welche in Richtung auf die
Materialprobe B die Laserstrahlung f1 durchläßt und fokussiert
und welche in der entgegengesetzten Richtung bevorzugt die emittierten
IR-Lichtsignale durchläßt. Bevorzugt hat diese Doppeloptik
6 an ihrer Frontseite eine Beschichtung, welche als Fenster
für einen Spektralbereich von 2 - 5 µm im Infrarotbereich wirkt,
dagegen praktisch nicht das Laserlicht mit seiner Wellenlänge
von 1,064 µm in der Strahlrichtung der IR-Lichtsignale transmittiert.
Zum Beispiel besteht diese Doppeloptik 6 aus Zn-Selenid-Glas
und/oder Ca-Fluorid und/oder Ba-Fluorid.FIG. 1 shows in three blocks the essential elements of the method for examining the properties of absorbent materials, in this case material sample B, after the photothermal effect and the device for carrying it out. The measuring head A, highlighted by a black border, is designed as an integral laser measuring head. It contains a directly modulated, diode-pumped neodymium / YAG laser FL, which emits in the 1064 nm wavelength range, ie in the invisible near IR range, and has an output of approx. 0.35 W. This laser light source FL, hereinafter abbreviated as laser, is indicated schematically by a square. A diverging optic 1, the laser beam passes f 1 to a
Die von der Doppeloptik 6 durchgelassene IR-Strahlung -Δ f3
wird zunächst auf die Scanner-Spiegelanordnung 5 und von dieser
auf einen halbdurchlässigen Koppelspiegel 4a geworfen, dieser
ist ausgeführt als dichroitischer Spiegel, der in Richtung des
Laserstrahls f1 reflektiert, aber in der dazu entgegengesetzten
Richtung als ein bezüglich der IR-Lichtsignale durchlässiges
Fenster wirkt. Doppeloptik 6 und Koppelspiegel 4a wirken als
Auskoppelelement für die emittierten IR-Lichtsignale. Vom
Koppelspiegel 4a werden die IR-Lichtsignale auf einen ihm
optisch nachgeschalteten IR-Umlenkspiegel 4b geworfen, der die
IR-Lichtsignale z.B. um 90° umlenkt und auf das IR-Objektiv 7
leitet. Durch entsprechende Auslegung der Doppeloptik 6 bzw.
durch Ausbildung eines optischen Systems bestehend aus Optiken
für sichtbares Licht und für IR-Licht, ist es auch möglich, die
IR-Dektektion in einem über den örtlichen Abstand einstellbaren
zeitlichen Abstand zur Laseranregung "nachlaufen" zu lassen, um
so eine definierte Tiefenzone der Probe zu detektieren oder diese
- wenn ihre Wanddicke nicht zu groß ist - so anzustrahlen, daß
sie von ihrer Rückseite IR-Lichtsignale aussendet bzw. emittiert.
Wie erwähnt, werden bevorzugt für die Doppeloptik 6 Gläser verwendet,
die in ihren Eigenschaften so ausgelegt werden, daß sowohl
für die Laserstrahlen f1 als auch für die IR-Strahlung - Δ f3
die Wirkung einer Sammel-Linse erzielt wird. Durch die Veränderung
der Apertur der Doppeloptik 6, z.B. durch Änderung des
Aufbaus und der Anordnung der optischen Elemente, kann ein dem
Meßzweck angepaßter Anteil der von der Materialprobe B emittierten
IR-Lichtsignale vergrößert und auf den IR-Detektor gelenkt
werden. Die Funktion der Doppeloptik 6 kann grundsätzlich durch
holographisch/optische Elemente ersetzt werden.The IR radiation -Δ f 3 transmitted through the
Die IR-Lichtsignale gelangen über den Koppelspiegel 4a und den
Umlenkspiegel 4b, welch letzterer die genannten Signale um z.B.
90° umlenkt, auf das IR-Objektiv 7, welches die IR-Lichtsignale
auf die Empfangsflächen 8a des IR-Detektors 8 fokussiert. Das
IR-Objektiv 7 besteht, z.B. aus Calcium-Fluorid, oder Ge oder
Si. Der IR-Detektor, welcher die ankommenden IR-Lichtsignale in
entsprechende elektrische Signale umformt, besteht z.B. aus
einer Indium-Antimonid-Verbindung und hat eine Detektionsfläche
von ca. 50 - 100 µm im Durchmesser. Sein Signal/Rausch-Verhältnis
ist bei einer Arbeitstemperatur von ca. 100 K am günstigsten.
Diese Temperatur wird näherungsweise durch Kühlung mit Stickstoff
erreicht. Ein entsprechendes Detektor-Kühlaggregat ist bei 10
angedeutet; die entsprechende Kühlgaszu- und -abfuhrleitung ist
mit 11 bezeichnet. Der IR-Detektor wird insbesondere mit einer
Joule-Thomson-Kühlung (mittels N2) gekühlt. Stattdessen kann z.B.
auch ein Stirling-Kühler nach dem Prinzip des Stirling-Motors
verwendet werden.The IR light signals pass through the
Die im IR-Detektor erzeugten elektrischen Signale gelangen über
eine Signalleitung 12 zu einem innerhalb des Meßkopfes A angeordneten
Vorverstärker 13 kleiner Baugröße, und vom Ausgang des
Vorverstärkers 13 werden die vorverstärkten elektrischen, den
IR-Lichtsignalen analogen Signale über die Signalleitung 14
einer elektronischen Verstärkerstufe, insbesondere einem Lock-in-Verstärker
15 zugeleitet, welch letzterer innerhalb einer
transportablen elektronischen Schrankeinheit C untergebracht ist.The electrical signals generated in the IR detector pass through
a
Bei Verwendung des diodengepumpten Festkörperlasers FL bzw. bei Verwendung einer für den vorgesehenen Zweck auch geeigneten Laserdiode kann die Modulation des Laserstrahls f1 über die elektrische Schaltung des Lasers erreicht werden; ein separater Modulator oder Chopper ist dann nicht erforderlich.When using the diode-pumped solid-state laser FL or when using a laser diode that is also suitable for the intended purpose, the modulation of the laser beam f 1 can be achieved via the electrical circuit of the laser; a separate modulator or chopper is then not required.
Die innerhalb der elektronischen Schrankeinheit C untergebrachte
Verstärkerstufe 15 ist z.B. ein digitaler Lock-in-Verstärker
(DLI). Im Unterschied zur Thermographie (bei der die zeitlich
weitgehend konstante Temperatur erfaßt wird) werden bei dem
photothermischen Meßverfahren die Amplitude und Phase der
Temperaturmodulation ermittelt. Die Phasenverschiebung ergibt
sich aus der zeitlichen Verzögerung, mit der die maximale
Temperatur an der Oberfläche gegenüber dem Zeitpunkt der Anregung
gemessen wird. Die Phasenverschiebung wird mit dem Lock-in-Verstärker
bestimmt. In elektrischer Wirkverbindung in beiden
Signalrichtungen steht dieser Verstärker 15 mit einem Modul
16 "Gerätesteuerung", und dieses Steuermodul 16 ist wiederum
elektrisch und elektronisch verschaltet mit einer integralen
elektrischen Signalverarbeitungs- und Speichereinheit 17 mit
Bildschirm oder Monitor 18. Die Einheit 17 ist insbesondere ein
Personal-Computer (PC). Mit anderen Worten: Die transportable
elektronische Schrankeinheit C umfaßt Mittel 15, 17 zur elektronischen
Signalverarbeitung, Speicherung und Darstellung der von
wenigstens einem IR-Lichtdetektor 8 gelieferten elektrischen
Signale und zweite Mittel 16 zur Steuerung des Meßkopfes A.
