EP0274695A1 - Heat exchange module made of burned ceramic material - Google Patents

Heat exchange module made of burned ceramic material Download PDF

Info

Publication number
EP0274695A1
EP0274695A1 EP87118638A EP87118638A EP0274695A1 EP 0274695 A1 EP0274695 A1 EP 0274695A1 EP 87118638 A EP87118638 A EP 87118638A EP 87118638 A EP87118638 A EP 87118638A EP 0274695 A1 EP0274695 A1 EP 0274695A1
Authority
EP
European Patent Office
Prior art keywords
cards
heat exchanger
ceramic material
heat exchange
exchange module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP87118638A
Other languages
German (de)
French (fr)
Other versions
EP0274695B1 (en
Inventor
Rudolf Dr. Ganz
Otto Heinz
Heinrich Schelter
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hoechst AG
Original Assignee
Hoechst AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hoechst AG filed Critical Hoechst AG
Priority to AT87118638T priority Critical patent/ATE58231T1/en
Publication of EP0274695A1 publication Critical patent/EP0274695A1/en
Application granted granted Critical
Publication of EP0274695B1 publication Critical patent/EP0274695B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/04—Constructions of heat-exchange apparatus characterised by the selection of particular materials of ceramic; of concrete; of natural stone
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/08—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning
    • F28F3/086—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning having one or more openings therein forming tubular heat-exchange passages

Definitions

  • the invention relates to a heat exchanger module made of fired ceramic material, which is produced by firing a stack of punched and laminated green ceramic cards.
  • Heat exchangers of the type mentioned are known from DE-A-31 36 253. They are made from ceramic films or cards into which the flow channels are stamped or stamped and which are connected to one another by means of lamination aids. The heat exchanger block thus obtained is first heated and the organic components are baked out at 200-300 ° C. The block is then fired at 1200 to 1700 ° C. Disadvantages are the large number of different card patterns for the construction of the block, the reworking of the green block, as well as the burned block and the limited possibility of cleaning the channels. The invention seeks to remedy this. The heat exchanger should be able to be produced using a minimum of card samples and be used equally for particle-laden gas flows and for the heat exchange between liquid-gas and liquid-liquid.
  • a heat exchanger module which is characterized in that the stack consists of at least two cards, the cards have recesses which form tubular channels when the cards are stacked and rings surrounding the tubular channels are arranged between the cards.
  • the module can be constructed from a card pattern. If necessary, the fired module can be sealed by a second fire and Introducing sealants such as silicon or a glaze through the tubular channels intended for the warm medium into the interior of the module can be improved.
  • the heat exchanger module is particularly well suited for the construction of heat exchanger systems.
  • the modules are expediently stacked on top of one another. In this arrangement, the hot medium is guided in a straight line through the columnar structure.
  • the modules can be sealed together by gluing with organic or inorganic adhesives, mortars, glasses and the like. However, conventional sealing elements such as fiber cords, fiber papers, 0-rings, C-seals, etc. are also suitable.
  • the sealing surfaces can be structured or ground. Any number of columns can be installed in a heat exchanger housing. It is sufficient to brace the individual columns against a fixed abutment with spring elements to compensate for thermal expansion. A rigid connection between the columns is not necessary. However, they can be positioned using guide elements inserted in the module's guide grooves. The guide elements can be designed in such a way that the cold medium is always led into the interior of the module during the transition from one column to the next. By designing the heat exchanger housing, the operating mode of the heat exchanger can be changed from cross-flow to cross-flow, for example, without changing the column concept.
  • the heat exchanger module 1 consists of ceramic cards 2 and ceramic rings 3.
  • the cards have recesses 4 and the rings 3 expediently have the same inner contour and the same free cross-section as the recesses 4.
  • Cards 2 with recesses 4 and rings 3 are stacked alternately , in such a way that rings 3 and recesses 4 form a rectilinear tubular channel 5.
  • Slit-shaped channels 6 are formed transverse to the direction of the tubular channels 5 and parallel to the card plane. The height of the channels 6 can be varied as desired by stacking several rings 3 on top of one another.
  • the perforation 7 on the edge of the card can be used to hold stacking aids, assembly aids 8, guide elements, etc.
  • heat exchanger modules 1 are assembled into columns 9, which are arranged parallel to one another in a housing 12.
  • the individual columns 9 are fixed in relation to one another and with respect to the housing 12 by mounting aids 8, which can also be designed as guide elements.
  • Seals 11 are arranged between the heat exchanger modules 1 of a column 9 in order to prevent the heat exchanger media from mixing.
  • the ends of individual columns 9 are also sealed off from the housing 13 by seals 11.
  • the columns 9 are arranged from bearing elements 17, 17,1, which are sealed off from the columns 9 by means of seals 11 and from the housing 12 by means of seals 11 ⁇ , 13 and 14. While the bearing element 17 ⁇ is supported directly on the housing 12 via seals 11 ⁇ , the bearing element 17 is supported on the housing 12 via springs 10.
  • 15 indicates the flow direction of the cold medium and 16 the flow direction of the hot medium.

