EP0337470A2 - Semiconductor quantum well laser - Google Patents
Semiconductor quantum well laser Download PDFInfo
- Publication number
- EP0337470A2 EP0337470A2 EP89106647A EP89106647A EP0337470A2 EP 0337470 A2 EP0337470 A2 EP 0337470A2 EP 89106647 A EP89106647 A EP 89106647A EP 89106647 A EP89106647 A EP 89106647A EP 0337470 A2 EP0337470 A2 EP 0337470A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- quantum well
- layer
- barrier layer
- laser
- gaas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
- H01S5/343—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/34313—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser with a well layer having only As as V-compound, e.g. AlGaAs, InGaAs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
- H01S5/3407—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers characterised by special barrier layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
- H01S5/343—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/34313—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser with a well layer having only As as V-compound, e.g. AlGaAs, InGaAs
- H01S5/3432—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser with a well layer having only As as V-compound, e.g. AlGaAs, InGaAs the whole junction comprising only (AI)GaAs
Definitions
- the present invention relates to a semiconductor quantum well laser manufactured by use of methods such as a molecualr bean epitaxial method.
- the component ratio of Al is 0.4 in the clad layer and 0.2 in the bariier layer, namely, there exist two kinds of Al component ratios, which hence requires to employ two Al cells for manufacturing the laser.
- the X point (indirect transition) becomes to be located at a position near the ⁇ point (direct transition) in the barrier layer (for example, when it is deisred to obtain an emission of light with a wavelength of about 680 nm, the Al component ratio becomes to be 0.4 to 0.5 and hence the distance between the X point and the ⁇ point is descreased).
- the transition from the X point is further facilitated, and this does not contribute to the light emission, which leads to problems that the leakage of the injection carriers is increased and that the threshold current becomes greater and the temperature characteristic is deteriorated.
- the semiconductor quantum well laser according to the present invention is characterized in that an active layer is enclosed on both sides thereof with thick (for example, a thickness of at least 200 ⁇ ) barrier layers, each of which is formed by alternately accumulating thin films (comprising 2 ⁇ 5 molecular layers) respectively having different mixed crystal ratios so as to obtain a superlattice structure possessing an intermediate mixed crystal ratio therebetween.
- thick barrier layers for example, a thickness of at least 200 ⁇ barrier layers, each of which is formed by alternately accumulating thin films (comprising 2 ⁇ 5 molecular layers) respectively having different mixed crystal ratios so as to obtain a superlattice structure possessing an intermediate mixed crystal ratio therebetween.
- a barrier layer of an SCH quantum well structure is formed by alternately accumulating AlGaAs/GaAs layers with the thickness of each layer set to about two to five molecular layers; and hence a large distance can be obtained between the X point and the ⁇ point in the barrier layer, which decreases the leakage of the injection carriers and which improves the temperature characterstic.
- the increase of the threshold value is prevented even when a short wavelength is to be obtained. For example, if the Al component ratio (average) is at most 0.5, the distance between the X point and the ⁇ point can be set to be greater than that of the bulk, which enables an operation to be conductyed for the short wavelength.
- the semiconductor laser according to the present invention is manufactured by use of the molecular beam epitaxial (MBE) method
- MBE molecular beam epitaxial
- a barrier layer is formed prior to the fabrication of an active layer; in consequence, impurities mixed due to the open and close operations of the shutter can be captured in a stage to form the barrier layer, and hence flattening in a plane is enhanced in the growth of the GaAs layer when the active layer is fabricated, which enables the quantum well active layer to be formed with a high quality and with a satisfactory flatness.
- the superlattice since the superlattice is adopted, there is attained a characteristic that the growth can be achieved with one Al cell. For example, by alternately accumulating an Al 0.4 Ga 0.6 As layer and a GaAs layer in a periodic fashion, a barrier layer can be formed with the average Al component ratio set to 0.2.
