EP0352142B1 - Tintenstrahlaufzeichnungsanordnung - Google Patents

Tintenstrahlaufzeichnungsanordnung Download PDF

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Publication number
EP0352142B1
EP0352142B1 EP89307471A EP89307471A EP0352142B1 EP 0352142 B1 EP0352142 B1 EP 0352142B1 EP 89307471 A EP89307471 A EP 89307471A EP 89307471 A EP89307471 A EP 89307471A EP 0352142 B1 EP0352142 B1 EP 0352142B1
Authority
EP
European Patent Office
Prior art keywords
layer
recording
recording element
substrate
ink jet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP89307471A
Other languages
English (en)
French (fr)
Other versions
EP0352142A3 (en
EP0352142A2 (de
Inventor
Yutaka Koizumi
Yasutomo Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
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Filing date
Publication date
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Publication of EP0352142A2 publication Critical patent/EP0352142A2/de
Publication of EP0352142A3 publication Critical patent/EP0352142A3/en
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Publication of EP0352142B1 publication Critical patent/EP0352142B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14088—Structure of heating means
    • B41J2/14112—Resistive element
    • B41J2/14129—Layer structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1601—Production of bubble jet print heads
    • B41J2/1604—Production of bubble jet print heads of the edge shooter type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1623—Manufacturing processes bonding and adhesion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1631—Manufacturing processes photolithography
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1643—Manufacturing processes thin film formation thin film formation by plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1646—Manufacturing processes thin film formation thin film formation by sputtering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01—Embodiments of or processes related to ink-jet heads
    • B41J2202/19—Assembling head units

