EP0381792A1 - Cooking utensil - Google Patents

Cooking utensil Download PDF

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Publication number
EP0381792A1
EP0381792A1 EP89102187A EP89102187A EP0381792A1 EP 0381792 A1 EP0381792 A1 EP 0381792A1 EP 89102187 A EP89102187 A EP 89102187A EP 89102187 A EP89102187 A EP 89102187A EP 0381792 A1 EP0381792 A1 EP 0381792A1
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EP
European Patent Office
Prior art keywords
carrier plate
hotplate
cooking appliance
glass
appliance according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP89102187A
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German (de)
French (fr)
Inventor
Josef Lorenz
Robert Kicherer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EGO Elektro Geratebau GmbH
Original Assignee
EGO Elektro Gerate Blanc und Fischer GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EGO Elektro Gerate Blanc und Fischer GmbH filed Critical EGO Elektro Gerate Blanc und Fischer GmbH
Publication of EP0381792A1 publication Critical patent/EP0381792A1/en
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/68—Heating arrangements specially adapted for cooking plates or analogous hot-plates
    • H05B3/72—Plates of sheet metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/68—Heating arrangements specially adapted for cooking plates or analogous hot-plates
    • H05B3/74—Non-metallic plates, e.g. vitroceramic, ceramic or glassceramic hobs, also including power or control circuits
    • H05B3/748—Resistive heating elements, i.e. heating elements exposed to the air, e.g. coil wire heater
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/013—Heaters using resistive films or coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/017—Manufacturing methods or apparatus for heaters