Landscapes

  • Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
  • Ceramic Products (AREA)
  • Paper (AREA)
  • Orthopedics, Nursing, And Contraception (AREA)
  • Filtering Materials (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Laminated Bodies (AREA)
  • Cookers (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The module is produced from a stack of punched and laminated green ceramic cards and consists of at least two cards (2). The cards have recesses (4) which form tubular channels (5) when the cards (2) are stacked. Rings (3) are arranged between the cards as part of the tubular channels (5). <IMAGE>

Description

Die Erfindung betrifft einen Wärmetauschermodul aus gebranntem keramischen Material, der durch Brennen eines Stapels gestanzter und laminierter grüner keramischer Karten hergestellt wird.The invention relates to a heat exchanger module made of fired ceramic material, which is produced by firing a stack of punched and laminated green ceramic cards.

Wärmetauscher der genannten Art sind aus der DE-A-31 36 253 bekannt. Sie werden aus kermischen Folien bzw. Karten hergestellt, in die die Strömungskanäle eingestanzt oder eingeprägt sind und die durch Laminierhilfsmittel miteinander verbunden werden. Der so erhaltene Wärmetauscherblock wird zunächst erhitzt, und die organischen Bestandteile werden bei 200 - 300°C ausgeheizt. Anschließend wird der Block bei 1200 bis 1700°C gebrannt. Nachteilig ist die große Anzahl unterschiedlicher Kartenmuster für den Aufbau des Blocks, das Nacharbeiten des grünen Blocks, sowie des gebrannten Blocks und die begrenzte Reinigungsmöglichkeit der Kanäle. Hier will die Erfindung Abhilfe schaffen. Der Wärmetauscher soll durch ein Minimum an Kartenmustern herstellbar und für partikelbeladene Gasströme sowie für den Wärmetausch zwischen Flüssigkeit-Gas und Flüssigkeit-Flüssigkeit gleichermaßen einsetzbar sein.Heat exchangers of the type mentioned are known from DE-A-31 36 253. They are made from ceramic films or cards into which the flow channels are stamped or stamped and which are connected to one another by means of lamination aids. The heat exchanger block thus obtained is first heated and the organic components are baked out at 200-300 ° C. The block is then fired at 1200 to 1700 ° C. Disadvantages are the large number of different card patterns for the construction of the block, the reworking of the green block, as well as the burned block and the limited possibility of cleaning the channels. The invention seeks to remedy this. The heat exchanger should be able to be produced using a minimum of card samples and be used equally for particle-laden gas flows and for the heat exchange between liquid-gas and liquid-liquid.

Die Aufgabe wird durch einen Wärmetauschermodul gelöst, der dadurch gekennzeichnet ist, daß der Stapel aus mindestens zwei Karten besteht, die Karten Ausnehmungen aufweisen, die bei gestapelten Karten rohrförmige Kanäle bilden und zwischen den Karten die rohrförmigen Kanäle umgebende Ringe angeordnet sind.The object is achieved by a heat exchanger module, which is characterized in that the stack consists of at least two cards, the cards have recesses which form tubular channels when the cards are stacked and rings surrounding the tubular channels are arranged between the cards.