Dazu gehören: Wenigstens eine elektronische Verstärkerstufe 15
und eine dazugehörige elektronische Rechnereinheit 17, ferner
das zwischen den Verstärkern 13, 15 und der elektronischen
Rechnereinheit 17 eingeschaltete Steuermodul 16. Auf dem
Bildschirm 18 werden die aus den IR-Lichtsignale gewonnenen,
gesammelten und aufbereiteten Daten dargestellt. Das Steuermodul
16 erzeugt dabei die Steuersignale zur Einstellung der
Laserstrahl-Charakteristika für den Laser FL, wie Puls-Pausen-Verhältnis
und Strahlleistung, Anstrahl-Bahnmuster und Abtast-Bahnmuster
sowie Scan-Geschwindigkeit.The housed inside the electronic cabinet unit
Durch den Wegfall des separat aufzustellenden Gaslasers und den Verzicht auf Übertragung der Laserstrahlung über Lichtwellenleiter kann, wie bereits erwähnt, die Geräte-Mobilität hergestellt werden.By eliminating the separate gas laser and the No transmission of laser radiation via optical fibers As already mentioned, device mobility can be established.
Die elektronische Schrankeinheit C und der integrale Meßkopf A werden lediglich durch ein hochflexibles elektrisches Kabel C1 (vgl. Figur 3 und 4) relativ großer Reichweite miteinander verbunden. Damit ist vor Ort auch die zentrale Aufstellung der elektronischen Schrankeinheit C möglich, wobei Meßstellen im weiten Umkreis erreicht werden können.The electronic cabinet unit C and the integral measuring head A only by a highly flexible electrical cable C1 (cf. FIGS. 3 and 4) a relatively large range with one another connected. This also means that the electronic cabinet unit C possible, measuring points in wide range can be reached.
In Figur 1 sind mit 19 eine elektrische Signalleitung zwischen
dem Verstärker 15 und dem Laser FL bezeichnet und mit 20 eine
weitere elektrische Signalleitung zur Ansteuerung der Spiegel-Scanner-Anordnung
5 von entsprechenden Signalausgangs-Klemmen
des Personal-Computers oder der Rechnereinheit 17 her. In Figur
1 ist ein Kabel zur Versorgung des Meßkopfes A mit elektrischer
Energie nicht gesondert dargestellt. Ein solches Energieversorgungskabel
ist aber in dem flexiblen Verbindungskabel C1 nach
Figur 3 bzw. Figur 4 enthalten. In Figure 1 with 19 are an electrical signal line between
the
Bei dem im Vergleich zu Figur 1 detaillierteren Ausführungsbeispiel
nach Figur 2 erkennt man zwei optisch hintereinander geschaltete
Umlenkspiegel 2a, 2b und ein dem zweiten Umlenkspiegel
2b im Strahlengang nachgeschaltetes Aufweitobjektiv 3. Weiterhin
ist deutlicher erkennbar die Spiegel-Scanner-Anordnung 5,
welche aus zwei Scanner-Spiegeln 5a, 5b besteht, die optisch
hintereinander geschaltet sind, wobei der Scanner-Spiegel 5a um
die Drehachse 21 verstellbar gelagert ist und der Scanner-Spiegel
5b um die Drehachse 22 verdrehbar gelagert ist, so daß der
Scanner-Spiegel 5a den auf ihn geworfenen Laserstrahl f1 in
Richtung ± x und der Scanner-Spiegel 5b den auf ihn geworfenen
Laserstrahl in Richtung ± y verstellt (vgl. Figur 11). In Figur
2 ist weiterhin ein Gehäuse 23 für den Laser FL in seinen
Umrissen angedeutet und ein mit diesem Gehäuse 23 baulich
vereinigter Pilotlaser DL in Form eines Diodenlasers, von
welchem ein Pilotstrahl f2 seinen Ausgang nimmt, welcher über
den zweiten Umlenkspiegel 2b in den Strahlengang des Laserstrahls
f1 eingekoppelt wird. Wie man sieht, laufen die Strahlen
f1 (Laserstrahl) und f2 (Pilotstrahl) zunächst achsparallel
zueinander. Durch die beiden hintereinander geschalteten ersten
und zweiten Umlenkspiegel 2a, 2b wird der Laserstrahl f1 zweimal
um 90° umgelenkt, und nach der zweiten Umlenkung (nach dem
zweiten Umlenkspiegel 2b) fallen beide Strahlen f1 und f2 aufeinander.
Der zweite Umlenkspiegel 2b ist zur Einkopplung des
Pilotstrahls f2 als dichroitischer Spiegel ausgeführt, welcher
mit seiner Reflektionsseite den Laserstrahl f1 reflektiert, zugleich
aber den von der anderen Seite ankommenden Pilotstrahl
f2 als durchlässiges Fenster durchläßt. Beide Strahlen f1, f2
passieren dann die Aufweitoptik 3 und gelangen auf den dielektrischen
Spiegel 4a. In praxi wird der Pilotlaser DL nur eingeschaltet,
wenn die Scan-Zone 9 (Figur 1) festgelegt werden
soll. Der Pilotstrahl f2 gelangt mithin (wenn der Laser FL noch
nicht arbeitet und der Pilotlaser DL eingeschaltet ist) über
den dielektrischen Koppelspiegel 4a und die Scanner-Spiegelanordnung
5 durch die Doppeloptik 6 auf die Materialprobe und
erzeugt dabei einen z.B. roten Leuchtpunkt. Wenn die Scan-Zone
festgelegt ist, sollte der Pilotlaser DL vorzugsweise weiterbetrieben
werden, damit der eigentliche Meßvorgang verfolgt
werden kann, wenn dieser nach Einschalten des Lasers FL beginnt.
In Figur 2 sind in einer Art Phantomdarstellung noch einige
pultartige Lagerelemente für die vorbeschriebenen Optiken
angedeutet und generell mit 24 bezeichnet.In the exemplary embodiment according to FIG. 2, which is more detailed in comparison to FIG. 1, two optically connected deflection mirrors 2a, 2b and an
In Figur 2 sind der Laserstrahl f1 und der Pilotstrahl f2 sowie
der Strahl der von der Materialprobe (in Figur 2 nicht ersichtlich)
emittierten IR-Lichtsignale durch verstärkte Linien
hervorgehoben. Zwischen dem Koppelspiegel 4a und der Doppeloptik
6 sind die Strahlwege aller drei Strahlentypen gemeinsam;
vor dem Koppelspiegel 4a bis zum IR-Detektor 8 existiert nur
IR-Strahlung. Für die nachstehende Tabelle sei angenommen, daß
(+) die Strahlrichtung in Richtung auf die Materialprobe ist
und (-) die Richtung der von der Materialprobe emittierten
IR-Lichtsignale. Die nachfolgende Tabelle stellt eine übersichtliche
Zusammenfassung der Eigenschaften der einzelnen
Optiken sowie der optischen Verhältnisse für die drei Strahlentypen
f1, f2 und - Δf3 dar und gibt in der rechten Spalte
außerdem die Transmissionsgrade der Optiken und die Reflexionsgrade
der Spiegel für die Laserstrahlung f1 an. Durch Multiplikation
der Werte der rechten Spalte erhält man einen resultierenden
kombinierten (ersten) Transmissions- und Reflexionsgrad
für den Laserstrahl f1 von 0,829 bzw. 82,9 %. Für den IR-Strahl
- Δf3 ergibt sich ein ähnlich günstiger resultierender
(zweiter) Wert, weil die Transmissions- und Reflexionsgrade der
Optiken 6, 7 und der Spiegel 5b, 5a, 4a, 4b für den IR-Strahl
vergleichbar sind mit den Transmissions- und Reflexionsgraden
der entsprechenden Optiken und Spiegel für den Laserstrahl f1.