- the present invention is also applicable to semiconductor lasers associated with a single quantum well, a double quantum well, and a multiple quantum well; moreover, it is natural that the present invention is also applicable to a laser of a GRIN-SCH structure.
- the accompanying drawing shows a schematic across-sectional view of a semiconductor laser including an AlGaAS structure showing an embodiment according to the present invention.
- This diagram also includes the configuration of a superlattice barrier layer in a magnified form as well as a mean value of mixed crystal distribution of Al in the proximity of an active layer and a distribution of Al in the superlattice barrier layer.
- Si carrier density
- Si 1018cm ⁇ 3
- a non-doped GaAs quantum well active layer 50 ⁇
- Be 1018cm ⁇ 3.
- the mean Al component ratio of the barrier layer 4 is 0.2.
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Nanotechnology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Life Sciences & Earth Sciences (AREA)
- Biophysics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Semiconductor Lasers (AREA)
Abstract
Description
- The present invention relates to a semiconductor quantum well laser manufactured by use of methods such as a molecualr bean epitaxial method.
- As a semiconductor quantum well laser manufactured with a barrier layer having a thickness of at most 1000 Å, there has been one described in pages 371 to 373 of "LOW-THRESHOLD, HIGH-POWER ZERO-ORDER LATERAL-MODE DQW-SCH METAL-CLAD RIDGE WAVEGUIDE (AlGa)As/GaAs LASERS" written by B. Garrett et al and published in ELECTRONICS LETTERS, 9th April 1987, Vol. 23, No. 8. This is of a Separately Confined Heterostructure (SCH) and there is formed a quantum well enclosed with barrier layer each of Al0.2Ga0.8As with a thickness of at most 1000 Å.
- However, in the semiconductor quantum well laser above, the component ratio of Al is 0.4 in the clad layer and 0.2 in the bariier layer, namely, there exist two kinds of Al component ratios, which hence requires to employ two Al cells for manufacturing the laser.
- In addition, when it is desired to emit a light having a short wavelength, since there is used a mixed crystal barrier layer of AlGaAs, the X point (indirect transition) becomes to be located at a position near the Γ point (direct transition) in the barrier layer (for example, when it is deisred to obtain an emission of light with a wavelength of about 680 nm, the Al component ratio becomes to be 0.4 to 0.5 and hence the distance between the X point and the Γ point is descreased). In consequence, the transition from the X point is further facilitated, and this does not contribute to the light emission, which leads to problems that the leakage of the injection carriers is increased and that the threshold current becomes greater and the temperature characteristic is deteriorated.
- It is therefore an object of the present invention to provide a semiconductor quantum well laser in which there is required only a cell of Al or the like and a light having a short wavelength can be emitted in a relatively easy fashion.
- The semiconductor quantum well laser according to the present invention is characterized in that an active layer is enclosed on both sides thereof with thick (for example, a thickness of at least 200 Å) barrier layers, each of which is formed by alternately accumulating thin films (comprising 2∼5 molecular layers) respectively having different mixed crystal ratios so as to obtain a superlattice structure possessing an intermediate mixed crystal ratio therebetween.
- For easy understanding of the semiconductor laser of the present invention, description will be given of a laser of an AlGaAs/GaAs structure. According to the present invention, a barrier layer of an SCH quantum well structure is formed by alternately accumulating AlGaAs/GaAs layers with the thickness of each layer set to about two to five molecular layers; and hence a large distance can be obtained between the X point and theΓ point in the barrier layer, which decreases the leakage of the injection carriers and which improves the temperature characterstic. In addtion, there is developed an effect that the increase of the threshold value is prevented even when a short wavelength is to be obtained. For example, if the Al component ratio (average) is at most 0.5, the distance between the X point and theΓ point can be set to be greater than that of the bulk, which enables an operation to be conductyed for the short wavelength.
- Furthermore, when the semiconductor laser according to the present invention is manufactured by use of the molecular beam epitaxial (MBE) method, a barrier layer is formed prior to the fabrication of an active layer; in consequence, impurities mixed due to the open and close operations of the shutter can be captured in a stage to form the barrier layer, and hence flattening in a plane is enhanced in the growth of the GaAs layer when the active layer is fabricated, which enables the quantum well active layer to be formed with a high quality and with a satisfactory flatness.