Definitions

  • This invention relates to a recording element unit, and a recording element driving unit, an ink jet unit, an ink jet driving unit and an ink jet device by use thereof.
  • a recording element unit to be used for ink jet recording device, etc. for example, a recording element unit as shown in Fig. 19 (a) has been known as the prior art. Also, a sectional view taken along A-A′ in Fig. 19 (a) is shown in Fig. 19 (b).
  • 1501 is a holding member, 1502 a HfB2 layer as the heat-generating resistance layer, 1503 the common electrode of Al, 1504 individual electrodes of Al, 1505a and 1505b pattern wirings of Al, 1506 a SiO2 layer as the oxidation resistant layer and the insulating layer, 1507 a photosensitive polyimide layer as the ink resistant layer and the insulating layer, and 1508 a Ta layer as the cavitation resistant layer.
  • the recording element unit as shown in Fig. 19 (a) and Fig. 19 (b) passes current to the HfB2 layer 1502 as the heat-generating resistance layer, thereby generating heat energy from said HfB2 layer. More specifically, by permitting the driving current to flow into the HfB2 layer externally through the individual electrodes 1504 and the pattern wirings. 1505a, and further permitting the current to flow out externally through the pattern wirings 1505b and the common electrode 1503, heat energy can be generated at the HfB2 layer. In the ink jet recording device, recording is performed by discharging liquid utilizing the heat energy.
  • heat-generating element such combination of HfB2 layer 1502, individual electrodes 1504, pattern wirings 1505a and 1505b (hereinafter called heat-generating element) is formed in a plural number in the recording unit 1 as shown in Fig. 19 (a).
  • heat-generating element an ink jet recording device capable of performing simultaneous recording of a plurality of dots is obtained, thereby becoming feasible to effect higher speed of recording.
  • simultaneous recording of one main scanning line has been generalized, and therefore recording element units having a large number of heat generating elements at high density are appearing.
  • driving element In the case of performing simultaneous recording of a plurality of dots by arranging a plurality of heat generating elements on one recording element unit, ON-OFF must be controlled individually for the respective heat-generating elements.
  • the means for performing such control (hereinafter called driving element) can be also formed within the recording element unit, but generally formed on an independent substrate (hereinafter, this substrate is called the driving element substrate), and is connected to the recording element unit. This is because, when the recording element and the driving element are formed integrally, there is the problem that if a defect occurs in a part of either of the recording element or the driving element, the whole will fail to be actuated.
  • the wire bonding method is a method, as shown in Fig. 20, in which the electrode 1614, 1615 of the recording element substrate 1604 is electrically connected to a desired electrode of the driving element substrate by use of an extremely fine metal wire 1616 such as of gold, etc.
  • Figs. 21A to 21C are diagrams for illustration of this method.
  • 1704 is a recording element substrate, 1705 a driving element substrate, 1714 and 1715 electrode portions, 1719 and 1720 insulating films.
  • 1703 is an electrical connecting member, 1717 an electroconductive member, and 1718 a holding member for holding the electroconductive member 1717.
  • the pitch of the electroconductive member 1717 is set narrower than the pitch of the electrodes of 1714 and 1715.
  • the recording element substrate 1704, the driving element substrate 1705 and the electrical connecting member 1703 are first arranged as shown in Fig. 21A, and then pressure contacted with each other as shown in Fig. 21B.
  • Fig. 21C shows the whole view after pressure contact.
  • This method has the advantages that the unit can be miniaturized, no highly precise registration is required, and the cost can be reduced, etc., but further miniaturization and cost reduction are demanded.
  • JP-A-59111338 discloses a circuit board having a glass paste film through apertures of which extend projections connected to the circuit board electrodes and bonded to electrodes of the semiconductor element.
  • a recording head assembly including at least two modules, a first module including at least one heat generating resistor and a second module including at least one driving circuit, characterised in that said first module includes a substrate, a heat generating resistance layer, a wiring layer for supplying electrical signals to said resistance layer, and electrodes supported by said substrate and electrically connected to said wiring layer, said electrodes being raised from their respective surrounding surfaces so as to project from said wiring layer, in that said second module comprises a driving element substrate having a driving circuit, and a wiring layer connected to said driving circuit; said projecting electrodes of the first module providing an electrical connection to the wiring layer of said second module, and in that said modules are readily detachable from each other whereby one or other module is replaceable.
  • An ink jet recording apparatus may be provided having a member which is adapted for mounting said head assembly.
  • an electricity-heat converter which generates heat energy (heat-generating element) and other recording elements such as piezoelectric element may be employed.
  • the pattern wiring of the recording element substrate (recording element unit) and the driving element substrate is formed on the surface of the holding member. Also, when a protective film is formed on the surface of the holding member for protection and insulation of the pattern wiring, a pattern wiring with a sufficient area for formation of projecting electrode may be exposed.
  • the pattern wiring may be formed of, for example, an electroconductive material such as Al, etc.
  • a bonding portion comprising a projecting electrode is formed.
  • the projecting electrode may be formed only one or in a plural number per one bonding portion. On the other hand, no projecting electrode is required to be formed on the pattern wiring of the driving element substrate.
  • the bonding portion comprising a projecting electrode is provided for effecting electrical connection to another circuit substrate (e.g. driving element substrate). That is, electrical connection is effected by bonding directly to the bonding portion of another circuit substrate.