Definitions

  • the invention relates to a cooking appliance which can either be provided in the form of an overall appliance, for example with a coherent cooking surface covering a plurality of hotplates, or can also consist of individual hotplates to be inserted in a cooker or hob.
  • the object of the invention is to further improve such a hotplate and / or its heating.
  • the invention provides a hotplate which has one or more of the features of the invention described below, which can be used individually or in groups, also in the form of sub-combinations, to implement the invention:
  • the hotplate support can consist of metal, in particular sheet metal, preferably of chrome steel. Chrome steel types 1.4742 and 1.4016 have proven particularly suitable.
  • the hotplate support can also be made of glass, for example quartz glass, or ceramic, e.g. based on aluminum titanate, aluminum nitride or silicon nitride, or made of glass ceramic. Instead of quartz glass, it is also possible to use quartz material which differs from quartz glass in optical properties, but this is not so important in the present application. Composite materials, for example a metal with a dielectric insulating layer applied below and / or an enamelling on the upper surface, can also be used advantageously. In the case of a chrome steel carrier plate in particular, it is preferred to provide the hotplate surface with a dark, temperature-resistant enamel, because chrome steel could discolor at the temperatures which occur, which is not accepted due to the appearance.
  • these carrier plates can be provided as individual hot plates or as entire plates with heating arranged in places below them, with the chromium steel plates preferably being designed as a single plate in order to prevent signs of distortion.
  • the heating is advantageously carried out by thick-film resistors which are applied to the underside of the carrier in the case of insulating carriers directly and in the case of conductive or becoming conductive materials which are incompatible with the heating on a corresponding intermediate layer.
  • the thick-film resistors can be applied to the carrier by screen printing, by doctor blade method or by an ink-jet application method. They are either very thin layers provided with highly conductive metals, for example based on silver, copper, nickel or aluminum, which are arranged as meanders, if necessary, around the nope to give resistance or real resistance layers can be used, which then have a large area of current flowing through them, for example based on ruthenium.
  • the conductive components are provided in glass frits or other powdered or pasty media, which can also contain oxides as binders, applied in the process already described and finally melted or burned on.
  • a dielectric layer possibly provided on the carrier as a composite or intermediate layer can also be provided in the same process as a thin glass layer applied in paste form.
  • connections are made advantageously via soldered pins with an enlarged contact plate.
  • a metal-filled glass paste is used as the hard solder, which is preferably applied to the contact point using the screen printing method.
  • a nickel-made bolt is soldered directly to the thick-film resistor on the intended contact surface, in a hard soldering process that can withstand considerable temperatures.
  • a strand can then be attached to the connecting bolt by a conventional welding process.
  • Thick-film temperature sensors can also be attached as sensors, for example sensor layers with positive or negative thermal resistance characteristics (PTC or NTC sensors).
  • PTC or NTC sensors positive or negative thermal resistance characteristics
  • the advantageous attachment of several sensors at different locations on the carrier and / or one or more sensors that measure the temperature over a large area can also detect temperature differences within the carrier, which makes it possible to develop an automatic cooking system with pan detection. It is taken into account whether a pot decreases its performance due to its uneven bottom or because of the small amount.
  • the temperature limitation via these preferably printed sensors should advantageously be carried out in such a way that there can be no warping or thermal overloading of the supports.
  • warpage is the main problem, which can be counteracted by choosing material with a low coefficient of expansion.
  • a reasonable temperature limit should be between 350 and 500 ° C, preferably between 400 and 450 ° C. All cooking and roasting processes must be carried out at these temperatures and there is very little tendency to warp. This applies in particular to hot plates which transfer heat preferably by contact, while radiation-heated hot plates are sometimes exposed to higher temperatures on their underside, which up to e.g. Appropriate temperature limit (over 600 ° C) for glass ceramics.
  • the temperature can be reliably detected and limited by the temperature limitation by means of printed sensors.
  • Standard hotplate geometries are possible, for example circular shapes and all other useful shapes, such as elongated, oval or square hotplate shapes.
  • Two-circle versions for example in the form of two concentric, independently switchable hotplates that allow adaptation to different saucepan sizes, are also feasible, as are shapes that have a central, round hob and one or both sides adjoining the cooking surface into an elongated shape have additional switch-on heating points.
  • the sealing between individual hot plates and the hob or built-in plate can be made by silicone seals or, in particular in connection with an edge or frame made of metal, by melting glass.
  • the plate which itself is made of glass or ceramic, for example, can be fused or glued to the ring surrounding it by means of a lower-melting glass, so that absolute throughput security is provided.
  • a material with a comparable or identical coefficient of expansion is preferably selected for the edge and the plate and possibly also the melting glass, taking into account the temperatures occurring at the individual points.
  • the thick-layer conductor track and / or a colored layer underneath can serve as decor. This means that the respective hotplate can be visually identified.
  • thermal insulation it is very advantageous for the thermal insulation to be carried out downwards by means of a thermal insulation mat or a molded body made of insulating material, a gap of a few millimeters, preferably approximately 2 mm, preferably being present between the thick-film resistor and the mat, in which there is still air or can also be a vacuum.
  • the decorative layer on the side facing away from the carrier plate, ie below the heating conductor, can also serve as protection for these at the same time.
  • Fig. 1 shows the top view of a cooking device 11 with a mounting plate 15, which is installed in a worktop 12, for example the upper cover plate of a piece of kitchen furniture.
  • This mounting plate 15 consists of glass ceramic, four heating points 13, each with two concentrically arranged heating resistors in the form of a thick-film resistor, are applied to the underside, possibly with the interposition of an insulating glass intermediate layer.
  • the drawing shows the decor of the hotplate top, which indicates two mutually concentric, independently switchable areas.
  • Fig. 2 shows a section through a single hotplate 14, which consists of an upper support plate 15 made of quartz glass, on the underside of which thick-film resistors 16 are applied by coating.
  • the carrier plate 15 lies in the edge of a carrier shell 17 which rests with a protruding edge 18 on the edge of the opening in a mounting plate 19 and is supported there by spring elements 20 on the underside.
  • the mounting plate can, for example, be made of tempered glass, but also consist of enamelled steel sheet or V2A steel.
  • Thermal insulation 21 lies in the flat carrier shell at a distance from the underside of the heater 16.
  • FIG. 3 likewise shows a carrier plate 15 made of quartz glass, on the underside of which a thick-film resistor 16 is applied in several areas, for example to create a two-circuit plate.
  • a sensor 22 for temperature control and / or limitation is applied in the same way on the underside.
  • the entire back is covered by a colored protective layer 23, which can also shimmer through the quartz glass plate.
  • the carrier plate 15 is received in an edge made of stainless steel sheet, which has a drip edge 24 projecting downwards on the inside, a receiving angle 25 for the edge of the carrier plate and an outwardly projecting flange 26, which at first is essentially horizontal, then runs inclined downwards at an angle and rests on a shoulder of a mounting plate 19 which consists of deformed sheet metal.
  • the shoulder 27 is followed on the inside by an upwardly directed coaming 28 and on the outside by a depression 29.
  • the edge of the carrier plate 15 is fastened in the region of the receiving angle 25 by melting using a melting glass made from a glass paste.
  • FIG. 4 shows such an embodiment, in which the edge of the carrier plate 15 is flared downwards and is surrounded by an edge region 30 of the carrier shell 17, a silicone seal being interposed there.
  • the support on the mounting plate 19, which in turn can consist of tempered glass, is carried out via a silicone seal.
  • the carrier shell 17 is fixed in the opening of the mounting plate 19 by resilient tabs 31 which snap into the mounting opening behind the opening edge when the unit is pressed in.
  • FIG. 5 shows a corresponding construction in which, in order to reduce the installation height of the cooking surface 33 compared to the surface of the installation plate 19, this has an upper circumferential recess 34 in the opening area, into which the receiving angle 25 can be inserted.
  • the horizontally extending upper, outer flange 35 of the carrier shell lies on the surface of the mounting plate. It can consist of enamelled steel sheet.
  • the heating carrier plate 15 is received in the receiving angle 25 similarly to FIG. 3, however the receiving angle is not as deep as the carrier plate is thick and the edge is chamfered for this purpose.
  • FIG. 6 shows an embodiment corresponding to FIG. 5, in which, as in all embodiments, the same parts are identified by the same reference symbols and their repeated description is dispensed with.
  • the edge flange 35 is also sunk in the mounting plate 19.
  • FIG. 7 shows an embodiment in which the carrier plate 15 rests on the mounting plate 19 with the interposition of the receiving angular range 25 because it has a larger diameter than the mounting opening.
  • the outer edge 36 of the carrier shell 17 is inclined downward and lies on the surface of the mounting plate.
  • FIG. 8 shows in high magnification a connecting bolt 40, preferably made of nickel, which is soldered by means of a hard solder layer 41 with its plate-shaped fastening section 42 onto a contact surface 43 belonging to the thick-film resistance heating 16.
  • the thick-film heater 16 is applied with the interposition of a glass-like insulating layer 44 on a carrier plate or hotplate 15 made, for example, of chrome steel.
  • the individual layers have the compositions described at the beginning, one for the hard solder filled with precious metal Glass paste, for the resistance layer 16, a ruthenium-based one in a glass frit and for the insulating layer 44, a glass layer is preferred, all of which are applied one after the other by melting or baking, after they have been applied beforehand by screen printing or a similar application method.
  • a connecting wire 46 is welded to the relatively thin connecting pin 45 of the bolt projecting from the plate-shaped contact surface.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Electric Stoves And Ranges (AREA)
  • Resistance Heating (AREA)
  • Surface Heating Bodies (AREA)
  • Cookers (AREA)

Abstract

Ein Elektrokochgerät weist eine aus Stahlblech, Glas, Keramik oder Glaskeramik bestehende Trägerplatte (15) auf, auf deren Unterseite Dickschicht-Widerstände (16) zur elektrischen Beheizung angebracht sind. Sie kann als großflächige Platte mit mehreren Kochstellen oder als Einzelkochplatte ausgebildet sein, die in einem Einbaurand (26) aufgenommen ist. Fühler (22) zur Temperaturbegrenzung und -regelung sind ebenfalls als Schicht-Widerstandsfühler auf der Trägerplatten-Unterseite angebracht.An electric cooking appliance has a carrier plate (15) made of sheet steel, glass, ceramic or glass ceramic, on the underside of which thick-film resistors (16) are attached for electrical heating. It can be designed as a large-area plate with several hotplates or as a single hotplate, which is received in an installation edge (26). Sensors (22) for temperature limitation and control are also attached as layer resistance sensors on the underside of the carrier plate.

