EP0349833A1 - Appareil pour le revêtement électrolytique de pièces en forme de plaque, notamment de cartes de circuits imprimés - Google Patents

Appareil pour le revêtement électrolytique de pièces en forme de plaque, notamment de cartes de circuits imprimés Download PDF

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Publication number
EP0349833A1
EP0349833A1 EP89111308A EP89111308A EP0349833A1 EP 0349833 A1 EP0349833 A1 EP 0349833A1 EP 89111308 A EP89111308 A EP 89111308A EP 89111308 A EP89111308 A EP 89111308A EP 0349833 A1 EP0349833 A1 EP 0349833A1
Authority
EP
European Patent Office
Prior art keywords
electrolyte
anode
electrolyte solution
circuit boards
conveyance path
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP89111308A
Other languages
German (de)
English (en)
Other versions
EP0349833B1 (fr
Inventor
Daniel Hosten
Lothar Dr. Flögel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wincor Nixdorf International GmbH
Original Assignee
Siemens AG
Wincor Nixdorf International GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE3823072A external-priority patent/DE3823072A1/de
Application filed by Siemens AG, Wincor Nixdorf International GmbH filed Critical Siemens AG
Priority to AT89111308T priority Critical patent/ATE82335T1/de
Publication of EP0349833A1 publication Critical patent/EP0349833A1/fr
Application granted granted Critical
Publication of EP0349833B1 publication Critical patent/EP0349833B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0621—In horizontal cells
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Definitions