  • the projecting electrode may be made of the same material as the pattern wiring or a material different therefrom.
  • the material for forming the projecting electrode for example, metals such as Cu, Ni, Au, Cr, Rh, etc., or alloys comprising combinations of these may be available.
  • the projecting electrode and the pattern wiring may be formed as integrally formed from the beginning, or alternatively the pattern wiring may be formed first and then the projecting electrode formed thereon.
  • the projecting electrode is formed after formation of the pattern wiring, for the reason as described below, it should be desirably formed according to the electroplating method with said pattern wiring as the electrode.
  • said pattern wiring should be desirably formed of Cu.
  • the pattern wiring which becomes the common electrode can be also provided on the driving element substrate, rather than on the recording element substate.
  • the recording element substrate (recording element unit) in the present invention, it is desirable to provide recording elements and the pattern wirings corresponding to the recording elements in a number more by one or more than the necessary number. By doing so, bonding between the bonding portion of the recording element substrate and the pattern wiring of the driving element substrate can be effected without requring strict registration. Also, for the same reason, it is desirable to provide driving elements and pattern wirings of driving element substrate in numbers more by one or more than the necessary numbers.
  • a protective layer should desirably be formed on the surface of the holding member.
  • the protective layer there may be included, for example, an oxidation resistant protective layer formed of SiO2, a protective layer for cavitation resistance formed of Ta, an ink resistance protective layer formed of a photosensitive polyimide, etc.
  • the protective layer may be one layer, or two or more layers may be also provided depending on the purpose.
  • the recording element substrate (recording element unit) of the present invention for the reason as described below, it is desirable to further provide an insulating layer on the protective layer.
  • the material for formation of the insulating layer there may be employed phenol resin, melanine resin, polyester resin, silicone resin, epoxy resin, vinyl chloride resin, styrol resin, acrylic resin, polyimide resin, phenol resin, polycarbonate resin, polypropylene, urea resin, etc. Since the present invention is intended to eliminate the influence from curving or unevenness of the surface of the unit by providing the insulating layer as described below, the thickness of the layer should be preferably as thick as possible.
  • an insulating film may be also provided on the protective layer.
  • phenol resin melanine resin
  • polyester resin silicone resin
  • epoxy resin vinyl chloride resin
  • styrol resin acrylic resin
  • polyimide resin phenol resin polycarbonate resin
  • polypropylene polypropylene, urea resin, etc.
  • the insulating film has a thruhole, and the projecting electrode is exposed from the surface therethrough.
  • the position, size and number of thruholes are not particularly limited. For example, it is not required to be positioned only at the electrode forming portion, may be also present on other portions without giving any influence. Also. one thruhole may be formed corresponding to one projecting electrode, or alternatively a large number of throughholes may be also formed at around the bonding portion as shown in Figs. 14F and 14G described below. When a large number of throughholes are formed at around the bonding portion, there is the advantage that no strict precision in pitch in forming the insulating film or no strict precision in registration during plastering the insulating film is required (or no registration may be required).
  • the thickness of the film should be preferably as thick as possible.
  • 104 is a recording element substrate, 105 a driving element substrate, 106 a driving element and 107 a base stand.
  • the surface of the driving element substrate on which the driving element is provided and the surface having the bonding portion are not required to be the same, but may be the opposite surfaces.
  • the present invention exhibits particularly its effect when the bonding portion of the recording element substrate (recording element unit) and the bonding portion of the driving element substrate are bonded according to the pressure bonding method. Also, bonding by way of metallization and/or alloy formation, or other methods than metallization and/or alloy formation may be feasible, and these methods may be also used in combination with the pressure bonding method.
  • the layer formed by metallization becomes to have the same kind of crystalline structure as the projecting electrode of the recording element substrate or the pattern wiring of the driving element substrate.
  • the method for metallization for example, after bringing the bump-shaped electrode of the recording element substrate in contact with the bonding portion of the driving element substrate corresponding to said projecting electrode, the contacted portions may be heated to a suitable temperature. In this case, diffusion of atoms, etc. occur in the vicinity of the contacted portions by heating, and the diffusion portions become metallized to form a metal layer.
  • the bonding layer to be formed becomes an alloy of the both metals.
  • the method for alloy formation similarly as described above, for example, after the projecting electrode of the recording element substrate is brought into contact with the bonding portion of the driving element substrate corresponding to said projecting electode, the contacted portions may be heated to a suitable temperature. In this case, diffusion of atoms, etc. occur in the vicinity of the contacted portions by heating, whereby an alloy layer comprising a solid solution or an intermetallic compound will be formed in the vicinity of the contacted portions.
  • the heating temperature may be preferably made 200 to 350 °C when, for example, the bonding portion (projecting electrode) of the recording element substrate is formed of Au, and the bonding portion of the driving element unit is formed of Al.
  • the bonding interface comprises an alloy layer.
