EP0367411A3 - Heterojunction semiconductor devices and methods of making the same - Google Patents

Heterojunction semiconductor devices and methods of making the same Download PDF

Info

Publication number
EP0367411A3
EP0367411A3 EP89310184A EP89310184A EP0367411A3 EP 0367411 A3 EP0367411 A3 EP 0367411A3 EP 89310184 A EP89310184 A EP 89310184A EP 89310184 A EP89310184 A EP 89310184A EP 0367411 A3 EP0367411 A3 EP 0367411A3
Authority
EP
European Patent Office
Prior art keywords
semiconductor layer
compound semiconductor
group iii
making
methods
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP89310184A
Other languages
German (de)
French (fr)
Other versions
EP0367411A2 (en
Inventor
Shigeru Kuroda
Takashi Mimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of EP0367411A2 publication Critical patent/EP0367411A2/en
Publication of EP0367411A3 publication Critical patent/EP0367411A3/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409—Unipolar field-effect transistors
    • H01L29/66446—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET]
    • H01L29/66462—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET] with a heterojunction interface channel or gate, e.g. HFET, HIGFET, SISFET, HJFET, HEMT
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30604—Chemical etching
    • H01L21/30612—Etching of AIIIBV compounds
    • H01L21/30621—Vapour phase etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/8252—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using III-V technology
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/20—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
    • H01L29/201—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds including two or more compounds, e.g. alloys
    • H01L29/205—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds including two or more compounds, e.g. alloys in different semiconductor regions, e.g. heterojunctions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
    • H01L29/7782—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with confinement of carriers by at least two heterojunctions, e.g. DHHEMT, quantum well HEMT, DHMODFET
    • H01L29/7783—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with confinement of carriers by at least two heterojunctions, e.g. DHHEMT, quantum well HEMT, DHMODFET using III-V semiconductor material

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Junction Field-Effect Transistors (AREA)
  • Recrystallisation Techniques (AREA)

Abstract

A semiconductor device comprises a first group III-V compound semiconductor layer (4, 24, 44) including indium (In), a second group III-V compound semiconductor layer (5, 25, 45) formed on the first group III-V compound semiconductor layer and including no indium (In), and at least a recess (6A, 30A, 110A) formed in the second group III-V compound semiconductor layer so that the first group III-V compound semiconductor layer is exposed within the recess. For example, the first group III-V compound semiconductor layer is made of a material selected from a group which includes indium aluminum arsenide (InAlAs) and indium gallium arsenide (InGaAs), and the second group III-V compound semiconductor layer is made of gallium arsenide.
EP89310184A 1988-10-12 1989-10-05 Heterojunction semiconductor devices and methods of making the same Ceased EP0367411A3 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP254971/88 1988-10-12
JP63254971A JP2630446B2 (en) 1988-10-12 1988-10-12 Semiconductor device and manufacturing method thereof

Publications (2)

Publication Number Publication Date
EP0367411A2 EP0367411A2 (en) 1990-05-09
EP0367411A3 true EP0367411A3 (en) 1990-08-08

Family

ID=17272412

Family Applications (1)

Application Number Title Priority Date Filing Date
EP89310184A Ceased EP0367411A3 (en) 1988-10-12 1989-10-05 Heterojunction semiconductor devices and methods of making the same

Country Status (3)

Country Link
EP (1) EP0367411A3 (en)
JP (1) JP2630446B2 (en)
KR (1) KR930001903B1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2822547B2 (en) * 1990-03-06 1998-11-11 富士通株式会社 High electron mobility transistor
DE69111120T2 (en) * 1990-04-11 1996-04-04 Hughes Aircraft Co HEMT structure with passivated structure.
US5140386A (en) * 1991-05-09 1992-08-18 Raytheon Company High electron mobility transistor
JP2735718B2 (en) * 1991-10-29 1998-04-02 三菱電機株式会社 Compound semiconductor device and method of manufacturing the same
JP3377022B2 (en) * 1997-01-23 2003-02-17 日本電信電話株式会社 Method of manufacturing heterojunction field effect transistor
US6144048A (en) * 1998-01-13 2000-11-07 Nippon Telegraph And Telephone Corporation Heterojunction field effect transistor and method of fabricating the same
JP3174293B2 (en) * 1998-01-14 2001-06-11 松下電器産業株式会社 Semiconductor device
JP4284254B2 (en) 2004-09-07 2009-06-24 富士通株式会社 Field effect semiconductor device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0175437A1 (en) * 1984-05-01 1986-03-26 Fujitsu Limited Production of GaAs enhancement and depletion mode HEMT's

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0175437A1 (en) * 1984-05-01 1986-03-26 Fujitsu Limited Production of GaAs enhancement and depletion mode HEMT's

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
APPLIED PHYSICS LETTERS. vol. 51, no. 26, 28 December 1987, NEW YORK US pages 2225 - 2226; C.B.COOPER et.al: "Use of thin AlGaAs and InGaAs stop-etch layers for reactive ion etch processing of III-V compound semiconductor devices" *
IEEE ELECTRON DEVICE LETTERS. vol. 9, no. 7, July 1988, NEW YORK US pages 328 - 330; A.FATHIMULLA et.al: "High-Performance InAlAs/InGaAs HEMT's and MESFET's" *

Also Published As

Publication number Publication date
JPH02102545A (en) 1990-04-16
EP0367411A2 (en) 1990-05-09
JP2630446B2 (en) 1997-07-16
KR930001903B1 (en) 1993-03-19

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