Description

Die Erfindung betrifft ein Kochgerät, das entweder in Form eines Gesamtgerätes, beispielsweise mit einer mehrere Koch­stellen überdeckenden zusammenhängenden Kochfläche versehen sein kann oder auch aus in einen Kochherd oder eine Kochmul­de einzusetzenden Einzelkochplatten bestehen kann.The invention relates to a cooking appliance which can either be provided in the form of an overall appliance, for example with a coherent cooking surface covering a plurality of hotplates, or can also consist of individual hotplates to be inserted in a cooker or hob.

Aufgabe der Erfindung ist es, eine solche Kochplatte und/ oder ihre Beheizung weiter zu verbessern.The object of the invention is to further improve such a hotplate and / or its heating.

Die Erfindung schafft eine Kochplatte, die ein oder mehrere der im folgenden beschriebenen Erfindungsmerkmale aufweist, wobei diese jeweils für sich allein oder zu mehreren, auch in Form von Unterkombinationen zur Verwirklichung der Erfin­dung dienen können:The invention provides a hotplate which has one or more of the features of the invention described below, which can be used individually or in groups, also in the form of sub-combinations, to implement the invention:

Der Kochplattenträger kann aus Metall, insbesondere Metall­blech, vorzugsweise aus Chromstahl bestehen. Chromstahl­Typen 1.4742 und 1.4016 haben sich besonders geeignet ge­zeigt. Der Kochplattenträger kann aber auch aus Glas, bei­spielsweise Quarzglas, oder Keramik, z.B. auf Basis von Alu­miniumtitanat, Aluminiumnitrid oder Siliciumnitrid, oder aus Glaskeramik bestehen. Statt Quarzglas kann auch Quarzgut verwendet werden, das sich in den optischen Eigenschaften vom Quarzglas unterscheidet, was jedoch im vorliegenden An­wendungsfall nicht so wesentlich ist. Auch Verbundwerkstof­fe, beispielsweise ein Metall mit einer unten aufgebrachten dielektrischen Isolierschicht und/oder einer Emaillierung auf der oberen Fläche sind vorteilhaft brauchbar. Insbeson­dere bei einer Chromstahl-Trägerplatte ist es bevorzugt, die Kochplatten-Oberfläche mit einem dunklen, temperaturbestän­digen Email zu versehen, weil Chromstahl sich bei den auf­tretenden Temperaturen verfärben könnte, was wegen der Optik nicht akzeptiert wird.The hotplate support can consist of metal, in particular sheet metal, preferably of chrome steel. Chrome steel types 1.4742 and 1.4016 have proven particularly suitable. The hotplate support can also be made of glass, for example quartz glass, or ceramic, e.g. based on aluminum titanate, aluminum nitride or silicon nitride, or made of glass ceramic. Instead of quartz glass, it is also possible to use quartz material which differs from quartz glass in optical properties, but this is not so important in the present application. Composite materials, for example a metal with a dielectric insulating layer applied below and / or an enamelling on the upper surface, can also be used advantageously. In the case of a chrome steel carrier plate in particular, it is preferred to provide the hotplate surface with a dark, temperature-resistant enamel, because chrome steel could discolor at the temperatures which occur, which is not accepted due to the appearance.

Diese Trägerplatten können, wie bereits beschrieben, als Einzelkochplatten oder als Gesamtplatten mit stellenweise darunter angebrachter Beheizung vorgesehen werden, wobei bei den Chromstahlplatten die Ausbildung als Einzelplatte bevor­zugt ist, um Verzugserscheinungen vorzubeugen.As already described, these carrier plates can be provided as individual hot plates or as entire plates with heating arranged in places below them, with the chromium steel plates preferably being designed as a single plate in order to prevent signs of distortion.

Die Beheizung erfolgt vorteilhaft durch Dickschicht-Wider­stände, die auf die Unterseite der Träger im Falle von iso­lierenden Trägern direkt und im Falle von leitenden oder leitend werdenden sowie mit der Beheizung unverträglichen Materialien auf einer entsprechenden Zwischenschicht aufge­bracht werden. Die Dickschicht-Widerstände können im Sieb­druck, durch Rakel-Verfahren oder eine Tintenstrahl-Auf­tragsmethode auf den Träger aufgebracht werden. Sie sind entweder mit gut leitenden Metallen, z.B. auf Silber-, Kup­fer-, Nickel- oder Aluminium-Basis, versehene sehr dünne Schichten, die ggf. als Mäander angeordnet sind, um den nö­ tigen Widerstand zu ergeben oder es können echte Wider­standsschichten verwendet werden, die dann großflächig von Strom durchflossen sind, beispielsweise auf Ruthenium-Basis. Die leitenden Bestandteile sind in Glasfritten oder anderen pulver- oder pastenförmigen Medien vorgesehen, die auch Oxi­de als Binder enthalten können, in dem bereits beschriebenen Verfahren aufgebracht und schließlich aufgeschmolzen bzw. aufgebrannt werden. Auch eine evtl. auf dem Träger als Ver­bund- oder Zwischenschicht vorgesehene dielektrische Schicht kann in dem gleichen Verfahren als dünne, in Pastenform auf­gebrachte Glasschicht vorgesehen sein.The heating is advantageously carried out by thick-film resistors which are applied to the underside of the carrier in the case of insulating carriers directly and in the case of conductive or becoming conductive materials which are incompatible with the heating on a corresponding intermediate layer. The thick-film resistors can be applied to the carrier by screen printing, by doctor blade method or by an ink-jet application method. They are either very thin layers provided with highly conductive metals, for example based on silver, copper, nickel or aluminum, which are arranged as meanders, if necessary, around the nope to give resistance or real resistance layers can be used, which then have a large area of current flowing through them, for example based on ruthenium. The conductive components are provided in glass frits or other powdered or pasty media, which can also contain oxides as binders, applied in the process already described and finally melted or burned on. A dielectric layer possibly provided on the carrier as a composite or intermediate layer can also be provided in the same process as a thin glass layer applied in paste form.