  • the invention relates to an electroplating device for plate-shaped workpieces to be treated in a horizontal pass, in particular perforated printed circuit boards, with at least one anode arranged above and at least one below the pass path parallel thereto, with electrolyte collectors aligned transversely to the entry side and exit side above and below the pass path, with between pass path and upper or lower anode-oriented openings for the inlet and / or outlet of electrolyte solution are arranged.
  • Such an electroplating device is the subject of the older European patent application in accordance with EP-A-0 276 725. With the electroplating device described there, the quality of the electrodeposited layers can be improved, particularly with regard to a uniform layer thickness distribution, a high adhesive strength and good ductility compared to the conventionally designed ones Electroplating equipment can be improved.
  • the older application is based on the knowledge that high-quality surfaces of the electrodeposited layers can only be guaranteed by flow components of the electrolyte liquid directed in the direction of flow of the workpieces and that such flow components can be realized in the longitudinal direction by the arrangement of the electrolyte collectors described.
  • flow components directed vertically onto the surface of the workpieces should not be excluded here, since they can still be important for the production of plated-through holes in perforated printed circuit boards.
  • the flow components in the longitudinal direction can be generated both by the inlet and the outlet of electrolyte solutions through the openings of the electrolyte collector. Particularly favorable results are achieved, however, if at least one electrolyte collector is intended for the supply of electrolyte solutions.
  • two electrolyte collectors are intended for the inlet and two electrolyte collectors for the outlet of the electrolyte solution.
  • a further improvement in the quality of the electrodeposited layers can be achieved in this case if the two electrolyte collectors arranged on the outlet side are intended for the supply of electrolyte solution. In other words, this means that the flow component in the longitudinal direction is opposite to the direction in which the workpieces pass.
  • the electrolyte solution of the two electrolyte collectors intended for the inlet can be supplied via separate pumps.
  • a particularly effective flooding of the holes can be achieved in that a larger amount of electrolyte solution is fed to the electrolyte collector arranged above the continuous path than to the electrolyte collector arranged below the continuous path. This is particularly advantageous if the workpieces are additionally swelled from below.
  • the openings are directed obliquely at a small angle of attack onto the continuous path.
  • openings are made in the electrolyte collectors in the form of bores arranged uniformly over the width of the continuous path. Such openings allow for a more even distribution of the desired flow component with less design effort compared to slots running in the transverse direction.
  • a plurality of surge nozzles which are aligned transversely with respect to the flow path and can be acted upon with electrolyte solution, are arranged between the two electrolyte collectors arranged below the flow path and below the sieve or grid-shaped, insoluble lower anode.
  • the placement of the surge nozzles in the electrolyte bath is made considerably easier by the sieve or grid-shaped design of an insoluble lower anode.
  • the surge nozzles are then preferably designed as slotted tubes, which have proven to be more favorable than boreholes for the flooding. If the surge nozzles can be charged with electrolyte solution via a separate pump, the conditions of the electrolyte movement can be optimized even better overall and matched to the particular characteristics of the workpieces to be treated.
  • the upper anode is designed as a soluble anode with soluble anode material arranged on a sieve or grid-shaped carrier.
  • the advantages of a soluble anode are thus achieved, at the same time ensuring a constant distance from the workpieces passing through.
  • optimal conditions with simple maintenance of the electroplating device are achieved with regard to the scattering of the layer thicknesses and the layer thickness distribution on the surface of the workpieces.
  • the object of the present invention is to further improve the electrolyte movement in a generic electroplating device.
  • this object is achieved in that a plurality of upper surge nozzles, which can be acted upon with the electrolyte solution and are arranged transversely to the flow path, are arranged between the two electrolyte collectors arranged above the flow path.
  • the upper surge nozzles are then preferably designed as slotted tubes, which have also proven to be more favorable than bores for the flooding. If the upper surge nozzles can be charged with electrolyte solution via a separate pump, the conditions of the electrolyte movement can also be better matched to the particular characteristics of the workpieces to be treated.
  • the upper surge nozzles are arranged in the region of the upper anode.
  • the upper surge nozzles are arranged above the sieve or lattice-shaped carrier of the upper soluble anode and are at least partially surrounded by the soluble anode material.
  • the drawing shows a highly simplified schematic representation of the electroplating device of a horizontal continuous system for through-plating and electroplating printed circuit boards.
  • the individual perforated printed circuit boards Lp to be electroplated are successively guided on a horizontal continuous path through an electrolyte solution (not shown in more detail) which is located in a collecting trough designated Aw.
  • the circuit boards Lp are fed through a horizontal inlet-side slot Sz to the collecting trough Aw, two inlet-side squeeze rollers Aq, then transported by means of transport means, not shown, between an upper anode Ao and a lower anode Au through the electrolytic solution until they then the galvanizing device leave again on the outlet-side squeeze rollers Aq and a horizontal outlet-side slot Sz of the collecting trough Aw.
  • the individual printed circuit boards Lp are contacted cathodically via contacting devices, also not shown in detail.
  • the upper anode Ao which is horizontally arranged at a short distance above the path of the printed circuit boards Lp, is a soluble anode which consists of a basket Kb and anode material Am arranged in one or more layers.
  • the bottom of the basket Kb which is made entirely of titanium, is made of expanded metal and forms a support for the anode material Am which is slightly permeable to the electrolyte solution.
  • the electrolyte solution is a copper bath and the anode material Am is copper balls, which are often also referred to as Cu pellets.
  • the horizontally aligned lower anode Au is designed as an insoluble anode and is arranged at a short distance below the path of the printed circuit boards Lp.
  • the design as an expanded metal screen made of platinized titanium also prevents the electrolyte exchange and the flow of the electrolyte solution from being impeded.
  • the combination of soluble upper anode Ao and insoluble lower anode Au shown has the advantage that the distance to the circuit boards Lp passing therebetween remains constant and thus with regard to the Scattering of the layer thickness and the layer thickness distribution on the surface optimal conditions can be achieved.
  • a number of slotted tubes Sr are arranged which are oriented transversely to the continuous path and which are supplied with electrolyte solution from a storage container Vb via a pump P1, the amount being able to be varied via a control valve Rv1.
  • the slots of the slot tubes Sr are aligned so that the circuit boards Lp are flowed essentially in the vertical direction from below.
  • electrolyte collectors Es1, Es2, Es3 and Es4 are additionally provided on the inlet side and outlet side, above and below the passageway.
  • Each of these electrolyte headers Es1 to Es4 has a plurality of evenly over the width of the pass-line arranged bores B, the SS under a low angle of incidence, for example 10 o obliquely to the pass-line and in the gap-shaped region between the throughput path and the upper anode Ao or bottom anode, Au directed are.
  • the electrolyte collector Es4 which is arranged on the outlet side below the pass-through path, is supplied with electrolyte solution from the reservoir Vb via a pump P2, the amount being able to be varied via a control valve Rv2.
  • the supplied electrolyte solution then emerges from the bores B of the electrolyte collector Es4 with an essentially horizontal speed component which runs on the underside of the printed circuit boards Lp and is opposite to the direction of passage Dr.
  • the electrolyte collector Es3 arranged on the outlet side above the through-flow path is removed from the storage tank by a pump P3 Vb container with electrolyte solution, the amount can be varied via a control valve Rv3.
  • the supplied electrolyte solution then emerges from the bores B of the electrolyte collector Es3 with an essentially horizontal speed component which runs on the upper side of the printed circuit boards Lp and is opposite to the direction of passage Dr.
  • the horizontal velocity components of the electrolyte flow on the top and bottom of the printed circuit boards Lp are further favored by the inlet-side electrolyte collectors Es1 and Es2, since these are intended for the drainage of electrolyte solution and are connected to the reservoir Vb via drain lines AL1 and AL2.
  • the collecting trough Aw is also connected to the storage container Vb via a drain line AL3.
  • an electrolyte movement is achieved with a very good flow through the holes in the circuit boards Lp and a strong electrolyte flow along the circuit board surface.
  • the following parameters were set: Flow rate pump P1: 20,000 l / h Exit speed: 1 m / sec Flow rate pump P2: 20,000 l / h Exit speed: 2.8 m / sec Flow rate pump P3: 20,000 l / h Exit speed: 2.8 m / sec
  • the exemplary embodiment described merely represents a preferred first possibility for the electrolyte movement with the aid of the electrolyte collectors Es1 to Es4 and the slotted tubes Sr. Further possibilities, which, however, are not intended to represent a subsequent list, are shown in the table below. Es1 Es2 Es3 Es4 Sr. 1st possibility procedure procedure Intake Intake Intake Intake 2nd possibility Intake Intake procedure procedure Intake 3rd possibility procedure Intake procedure Intake Intake Intake 4th possibility Intake procedure procedure Intake Intake
  • upper slotted tubes Sro are arranged in the area of the upper anode A, which are aligned transversely to the continuous path and are supplied with electrolyte solution from the reservoir Vb via a pump P4, the amount being able to be varied via a control valve Rv4.
  • the slots of the upper slot tubes Sro arranged inside the anode material are aligned in such a way that the circuit boards Lp are flowed through from the bottom of the basket Kb essentially in the vertical direction from above.
  • the following parameters are set with regard to the upper slotted tubes.
  • Flow pump P4 20,000 l / h
  • Exit speed 2.5 m / sec.