  • the respective projecting electrodes comprise the same kind of metal or alloy
  • the case when the respective electrodes different kinds of metals or alloys and other cases but in any case, the above metallization or alloy formation as described above is effected.
  • the same is the case with the bonding portion of the driving element substrate.
  • the projecting electrode of the recording element substrate or bonding portion of the driving element substrate may be a metal or an alloy at the contacted portions of the both, and may be also under the state of, for example, a metal formulated with an inorganic material such as glass, etc. or a metal formulated with an organic material such as resin, etc.
  • a plated layer comprising a metal readily formed into an alloy or an alloy.
  • the heating method other than the method such as heat pressurization adhesion, etc., there may be also employed the internal heating methods such as the sonication heating method, the high frequency induction heating method, the high frequency dielectric heating method, the microwave heating method, etc. or other external heating methods, and the above heating methods may be also used in combination.
  • the bonding portions of the driving element substrates are heated directly or indirectly to effect bonding. (Bonding according to methods other than metallization and/or alloy formation)
  • bonding may be effected by pressing the bonding portion of the driving element substrate against the projecting electrode of the recording element substrate by a suitable means.
  • bonding method by use of an adhesive, etc. That is, there are the methods in which bonding is effected by adhering the recording element substrate to the projecting electrode of the recording element substrate at at least a part excluding the bonding portion of the driving element substrate.
  • bonding between the recording element substrate and the driving element substrate should be preferably effected freely detachably.
  • the recording element driving unit in the present invention is a unit which drives the recording elements formed in the recording element unit following the image signals inputted externally.
  • the recording element driving unit comprises the above driving element substrate and the recording element substrate (recording element unit).
  • the ink jet unit has a liquid channel communicated to a discharging opening for discharging ink formed on the recording element substrate (recording element unit), which performs discharging of ink by permitting the energy of the recording element to act on ink.
  • the shape, dimensions, etc. of the liquid channel may be any desired ones.
  • the ink jet driving unit is a unit for discharging ink through the discharging opening following the image signals inputted externally, and comprises an ink jet unit and a driving element substrate.
  • the ink jet recording device in the present invention is a device which performs recording by discharging ink through a discharging opening following the image signals inputted externally, and attaching the ink onto a recording paper.
  • This ink jet recording device has at least the above ink jet driving unit and a means for mounting the ink jet driving unit.
  • the type of the ink jet recording device there are the so called serial scanning type (printing is effected while the print head moves in a reciprocal fashion in the lateral direction relative to the paper) and the full line type (recording of one main scanning line is effected at the same time by use of a print head with one main scanning line width).
  • Fig. 5 and Fig. 6 show an example of the principal portions of the ink jet recording device of the present invention.
  • Fig. 5 shows the serial scanning type and Fig. 6 the full line type.
  • 12 is the ink jet driving unit.
  • the present invention exhibits the effect particularly in a lengthy ink jet driving unit, and therefore it is preferable to employ the full line type.
  • the recording element substrate and the driving element substrate should most desirably completely flat plate without curving or unevenness. For, bonding can be effected easily and therefore reliability of electrical connection can be obtained with ease.
  • electrical circuit substrates are not generally flat plates, but there exist more or less curving or unevenness. Also, curving may be sometimes generated by heat generation during driving. When a substrate with large curving or unevenness is employed, there is a fear that defective connection may occur at the electrical connection between the recording element substrate and the driving element substrate. For prevention of defective connection, it is necessary to make the connection firm or employ a substrate with no curving or unevenness (or difficultly curved), but such a method has the problem of inviting increased cost.
  • the present invention improves reliability of electrical connection to greater extent than in the prior art, and the influence from curving and unevenness is by far small as compared with the prior art. Accordingly, there ensues generally no such problem.
  • the recording element unit of the present invention can exhibit its advantage as the length in the lengthy direction is longer and therefore, in view of the possibility of demand of enlargement of the recording paper size in the future, it may be considered necessary to have the technique to remove the influence from curving of the substrate, etc.
  • the present inventors have investigated intensively for solving this task and consequently obtained an idea that the above task may be solved by forming a projecting electrode through a layer with great film thickness for absorbing curving and unevenness of the substrate.
  • the present inventors first attempted to improve defective connection by making greater the thickness of the protective layer such as oxidation resistant layer, ink resistant layer, etc. provided in the recording element substrate of the prior art. However, according to such method, no sufficient effect could be obtained. Accordingly, the present inventors have investigated about this reason and consequently obtained the following information
  • the present inventors have obtained an idea that the protective layer of the prior art and the layer for absorbing curving or unevenness should be formed separately, and obtained a knowledge that it is preferable to provide a new insulating layer for absorbing curving or unevenness.