Die durch die Erfindung erreichten Vorteile sind im wesentlichen darin zu sehen, daß sich der Modul aus einem Kartenmuster aufbauen läßt. Falls erforderlich kann die Abdichtung des gebrannten Moduls durch einen zweiten Brand und Einbringen von Dichtungsmittel wie z.B. Silizium oder einer Glasur über die für das warme Medium bestimmten rohrförmigen Kanäle in das Innere des Moduls verbessert werden. Der Wärmetauschermodul eignet sich besonders gut zum Aufbau von Wärmetauschersystemen. Dabei werden die Modulen zweckmäßig zu Säulen aufeinandergesetzt. Das heiße Medium wird bei dieser Anordnung geradlinig durch den säulenförmigen Aufbau geleitet. Die Dichtung der Modulen untereinander kann wahlweise durch Verkleben mit organischen oder anorganischen Klebern, Mörteln, Gläsern und ähnlichem Erfolgen. Es eignen sich aber auch übliche Dichtelemente wie Faserschnüre, Faserpapiere, 0-Ringe, C-Dichtungen usw. Die Dichtflächen können strukturiert oder geschliffen sein. In ein Wärmetauschergehäuse können beliebig viele Säulen eingebaut werden. Dabei genügt es die einzelnen Säulen gegen ein festes Widerlage mit Federelementen zur Kompensation von Wärmedehnungen zu verspannen. Eine starre Verbindung der Säulen untereinander ist nicht erforderlich. Sie können jedoch über in Führungsnuten des Moduls eingeschobene Leitelemente positioniert werden. Die Leitelemente können so gestaltet werden, daß das kalte Medium beim Übergang von einer zur nächsten Säule stets in das Modulinnere geleitet wird. Durch die Gestaltung des Wärmetauschergehäuses kann ohne Änderung des Säulenkonzepts die Betriebsweise des Wärmetauschers von z.B. Kreuz- in Kreuz Gegenstrom geändert werden.The advantages achieved by the invention are essentially to be seen in the fact that the module can be constructed from a card pattern. If necessary, the fired module can be sealed by a second fire and Introducing sealants such as silicon or a glaze through the tubular channels intended for the warm medium into the interior of the module can be improved. The heat exchanger module is particularly well suited for the construction of heat exchanger systems. The modules are expediently stacked on top of one another. In this arrangement, the hot medium is guided in a straight line through the columnar structure. The modules can be sealed together by gluing with organic or inorganic adhesives, mortars, glasses and the like. However, conventional sealing elements such as fiber cords, fiber papers, 0-rings, C-seals, etc. are also suitable. The sealing surfaces can be structured or ground. Any number of columns can be installed in a heat exchanger housing. It is sufficient to brace the individual columns against a fixed abutment with spring elements to compensate for thermal expansion. A rigid connection between the columns is not necessary. However, they can be positioned using guide elements inserted in the module's guide grooves. The guide elements can be designed in such a way that the cold medium is always led into the interior of the module during the transition from one column to the next. By designing the heat exchanger housing, the operating mode of the heat exchanger can be changed from cross-flow to cross-flow, for example, without changing the column concept.

Im folgenden wird die Erfindung anhand von lediglich einen Ausführungsweg darstellenden Zeichnungen näher erläutert.
Es zeigt

  • Figur 1 eine Draufsicht auf den Wärmetauschermodul,
  • Figur 2 den Schnitt II-II der Figur 1
  • Figur 3 ein Wäremtauschersystem, aufgebaut aus Wärmetauschermodulen gemäß Figur 2 und zwar den Schnitt III-III der Firgur 4 und
  • Figur 4 den Schnitt IV-IV der Figur 3.
The invention is explained in more detail below with the aid of drawings which illustrate only one embodiment.
It shows
  • FIG. 1 shows a top view of the heat exchanger module,
  • Figure 2 shows the section II-II of Figure 1
  • 3 shows a heat exchanger system, built up from heat exchanger modules according to FIG. 2, specifically section III-III of Firgur 4 and
  • 4 shows the section IV-IV of Figure 3.