Die Anschlüsse erfolgen vorteilhaft über aufgelötete Stifte mit einer vergrößerten Kontaktplatte. Als Hartlot wird eine metallgefüllte Glaspaste verwendet, die vorzugsweise im Siebdruckverfahren auf die Kontaktstelle aufgebracht wird. Hiermit kann z.B. ein aus Nickel bestehender Bolzen an der vorgesehenen Kontaktfläche direkt am Dickschicht-Widerstand festgelötet werden, und zwar in einem Hartlot-Verfahren, das erhebliche Temperaturen aushält. An dem Anschlußbolzen kann dann durch ein übliches Schweißverfahren eine Litze be­festigt werden.The connections are made advantageously via soldered pins with an enlarged contact plate. A metal-filled glass paste is used as the hard solder, which is preferably applied to the contact point using the screen printing method. With this e.g. a nickel-made bolt is soldered directly to the thick-film resistor on the intended contact surface, in a hard soldering process that can withstand considerable temperatures. A strand can then be attached to the connecting bolt by a conventional welding process.

Die Regelung bzw. Temperaturbegrenzung kann vorteilhaft me­chanisch oder elektronisch erfolgen. Als Fühler können Dick­schicht-Temperatursensoren auf dem Träger mit angebracht werden, z.B. Fühlerschichten mit positiver oder negativer thermischer Widerstandscharakteristik (PTC- oder NTC-Füh­ler). Die vorteilhafte Anbringung mehrerer Fühler an unter­schiedlichen Orten des Trägers und/oder ein oder mehrere großflächig die Temperatur erfassende Fühler können auch Temperaturdifferenzen innerhalb des Trägers erfassen, was die Entwicklung eines automatischen Kochsystems mit Topfer­kennung möglich macht. Dabei wird berücksichtigt, ob ein Topf z.B. wegen seines unebenen Bodens oder wegen geringer Füllmenge wenig Leistung abnimmt.The regulation or temperature limitation can advantageously be carried out mechanically or electronically. Thick-film temperature sensors can also be attached as sensors, for example sensor layers with positive or negative thermal resistance characteristics (PTC or NTC sensors). The advantageous attachment of several sensors at different locations on the carrier and / or one or more sensors that measure the temperature over a large area can also detect temperature differences within the carrier, which makes it possible to develop an automatic cooking system with pan detection. It is taken into account whether a pot decreases its performance due to its uneven bottom or because of the small amount.

Die Temperaturbegrenzung über diese vorzugsweise aufgedruck­ten Fühler sollte vorteilhaft so erfolgen, daß keine Verwer­fung oder thermische Überlastung der Träger erfolgen kann. Bei Metallträgern, insbesondere wenn sie relativ dünn sind, ist die Verwerfung das Hauptproblem, dem man allerdings durch die Wahl von Material mit geringem Ausdehnungskoeffi­zienten entgegensteuern kann. Eine sinnvolle Temperaturgren­ze dürfte zwischen 350 und 500 °C, vorzugsweise zwischen 400 und 450 °C liegen. Mit diesen Temperaturen sind alle Koch- und Bratvorgänge durchzuführen und eine Verwerfungsneigung hält sich dort sehr in Grenzen. Dies gilt insbesondere für Kochplatten die die Wärme bevorzugt durch Kontakt übertra­gen, während strahlungsbeheizte Kochplatten teilweise an ihrer Unterseite höheren Temperaturen ausgesetzt sind, die bis an die z.B. für Glaskeramik zulässige Temperaturgrenze (über 600 °C) herangehen. Auch dort läßt sich aber durch die Temperaturbegrenzung mittels aufgedruckter Fühler die Tempe­ratur sicher erfassen und begrenzen.The temperature limitation via these preferably printed sensors should advantageously be carried out in such a way that there can be no warping or thermal overloading of the supports. For metal beams, especially if they are relatively thin, warpage is the main problem, which can be counteracted by choosing material with a low coefficient of expansion. A reasonable temperature limit should be between 350 and 500 ° C, preferably between 400 and 450 ° C. All cooking and roasting processes must be carried out at these temperatures and there is very little tendency to warp. This applies in particular to hot plates which transfer heat preferably by contact, while radiation-heated hot plates are sometimes exposed to higher temperatures on their underside, which up to e.g. Appropriate temperature limit (over 600 ° C) for glass ceramics. Here, too, the temperature can be reliably detected and limited by the temperature limitation by means of printed sensors.

Es sind Standard-Kochplattengeometrien möglich, beispiels­weise Kreisformen und alle anderen sinnvollen Formen, wie langgestreckte, ovale oder viereckige Kochplattenformen. Auch Zweikreis-Ausführungen, beispielsweise in Form von zwei konzentrischen, unabhängig voneinander schaltbaren Kochstel­len, die eine Anpassung an unterschiedliche Kochtopfgrößen gestatten, sind gut machbar, auch Formen, die ein zentrales rundes Kochfeld und daran einseitig oder beidseitig an­schließende, die Kochfläche zu einer langgestreckten Form verlängernde Zuschalt-Heizstellen haben.Standard hotplate geometries are possible, for example circular shapes and all other useful shapes, such as elongated, oval or square hotplate shapes. Two-circle versions, for example in the form of two concentric, independently switchable hotplates that allow adaptation to different saucepan sizes, are also feasible, as are shapes that have a central, round hob and one or both sides adjoining the cooking surface into an elongated shape have additional switch-on heating points.