In Figur 3 und 4 sind gleiche Teile zu Figur 1 auch mit den
gleichen Bezugszeichen versehen. In beiden Darstellungen ist
der portable Meßkopf A mit Kühlschlitzen 25 zur Abführung der
Verlustwärme versehen; er ist jeweils auf der Plattform 26
eines Stativs 27 angeordnet und über ein flexibles Kabel C1 mit
der elektronischen Schrankeinheit C verbunden. In Figures 3 and 4 are the same parts to Figure 1 with the
provided with the same reference numerals. In both representations is
the portable measuring head A with cooling
Aus den Figuren 5 bis 7 erkennt man weitere Einzelheiten,
insbesondere konstruktiver Art, des Meßkopfes A. Figur 5 zeigt
die Doppeloptik 6 an der Stirnseite Al des Meßkopfes A, den
Koppelspiegel 4a und den IR-Umlenkspiegel 4b sowie die Scanner-Spiegelanordnung
5. In Figur 6 sind der Antrieb 5bl für den
einen Scanner-Spiegel 5b und der andere Scanner-Spiegel 5a
zu sehen, ebenso die Doppeloptik 6. Figur 7 zeigt in ihren
Umrissen den Laser FL mit seiner Aufweitoptik 1, die beiden ihm
nachgeschalteten Umlenkspiegel 2a, 2b, den Koppelspiegel 4a,
den IR-Umlenkspiegel 4b (der in der Zeichnung kreisförmig ausgeführt
ist) und die zweite Optik 3, welche Teil der Aufweitoptik
ist.From Figures 5 to 7 you can see further details,
in particular of a constructive nature, the measuring head A. Figure 5 shows
the
Figur 8 zeigt die Momentaufnahme einer Scan-Zone, vergrößert, und zwar handelt es sich um festgestellte Mikroporen in zeitstandsbeanspruchten Rohrleitungen.FIG. 8 shows the snapshot of a scan zone, enlarged, namely, micro-pores found in creep stresses Pipelines.
Figur 9 zeigt, daß an den Meßkopf A eine Energieversorgungseinheit AO angebaut werden kann, so daß zum Meßkopf keine Stromversorgungskabel verlegt werden müssen. Diese Versorgungseinheit AO kann aufladbare Akkus enthalten.FIG. 9 shows that an energy supply unit is attached to the measuring head A. AO can be attached so that no power supply cable to the measuring head must be relocated. This supply unit AO can contain rechargeable batteries.
Figur 10 zeigt, daß es durch ein gesondertes, an den eigentlichen
Meßkopf anbaubares Aggregat A2 möglich ist, relativ dünnwandige
Materialproben B' auf die von ihrer Rückseite abgestrahlte
IR-Strahlung zu untersuchen, welche über die IR-Optik 26,
die beiden Umlenkspiegel 27, 28 und eine weitere IR-Optik 29
über ein Eintrittsfenster 30 des Meßkopfes A auf den Umlenkspiegel
4b von dessen Rückseite her gelangt. Dieser Umlenkspiegel
4b ist für diesen Anwendungsfall ein dichroitischer Spiegel, wobei
dann der weitere Strahlenverlauf zum IR-Objektiv 7 und zum
IR-Detektor 8 so ist, wie anhand von Figur 2 erläutert.Figure 10 shows that there is a separate, at the actual
Measuring head attachable unit A2 is possible, relatively thin-walled
Material samples B 'on the radiated from their back
To investigate IR radiation, which via the
Mit der Einrichtung nach Figur 10 wird ein Verfahren
verwirklicht, bei dem die Materialprobe B' an einer Frontseite
mit dem Laserstrahl f1 entsprechend einem Anstrahl-Bahnmuster
angestrahlt wird. Bei entsprechend geringer Materialwanddicke
der Materialprobe B' (z. B. Bruchteilen von Millimetern) können
nun die von der Rückseite der Materialprobe B' emittierten
IR-Lichtsignale - Δ f4 entsprechend einem Abtast-Bahnmuster
abgetastet werden. Dies kann z. B. so geschehen, daß die
Umlenkspiegel 27, 28 als Scanner-Spiegel ausgeführt sind,
welche entsprechend den Scanner-Spiegeln 5a, 5b nach Figur 2
synchron mit diesen in x- bzw. y-Richtung um kleine Beträge
motorisch ausgelenkt werden. Wie man es aus Figur 10 außerdem
erkennt, ist es günstig, wenn die von der Rückseite der
dünnwandigen Materialprobe B' emittierten IR-Lichtsignale - Δ f4
so umgelenkt werden, daß sie mit dem letzten Teil des Strahlenganges
für die von der laserzugewandten Materialprobenseite
emittierten IR-Lichtsignale - Δ f3, der auf den IR-Detektor 8
ausgerichtet ist, zusammen fallen. Im vorliegenden Falle findet
die Vereinigung am IR-Umlenkspiegel 4b statt. Durch in Figur 10
nicht näher dargestellte Lichtschranken kann erreicht werden,
daß entweder nur die IR-Lichtsignale - Δ f3 oder aber - Δ f4
über den IR-Umlenkspiegel zum IR-Detektor 8 gelangen. Man kann
also die Materialprobe B' nach beiden Verfahrensvarianten
untersuchen: Man wertet entweder die IR-Lichtsignale - Δ f3
aus, die von der laserzugewandten Seite der Materialprobe B'
emittiert werden, oder die IR-Lichtsignale - Δ f4, welche von
der laserabgewandten Seite der Materialprobe B' emittiert
werden. Zwischen Meßkopf A und Zusatzaggregat ist zum Einfügen
der dünnwandigen Materialprobe B' ein Zwischenraum 31
vorgesehen. Das vom Zusatzaggregat A2 über die IR-Optik 26
empfangene IR-Lichtsignal - Δ f4 wird nach seiner Umlenkung um
zweimal 90° durch eine erste gehäuseabdichtende lichtleitende
Optik 29 vom Zusatzaggregat in den Zwischenraum 31 und von
diesem über eine zweite gehäuseabdichtende Optik 30 in den
internen Strahlengang der IR-Lichtsignale - Δ f3 des Meßkopfes
A geleitet. Dies hat den Vorteil, daß man mit einem einzigen
IR-Detektor 8 auskommt. In Sonderfällen kann aber dem
Zusatzaggregat A2 ein eigener IR-Detektor zugeordnet werden, so
daß eine Materialprobe B' praktisch gleichzeitig von beiden
Seiten her untersucht werden kann. Das Zusatzaggregat A2 kann
auch ein- und ausschwenkbar im Bezug auf die Achse des
Laserstrahls f1 ausgeführt werden, so daß der Meßkopf A
wahlweise für Oberflächenuntersuchungen oder aber für
Durchstrahlungsuntersuchungen dünnwandiger Materialproben
geeignet ist.With the device according to FIG. 10, a method is implemented in which the material sample B 'is illuminated on a front side with the laser beam f 1 in accordance with an illumination path pattern. With a correspondingly small material wall thickness of the material sample B '(e.g. fractions of a millimeter), the IR light signals - Δ f 4 emitted from the back of the material sample B' can now be scanned in accordance with a scanning path pattern. This can e.g. B. happen so that the deflecting mirrors 27, 28 are designed as scanner mirrors, which are deflected according to the scanner mirrors 5a, 5b according to Figure 2 synchronously with them in the x or y direction by small amounts by motor. As can also be seen from FIG. 10, it is advantageous if the IR light signals - Δ f 4 emitted from the back of the thin-walled material sample B 'are deflected such that they emitted with the last part of the beam path for the material sample side facing the laser IR light signals - Δ f 3 , which is aligned with the
Zurückkommend auf das bevorzugte Ausführungsbeispiel des
"Wärmemikroskops" nach Figuren 1 bis 7, wird im folgenden noch
einmal erläutert, weshalb das Weglassen von Lichtleiterfasern
im Strahlengang des Laserstrahls f1 innerhalb des portablen
Meßkopfes und das bevorzugte Weglassen dieser Lichtleiterfasern
im Strahlengang der von der Materialprobe emittierten IR-Lichtsignale
- Δf3 bis hin zum IR-Lichtdetektor 8 besonders vorteilhaft
ist. Lichtleiterfasern für das Laserlicht müssen
sogenannte Monomode-Fasern sein. Sie wirken etwa wie ein Hohlleiter,
d.h.: die Strahlen gehen praktisch geradlinig durch den
Kern. Die Kohärenzeigenschaften des Laserlichts werden nicht
oder wenig beeinträchtigt. Erforderlich ist dafür ein Kerndurchmesser
von einigen µm, also einige tausendstel Millimeter.