Der Wärmetauschermodul 1 besteht aus keramischen Karten 2 und keramischen Ringen 3. Die Karten weisen Ausnehmungen 4 auf und die Ringe 3 haben zweckmäßig die gleiche innere Kontur und den gleichen freien Querschnitt wie die Ausnehmungen 4. Karten 2 mit Ausnehmungen 4 und Ringen 3 werden abwechselnd gestapelt, und zwar so, daß Ringe 3 und Ausnehmungen 4 einen geradlinig verlaufenden rohrförmigen Kanal 5 bilden. Quer zur Richtung der rohrförmigen Kanäle 5 und parallel zur Kartenebene bilden sich schlitzförmige Kanäle 6 aus. Die Höhe der Kanäle 6 kann durch Übereinanderschichten mehrerer Ringe 3 beliebig variiert werden. Die Perforation 7 am Kartenrand kann der Aufnahme von Stapelhilfen, Montagehilfen 8, Leitelementen usw. dienen.The heat exchanger module 1 consists of ceramic cards 2 and ceramic rings 3. The cards have recesses 4 and the rings 3 expediently have the same inner contour and the same free cross-section as the recesses 4. Cards 2 with recesses 4 and rings 3 are stacked alternately , in such a way that rings 3 and recesses 4 form a rectilinear tubular channel 5. Slit-shaped channels 6 are formed transverse to the direction of the tubular channels 5 and parallel to the card plane. The height of the channels 6 can be varied as desired by stacking several rings 3 on top of one another. The perforation 7 on the edge of the card can be used to hold stacking aids, assembly aids 8, guide elements, etc.

Bei dem Wäremtauschersystem gemäß Figuren 3 und 4 sind Wärmetauschermodule 1 zu Säulen 9 zusammengestellt, die parallel zueinander in einem Gehäuse 12 angeordnet sind. Die einzelnen Säulen 9 sind zueinander und in Bezug auf das Gehäuse 12 durch Montagehilfen 8, die auch als Leitelemente ausgebildet sein können, lagemäßig fixiert. Zwischen den Wärmetauschermodulen 1 einer Säule 9 sind Abdichtungen 11 angeordnet, um zu verhindern, daß sich die Wärmetauschermedien vermischen. Gegenüber dem Gehäuse 13 sind die Enden einzelner Säulen 9 ebenfalls durch Dichtungen 11 abgedichtet. Um temperaturbedingte Längenausdehnungen der Säulen 9 aufzufangen, sind die Säulen 9 aus Lagerelementen 17,17ʹ angeordnet, die gegenüber den Säulen 9 mittels Dichtungen 11 und gegenüber dem Gehäuse 12 mittels Dichtungen 11ʹ, 13 und 14 abgedichtet sind. Während sich das Lagerelement 17ʹ direkt über Dichtungen 11ʹ am Gehäuse 12 abstützt, stützt sich das Lagerelement 17 über Federn 10 am Gehäuse 12 ab. 15 deutet die Strömungsrichtung des kalten Mediums und 16 die Strömungsrichtung des heißen Mediums an.In the heat exchanger system according to FIGS. 3 and 4, heat exchanger modules 1 are assembled into columns 9, which are arranged parallel to one another in a housing 12. The individual columns 9 are fixed in relation to one another and with respect to the housing 12 by mounting aids 8, which can also be designed as guide elements. Seals 11 are arranged between the heat exchanger modules 1 of a column 9 in order to prevent the heat exchanger media from mixing. The ends of individual columns 9 are also sealed off from the housing 13 by seals 11. In order to absorb temperature-related linear expansion of the columns 9, the columns 9 are arranged from bearing elements 17, 17,1, which are sealed off from the columns 9 by means of seals 11 and from the housing 12 by means of seals 11ʹ, 13 and 14. While the bearing element 17ʹ is supported directly on the housing 12 via seals 11ʹ, the bearing element 17 is supported on the housing 12 via springs 10. 15 indicates the flow direction of the cold medium and 16 the flow direction of the hot medium.