  • the present inventors have made further investigations, and obtained an idea that the influence from curving or unevenness of the substrate may be avoided by forming a new film by plastering an insulating film on the protective film and forming a projecting electrode with long foot length by use of this. Further, the present inventors have investigated about the method for performing the step of plastering an insulating film at low cost, and consequently found that substantially no registration of insulating film is required by forming a large number of throughholes at the bonding portion of the insulating film and therearound.
  • the recording element unit having substantially the same constitution as in Fig. 19 (a) and Fig. 19 (b), and having formed projecting electrode for the individual electrodes 1504 is to be described.
  • Figs. 2A-2F are diagrams for illustration of an example of the preparation steps of the recording element unit according to the present invention.
  • the raised portion 207a prepared in the above (10) becomes the bonding portion prepared.
  • Fig. 3 shows an enlarged view of this portion.
  • Example 1 the recording element unit according to an example of the present invention was described.
  • examples of the recording element driving unit, the ink jet unit, the ink jet driving unit and the ink jet device according to the present invention are described respectively.
  • the recording element driving unit according to this Example is formed by connecting a driving element substrate to the recording element unit prepared as described in the above Example 1, and takes a constitution as shown in Fig. 1.
  • 104 is a recording element substrate (namely the recording element unit according to Example 1), 105 a driving element substrate and 106 a driving element.
  • the ink jet unit according to this Example has a liquid channel communicated to a discharging opening formed on the recording element unit prepared as described in the above Example 1, and also the ink jet driving unit has a driving element substrate connected to the ink jet unit.
  • Fig. 4 shows an example of the ink jet unit and the ink jet driving unit according to this Example.
  • 408 is the ink jet unit according to the present invention, 405 a driving element substrate and 406 a driving element.
  • FIG. 5 is a diagram showing an example of the ink jet recording device according to the present invention.
  • the recording sheet 503 is conveyed by a paper feeding roller (not shown) to the sheet delivery rollers 501, 502 placed as keeping a predetermined interval vertically and sheet delivered in the arrowhead A direction.
  • the above carriage 510 is driven in a reciprocal fashion through the belt transmission mechanism 509 by a carriage driving motor (not shown).
  • recording is effected while discharging ink as droplets from the discharge opening of the above ink jet driving unit toward the recording sheet 503.
  • the ink jet driving unit is formed a discharging opening directed toward the recording sheet 503 side, and ink droplets fly from the discharging opening corresponding to the signals from the driving element.
  • Fig. 6 shows another example of the ink jet recording device of the present invention.
  • the ink jet driving unit 512 of this example has recording elements corresponding to the recording width of the recording paper. Accordingly, no reciprocal driving of the carriage is required, and therefore the mechanism can be simple and also high speed recording is possible. In this example, since a very long unit is used, the effect of practising the present invention is enormous.
  • Fig. 7 is a schematic sectional view showing the recording element unit according to this Example.
  • 701 is a holding member, 702 a HfB2 layer as the heat-generating resistance layer, 703 and 704 individual electrodes of Al, 705a and 705b pattern wirings of Al, 706 a SiO2 layer as the oxidation resistant layer and the insulating layer, 707 a photosensitive polyimide layer as the ink resistant layer and the insulating layer, and 708 a Ta layer as the cavitation resistant layer.
  • the recording element driving unit By bonding a driving element substrate to such recording element unit similarly as described in the above Example 2, the recording element driving unit could be miniaturized.
  • the ink jet unit could be miniaturized.
  • an ink jet driving unit By connecting electrically a driving element unit to the ink jet unit, an ink jet driving unit could be miniaturized.
  • the ink jet recording device could be miniaturized. Further, when recording test was conducted for the ink jet recording device, stable recording could be performed.
  • Fig. 9A and Fig. 9B are schematic sectional views showing the recording element unit according to this Example, Fig. 9A showing the recording element unit having no common electrode, and Fig. 9B the recording element unit having a common electrode.
  • 901 is a holding member, 902 a HfB2 layer as the heat-generating resistance layer, 903 a common electrode of Cu, 904 an individual electrode of Cu, 905a and 905b pattern wirings of Cu, 906 a SiO2 layer as the oxidation resistant layer and the insulating layer, 907 a photosensitive polyimide layer as the ink resistant layer and the insulating layer, and 908 a Ta layer as the cavitation resistant layer.
  • the sectional shape of the tip end of the projecting electrode is convex.
  • Example 10 An example of the preparation steps of the recording element unit according to this Example is described by referring to Example 10, by taking an example of the case having a common electrode.
  • the common electrode 903 can be also formed simultaneously with the projecting electrode 904. At this time, plating grows initially per individual bit at the common electrode portion, but plating must be continued until plating between the adjacent bits is sufficiently connected. On the other hand, at this time the individual electrodes must be made so that no contact may occur between the adjacent bits (Fig. 10F).
  • the recording element unit of this Example requires none of the steps of forming an electroplated subbing layer on the whole substrate surface, patterning by coating of a resist and removing the resist by etching, etc. which have been required in the prior art in preparation thereof, and therefore could be prepared at very low cost.
  • a recording element driving unit with low contact resistance at the bonding portion could be prepared at low cost.
  • an ink jet unit could be prepared at low cost.