Eine solche Faser wird benötigt, um eine beugungsbegrenzte
Fokussierung und demzufolge eine hohe laterale Auflösung zu
ermöglichen. Die Nachteile von Monomode-Fasern sind eine aufwendige
Einkoppelmechanik und -optik zwischen Laser und Fasereintritt
sowie die hohen Einkoppelverluste, die dennoch entstehen.
Sie liegen, wie es im Labor unter optimalen Bedingungen
gemessen wurde, bei 30 bis 40 %, im praktischen Einsatz dagegen
bei 50 %. Verglichen damit sind die Dämpfungsverluste in der
Faser relativ gering (30 dB/km bei 488 nm, 2 dB/km bei 1064 nm).Returning to the preferred exemplary embodiment of the "thermal microscope" according to FIGS. 1 to 7, the following explains again why the omission of optical fibers in the beam path of the laser beam f 1 within the portable measuring head and the preferred omission of these optical fibers in the beam path emitted by the material sample IR light signals - Δf 3 up to the
Bei dem Wärmemikroskop gemäß der vorliegenden Erfindung liegt
eine kollineare Anordnung (Übereinstimmung von Laser- und IR-Pfad
zwischen dichroitischem Spiegel 4a und Doppeloptik bzw. Scan-Objektiv
6) vor, welche mit Lichtleiterfaser-Technik nicht
realisierbar ist, da eine IR-Lichtleiterfaser nicht gleichzeitig
Monomode-Faser für die Laserwellenlänge sein kann. Man könnte
allenfalls daran denken, zwischen dichroitischem Spiegel 4a und
IR-Detektor 8 eine IR-Lichtleiterfaser zu installieren. Dadurch
könnte der IR-Detektor außerhalb des portablen Meßkopfes
plaziert werden. Nachteilig dabei wären jedoch die weiteren
Übertragungsverluste und die geringe mechanische Belastbarkeit
von IR-Fasern. Außerdem wäre eine Verbindungsleitung zwischen
den elektronischen Bausteinen einschließlich IR-Detektor und
dem portablen Meßkopf dann wohl kaum steckbar zu machen,
sondern müßte fest installiert sein.The thermal microscope according to the present invention
a collinear arrangement (match of laser and IR path
between
Zusammengefaßt läßt sich die bevorzugte Ausführungsform der
Einrichtung nach der Erfindung, die man als "Wärmemikroskop"
bezeichnen kann, durch die folgenden Merkmale charakterisieren:
Wie es in den Verfahrensansprüchen 1 und 39 sowie im Begleittext
zur Tabelle auf Seite 17 und aus der rechten Spalte dieser
Tabelle hervorgeht, lassen sich mit dem Wärmemikroskop nach der
Erfindung sehr gute resultierende Transmissions- und Reflexionsgrade
von mindestens 60 % erreichen, und zwar sowohl für den
Lichtweg des Laserstrahls f1 als auch den Lichtweg der emittierten
IR-Lichtsignale -Δ f3. Der erste resultierende Transmissions-
und Reflexionsgrad für den Laserstrahl f1 kann sogar bei guter
Qualität der verwendeten Optiken und Beschichtungen in einem
Bereich zwischen 60 und 85 % liegen und beträgt vorzugsweise
mindestens 80 %. Die entsprechenden Werte für den IR-Strahl
liegen etwas niedriger, sind aber durchaus vergleichbar mit den
günstigen Transmissions- und Reflexionsgraden, die man für den
Laserstrahl f1 erzielen kann.As can be seen in process claims 1 and 39 as well as in the accompanying text to the table on
Claims (39)
- Method for testing the properties of materials according to the photothermal effect, having the following method features:a) emission of a laser beam (f1) in the direction of the surface region (9) to be tested of the material sample (B), with the laser beam (f1) being focused to the desired measuring point diameter in the target light spot by means of a photoconductive optical element (6) on the laser-beam-end side, so that there a portion of the amount of light energy is absorbed by the irradiated volume elements of the material sample, and infrared (IR) light signals (-Δf3) are emitted by the surface of the latter and the volume elements adjacent thereto;b) simultaneous generation of an irradiation path pattern of the laser radiation (f1) and of a radiation path pattern of the emitted IR light signals (-Δf3) by a scanner arrangement (5), which is arranged inside a portable measuring head (A) and has at least one mirror, which is rotatable about an axis and through which the laser radiation (f1) and the IR light signals ( -Δf3 ) are conducted;c) conduction of the IR light signals (-Δf3), which have been emitted and conducted through the scanner arrangement (5), to an optical decoupling element (6, 4a), by which the emitted IR light signals (-Δf3) are conducted further and portions of the laser beam (f1) that are reflected on the surface of the sample are substantially suppressed;d) further conduction of the decoupled IR light signals (-Δf3) and focusing thereof onto the receiving surfaces (8a) of at least one IR light detector (8), which converts the received IR light signals into corresponding electrical signals for the purpose of the further signal conditioning; ande) integration of a laser light source (FL) into the housing of the portable measuring head and conduction of the laser beam (f1) from the laser light source (FL) up to the photoconductive optical element (6), on the laser-beam-end side, inside the portable measuring head (A) with a first resulting transmittance and reflectance of at least 60%, and conduction of the IR light signals (-Δf3), which are emitted by the material sample (B), to an IR light detector (8) inside the portable measuring head (A) with a second resulting transmittance and reflectance of at least 60%.
- Method according to claim 1, characterised in that a diode-pumped solid-state laser is used as a laser light source (FL).
- Method according to claim 1, characterised in that a diode laser is used as a laser light source (FL).
- Method according to one of the claims 1 to 3, characterised in that a face of the material sample (B') is irradiated with the laser beam (f1) according to the irradiation path pattern, and in that the IR light signals (-Δf4) which - in the case of a correspondingly small material wall thickness - are emitted by the rear side of the material sample (B') are scanned according to the scanning path pattern.
- Method according to one of the claims 1 to 3, characterised in that the material sample (B) is irradiated on the same side by the laser beam (f1) and scanned with regard to the IR light signals (-Δf3) emitted by it, and in that the emitted IR light signals, on part of their way, are conducted along the same beam path and through at least one photoconductive optical element on the laser-beam-end side, as used for conducting the incoming laser radiation (f1) in accordance with the irradiation path pattern, to the optical decoupling element.
- Method according to one of the claims 1 to 3 and 5, characterised in that the optical decoupling element (4a, 6) comprises a so-called doublet (6) which lets through and focuses the laser radiation (f1) in the direction of the material sample (B), and in the opposite direction preferentially lets through the emitted IR light signals (-Δf3).
- Method according to one of the claims 1 to 6, characterised in that in order to generate the irradiation path pattern of the laser radiation (f1), the latter is conducted via two scanner mirrors (5a, 5b) which are optically connected in series, one (5a) of which mirrors is rotated about a first axis (21) for beam deflection in the X direction, and the other (5b) is rotated about a second axis (22) for beam deflection in the Y direction.
- Method according to one of the claims 1 to 3 and 5 to 7, characterised in that the optical decoupling element (6, 4a) comprises a dichroic coupling mirror (4a), and the laser radiation (f1) in a beam direction pointing towards the material sample (B) is reflected by the active mirror surface of the coupling mirror (4a) into the beam path which is aligned with the scanner mirrors (5a, 5b), while on the other hand, the IR light signals (-Δf3) arriving in the opposite direction to the laser beam (f1) are let through by the coupling mirror (4a), which acts as a window in this direction.
- Method according to one of the claims 1 to 8, characterised in that the laser beam (f1) exiting from the laser light source (FL) passes through a first optical element (1), which expands the laser beam and is part of an expanding optical element (1, 3), and is subsequently deflected twice, by 90° in each case, by way of two deflecting mirrors (2a, 2b), which are optically connected in series, so that it is aligned with the active surface of the coupling mirror (4a), and from there makes its way via the two scanner mirrors (5a, 5b) to the photoconductive optical element (6) on the laser-beam-end side, by which it is focused onto the measuring points on the material sample (B).