Es ist ferner möglich, den Träger in Bereiche mit unter­schiedlichen Temperatur-Grundeinstellungen oder unterschied­licher Einstellbarkeit zu unterteilen, die beispielsweise zum Braten, Kochen und Wärmen vorgesehen sind.It is also possible to subdivide the carrier into areas with different basic temperature settings or different adjustability, which are provided for example for frying, cooking and heating.

Auch bei Einzelkochplatten ist ein nahezu ebener, d.h. mit der die Einzelplatte umgebenden Einbauplatte nahezu gleich hoher Einbau möglich.Even with single hot plates, an almost flat one, i.e. with the mounting plate surrounding the single plate, almost the same height installation possible.

Die Abdichtung zwischen Einzelkochplatten und der Kochmulde oder Einbauplatte kann durch Silicondichtungen oder auch, insbesondere in Verbindung mit einem aus Metall bestehenden Rand oder Rahmen, durch Schmelzglas erfolgen. Die beispiels­weise selbst aus Glas oder Keramik bestehende Platte kann durch ein niedriger schmelzendes Glas mit dem sie umgebenden Ring verschmolzen oder verklebt sein, so daß absolute Durch­laufsicherheit gegeben ist. Dazu wird bevorzugt für den Rand und die Platte und ggf. auch das Schmelzglas ein Material mit vergleichbarem oder gleichem Ausdehnungskoeffizienten gewählt, und zwar unter Berücksichtigung der jeweils an den einzelnen Stellen auftretenden Temperaturen.The sealing between individual hot plates and the hob or built-in plate can be made by silicone seals or, in particular in connection with an edge or frame made of metal, by melting glass. The plate, which itself is made of glass or ceramic, for example, can be fused or glued to the ring surrounding it by means of a lower-melting glass, so that absolute throughput security is provided. For this purpose, a material with a comparable or identical coefficient of expansion is preferably selected for the edge and the plate and possibly also the melting glass, taking into account the temperatures occurring at the individual points.

Bei der Verwendung einer weitgehend durchsichtigen oder transparenten Trägerplatte kann die Dickschicht-Leiterbahn und/oder eine darunter liegende farbige Schicht, beispiels­weise eine Rückseiten-Isolierschicht, als Dekor dienen. Da­mit ist eine gute optische Kennzeichnung der jeweiligen Kochstelle möglich.When a largely transparent or transparent carrier plate is used, the thick-layer conductor track and / or a colored layer underneath, for example a rear insulation layer, can serve as decor. This means that the respective hotplate can be visually identified.

Aufgrund der niedrigen Masse und niedrigen Wärmeträgheit der an der Heizung beteiligten Bauteile und der guten Wärmeleit­fähigkeit (bei Chromstahl metallische Wärmeleitfähigkeit, bei Glas hoher Strahlungsanteil ergeben sich extrem gute Wirkungsgrade. Eine Verbesserung des Wirkungsgrades wurde gegenüber üblichen Beheizungen um über 50 % gemessen.Due to the low mass and low thermal inertia of the components involved in the heating and the good thermal conductivity (metallic heat conductivity in the case of chrome steel, high efficiency in the case of glass), the efficiency is extremely good. An improvement in efficiency was measured by more than 50% compared to conventional heating.

Sehr vorteilhaft kann die Wärmedämmung nach unten durch eine Wärmedämm-Matte oder einen Formkörper aus Isoliermaterial erfolgen wobei vorzugsweise zwischen dem Dickschicht-Wider­stand und der Matte ein Abstand von einigen Millimetern, vorzugsweise ca. 2 mm, besteht, in dem sich ruhende Luft oder auch ein Vakuum befinden kann. Die Dekorschicht auf der der Trägerplatte abgewandten Seite, d.h. unterhalb der Heiz­leiter, kann gleichzeitig auch als Schutz für diese dienen.It is very advantageous for the thermal insulation to be carried out downwards by means of a thermal insulation mat or a molded body made of insulating material, a gap of a few millimeters, preferably approximately 2 mm, preferably being present between the thick-film resistor and the mat, in which there is still air or can also be a vacuum. The decorative layer on the side facing away from the carrier plate, ie below the heating conductor, can also serve as protection for these at the same time.

Einige Ausführungsbeispiele der Erfindung sind in der Zeich­nung dargestellt und werden im folgenden näher erläutert. Es zeigen:

  • Fig. 1 eine Draufsicht auf ein Kochgerät;
  • Fig. 2 bis 7 Teil-Querschnitte durch in einer Einbau­platte eingebaute Einzelkochplatten; und
  • Fig. 8 eine Detaildarstellung eines Kochplatten­anschlusses.
Some embodiments of the invention are shown in the drawing and are explained in more detail below. Show it:
  • Figure 1 is a plan view of a cooking device.
  • Fig. 2 to 7 partial cross sections through individual hot plates installed in a mounting plate; and
  • 8 shows a detailed illustration of a hotplate connection.

Fig. 1 zeigt die Draufsicht auf ein Kochgerät 11 mit einer Einbauplatte 15, die in eine Arbeitsplatte 12, beispielswei­se die obere Abdeckplatte eines Küchenmöbels, eingebaut ist. Diese Einbauplatte 15 besteht aus Glaskeramik, die an der Unterseite, ggf. unter Zwischenschaltung einer isolierenden Glas-Zwischenschicht vier Heizstellen 13 mit je zwei konzen­trisch zueinander angeordneten Heizwiderständen in Form eines Dickschicht-Widerstandes aufgebracht sind. Die Zeich­nung zeigt das Dekor der Kochplatten-Oberseite, das jeweils zwei zueinander konzentrische, unabhängig voneinander schaltbare Bereiche andeutet.Fig. 1 shows the top view of a cooking device 11 with a mounting plate 15, which is installed in a worktop 12, for example the upper cover plate of a piece of kitchen furniture. This mounting plate 15 consists of glass ceramic, four heating points 13, each with two concentrically arranged heating resistors in the form of a thick-film resistor, are applied to the underside, possibly with the interposition of an insulating glass intermediate layer. The drawing shows the decor of the hotplate top, which indicates two mutually concentric, independently switchable areas.