  • an ink jet driving unit with low contact resistance at the bonding portion could be prepared at low cost.
  • Fig. 11 is a schematic sectional view showing the recording element unit according to this Example.
  • 1101 is a holding member, 1102 a HfB2 layer as the heat-generating resistance layer, 1103 a common electrode, of Al, 1104 an individual electrode of Al, 1105 a pattern wiring of Al, 1106 a SiO2 layer as the oxidation resistance layer and the insulating layer, 1107 a photosensitive polyimide layer as the ink resistant layer and the insulating layer, 1108 a Ta layer as the cavitation layer and 1109 an insulating layer for forming the projecting electrode of individual electrode long in the substrate thickness direction.
  • the projecting electrode of individual electrode is formed long in the substrate thickness direction by providing thus a new insulating layer in the present invention, the influence from curving of the substrate can be removed.
  • an ink jet unit was prepared.
  • an ink jet driving unit was prepared.
  • Fig. 13 is a schematic sectional view showing the recording element unit according to this Example.
  • 1301 is a holding member, 1302 a HfB2 layer as the heat-generating resistance layer, 1303 a common electrode of Al, 1304 an individual electrode of Al, 1305 a pattern wiring of Al, 1306 a SiO2 layer as the oxidation resistant layer and the insulating layer, 1307 a photosensitive polyimide layer as the ink resistant layer and the insulating layer, 1308 a Ta layer as the cavitation layer and 1309 an insulating film for forming the projecting electrode of individual electrode long in the substrate thickness direction.
  • the projecting electrode of individual electrode is formed long in the substrate thickness direction by providing thus a new insulating layer in the present invention, the influence from curving of the substrate can be removed.
  • an ink jet unit was prepared.
  • the recording element unit having a projecting electrode electroconductive raised portion as the individual electrode 1504 having substantially the same constitution as shown in Fig. 19 (a) and 19 (b) is to be described.
  • Figs. 15A - 15F are diagrams for illustration of the preparation steps of the recording element unit according to the present invention.
  • the portion which becomes the bonding portion is the raised portion 1404.
  • An enlarged view of this portion is shown in Fig. 16.
  • Fig. 17 is a schematic exploded perspective view showing an example of the head portion of the ink jet unit and the ink jet driving unit according to the present invention.
  • the symbol 61 is a discharging opening, 62 an ink channel communicated to the discharging opening 61, and 63 an ink chamber communicated to the ink channel 62.
  • the liquid channel in this Example has an ink channel 62 and an ink chamber 63.
  • the ink channel 62 and the ink chamber 63 are formed by bonding mutually of the recording element substrate 184 (for better understanding of the description, length is drawn shorter), the wall forming member 64 and the covering member 65.
  • a heat-generating portion 67 is provided as the recording element corresponding to each ink channel 62, and electrodes (not shown in Fig. 17) are arranged at these heat-generating portions 67.
  • the symbol 66 in Fig. 17 is an ink feeding opening to the ink chamber 63.
  • Fig. 18 is a schematic perspective appearance view showing an example of the ink jet device according to the present invention.
  • the symbol 1000 is the main body of the device, 1100 the power source switch and 1200 the panel for operation.
  • the present invention brings about excellent effects particularly in the recording head, recording device of the bubble jet system among ink jet recording systems.
  • the constitution of the recording head in addition to the constitution comprising a combination of discharging opening, liquid channel and electricity-heat converter (linear liquid channel or right angle liquid channel), the constitution utilizng U.S. Patent 4558333 or 4459600 disclosing a constitution having a heat-acting portion arranged in a flexed region is also included in the present invention.
  • the present invention is also effective for such constitution as based on Japanese Unexamined patent Publication No. 59-123670 disclosing the constitution comprising a common slit as the discharging portion of electricity-heat converter for a plurality of electricity-heat converters or Japanese Unexamined Patent Publication No. 59-138461 disclosing the constitution having an opening which absorbs pressure wave of heat energy corresponding to the discharging portion.
  • the recording head of the full line type having a length corresponding to the width of the maximum recording medium which can be recorded by the recording device either constitution satisfying its length or constitution as one recording head integrally formed may be employed according to a combination of a plurality of recording heads as disclosed in the specifications as described above, and the present invention can exhibit the effects as described above more effectively.
  • the present invention is also effective for the case of using a freely exchangeable recording head of the chip type in which electrical connection with the main device or feeding of ink from the main device becomes possible by mounting onto the main device, or the case of using a recording head of the cartridge type provided integrally with the recording head itself.
  • a restoration means, preliminary auxiliary means, etc. for the recording head provided as the constitution of the recording device of the present invention is preferable in stabilizing further the effects of the present invention.
  • These may specifically include capping means, cleaning means, pressurization or absorption means, preliminary heating means using electicity-heat converter, heating means separate from this or the combination of these, and performing of preliminary discharging mode separate from recording are also effective for stable recording.
  • the recording mode of the recording device not only the recording mode only of the main color such as black, etc., but a constitution constituting integrally the recording head or a plurality of colors may be employed, and for a device provided with at least one of complex colors with different colors or full color by color mixing, the present invention is extremely effective.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)