- Method according to claim 9, characterised in that the laser beam (f1) is guided from the second (2b) of the deflecting mirrors (2a, 2b) to the coupling mirror (4a) by way of a second optical element (3), which is part of the expanding optical element (1, 3).
- Method according to claim 9 or 10, characterised in that the pilot beam (f2) of a pilot laser (DL) is coupled into the beam path of the laser beam (f1), so that before the start of the testing or irradiation of the material sample (B) with the laser beam (f1), there is a visible target pilot light spot on the material sample for the adjustment of the scanning zone (9).
- Method according to claim 11, characterised by the use of a pilot laser (DL), preferably a diode laser, which emits in the visible red range.
- Method according to claim 11 or 12, characterised in that the pilot beam (f2) is irradiated into the beam path between the second deflecting mirror (2b) and the coupling mirror (4a), and in that for this purpose, the second deflecting mirror (2b) lets through, in the manner of a window, the pilot beam (f2) arriving on its rear side, while it reflects onto the coupling mirror (4a) the laser beam (f1) arriving on its front side.
- Method according to one of the claims 1 to 13, characterised in that the laser beam (f1) is modulated in order to achieve a desired mark-to-space ratio.
- Method according to one of the claims 1 to 14, characterised in that the laser beam (f1) is guided over the scanning zone (9) along an orthogonal irradiation path pattern.
- Method according to one of the claims 1 to 14, characterised in that the laser beam (f1) is guided over the scanning zone (9) along an irradiation path pattern which is formed by spiral or concentric circular paths.
- Method according to claim 4, characterised in that the IR light signals (-Δf4) emitted by the rear side of the thin-walled material sample (B') are deflected in such a way that they coincide with the last portion of the beam path for the IR light signals (-Δf3) emitted by the side of the material sample that faces the laser, which beam path is aligned with the IR detector (8).
- Use of the method according to one of the claims 1 to 17 within the scope of non-destructive material testing for detecting material non-homogeneities, flaws in the material, delaminations as well as corrosion marks and erosion marks, for example for:detecting creep damages in the form of cavities in metallic materialschecking for flaws inelectrical components such as chips, semiconductors, solar cellssoldered jointsproducts of the paper industry with regard to thickness, fibre distribution, adhesion,products of the plastics industry with regard to porosities, fibre distribution and orientation, andfor process control.
- Use of the method according to one of the claims 1 to 17 for establishing material structures, material characteristics such as density, thermal conductivity, specific heat, degree of hardness, for example, and for establishing material conditions.
- Use of the method according to one of the claims 1 to 17 for measuring layer thicknesses, coatings, surface qualities, for example peak-to-valley heights, and for measuring the adhesion of coatings.
- Use of the method according to one of the claims 1 to 17 for searching for traces, for example for fingerprints.
- Use of the method according to one of the claims 1 to 17 for tracing and uncovering forgeries, for example in bank notes, paintings, metal alloys, coins, ceramics and antique furniture.
- Device for carrying out the method according to one of the claims 1 to 16, having a portable measuring head which has a compact housing, with the housing having an end wall, comprising:a) a laser light source, accommodated in the housing of the portable measuring head, the laser beam (f1) of which laser light source is conducted without optical fibres by way of beam-guiding means (1, 2a, 2b, 3, 4a, 5a, 5b), which are inside the housing, up to a photoconductive optical element (6) on the laser-beam-end side;b) the above-mentioned photoconductive optical element (6) on the laser-beam-end side, accommodated on or in the end wall (A1) of the housing and constructed as a so-called doublet, which lets through and focuses the laser radiation (f1) in the direction of the material sample (B), and in the opposite direction preferentially lets through the IR light signals (-Δf3) emitted by the material sample, with the optical element (6) being part of an optical decoupling element (6, 4a);c) at least one IR light detector, accommodated in the housing of the measuring head and having its receiving surfaces aligned with the focus point of an infrared objective connected optically upstream for converting the IR light signals into corresponding electrical signals for the purpose of further signal conditioning, with the beam-guiding means inside the housing comprising a scanner mirror arrangement (5), which is connected upstream of the optical element, which is on the laser-beam-end side, in the beam path of the laser beam (f1) and is arranged for deflecting the laser beam (f1) in accordance with an irradiation path pattern and for scanning the IR light signals (-Δf3), which are emitted by the material sample (B) in the region of its scanning zone (9), according to a scanning path pattern; and with the means for conducting the laser beam (f1) being provided with a first resulting transmittance and reflectance of at least 60% and the means for conducting the IR light signals (-Δf3) being provided with a second resulting transmittance and reflectance of at least 60%.
- Device according to claim 23, characterised in that the beam-guiding means inside the housing additionally comprise:a1) a coupling mirror (4a), constructed as a dichroic mirror, which is connected upstream of the scanner mirror arrangement (5) in the beam path of the laser beam (f1) and reflects in the direction of the laser beam (f1) and in the direction opposite thereto acts as a window which is transparent with regard to the IR light signals;a2) an infrared objective (7) which, in a direction opposite to the direction of the laser beam (f1), i.e. on the side of the coupling mirror (4a) that faces away from the reflecting surface, is connected upstream of said coupling mirror and focuses the IR light signals arriving from the coupling mirror (4a) onto the receiving surfaces (8a) of at least one IR light detector (8).
- Device according to claim 23 or 24, characterised by at least one transportable electronic cabinet unit (C), comprising first means (15, 17) for electrical signal processing of the electrical signals delivered by the at least one IR light detector (8) and second means for controlling the measuring head, with the first means comprising: at least one electronic amplifier stage (15) and one electronic computer unit (17), and with the second means comprising: a control module (16) connected between amplifier stage (15) and electronic computer unit (17), with the electronic computer unit (17) having at least one screen (18) on which can be displayed the data which has been obtained from the IR light signals, collected and conditioned, and with the control module (16) generating control signals for adjusting the laser-beam characteristics of the laser light source (FL), such as mark-to-space ratio and radiant power, irradiation path pattern and scanning path pattern as well as scanning rate; at least one flexible, electrical interconnecting cable for signal transport between the measuring head (A) and the electronic cabinet unit (C), and means for supplying the portable measuring head (A) with electrical energy from an energy supply source.
- Device according to claim 25, characterised in that accommodated in the portable measuring head (A) is a pre-amplifier which is electrically connected downstream of the IR light detector and the output signal line (14) of which is led to the amplifier stage (15) of the electronic cabinet unit (C).
- Device according to claim 25 or 26, characterised in that the amplifier stage (15) is a lock-in amplifier.
- Device according to one of the claims 23 to 27, characterised in that accommodated inside the portable measuring head (A) is a pilot laser (DL), the pilot beam (f2) of which can be coupled into the beam path of the laser beam (f1), and which is used for adjustment of the scanning zone (9).
- Device according to claim 28, characterised in that the pilot laser (DL) radiates in the visible red range.
- Device according to claim 28 or 29, characterised in that the pilot beam (f2) of the pilot laser (DL) is aligned with the beam path for the laser beam (f1) of the laser light source (FL) that is situated between a second deflecting mirror (2b) and the coupling mirror (4a), with the second deflecting mirror (2b) forming a transmission window for the pilot beam (f2), which arrives on its rear side, and casting the latter onto the coupling mirror (4a).
- Device according to one of the claims 23 to 30, characterised in that a cooling unit (10) is provided in order to maintain a low-temperature working range for the IR light detector.
- Device according to one of the claims 28 to 30, characterised in that in the beam path of the laser (f1) onto a first optical element (1), which is part of an expanding optical element, there are arranged one behind the other at the output of the laser light source (FL) two first and second deflecting mirrors (2a, 2b), which are optically connected in series and direct the laser beam (f1) into an offset path which is aligned with the coupling mirror (4a), with the pilot beam (f2) of the pilot laser (DL) being aligned so as to radiate into this offset path.