- In addition, since the superlattice is adopted, there is attained a characteristic that the growth can be achieved with one Al cell. For example, by alternately accumulating an Al0.4Ga0.6As layer and a GaAs layer in a periodic fashion, a barrier layer can be formed with the average Al component ratio set to 0.2.
- The present invention is also applicable to semiconductor lasers associated with a single quantum well, a double quantum well, and a multiple quantum well; moreover, it is natural that the present invention is also applicable to a laser of a GRIN-SCH structure.
- These and other objects and advantages of the present invention will become apparent by reference to the following description and accompanying drawing.
- The drawing is a cross-sectional view of a semiconductor quantum well laser including an AlGaAS structure in which the barrier layer is shown in a magnified form; in addition, there are also shown a mean value of component distribution of Al in the proximity of an active layer and a component distribution of Al in the superlattice barrier layer at the same time.
- The accompanying drawing shows a schematic across-sectional view of a semiconductor laser including an AlGaAS structure showing an embodiment according to the present invention. This diagram also includes the configuration of a superlattice barrier layer in a magnified form as well as a mean value of mixed crystal distribution of Al in the proximity of an active layer and a distribution of Al in the superlattice barrier layer.
- On an n-GaAs substrate (carrier density Si = 10¹⁸cm⁻³) 1, there are continuously grown by use of an MBE method an n-GaAs buffer layer (Si = 10¹⁸cm⁻³, thickness = 0.5 µ m) 2, an n-Al0.4Ga0.6As clad layer(Si = 10¹⁸cm¹⁻³, thickness = 1.5 µ m) 3, a non-doped Al0.4Ga0.6As/GaAs superlattice barrier layer (total thickness = about 1000 Å) 4, a non-doped GaAs quantum well active layer (50 Å) 5, a p-Al0.7Ga0.3As clad layer (Be = 10¹⁸cm⁻³. thickness = 1.5 µ m) 6, and a p-GaAs cap layer (Be = 10¹⁸cm⁻³, thickness = 0.5 µ m) 7, thereby manufacturing a semiconductor laser. Since this exmple is of a double quantum well structure, there are disposed two quantum well
active layers 5 each being enclosed or sandwiched withbarrier layers 4. - The
superlattice barrier layer 4 is formed, as shown in a magnified image, by alternately accumulating an Al0.4Ga0.6As (thickness = 5.6Å)layer 21 and a GaAs layer (thickness = 5.6Å ) 22 in a multilayer structure. The mean Al component ratio of thebarrier layer 4 is 0.2.
Claims (1)
- A semiconductor quantum well laser in which an active layer is enclosed on both sides thereof with thick barrier layers, each said barrier layer being formed by alternately accumulating thin films respectively having different mixed crystal ratios so as to obtain a superlattice structure possessing an intermediate mixed crystal ratio therebetween.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63091634A JPH01264286A (en) | 1988-04-15 | 1988-04-15 | Semiconductor quantum well laser |
| JP91634/88 | 1988-04-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP0337470A2 true EP0337470A2 (en) | 1989-10-18 |
| EP0337470A3 EP0337470A3 (en) | 1990-01-31 |
Family
ID=14031967
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP89106647A Withdrawn EP0337470A3 (en) | 1988-04-15 | 1989-04-13 | Semiconductor quantum well laser |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US4999844A (en) |
| EP (1) | EP0337470A3 (en) |