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Coating With Molten Metal (AREA)
EP89111308A 1988-07-07 1989-06-21 Appareil pour le revêtement électrolytique de pièces en forme de plaque, notamment de cartes de circuits imprimés Expired - Lifetime EP0349833B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AT89111308T ATE82335T1 (de) 1988-07-07 1989-06-21 Galvanisiereinrichtung fuer plattenfoermige werkstuecke, insbesondere leiterplatten.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3823072 1988-07-07
DE3823072A DE3823072A1 (de) 1987-01-26 1988-07-07 Galvanisiereinrichtung fuer plattenfoermige werkstuecke, insbesondere leiterplatten

Publications (2)

Publication Number Publication Date
EP0349833A1 true EP0349833A1 (fr) 1990-01-10
EP0349833B1 EP0349833B1 (fr) 1992-11-11

Family

ID=6358199

Family Applications (1)

Application Number Title Priority Date Filing Date
EP89111308A Expired - Lifetime EP0349833B1 (fr) 1988-07-07 1989-06-21 Appareil pour le revêtement électrolytique de pièces en forme de plaque, notamment de cartes de circuits imprimés

Country Status (4)

Country Link
US (1) US4986888A (fr)
EP (1) EP0349833B1 (fr)
AT (1) ATE82335T1 (fr)
DE (1) DE58902662D1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0534269A2 (fr) * 1991-09-26 1993-03-31 Siemens Aktiengesellschaft Dispositif pour l'électroplacage de plaques de circuits imprimés à trous traversants se déplaçant horizontalement
WO1997027348A1 (fr) * 1996-01-23 1997-07-31 Minnesota Mining And Manufacturing Company Appareil et procede de metallisation electrolytique d'un substrat