Fig. 2 zeigt eine Schnitt durch eine Einzelkochstelle 14, die aus einer oberen Trägerplatte 15 aus Quarzglas besteht, an deren Unterseite Dickschicht-Widerstände 16 durch Be­schichten aufbegracht sind. Die Trägerplatte 15 liegt im Rand einer Trägerschale 17, die mit einem überragenden Rand 18 auf dem Rand der Öffnung in einer Einbauplatte 19 auf­liegt und sich dort über Federelemente 20 an der Unterseite abstützt. Die Einbauplatte kann beispielsweise aus Hartglas, aber auch aus emailliertem Stahlblech oder V2A-Stahl beste­hen. In der flachen Trägerschale liegt mit Abstand von der Unterseite der Beheizung 16 eine Wärmeisolierung 21.Fig. 2 shows a section through a single hotplate 14, which consists of an upper support plate 15 made of quartz glass, on the underside of which thick-film resistors 16 are applied by coating. The carrier plate 15 lies in the edge of a carrier shell 17 which rests with a protruding edge 18 on the edge of the opening in a mounting plate 19 and is supported there by spring elements 20 on the underside. The mounting plate can, for example, be made of tempered glass, but also consist of enamelled steel sheet or V2A steel. Thermal insulation 21 lies in the flat carrier shell at a distance from the underside of the heater 16.

Fig. 3 zeigt ebenfalls eine Trägerplatte 15 aus Quarzglas, auf der Unterseite ein Dickschicht-Widerstand 16 in mehreren Bereichen, beispielsweise zur Schaffung einer Zweikreis­Platte direkt aufgebracht ist. Ein Sensor 22 für eine Tempe­raturregelung und/oder -begrenzung ist in gleicher Weise an der Unterseite aufgebracht. Die ganze Rückseite wird von einer farbigen Schutzschicht 23 überdeckt, die auch durch die Quarzglasplatte hindurchschimmern kann. Am Rand ist die Trägerplatte 15 in einem aus rostfreiem Stahlblech bestehen­den Rand aufgenommen, der einen an der Innenseite nach unten vorstehenden Tropfrand 24, einen Aufnahmewinkel 25 für den Rand der Trägerplatte und einen nach außen ragenden Flansch 26 aufweist, der zuerst im wesentlichen horizontal, dann unter einem Winkel abwärts geneigt verläuft und auf einer Schulter einer Einbauplatte 19 aufliegt, die aus verformtem Blech besteht. An die Schulter 27 schließt sich innen ein aufwärts gerichteter Süllrand 28 und außen eine Vertiefung 29 an. Der Rand der Trägerplatte 15 ist im Bereich des Auf­nahmewinkels 25 durch Einschmelzen mittels eines aus einer Glaspaste entstandenen Schmelzglases befestigt.3 likewise shows a carrier plate 15 made of quartz glass, on the underside of which a thick-film resistor 16 is applied in several areas, for example to create a two-circuit plate. A sensor 22 for temperature control and / or limitation is applied in the same way on the underside. The entire back is covered by a colored protective layer 23, which can also shimmer through the quartz glass plate. At the edge, the carrier plate 15 is received in an edge made of stainless steel sheet, which has a drip edge 24 projecting downwards on the inside, a receiving angle 25 for the edge of the carrier plate and an outwardly projecting flange 26, which at first is essentially horizontal, then runs inclined downwards at an angle and rests on a shoulder of a mounting plate 19 which consists of deformed sheet metal. The shoulder 27 is followed on the inside by an upwardly directed coaming 28 and on the outside by a depression 29. The edge of the carrier plate 15 is fastened in the region of the receiving angle 25 by melting using a melting glass made from a glass paste.

Fig. 4 zeigt eine derartige Ausführung, bei der der Rand der Trägerplatte 15 nach unten konisch erweitert ist und von einem Randbereich 30 der Trägerschale 17 umfaßt wird, wobei dort eine Silicondichtung zwischengelegt ist. Auch die Auf­lage auf der Einbauplatte 19, die wiederum aus Hartglas be­stehen kann, wird über eine Silicondichtung vorgenommen. Die Festlegung der Trägerschale 17 in der Öffnung der Einbau­platte 19 erfolgt durch federnde Lappen 31, die beim Ein­drücken der Einheit in die Einbauöffnung hinter dem Öff­nungsrand einschnappen.FIG. 4 shows such an embodiment, in which the edge of the carrier plate 15 is flared downwards and is surrounded by an edge region 30 of the carrier shell 17, a silicone seal being interposed there. The support on the mounting plate 19, which in turn can consist of tempered glass, is carried out via a silicone seal. The carrier shell 17 is fixed in the opening of the mounting plate 19 by resilient tabs 31 which snap into the mounting opening behind the opening edge when the unit is pressed in.