| JP (1) | JPH01264286A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1991016747A1 (en) * | 1990-04-20 | 1991-10-31 | Institutul De Fizica Atomica | High power laser diode |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5172195A (en) * | 1990-04-18 | 1992-12-15 | Kabushiki Kaisha Toshiba | Double heterostructure GaAlAs 610-640 nm LED |
| US5173912A (en) * | 1991-04-02 | 1992-12-22 | The Furukawa Electric Co., Ltd. | Double-carrier confinement laser diode with quantum well active and sch structures |
| DE69217344T2 (en) * | 1991-12-16 | 1997-08-21 | Ibm | Tunable laser with coupled quantum well structure |
| JPH05243676A (en) * | 1992-02-28 | 1993-09-21 | Mitsubishi Electric Corp | Semiconductor laser device |
| US5216262A (en) * | 1992-03-02 | 1993-06-01 | Raphael Tsu | Quantum well structures useful for semiconductor devices |
| JPH0629621A (en) * | 1992-07-09 | 1994-02-04 | Mitsubishi Electric Corp | Semiconductor laser device |
| JPH0653602A (en) * | 1992-07-31 | 1994-02-25 | Hitachi Ltd | Semiconductor laser device |
| US5600667A (en) * | 1993-04-05 | 1997-02-04 | Matsushita Electric Industrial Co., Ltd. | Semiconductor laser device |
| US5937274A (en) * | 1995-01-31 | 1999-08-10 | Hitachi, Ltd. | Fabrication method for AlGaIn NPAsSb based devices |
| JPH1079554A (en) * | 1996-09-04 | 1998-03-24 | Mitsubishi Electric Corp | Optical semiconductor device |
| DE102004009531B4 (en) * | 2004-02-20 | 2007-03-01 | Forschungszentrum Rossendorf E.V. | Quantum cascade laser structure |
| KR100670827B1 (en) * | 2005-12-10 | 2007-01-19 | 한국전자통신연구원 | Waveguide Type i-i-n Photodiode with Inclined Refractive Index Distribution Around the Light Absorption Layer |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59104189A (en) * | 1982-12-07 | 1984-06-15 | Kokusai Denshin Denwa Co Ltd <Kdd> | Semiconductor laser |
| JPS59181084A (en) * | 1983-03-30 | 1984-10-15 | Fujitsu Ltd | Semiconductor laser device |
| JPS60145686A (en) * | 1984-01-09 | 1985-08-01 | Nec Corp | Semiconductor laser |
| JPS60145687A (en) * | 1984-01-09 | 1985-08-01 | Nec Corp | Semiconductor laser |
| JPS61154191A (en) * | 1984-12-27 | 1986-07-12 | Mitsubishi Electric Corp | semiconductor laser device |
| JPS61171913A (en) * | 1985-01-25 | 1986-08-02 | Mitsubishi Rayon Co Ltd | Light-weight and heat-resistance roll raw material tube |
| JPS61210690A (en) * | 1985-03-15 | 1986-09-18 | Sony Corp | Semiconductor light emitting device |
| JPH0821748B2 (en) * | 1985-09-04 | 1996-03-04 | 株式会社日立製作所 | Semiconductor laser device |
| JPS62190885A (en) * | 1986-02-18 | 1987-08-21 | Mitsubishi Electric Corp | Semiconductor laser |
| JPS62190886A (en) * | 1986-02-18 | 1987-08-21 | Mitsubishi Electric Corp | semiconductor laser equipment |
| JPS62209884A (en) * | 1986-03-10 | 1987-09-16 | Mitsubishi Electric Corp | semiconductor laser |
| JPH06329988A (en) * | 1993-05-21 | 1994-11-29 | Nikon Corp | Coating composition and plastic substrate |
-
1988
- 1988-04-15 JP JP63091634A patent/JPH01264286A/en active Pending
-
1989
- 1989-04-12 US US07/337,069 patent/US4999844A/en not_active Expired - Fee Related
- 1989-04-13 EP EP89106647A patent/EP0337470A3/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1991016747A1 (en) * | 1990-04-20 | 1991-10-31 | Institutul De Fizica Atomica | High power laser diode |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01264286A (en) | 1989-10-20 |
| EP0337470A3 (en) | 1990-01-31 |
| US4999844A (en) | 1991-03-12 |
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| 18D | Application deemed to be withdrawn |
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