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06228791A (ja) * 1992-12-07 1994-08-16 Ebara Yuujiraito Kk 電気めっき装置
US5827410A (en) * 1994-11-15 1998-10-27 Siemens S.A. Device for the electrolytic treatment of plate-shaped workpieces
DE19717512C3 (de) 1997-04-25 2003-06-18 Atotech Deutschland Gmbh Vorrichtung zum Galvanisieren von Leiterplatten unter konstanten Bedingungen in Durchlaufanlagen
TW424807U (en) * 1998-05-06 2001-03-01 Ke Jian Shin Improved structure for rotatory conductive wheel
US6048584A (en) * 1998-05-13 2000-04-11 Tyco Printed Circuit Group, Inc. Apparatus and method for coating multilayer article
DE05075545T1 (de) 1998-05-20 2006-08-31 Process Automation International Ltd., Tai Po Vorrichtung zur Elektroplattierung
US6261425B1 (en) 1998-08-28 2001-07-17 Process Automation International, Ltd. Electroplating machine
IT1303889B1 (it) * 1998-12-01 2001-03-01 Giovanna Angelini Procedimento ed apparecchiatura per la cromatura in continuo di barree relativa struttura di anodo
US6203685B1 (en) * 1999-01-20 2001-03-20 International Business Machines Corporation Apparatus and method for selective electrolytic metallization/deposition utilizing a fluid head
US6514391B2 (en) * 2001-06-07 2003-02-04 Jason Ko Electroplating apparatus with conducting nets for distributing evenly anode current
US9303316B1 (en) * 2010-01-15 2016-04-05 Apollo Precision Kunming Yuanhong Limited Continuous web apparatus and method using an air to vacuum seal and accumulator
WO2012092301A2 (fr) * 2010-12-29 2012-07-05 Intevac, Inc. Procédé et appareil permettant le masquage de substrats en vue d'un dépôt
CN103422150A (zh) * 2012-05-22 2013-12-04 泰州宏瑞新材料有限责任公司 用于电镀的重金属离子浓度调节槽及电镀装置
DE102012221012B4 (de) 2012-11-16 2023-01-19 Atotech Deutschland Gmbh Vorrichtung und Verfahren zur Behandlung von flachem Behandlungsgut

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0086115A1 (fr) * 1982-02-10 1983-08-17 Nippon Steel Corporation Procédé et appareil pour le traitement électrolytique continu d'une bande métallique utilisant des électrodes horizontales
US4459183A (en) * 1981-10-07 1984-07-10 Chemcut Corporation Electroplating apparatus and method
EP0276725A1 (fr) * 1987-01-26 1988-08-03 Siemens Aktiengesellschaft Installation d'électroplacage de pièces en forme de plaques en particulier de plaques de circuits imprimés

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4162952A (en) * 1977-02-24 1979-07-31 Societe Anonyme dite: F.M.C. Apparatus for electrolysis by projection
DE3603856C2 (de) * 1986-02-07 1994-05-05 Bosch Gmbh Robert Verfahren und Vorrichtung zur Galvanisierung von ebenen Werkstücken wie Leiterplatten
US4761213A (en) * 1986-07-28 1988-08-02 Siemens Aktiengesellschaft Treatment facility particularly for printed circuit boards to be treated while in a horizontal plane
US4772361A (en) * 1987-12-04 1988-09-20 Dorsett Terry E Application of electroplate to moving metal by belt plating

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4459183A (en) * 1981-10-07 1984-07-10 Chemcut Corporation Electroplating apparatus and method
EP0086115A1 (fr) * 1982-02-10 1983-08-17 Nippon Steel Corporation Procédé et appareil pour le traitement électrolytique continu d'une bande métallique utilisant des électrodes horizontales
EP0276725A1 (fr) * 1987-01-26 1988-08-03 Siemens Aktiengesellschaft Installation d'électroplacage de pièces en forme de plaques en particulier de plaques de circuits imprimés

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0534269A2 (fr) * 1991-09-26 1993-03-31 Siemens Aktiengesellschaft Dispositif pour l'électroplacage de plaques de circuits imprimés à trous traversants se déplaçant horizontalement
EP0534269A3 (en) * 1991-09-26 1993-09-01 Siemens Aktiengesellschaft Electroplating apparatus for through-hole printed circuit boards moving horizontally
WO1997027348A1 (fr) * 1996-01-23 1997-07-31 Minnesota Mining And Manufacturing Company Appareil et procede de metallisation electrolytique d'un substrat
US6063253A (en) * 1996-01-23 2000-05-16 3M Innovative Properties Company Apparatus and method for electroplating a metal onto a substrate

Also Published As

Publication number Publication date
ATE82335T1 (de) 1992-11-15
EP0349833B1 (fr) 1992-11-11
DE58902662D1 (de) 1992-12-17
US4986888A (en) 1991-01-22

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