- Device according to claim 32, characterised in that between the second deflecting mirror (2b) and the coupling mirror (4a), a second optical element (3), which is part of the expanding optical element system (1, 3), is inserted into the beam path.
- Device according to one of the claims 23 to 33, characterised in that in the beam path of the IR light signal (-Δf3), there is connected downstream of the coupling mirror (4a) an IR deflecting mirror (4b), which receives the IR light signals let through by the coupling mirror (4a) and casts them in the direction of the IR light detector (8) or onto an infrared objective (7) connected upstream thereof.
- Device according to one of the claims 23 to 34, characterised by a supplementary unit (A2) for the measuring head (A) for photothermal measuring of relatively thin-walled material samples (B') by receiving the IR light signals (-Δf4) emitted by the rear side of the material sample (B'), comprising an infrared optical element (26) for receiving the IR light signals, a deflecting mirror arrangement (27, 28) for deflecting the IR light signals into a beam axis which is in alignment with the receiving surface (8a) of the IR light detector (8).
- Device according to claim 35, characterised in that the IR deflecting mirror (4b) arranged upstream of the infrared objective (7) is reflective with regard to the IR light signals (-Δf3) emitted by the side of the material sample that faces the laser and transparent with regard to the IR light signals (-Δf4) emitted by the side of the material sample that faces away from the laser.
- Device according to claim 35 or 36, characterised in that there is provided between measuring head (A) and supplementary unit (A2) a gap for inserting the thin-walled material sample (B'), and in that the IR light signal (-Δf4) received by the supplementary unit (A2) can be conducted through a first photoconductive optical element (29), which seals off the housing, from the supplementary unit (A2) into the gap, and from here via a second photoconductive optical element (30), which seals off the housing, into the internal beam path of the IR light signals (-Δf3) of the measuring head (A).
- Heat microscopea) having a laser (FL) for emitting a pure-mode laser beam (f1),b) having an optical element (6)b1) for focusing the laser beam (f1) onto a material sample (B) at a measuring point (b2) having a focus diameter which is less than or equal to 10 µ, andb2) for returning the infrared light signals (-Δf3) emitted by the material sample (B),c) having a scanner arrangement (5; 5a, 5b) having at least one mirror which is rotatable about an axis, for deflecting the laser beam (f1) and the emitted IR light signal (-Δf3),d) having a decoupling element (4a) for decoupling the infrared light signals (-Δf3),e) having an infrared detector (8), which is arranged next to the laser (FL),f) having a deflecting mirror (4b) for deflecting onto the infrared detector (8) the infrared light signals (-Δf3) which have been decoupled by the decoupling element (4a),g) having a housing in which the laser (FL), the scanner arrangement (5; 5a, 5b), the optical element (6), the decoupling element (4a), the deflecting mirror (4b) and the infrared detector (8) are jointly accommodated, andh) having a signal evaluating unit (13, 15, 17, 18) for evaluating and displaying the signals of the infrared detector (8).
- Method according to claim 1, characterised in that the first resulting transmittance and reflectance for the laser beam (f1) lies in the range between 60% and 85%, and preferably amounts to at least 80%.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE3913474 | 1989-04-24 | ||
DE3913474A DE3913474A1 (en) | 1989-04-24 | 1989-04-24 | PHOTOTHERMAL EXAMINATION METHOD, DEVICE FOR IMPLEMENTING IT AND USE OF THE METHOD |
Publications (3)
Publication Number | Publication Date |
---|---|
EP0394932A2 EP0394932A2 (en) | 1990-10-31 |
EP0394932A3 EP0394932A3 (en) | 1992-03-25 |
EP0394932B1 true EP0394932B1 (en) | 1998-03-04 |
Family
ID=6379348
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP90107682A Expired - Lifetime EP0394932B1 (en) | 1989-04-24 | 1990-04-23 | Photothermal inspection method, arrangement for its working out, and utilisation of the method |
Country Status (6)
Country | Link |
---|---|
US (1) | US5118945A (en) |
EP (1) | EP0394932B1 (en) |
JP (1) | JPH034151A (en) |
AT (1) | ATE163762T1 (en) |
DE (2) | DE3913474A1 (en) |
ES (1) | ES2113849T3 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109142424A (en) * | 2018-07-24 | 2019-01-04 | 安徽康能电气有限公司 | A kind of transmission line of electricity external force damage prevention monitoring device based on infrared thermal imaging technique |
CN110261436A (en) * | 2019-06-13 | 2019-09-20 | 暨南大学 | Rail deformation detection method and system based on infrared thermal imaging and computer vision |
DE102021127596A1 (en) | 2021-10-22 | 2023-04-27 | Linseis Messgeräte Gesellschaft mit beschränkter Haftung | thermal conductivity meter |
Families Citing this family (44)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4003407A1 (en) * | 1990-02-05 | 1991-08-08 | Siemens Ag | Testing surfaces of moving objects - by photo-thermal heat wave analysis using fixed measurement arrangement with measurement spot inside thermal radiation spot |
DE4114671A1 (en) * | 1991-05-06 | 1992-11-12 | Hoechst Ag | METHOD AND MEASURING ARRANGEMENT FOR CONTACTLESS ON-LINE MEASUREMENT |
DE4114672A1 (en) * | 1991-05-06 | 1992-11-12 | Hoechst Ag | METHOD AND MEASURING ARRANGEMENT FOR CONTACTLESS ON-LINE MEASUREMENT |
DE4131866C2 (en) * | 1991-09-25 | 1995-07-27 | Orga Kartensysteme Gmbh | Device for laser recording on identity cards |
DE4203272C2 (en) * | 1992-02-05 | 1995-05-18 | Busse Gerd Prof Dr Rer Nat Hab | Process for the phase-sensitive display of an effect-modulated object |
DE4239479A1 (en) * | 1992-11-21 | 1994-05-26 | Hannover Laser Zentrum | Methods for recognizing and sorting different plastics |
CA2111945C (en) * | 1992-12-21 | 1997-12-09 | Katsuji Kimura | Analog multiplier using an octotail cell or a quadritail cell |
US5376793A (en) * | 1993-09-15 | 1994-12-27 | Stress Photonics, Inc. | Forced-diffusion thermal imaging apparatus and method |
DE4343076C2 (en) * | 1993-12-16 | 1997-04-03 | Phototherm Dr Petry Gmbh | Device for photothermal testing of a surface of an object in particular being moved |
DE19542534C1 (en) * | 1995-11-15 | 1997-02-27 | Phototherm Dr Petry Gmbh | Induced heat radiation generating and detecting apparatus radiation |
US5567939A (en) * | 1995-12-19 | 1996-10-22 | Hong; Yu-I | Infrared scanner and stand assembly |
DE19623121C2 (en) * | 1996-06-10 | 2000-05-11 | Wagner International Ag Altsta | Method and device for photothermal testing of workpiece surfaces |
US5702184A (en) * | 1996-07-09 | 1997-12-30 | Chang; Su-Fen | Device for thermally testing a temperature control element |
US5719395A (en) * | 1996-09-12 | 1998-02-17 | Stress Photonics Inc. | Coating tolerant thermography |
US5714758A (en) * | 1996-10-10 | 1998-02-03 | Surface Optics Corp. | Portable infrared surface inspection system |
DE19747784A1 (en) * | 1997-10-29 | 1999-05-06 | Rothe Lutz Dr Ing Habil | Object identifying using thermal signature analysis and infrared sensor system |
FI109730B (en) * | 1998-06-18 | 2002-09-30 | Janesko Oy | Arrangement for measurement of pH or other chemical property detectable by dye indicators |
US6360935B1 (en) * | 1999-01-26 | 2002-03-26 | Board Of Regents Of The University Of Texas System | Apparatus and method for assessing solderability |
US6605807B2 (en) | 2000-06-05 | 2003-08-12 | The Boeing Company | Infrared crack detection apparatus and method |
US7401976B1 (en) * | 2000-08-25 | 2008-07-22 | Art Advanced Research Technologies Inc. | Detection of defects by thermographic analysis |
US6756591B1 (en) * | 2003-03-14 | 2004-06-29 | Centre National De La Recherche | Method and device for photothermal imaging tiny particles immersed in a given medium |