Claims (5)

  1. Eine Aufzeichnungskopf-Baueinheit, die mindestens zwei Moduln umfaßt, nämlich einen ersten Modul (104), der mindestens einen wärmeentwickelnden Widerstand (202) enthält, und einen zweiten Modul (105), der mindestens eine Treiberschaltung (106) enthält, dadurch gekennzeichnet, daß der genannte erste Modul (104) ein Substrat (201), eine Wärmeerzeugende Widerstandsschicht (202), eine Verdrahtungsschicht (203) zur Zufuhr von elektrischen Signalen zu der besagten Widerstandsschicht sowie von dem erwähnten Substrat getragene und elektrisch mit der besagten Verdrahtungsschicht (203) verbundene Elektroden einschließt, wobei diese Elektroden von ihren jeweiligen Umgebungsflächen aus erhöht sind, so daß sie von der erwähnten Verdrahtungsschicht (203) vorstehen, daß der genannte zweite Modul ein Treiberelementsubstrat mit einer Treiberschaltung (106) sowie eine mit dieser Treiberschaltung verbundene Verdrahtungsschicht umfaßt, wobei die besagten vorstehenden Elektroden des ersten Moduls (104) eine elektrische Verbindung zur Verdrahtungsschicht des genannten zweiten Moduls (105) herstellen, und daß die genannten Moduln voneinander leicht lösbar sind, wodurch der eine oder andere Modul austauschbar ist.
  2. Eine Baueinheit nach Anspruch 1, dadurch gekennzeichnet, daß der genannte erste Modul (104) einen Flüssigkeitskanal enthält, der mit einer Ausstoßöffnung zum Ausstoßen von Tinte im Ansprechen auf durch das besagte Aufzeichnungselement erzeugter Energie in Verbindung steht.
  3. Ein Tintenstrahl-Aufzeichnungsgerät, das eine Baueindheit nach Anspruch 1 oder 2 enthält, gekennzeichnet durch ein Schlittenbauteil (510), das imstande ist, die genannte Baueinheit lösbar zu tragen.
  4. Ein Verfahren zur Herstellung einer Aufzeichnungskopf-Baueinheit nach Anspruch 1 oder 2, wobei dieses Verfahren die Schritte umfaßt des:
    - Ausbildens einer wärmeerzeugenden Widerstandsschicht (202) sowie einer Verdrahtungsschicht (203) an einem Substrat (201); und
    - Ausbildens von Elektroden (207a, 207b) an der Verdrahtungsschicht (203) durch Elektroplattieren derart, daß die Elektroden von dem Substrat getragen, elektrisch mit der Verdrahtungsschicht (203) verbunden und von ihrer jeweiligen Umgebungsfläche aus erhöht sind, so daß sie von der Verdrahtungsschicht (203) vorstehen.
  5. Ein Verfahren nach Anspruch 4, das ferner den Schritt des Ausbildens einer Zwischenleitschicht umfaßt, um die Elektroden vor dem Schritt des Ausbildens der Elektroden zu erzeugen.
EP89307471A 1988-07-22 1989-07-21 Tintenstrahlaufzeichnungsanordnung Expired - Lifetime EP0352142B1 (de)