Claims (1)

Wärmetauschermodul aus gebranntem keramischen Material, hergestellt aus einem Stapel gestanzter und laminierter, grüner keramischer Karten, dadurch gekennzeichnet, daß der Stapel aus mindestens zwei Karten (2) besteht, die Karten Ausnehmungen (4) aufweisen, die bei gestapelten Karten (2) rohrförmige Kanäle (5) bilden und zwischen den Karten die rohrförmigen Kanäle (5) umgebende Ringe (3) angeordnet sind.Heat exchanger module made of fired ceramic material, made from a stack of punched and laminated, green ceramic cards, characterized in that the stack consists of at least two cards (2), the cards have recesses (4) which, in the case of stacked cards (2), have tubular channels (5) form and between the cards the tubular channels (5) surrounding rings (3) are arranged.
EP87118638A 1986-12-20 1987-12-16 Heat exchange module made of burned ceramic material Expired - Lifetime EP0274695B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AT87118638T ATE58231T1 (en) 1986-12-20 1987-12-16 HEAT EXCHANGER MODULE MADE OF FIRED CERAMIC MATERIAL.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3643749 1986-12-20
DE19863643749 DE3643749A1 (en) 1986-12-20 1986-12-20 HEAT EXCHANGER MODULE FROM BURNED CERAMIC MATERIAL

Publications (2)

Publication Number Publication Date
EP0274695A1 true EP0274695A1 (en) 1988-07-20
EP0274695B1 EP0274695B1 (en) 1990-11-07

Family

ID=6316767

Family Applications (1)

Application Number Title Priority Date Filing Date
EP87118638A Expired - Lifetime EP0274695B1 (en) 1986-12-20 1987-12-16 Heat exchange module made of burned ceramic material

Country Status (11)

Country Link
EP (1) EP0274695B1 (en)
JP (1) JP2553115B2 (en)
AT (1) ATE58231T1 (en)
CA (1) CA1305698C (en)
DE (2) DE3643749A1 (en)
DK (1) DK162410C (en)
ES (1) ES2019087B3 (en)
FI (1) FI84662C (en)
GR (1) GR3001353T3 (en)
IE (1) IE61481B1 (en)
NO (1) NO166813C (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0467217A1 (en) * 1990-07-17 1992-01-22 Hoechst Aktiengesellschaft Card for building up a permeable structure
EP0597398A1 (en) * 1992-11-12 1994-05-18 Hoechst CeramTec Aktiengesellschaft Permeable structure
WO1998055814A1 (en) * 1997-06-03 1998-12-10 Siamant Ceramic Systems Gmbh & Co. Kg Heat exchanger made from a mixture of silicon carbide and molybedenum disilicide
WO1999004213A1 (en) * 1997-07-16 1999-01-28 Deutsches Zentrum für Luft- und Raumfahrt e.V. Heat exchanger
CN107429977A (en) * 2015-02-18 2017-12-01 达纳加拿大公司 For heating and/or the flexible construction of the heat exchanger of cooling liquid

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3924411A1 (en) * 1989-07-24 1991-01-31 Hoechst Ceram Tec Ag RIB TUBE HEAT EXCHANGER
JP6363485B2 (en) * 2014-12-03 2018-07-25 京セラ株式会社 Ceramic channel body and heat exchanger provided with the same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1557695A (en) * 1966-10-17 1969-02-21
FR2152729A1 (en) * 1971-09-08 1973-04-27 Ostbo Karl
EP0043113A2 (en) * 1980-06-26 1982-01-06 GTE Products Corporation Ceramic heat recuperative apparatus
DE3136253A1 (en) * 1981-09-12 1983-03-31 Rosenthal Technik Ag, 8672 Selb METHOD AND DEVICE FOR PRODUCING HEAT EXCHANGERS FROM CERAMIC FILMS