US7063097B2 (en) | 2003-03-28 | 2006-06-20 | Advanced Technology Materials, Inc. | In-situ gas blending and dilution system for delivery of dilute gas at a predetermined concentration |
WO2004088415A2 (en) * | 2003-03-28 | 2004-10-14 | Advanced Technology Materials Inc. | Photometrically modulated delivery of reagents |
US7052174B2 (en) * | 2004-09-16 | 2006-05-30 | The United States Of America As Represented By The Secretary Of The Army | Device for determining changes in dimension due to temperature fluctuation |
EP1691189A3 (en) * | 2005-02-14 | 2010-12-01 | Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) | Photothermal conversion measurement apparatus, photothermal conversion measurement method, and sample cell |
DE102007059502B3 (en) * | 2007-12-07 | 2009-03-12 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Method for testing a rotor blade of a wind turbine and testing device |
US7712955B2 (en) * | 2007-12-17 | 2010-05-11 | Chinhua Wang | Non-contact method and apparatus for hardness case depth monitoring |
DE102010014744B4 (en) * | 2010-04-13 | 2013-07-11 | Siemens Aktiengesellschaft | Apparatus and method for projecting information onto an object in thermographic surveys |
US8488237B2 (en) * | 2011-01-12 | 2013-07-16 | Raytheon Company | Wide spectral coverage Ross corrected Cassegrain-like telescope |
WO2013007804A1 (en) * | 2011-07-13 | 2013-01-17 | Universität Leipzig | Twin-focus photothermal correlation spectroscopy method and device for the characterization of dynamical processes in liquids and biomaterials with the help of absorbing markers |
EP3640701B1 (en) | 2011-10-25 | 2022-06-15 | Daylight Solutions Inc. | Infrared imaging microscope using tunable laser radiation |
DE102012101467B4 (en) * | 2012-02-23 | 2013-10-31 | BAM Bundesanstalt für Materialforschung und -prüfung | Apparatus for thermographic testing for defects, in particular for cracks in surfaces and cavities |
DE102012103975B3 (en) * | 2012-05-07 | 2013-08-01 | Bundesrepublik Deutschland, vertreten durch das Bundesministerium für Wirtschaft und Technologie, dieses vertreten durch den Präsidenten der BAM, Bundesanstalt für Materialforschung und -prüfung | Device for active thermography examination, for non-destructive material testing of components, has dichroic filter between infrared (IR) camera and test element to block and pass electromagnetic radiation in two wavelength ranges |
JP6525161B2 (en) | 2013-04-12 | 2019-06-05 | デイライト ソリューションズ、インコーポレイテッド | Refractive objective lens assembly for infrared light |
JP2014240801A (en) * | 2013-06-12 | 2014-12-25 | 株式会社日立ハイテクノロジーズ | Infrared inspection apparatus |
FR3020678B1 (en) * | 2014-04-30 | 2021-06-25 | Areva Np | PHOTOTHERMAL EXAMINATION PROCESS AND CORRESPONDING EXAMINATION SET |
CN103983200A (en) * | 2014-05-04 | 2014-08-13 | 京东方科技集团股份有限公司 | Method and device for measuring film thickness and coating machine |
ES2672981T3 (en) * | 2014-07-18 | 2018-06-19 | Optisense Gmbh & Co. Kg | Photothermal measuring instrument for the measurement of layer thicknesses as well as a procedure for photothermal measurement |
US10132743B2 (en) | 2016-01-25 | 2018-11-20 | General Electric Company | Fixed optics photo-thermal spectroscopy reader and method of use |
FR3053469B1 (en) * | 2016-06-30 | 2018-08-17 | Areva Np | METHOD FOR INSPECTING A METAL SURFACE AND DEVICE THEREFOR |
JP2018059874A (en) * | 2016-10-07 | 2018-04-12 | 学校法人東北学院 | Heat source scanning type thermographic system |
CN109030463B (en) * | 2018-09-21 | 2024-01-30 | 中国工程物理研究院流体物理研究所 | Laser-induced breakdown spectroscopy system for single multi-point simultaneous measurement and measurement method |
LU101529B1 (en) * | 2019-12-12 | 2021-06-15 | Aim Systems Gmbh | Device and method for determining a material property of a test body in a test body area close to the surface |
US20230046023A1 (en) * | 2020-02-07 | 2023-02-16 | Agency For Science, Technology And Research | Active infrared thermography system and computer-implemented method for generating thermal image |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3803413A (en) * | 1972-05-01 | 1974-04-09 | Vanzetti Infrared Computer Sys | Infrared non-contact system for inspection of infrared emitting components in a device |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3808439A (en) * | 1972-04-24 | 1974-04-30 | Us Army | Laser illumination thermal imaging device for nondestructive testing |
DE3067251D1 (en) * | 1979-07-03 | 1984-05-03 | Allied Corp | Structural element, tetrahedral truss constructed therefrom and method of construction |
DE3034944C2 (en) * | 1980-09-01 | 1985-01-17 | Gerhard Dr. 8029 Sauerlach Busse | Method and device for the photothermal structure investigation of solid bodies |
DE3204146C2 (en) * | 1982-02-06 | 1986-06-19 | Bundesrepublik Deutschland, vertreten durch den Bundesminister für Wirtschaft in Bonn, dieser vertreten durch den Präsidenten der Bundesanstalt für Materialprüfung (BAM), 1000 Berlin | Infrared thermography reflection method |
IL65176A0 (en) * | 1982-03-05 | 1982-05-31 | C I Ltd | Material testing method and apparatus |
US4522510A (en) * | 1982-07-26 | 1985-06-11 | Therma-Wave, Inc. | Thin film thickness measurement with thermal waves |
US4481418A (en) * | 1982-09-30 | 1984-11-06 | Vanzetti Systems, Inc. | Fiber optic scanning system for laser/thermal inspection |
US4752140A (en) * | 1983-12-02 | 1988-06-21 | Canadian Patents And Development Limited/Societe Canadienne Des Brevets Et D'exploitation Limitee | Pulsed dilatometric method and device for the detection of delaminations |
GB8422873D0 (en) * | 1984-09-11 | 1984-10-17 | Secr Defence | Static stress measurement in object |
US4707605A (en) * | 1986-05-07 | 1987-11-17 | Barnes Engineering Company | Method and apparatus for thermal examination of a target by selective sampling |
DE3631652C2 (en) * | 1986-09-17 | 1994-05-19 | Siemens Ag | Measuring arrangement for non-contact thickness determination |
US4874948A (en) * | 1986-12-29 | 1989-10-17 | Canadian Patents And Development Limited | Method and apparatus for evaluating the degree of cure in polymeric composites |
US4792683A (en) * | 1987-01-16 | 1988-12-20 | Hughes Aircraft Company | Thermal technique for simultaneous testing of circuit board solder joints |
DE3813258A1 (en) * | 1988-04-20 | 1989-11-02 | Siemens Ag | Method for the non-contact testing and non-destructive testing of absorptive materials, and device for carrying it out |
-
1989
- 1989-04-24 DE DE3913474A patent/DE3913474A1/en not_active Withdrawn
-
1990
- 1990-04-23 ES ES90107682T patent/ES2113849T3/en not_active Expired - Lifetime
- 1990-04-23 AT AT90107682T patent/ATE163762T1/en not_active IP Right Cessation
- 1990-04-23 DE DE59010808T patent/DE59010808D1/en not_active Expired - Fee Related
- 1990-04-23 EP EP90107682A patent/EP0394932B1/en not_active Expired - Lifetime
- 1990-04-23 JP JP2108544A patent/JPH034151A/en active Pending
- 1990-04-24 US US07/513,902 patent/US5118945A/en not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3803413A (en) * | 1972-05-01 | 1974-04-09 | Vanzetti Infrared Computer Sys | Infrared non-contact system for inspection of infrared emitting components in a device |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109142424A (en) * | 2018-07-24 | 2019-01-04 | 安徽康能电气有限公司 | A kind of transmission line of electricity external force damage prevention monitoring device based on infrared thermal imaging technique |
CN110261436A (en) * | 2019-06-13 | 2019-09-20 | 暨南大学 | Rail deformation detection method and system based on infrared thermal imaging and computer vision |
CN110261436B (en) * | 2019-06-13 | 2022-03-22 | 暨南大学 | Rail fault detection method and system based on infrared thermal imaging and computer vision |
DE102021127596A1 (en) | 2021-10-22 | 2023-04-27 | Linseis Messgeräte Gesellschaft mit beschränkter Haftung | thermal conductivity meter |
Also Published As
Publication number | Publication date |
