EP0281804A3 - Stabilized alcaline gold plating bath without current - Google Patents

Stabilized alcaline gold plating bath without current Download PDF

Info

Publication number
EP0281804A3
EP0281804A3 EP88102273A EP88102273A EP0281804A3 EP 0281804 A3 EP0281804 A3 EP 0281804A3 EP 88102273 A EP88102273 A EP 88102273A EP 88102273 A EP88102273 A EP 88102273A EP 0281804 A3 EP0281804 A3 EP 0281804A3
Authority
EP
European Patent Office
Prior art keywords
stabilized
gold
alcaline
current
plating bath
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP88102273A
Other languages
German (de)
French (fr)
Other versions
EP0281804A2 (en
Inventor
Walter Prof. Dr. Ott
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bayer Pharma AG
Original Assignee
Schering AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schering AG filed Critical Schering AG
Publication of EP0281804A2 publication Critical patent/EP0281804A2/en
Publication of EP0281804A3 publication Critical patent/EP0281804A3/en
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

Die Erfindung betrifft ein stabilisiertes, wässriges, alkalisches Goldbad, ent­ haltend einen Dicyanogold(I)-Komplex, einen Komplexbildner, ein Alkalihydroxid und ein Reduktionsmittel, zur stromlosen Abscheidung von Gold auf Gold und Me­ talle, die unedler als Gold sind, sowie auf Legierungen dieser Metalle, dadurch gekennzeichnet, daß es als Stabilisator mindestens eine Verbindung aus der Klasse der Glykolderivate oder der Polyethylenimine enthält. The invention relates to a stabilized, aqueous, alkaline gold bath, ent holding a dicyanogold (I) complex, a complexing agent, an alkali hydroxide and a reducing agent for electroless deposition of gold on gold and me talle, which are less noble than gold, as well as on alloys of these metals, thereby characterized in that it acts as a stabilizer at least one compound from the Contains class of glycol derivatives or polyethyleneimines.

EP88102273A 1987-03-09 1988-02-17 Stabilized alcaline gold plating bath without current Ceased EP0281804A3 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19873707817 DE3707817A1 (en) 1987-03-09 1987-03-09 STABILIZED ALKALINE GOLD BATH FOR ELECTRIC DEPOSIT OF GOLD
DE3707817 1987-03-09

Publications (2)

Publication Number Publication Date
EP0281804A2 EP0281804A2 (en) 1988-09-14
EP0281804A3 true EP0281804A3 (en) 1989-03-15

Family

ID=6322785

Family Applications (1)

Application Number Title Priority Date Filing Date
EP88102273A Ceased EP0281804A3 (en) 1987-03-09 1988-02-17 Stabilized alcaline gold plating bath without current

Country Status (5)

Country Link
US (1) US4838937A (en)
EP (1) EP0281804A3 (en)
JP (1) JPS6425987A (en)
CA (1) CA1290993C (en)
DE (1) DE3707817A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4919720A (en) * 1988-06-30 1990-04-24 Learonal, Inc. Electroless gold plating solutions
GB2225026A (en) * 1988-11-22 1990-05-23 American Chem & Refining Co Electroless gold plating composition
DE4024764C1 (en) * 1990-08-02 1991-10-10 Schering Ag Berlin-Bergkamen, 1000 Berlin, De
JP2927142B2 (en) * 1993-03-26 1999-07-28 上村工業株式会社 Electroless gold plating bath and electroless gold plating method
US5803957A (en) * 1993-03-26 1998-09-08 C. Uyemura & Co.,Ltd. Electroless gold plating bath
US5338343A (en) * 1993-07-23 1994-08-16 Technic Incorporated Catalytic electroless gold plating baths
JP3395854B2 (en) * 1994-02-02 2003-04-14 日立化成工業株式会社 Chemical reduction solution of copper oxide and method for producing multilayer printed wiring board using the same
CN1053231C (en) * 1996-10-16 2000-06-07 南京大学 Plating bath for chemical plating nickel-phosphorus alloy and chemical plating process
JP4932094B2 (en) * 2001-07-02 2012-05-16 日本リーロナール有限会社 Electroless gold plating solution and electroless gold plating method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2441666A1 (en) * 1978-11-16 1980-06-13 Prost Tournier Patrick PROCESS FOR CHEMICAL DEPOSITION OF GOLD BY SELF-CATALYTIC REDUCTION

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5020012B1 (en) * 1964-06-24 1975-07-11
US3589916A (en) * 1964-06-24 1971-06-29 Photocircuits Corp Autocatalytic gold plating solutions
US4091128A (en) * 1976-10-08 1978-05-23 Ppg Industries, Inc. Electroless gold plating bath

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2441666A1 (en) * 1978-11-16 1980-06-13 Prost Tournier Patrick PROCESS FOR CHEMICAL DEPOSITION OF GOLD BY SELF-CATALYTIC REDUCTION

Also Published As

Publication number Publication date
JPS6425987A (en) 1989-01-27
US4838937A (en) 1989-06-13
CA1290993C (en) 1991-10-22
EP0281804A2 (en) 1988-09-14
DE3707817A1 (en) 1988-09-22

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