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1557695A (en) * 1966-10-17 1969-02-21
FR2152729A1 (en) * 1971-09-08 1973-04-27 Ostbo Karl
EP0043113A2 (en) * 1980-06-26 1982-01-06 GTE Products Corporation Ceramic heat recuperative apparatus
DE3136253A1 (en) * 1981-09-12 1983-03-31 Rosenthal Technik Ag, 8672 Selb METHOD AND DEVICE FOR PRODUCING HEAT EXCHANGERS FROM CERAMIC FILMS

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0467217A1 (en) * 1990-07-17 1992-01-22 Hoechst Aktiengesellschaft Card for building up a permeable structure
US5212004A (en) * 1990-07-17 1993-05-18 Hoechst Aktiengesellschaft Ceramic board utilized for the construction of heat exchanger plates
EP0597398A1 (en) * 1992-11-12 1994-05-18 Hoechst CeramTec Aktiengesellschaft Permeable structure
US5657818A (en) * 1992-11-12 1997-08-19 Hoechst Ceramtec Aktiengesellschaft Permeable structure
WO1998055814A1 (en) * 1997-06-03 1998-12-10 Siamant Ceramic Systems Gmbh & Co. Kg Heat exchanger made from a mixture of silicon carbide and molybedenum disilicide
WO1999004213A1 (en) * 1997-07-16 1999-01-28 Deutsches Zentrum für Luft- und Raumfahrt e.V. Heat exchanger
CN107429977A (en) * 2015-02-18 2017-12-01 达纳加拿大公司 For heating and/or the flexible construction of the heat exchanger of cooling liquid
CN107429977B (en) * 2015-02-18 2019-08-16 达纳加拿大公司 Stacking platelet heat exchangers with top manifolds and bottom manifold
US10429132B2 (en) 2015-02-18 2019-10-01 Dana Canada Corporation Stacked plate heat exchanger with top and bottom manifolds

Also Published As

Publication number Publication date
FI84662B (en) 1991-09-13
ATE58231T1 (en) 1990-11-15
DK670887A (en) 1988-06-21
IE873454L (en) 1988-06-20
NO166813B (en) 1991-05-27
NO875329L (en) 1988-06-21
ES2019087B3 (en) 1991-06-01
JPS63163790A (en) 1988-07-07
DE3643749A1 (en) 1988-06-30
FI875569A (en) 1988-06-21
JP2553115B2 (en) 1996-11-13
FI84662C (en) 1991-12-27
EP0274695B1 (en) 1990-11-07
NO166813C (en) 1991-09-04
DK162410B (en) 1991-10-21
DE3766093D1 (en) 1990-12-13
DK670887D0 (en) 1987-12-18
FI875569A0 (en) 1987-12-17
IE61481B1 (en) 1994-11-02
CA1305698C (en) 1992-07-28
NO875329D0 (en) 1987-12-18
DK162410C (en) 1992-03-16
GR3001353T3 (en) 1992-09-11