---|---|
ATE163762T1 (en) | 1998-03-15 |
DE59010808D1 (en) | 1998-04-09 |
EP0394932A2 (en) | 1990-10-31 |
EP0394932A3 (en) | 1992-03-25 |
JPH034151A (en) | 1991-01-10 |
ES2113849T3 (en) | 1998-05-16 |
US5118945A (en) | 1992-06-02 |
DE3913474A1 (en) | 1990-10-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0394932B1 (en) | Photothermal inspection method, arrangement for its working out, and utilisation of the method | |
DE4343076C2 (en) | Device for photothermal testing of a surface of an object in particular being moved | |
EP3172610B1 (en) | Method and device for microscopic examination of a sample | |
EP3583390B1 (en) | Method and device for detecting a focal position of a laser beam | |
EP1610117A2 (en) | Light scanning device | |
DE10105391A1 (en) | Scanning microscope and module for a scanning microscope | |
DE3424108A1 (en) | SPECTROMETRY SAMPLE ARRANGEMENT, METHOD FOR MEASURING LUMINESCENCE AND SCATTERING AND USE OF THE SAMPLE ARRANGEMENT | |
DE3610165A1 (en) | OPTICAL SCAN MICROSCOPE | |
EP1615064B1 (en) | Reflective phase filter for a scanning microscope | |
DE112015006624T5 (en) | Far infrared spectroscopy device | |
DE10217098A1 (en) | Incident lighting arrangement for a microscope | |
DE4015893C2 (en) | Method and device for examining the internal structure of an absorbent test specimen | |
DE3813258A1 (en) | Method for the non-contact testing and non-destructive testing of absorptive materials, and device for carrying it out | |
DE102008048266B4 (en) | A method for the rapid determination of the separate components of volume and surface absorption of optical materials, an apparatus therefor and their use | |
DE19909595B4 (en) | Method and apparatus for measuring the spatial power density distribution of high divergence and high power radiation | |
DE69937237T2 (en) | METHOD AND DEVICE FOR ULTRASONIC LASER TESTS | |
CN112595493A (en) | Common target surface measuring device and method for laser damage threshold and nonlinear absorption | |
EP0925496B1 (en) | Arrangement for assessing reflection behaviour | |
EP3614130A1 (en) | Device for determining optical properties of samples | |
DE102014110341A1 (en) | Method and apparatus for microscopically examining a sample | |
DE19548158A1 (en) | Very small optical measuring head for laser Doppler vibrometer | |
WO2010066751A2 (en) | Device and method for measuring the motion, shape, and/or deformation of objects | |
DE102015205699B4 (en) | Spectrometer with single mode waveguide | |
DE19950225A1 (en) | Arrangement for the optical scanning of an object | |
Power et al. | Longitudinal light profile microscopy: A new method for seeing below the surfaces of thin-film materials |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
AK | Designated contracting states |
Kind code of ref document: A2 Designated state(s): AT BE CH DE ES FR GB IT LI NL SE |
|
17P | Request for examination filed |
Effective date: 19901205 |
|
PUAL | Search report despatched |
Free format text: ORIGINAL CODE: 0009013 |
|
AK | Designated contracting states |
Kind code of ref document: A3 Designated state(s): AT BE CH DE ES FR GB IT LI NL SE |
|
17Q | First examination report despatched |
Effective date: 19950116 |
|
GRAG | Despatch of communication of intention to grant |
Free format text: ORIGINAL CODE: EPIDOS AGRA |
|
GRAG | Despatch of communication of intention to grant |
Free format text: ORIGINAL CODE: EPIDOS AGRA |
|
GRAG | Despatch of communication of intention to grant |
Free format text: ORIGINAL CODE: EPIDOS AGRA |
|
GRAH | Despatch of communication of intention to grant a patent |
Free format text: ORIGINAL CODE: EPIDOS IGRA |
|
GRAH | Despatch of communication of intention to grant a patent |
Free format text: ORIGINAL CODE: EPIDOS IGRA |
|
GRAA | (expected) grant |
Free format text: ORIGINAL CODE: 0009210 |
|
RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: PETRY, HARALD, DR. Owner name: SIEMENS AKTIENGESELLSCHAFT |
|
AK | Designated contracting states |
Kind code of ref document: B1 Designated state(s): AT BE CH DE ES FR GB IT LI NL SE |
|
REF | Corresponds to: |
Ref document number: 163762 Country of ref document: AT Date of ref document: 19980315 Kind code of ref document: T |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: GB Payment date: 19980310 Year of fee payment: 9 |
|
REG | Reference to a national code |
Ref country code: CH Ref legal event code: NV Representative=s name: SIEMENS SCHWEIZ AG Ref country code: CH Ref legal event code: EP |
|
GBT | Gb: translation of ep patent filed (gb section 77(6)(a)/1977) |
Effective date: 19980317 |
|
REF | Corresponds to: |
Ref document number: 59010808 Country of ref document: DE Date of ref document: 19980409 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: ES Payment date: 19980413 Year of fee payment: 9 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: AT Payment date: 19980416 Year of fee payment: 9 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: NL Payment date: 19980420 Year of fee payment: 9 Ref country code: FR Payment date: 19980420 Year of fee payment: 9 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: BE Payment date: 19980422 Year of fee payment: 9 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: SE Payment date: 19980423 Year of fee payment: 9 |
|
ET | Fr: translation filed | ||
ITF | It: translation for a ep patent filed |
Owner name: STUDIO JAUMANN P. & C. S.N.C. |
|
REG | Reference to a national code |
Ref country code: ES Ref legal event code: FG2A Ref document number: 2113849 Country of ref document: ES Kind code of ref document: T3 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: CH Payment date: 19980709 Year of fee payment: 9 |
|
PLBE | No opposition filed within time limit |
Free format text: ORIGINAL CODE: 0009261 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT |
|
26N | No opposition filed | ||
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: GB Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 19990423 Ref country code: AT Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 19990423 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: SE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 19990424 Ref country code: ES Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 19990424 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: LI Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 19990430 Ref country code: CH Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 19990430 Ref country code: BE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 19990430 |
|
BERE | Be: lapsed |
Owner name: SIEMENS A.G. Effective date: 19990430 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: NL Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 19991101 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: DE Payment date: 19991110 Year of fee payment: 10 |
|
GBPC | Gb: european patent ceased through non-payment of renewal fee |
Effective date: 19990423 |
|
REG | Reference to a national code |
Ref country code: CH Ref legal event code: PL |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: FR Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 19991231 |
|
NLV4 | Nl: lapsed or anulled due to non-payment of the annual fee |
Effective date: 19991101 |
|
EUG | Se: european patent has lapsed |
Ref document number: 90107682.8 |
|
REG | Reference to a national code |
Ref country code: FR Ref legal event code: ST |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: DE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20010201 |
|
REG | Reference to a national code |
Ref country code: ES Ref legal event code: FD2A Effective date: 20010503 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: IT Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES;WARNING: LAPSES OF ITALIAN PATENTS WITH EFFECTIVE DATE BEFORE 2007 MAY HAVE OCCURRED AT ANY TIME BEFORE 2007. THE CORRECT EFFECTIVE DATE MAY BE DIFFERENT FROM THE ONE RECORDED. Effective date: 20050423 |