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
JP18288088 1988-07-22
JP182880/88 1988-07-22
JP174049/88 1989-07-07
JP17405289 1989-07-07
JP17405089 1989-07-07
JP17405189 1989-07-07
JP174052/88 1989-07-07
JP17404989 1989-07-07
JP174050/88 1989-07-07
JP174051/88 1989-07-07

Publications (3)

Publication Number Publication Date
EP0352142A2 EP0352142A2 (de) 1990-01-24
EP0352142A3 EP0352142A3 (en) 1990-05-16
EP0352142B1 true EP0352142B1 (de) 1996-03-06

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
EP89307471A Expired - Lifetime EP0352142B1 (de) 1988-07-22 1989-07-21 Tintenstrahlaufzeichnungsanordnung

Country Status (3)

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EP (1) EP0352142B1 (de)
JP (1) JP2761042B2 (de)
DE (1) DE68925843T2 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5227812A (en) * 1990-02-26 1993-07-13 Canon Kabushiki Kaisha Liquid jet recording head with bump connector wiring
ATE133111T1 (de) * 1990-02-26 1996-02-15 Canon Kk Aufzeichnungsvorrichtung wobei der aufzeichnungskopf mit einem verdrahtungssubstrat versehen ist
US6084611A (en) * 1995-10-16 2000-07-04 Canon Kabushiki Kaisha Recording head, having pressure-bonding member for binding recording element substrate and driving element substrate, head cartridge and recording apparatus having same
JPH09109394A (ja) 1995-10-18 1997-04-28 Canon Inc 記録ヘッド
US6062675A (en) * 1996-01-09 2000-05-16 Canon Kabushiki Kaisha Recording head, recording apparatus and manufacturing method of recording head
TW455548B (en) * 2000-03-15 2001-09-21 Ind Tech Res Inst Structure of inkjet printhead chip and method for detecting the lifespan and defect thereof
JP2001341316A (ja) * 2000-06-02 2001-12-11 Sony Corp インクジェットヘッド及びその製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59111338A (ja) * 1982-12-16 1984-06-27 Matsushita Electric Ind Co Ltd 回路基板への半導体素子の接着方法
DE68927268T2 (de) * 1988-06-03 1997-02-20 Canon Kk Aufzeichnungskopf mit Flüssigkeitsausstoss, Substrat hierfür und Aufzeichnungsapparat mit Flüssigkeitsausstoss, welcher besagten Kopf verwendet

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
HEWLETT-PACKARD JOURNAL. vol. 36, no. 5, May 1985, PALO ALTO US pages 11- 26; Katen C.V. & Braun T.R: "An inexpensive, portable ink jet printer family" *

Also Published As

Publication number Publication date
DE68925843D1 (de) 1996-04-11
EP0352142A3 (en) 1990-05-16
EP0352142A2 (de) 1990-01-24
JP2761042B2 (ja) 1998-06-04
JPH03121851A (ja) 1991-05-23
DE68925843T2 (de) 1996-10-24

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