Fig. 5 zeigt eine entsprechende Konstruktion, bei der zur Verringerung der Einbauhöhe der Kochfläche 33 gegenüber der Oberfläche der Einbauplatte 19 diese im Öffnungsbereich eine obere umlaufende Vertiefung 34 aufweist, in die sich der Aufnahmewinkel 25 einfügen kann. Dabei liegt der sich hori­zontal erstreckende obere, äußere Flansch 35 der Trägerscha­le auf der Oberfläche der Einbauplatte auf. Er kann aus emailliertem Stahlblech bestehen. Die Aufnahme der Behei­zungs-Trägerplatte 15 in dem Aufnahmewinkel 25 erfolgt ähn­lich Fig. 3, jedoch ist der Aufnahmewinkel nicht so tief wie die Trägerplatte dick ist und diese ist dafür im Randbereich abgeschrägt.5 shows a corresponding construction in which, in order to reduce the installation height of the cooking surface 33 compared to the surface of the installation plate 19, this has an upper circumferential recess 34 in the opening area, into which the receiving angle 25 can be inserted. The horizontally extending upper, outer flange 35 of the carrier shell lies on the surface of the mounting plate. It can consist of enamelled steel sheet. The heating carrier plate 15 is received in the receiving angle 25 similarly to FIG. 3, however the receiving angle is not as deep as the carrier plate is thick and the edge is chamfered for this purpose.

Fig. 6 zeigt eine Ausführung entsprechend Fig. 5, bei der, wie bei allen Ausführungen, gleiche Teile durch gleiche Be­zugszeichen gekennzeichnet sind und auf ihre nochmalige Be­schreibung verzichtet wird. Hier ist auch der Randflansch 35 in der Einbauplatte 19 versenkt.FIG. 6 shows an embodiment corresponding to FIG. 5, in which, as in all embodiments, the same parts are identified by the same reference symbols and their repeated description is dispensed with. Here, the edge flange 35 is also sunk in the mounting plate 19.

In Fig. 7 ist eine Ausführung gezeigt, bei der die Träger­platte 15 unter Zwischenschaltung des Aufnahme-Winkelberei­ches 25 auf der Einbauplatte 19 aufliegt, weil sie einen größeren Durchmesser hat als die Einbauöffnung. Dabei ist der äußere Rand 36 der Trägerschale 17 nach unten geneigt und liegt auf der Oberfläche der Einbauplatte auf.7 shows an embodiment in which the carrier plate 15 rests on the mounting plate 19 with the interposition of the receiving angular range 25 because it has a larger diameter than the mounting opening. The outer edge 36 of the carrier shell 17 is inclined downward and lies on the surface of the mounting plate.

Fig. 8 zeigt in starker Vergrößerung einen vorzugsweise aus Nickel bestehenden Anschlußbolzen 40, der mittels einer Hartlotschicht 41 mit seinem plattenförmigen Befestigungsab­schnitt 42 auf einer zur Dickschicht-Widerstandsbeheizung 16 gehörenden Kontaktfläche 43 aufgelötet ist. Die Dick­schicht-Beheizung 16 ist unter Zwischenschaltung einer glas­artigen Isolierschicht 44 auf eine z.B. aus Chromstahl be­stehende Träger- oder Kochplatte 15 aufgebracht. Die einzel­nen Schichten haben die eingangs beschriebenen Zusammenset­zungen, wobei für das Hartlot eine mit Edelmetall gefüllte Glaspaste, für die Widerstandsschicht 16 eine solche auf Ruthenium-Basis in einer Glasfritte und für die Isolier­schicht 44 eine Glasschicht bevorzugt ist, die alle durch Schmelzen bzw. Einbrennen nacheinander aufgebracht sind, nachdem sie vorher im Siebdruckverfahren oder einem ähnli­chen Aufbringungsverfahren aufgebracht wurden. An dem rela­tiv dünnen, von der plattenförmigen Kontaktfläche abstehen­den Anschlußstift 45 des Bolzens ist ein Anschlußdraht 46 angeschweißt.FIG. 8 shows in high magnification a connecting bolt 40, preferably made of nickel, which is soldered by means of a hard solder layer 41 with its plate-shaped fastening section 42 onto a contact surface 43 belonging to the thick-film resistance heating 16. The thick-film heater 16 is applied with the interposition of a glass-like insulating layer 44 on a carrier plate or hotplate 15 made, for example, of chrome steel. The individual layers have the compositions described at the beginning, one for the hard solder filled with precious metal Glass paste, for the resistance layer 16, a ruthenium-based one in a glass frit and for the insulating layer 44, a glass layer is preferred, all of which are applied one after the other by melting or baking, after they have been applied beforehand by screen printing or a similar application method. A connecting wire 46 is welded to the relatively thin connecting pin 45 of the bolt projecting from the plate-shaped contact surface.

Claims (11)