Similar Documents

Publication Publication Date Title
EP0274694B1 (en) Heat exchange module made of burned ceramic material
DE3107010C2 (en) Metal cooler for cooling a fluid flowing through under high pressure with air
EP2322891A2 (en) Heat exchanger grid
DE3329325A1 (en) Heat sink for liquid cooling of at least one electrical power element
DE2937342A1 (en) CERAMIC HEAT EXCHANGER AND METHOD FOR THE PRODUCTION THEREOF
DE3046930A1 (en) &#34;HEAT EXCHANGER&#34;
EP0597398B1 (en) Permeable structure
DE2706253C2 (en)
DE3239004A1 (en) PACKING NUT IN PLATE ELEMENT FOR PLATE HEAT EXCHANGER
EP0274695B1 (en) Heat exchange module made of burned ceramic material
EP0394718A1 (en) Trickle insert
DE4022654A1 (en) CARD OF CERAMIC MATERIAL FOR BUILDING PERMANENT STRUCTURES
EP0181656A1 (en) Apparatus for separating liquid mixtures by pervaporation
EP1475596A2 (en) Plate heat exchanger with single and dopple wall plates
EP0176680B1 (en) Cross-flow heat exchanger
DE29604521U1 (en) Heat exchanger body made of plates
DE2549053A1 (en) HEAT EXCHANGER WITH PLATE-SHAPED HEAT EXCHANGER MATRIX FOR HEAT TRANSFER BETWEEN THREE MEDIA
DE3011011A1 (en) Plate heat exchange for air separation - having channels through plate for one medium and rectangular grooves on surface which form channels when placed with other plates
EP0236859A2 (en) Heat exchanger for combustion engines
EP3653951B1 (en) Arrangement with a refrigeration circuit and a plate heat exchanger and method for operating an assembly with a plate heat exchanger
DE10056229B4 (en) Heat exchanger for indirect heat exchange
DE3008079A1 (en) Heat exchanger for hot and/or corrosive media - using ceramic tubes located in ceramic chamber, esp. to reclaim heat from corrosive waste gas
DE2245849A1 (en) HEAT EXCHANGER
EP1447623B1 (en) Method of producing heat storage elements
DE102022103720A1 (en) Heat exchanger with optimized pressure loss

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE CH DE ES FR GB GR IT LI LU NL SE

17P Request for examination filed

Effective date: 19881001

17Q First examination report despatched

Effective date: 19890629

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AT BE CH DE ES FR GB GR IT LI LU NL SE

REF Corresponds to:

Ref document number: 58231

Country of ref document: AT

Date of ref document: 19901115

Kind code of ref document: T

REF Corresponds to:

Ref document number: 3766093

Country of ref document: DE

Date of ref document: 19901213

ITF It: translation for a ep patent filed

Owner name: ING. C. GREGORJ S.P.A.

ET Fr: translation filed
GBT Gb: translation of ep patent filed (gb section 77(6)(a)/1977)
PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed
ITTA It: last paid annual fee
REG Reference to a national code

Ref country code: GR

Ref legal event code: FG4A

Free format text: 3001353

EPTA Lu: last paid annual fee
EAL Se: european patent in force in sweden

Ref document number: 87118638.3

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 19971124

Year of fee payment: 11

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: NL

Payment date: 19971130

Year of fee payment: 11

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 19971204

Year of fee payment: 11

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: ES

Payment date: 19971209

Year of fee payment: 11

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: AT

Payment date: 19971210

Year of fee payment: 11

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: SE

Payment date: 19971211

Year of fee payment: 11

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: CH

Payment date: 19971217

Year of fee payment: 11

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GR

Payment date: 19971219

Year of fee payment: 11

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: LU

Payment date: 19971224

Year of fee payment: 11

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: BE

Payment date: 19971230

Year of fee payment: 11

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 19980429

Year of fee payment: 11

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 19981216

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 19981216

Ref country code: AT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 19981216

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 19981217

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 19981231

Ref country code: GR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 19981231

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 19981231

Ref country code: BE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 19981231

BERE Be: lapsed

Owner name: HOECHST A.G.

Effective date: 19981231

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: NL

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 19990701

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 19981216

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 19990831

NLV4 Nl: lapsed or anulled due to non-payment of the annual fee

Effective date: 19990701

REG Reference to a national code

Ref country code: FR

Ref legal event code: ST

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 19991001

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: ES

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 19991217

REG Reference to a national code

Ref country code: ES

Ref legal event code: FD2A

Effective date: 20000114

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES;WARNING: LAPSES OF ITALIAN PATENTS WITH EFFECTIVE DATE BEFORE 2007 MAY HAVE OCCURRED AT ANY TIME BEFORE 2007. THE CORRECT EFFECTIVE DATE MAY BE DIFFERENT FROM THE ONE RECORDED.

Effective date: 20051216