1. Kochgerät mit einer Trägerplatte (15) und einer elek­trischen Beheizung (16), dadurch gekennzeichnet, daß die Beheizung (16) an der Unterseite der Trägerplatte (15) in Form eines Schichtwiderstandes aufgebracht ist.1. Cooking device with a carrier plate (15) and an electric heater (16), characterized in that the heater (16) is applied to the underside of the carrier plate (15) in the form of a sheet resistor. 2. Kochgerät nach Anspruch 1, dadurch gekennzeichnet, daß die Trägerplatte (15) aus Metall, insbesondere einem Edelstahlblech, wie Chromstahlblech, besteht.2. Cooking device according to claim 1, characterized in that the carrier plate (15) made of metal, in particular a stainless steel sheet, such as chrome steel sheet. 3. Kochgerät nach Anspruch 1 oder 2, dadurch gekennzeich­net, daß auf die Unterseite der Trägerplatte (15) eine isolierende Zwischenschicht (44) aufgebracht ist.3. Cooking appliance according to claim 1 or 2, characterized in that an insulating intermediate layer (44) is applied to the underside of the carrier plate (15). 4. Kochgerät nach einem der vorhergehenden Ansprüche, da­durch gekennzeichnet, daß die Widerstandsschicht (16) und die ggf. vorgesehene Isolierschicht (44) eine Glas­schmelze beinhalten.4. Cooking appliance according to one of the preceding claims, characterized in that the resistance layer (16) and the optionally provided insulating layer (44) contain a glass melt. 5. Kochgerät nach einem der vorhergehenden Ansprüche, da­durch gekennzeichnet, daß der Anschluß in Form eines Metallbolzens, vorzugsweise mit einer vergrößerten An­lagefläche mittels eines metallgefüllten Glas-Hartlots (41) auf einen Kontaktbereich (43) der Widerstands­schicht (16) aufgebracht ist.5. Cooking appliance according to one of the preceding claims, characterized in that the connection in the form of a metal bolt, preferably with an enlarged contact surface by means of a metal-filled glass brazing solder (41) is applied to a contact region (43) of the resistance layer (16). 6. Kochgerät nach einem der vorhergehenden Ansprüche, da­durch gekennzeichnet, daß die Trägerplatte (15) aus Glas, Keramik oder Glaskeramik besteht und als Einzel­kochplatte oder als mehrere Kochstellen überdeckende Gesamtplatte ausgebildet ist.6. Cooking appliance according to one of the preceding claims, characterized in that the carrier plate (15) consists of glass, ceramic or glass ceramic and is designed as a single hotplate or as a whole plate covering several hotplates. 7. Kochgerät nach einem der vorhergehenden Ansprüche, da­durch gekennzeichnet, daß eine Kochplatte bzw. Koch­stelle mehrere unabhängig voneinander schaltbare Behei­zungen enthält, die nebeneinanderliegende oder einander umfassende Zonen bilden.7. Cooking device according to one of the preceding claims, characterized in that a hotplate or hotplate contains a plurality of independently switchable heaters which form adjacent or mutually extensive zones. 8. Kochgerät nach einem der vorhergehenden Ansprüche, da­durch gekennzeichnet, daß eine aus Metall bestehende Trägerplatte und/oder ein die Trägerplatte umgebender Einbauring emailliert ist.8. Cooking appliance according to one of the preceding claims, characterized in that an existing carrier plate made of metal and / or a mounting ring surrounding the carrier plate is enamelled. 9. Kochgerät nach einem der vorhergehenden Ansprüche, da­durch gekennzeichnet, daß eine Verbindung zwischen der Trägerplatte (15) und einem Einbaurand (24, 25, 26) durch eine Glasfritte erfolgt.9. Cooking appliance according to one of the preceding claims, characterized in that a connection between the carrier plate (15) and an installation edge (24, 25, 26) is made by a glass frit. 10. Kochgerät nach einem der vorhergehenden Ansprüche, da­durch gekennzeichnet, daß durch eine Dekorschicht (23) auf der der Trägerplatte (15) abgewandten Seite der Be­heizung (16), die gleichzeitig auch als Schutz für die Heizleiter dient und vorteilhaft auch nicht mit Behei­zung (16) versehene Teile der Kochstelle überdeckt.10. Cooking appliance according to one of the preceding claims, characterized in that by a decorative layer (23) on the carrier plate (15) facing away from the heating (16), which also serves as protection for the heating conductor and advantageously also not with heating ( 16) covered parts of the hotplate covered. 11. Kochgerät nach einem der vorhergehenden Ansprüche, da­durch gekennzeichnet, daß auf der Unterseite der Trä­gerplatte (15) Temperaturfühler (22) für die Tempera­turregelung bzw. -begrenzung nach Art von Schichtwider­ständen aufgebracht sind, wobei vorzugsweise mehrere Fühler an unterschiedlichen Stellen der Kochplatte an­geordnet sind und/oder die Fühler großflächig mehrere Bereiche der Kochplatte erfassen.11. Cooking appliance according to one of the preceding claims, characterized in that on the underside of the carrier plate (15) temperature sensors (22) for temperature control or limitation are applied in the manner of film resistances, preferably several sensors being arranged at different locations on the hotplate and / or the sensors cover several areas of the hotplate over a large area.
EP89102187A 1987-08-26 1989-02-09 Cooking utensil Withdrawn EP0381792A1 (en)

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DE19873728466 DE3728466A1 (en) 1987-08-26 1987-08-26 COOKER

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DE3545454A1 (en) * 1985-12-20 1987-07-02 Bosch Siemens Hausgeraete Heating element for thermal domestic appliances, especially for hotplates
GB2187836A (en) * 1986-03-11 1987-09-16 Thorn Emi Appliances Cooking hob
DE3728466A1 (en) * 1987-08-26 1989-03-09 Ego Elektro Blanc & Fischer COOKER

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0574310A1 (en) * 1992-06-11 1993-12-15 Seb S.A. Heating plate for a heating container, in particular for a kettle
FR2692426A1 (en) * 1992-06-11 1993-12-17 Seb Sa Hot plate for heating container, especially for kettle.
FR2718317A1 (en) * 1994-03-30 1995-10-06 Electrovac Combination of building elements.
EP0725557A1 (en) * 1995-02-02 1996-08-07 ATAG Keukentechniek B.V. Heating device
NL9500196A (en) * 1995-02-02 1996-09-02 Atag Keukentechniek Bv Heating device.
FR2750419A1 (en) * 1996-06-27 1998-01-02 Saint Gobain Vitrage High speed enamel jet printing process for glass substrate
US6150636A (en) * 1997-01-10 2000-11-21 E.G.O. Elektro-Geraetebau Gmbh Contact heat-transferring cooking system with an electric hotplate
DE10110789C1 (en) * 2001-03-06 2002-07-04 Schott Glas Electrical cooking appliance with non-planar three-dimensional cooking surface of glass or glass ceramic material directly contacted on its outside by resistance heating device
EP1331450A3 (en) * 2002-01-28 2007-05-23 Wilfried Pöllet Hot plate
EP1702499B1 (en) 2004-01-06 2016-06-22 Watlow Electric Manufacturing Company Combined material layering technologies for electric heaters
EP1702499B2 (en) † 2004-01-06 2019-11-27 Watlow Electric Manufacturing Company Combined material layering technologies for electric heaters
EP1962016A3 (en) * 2007-02-23 2015-05-27 BSH Hausgeräte GmbH Burner plate

Also Published As

Publication number Publication date
US4960978A (en) 1990-10-02
DE3728466A1 (en) 1989-03-09

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