Classifications

• • C—CHEMISTRY; METALLURGY
  • C07—ORGANIC CHEMISTRY
  • C07D—HETEROCYCLIC COMPOUNDS
  • C07D303/00—Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
  • C07D303/02—Compounds containing oxirane rings
  • C07D303/36—Compounds containing oxirane rings with hydrocarbon radicals, substituted by nitrogen atoms
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
  • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
  • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
  • C08G59/32—Epoxy compounds containing three or more epoxy groups
  • C08G59/3227—Compounds containing acyclic nitrogen atoms
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
  • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
  • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
  • C08G59/50—Amines

Definitions

• This invention relates to bis (4,4' aminophenoxy)-2,2-diphenylalkyl tetraglycidates, to epoxy resin systems made from the tetraglycidates, to prepregs made using the epoxy resin systems, and to articles of manufacture which incorporate the epoxy resins or the prepregs.
• Polyglycidates (also referred to herein as epoxy compounds) generally constitute a class of compounds having at least two glycidyl groups, the reactive moiety in each glycidyl group being the epoxy group.
• epoxy resin systems including N,N,N',N'- tetraglycidyl-4,4'-methylene dianiline, having the structure This material is made by reacting an excess of epichlorohydrin with methylene dianiline. It is available commercially as MY-7200 from Ciba Geigy Corp., Ardsley, N.Y. and consists of about 70% by weight of the above tetraglycidate, the remainder being oligomers and triglycidates.
• Another commonly used epoxy compound is made by reacting bisphenol A with epichlorohydrin.
• Commercially available resins made from this reaction contain the structure and include DER 331 from Dow Chemical and EPONO 828 (registered trademark) from Shell.
• Epoxy groups are reactive to amine and hydroxyl functionalities and can thus be copolymerized (i.e. cured) with compounds containing such functionalities to make epoxy resin systems.
• polyamines are favored as curing agents although polyhydroxy curing agents are also well known.
• the epoxy compounds can be reacted with one or more curing agents such that they are crosslinked, thereby finding use as structural adhesives or as encapsulating materials for electronic components.
• Epoxy resin systems are often used in prepregs, ready-to-mold comprising fibrous reinforcement inpregnated with uncured or partially cured epoxy resin systems.
• Prepregs can be assembled into a final part (such as an airplane wing) and fully cured (C-staged) to form a finished product.
• Such prepregs find wide use in the aircraft and aerospace industries.
• the present invention provides, in one aspect, tetraglycidates of the formula wherein R' and ? are independently hydrogen, alkyl of 1 to 8, preferably 1 to 4, carbon atoms, or perfluoroalkyl. taken together may also form a cycloalkylidene ring of from 5 to 7 carbon atoms such as cyclopentylidene, cyclohexylidene, and cycloheptylidene.
• R' and R 2 are most preferably methyl groups or trifluoromethyl groups.
• the invention provides epoxy resin systems comprising a tetraglycidate having the above formula (I) copolymerized with a polyamine curing agent (also referred to herein as a hardener).
• a polyamine curing agent also referred to herein as a hardener.
• the polyamine hardener may, for example, by any of the well known aliphatic polyamines such as diethylene triamine, triethylene tetraamine, or tetraethylene pentaamine.
• Additional hardeners are those containing benzenoid unsaturation such as m-and p-phenylenediamine, 1,6-diaminonaphthalene, 4,4'-diaminodiphenylmethane (also known as 4,4'-methylene dianiline), 4,4'-diaminodiphenyl ether, sulfanilamide, 3-methyl-4-aminobenzamide, and 4,4'-diaminodiphenyl sulfone (DDS), 4,4'-diaminodiphenyl, ring-alkylated derivatives of m-phenylene diamine such as ETHACURE@ 100 from Ethyl Corp., Baton Rouge, LA, and the like.
• benzenoid unsaturation such as m-and p-phenylenediamine, 1,6-diaminonaphthalene, 4,4'-diaminodiphenylmethane (also known as 4,4'-m
• polyamine curing agents are those disclosed in U.S. -A-4,521,583, which have the formula wherein a is 2 or 3, R 3 is hydrogen, alkyl of 1 to 8 carbon atoms or aryl of 6 to 18 carbon atoms, and X is a divalent or trivalent organic hydrocarbon, hetero-interrupted hydrocarbon, or substituted hydrocarbon radical or - N -.
• These hardening agents may be prepared from corresponding starting materials, e.g. nitro compounds, by reduction, for example, according to methods described in GB-A-1,182,377.
• Particularly comtemplated are those compounds (II) wherein R 3 is hydrogen or C,-C 3 alkyl and X is a divalent or trivalent radical selected from
• Preferred curing agents are (i) DDS, (ii) those diamines having the formula wherein each of the two amino groups is meta or para to the carbonyl group bonded to the same ring and wherein Y is -(CH 2 ) q - wherein q is an integer from 2 to 12, preferably 2 to 6, and most preferably 3; wherein t is an integer of from 0 to 5; and
• the polyamine curing agent and epoxy compound are mixed essentially in an amount which provides 0.3 to 2.0, preferably 0.4 to 1.7, and most preferably 0.45 to 1.3 moles of amine hydrogen for each mole of epoxy groups.
• the epoxy resin system comprising the curing agent and epoxy compound may be cured by heating between 93-205°C (200-400°F) for time periods ranging between 0.5 and 12 hours.
• this invention provides prepregs comprising the epoxy resins described herein.
• Prepregs contain structural fibers.
• the structural fibers which are useful in this invention include carbon, graphite, glass, silicon carbide, poly(benzothiazole), poly(benzimidazole), poly)benzoxazole), alumina, titania, boron, and aromatic polyamide fibers. These fibers are characterized by a tensile strength of greater than 69 N/cm 2 (100,000 psi), a tensile modulus of greater than 1.380 kN/cm 2 ( 2 mio psi), and a decomposition temperature of greater than 200°C.
• the fibers may be used in the form of continuous tows (500 to 400,000 filaments each), woven cloth, whiskers, chopped fiber or random mat.
• the preferred fibers are carbon and graphite fibers, aromatic polyamide fibers, such as Kevlare 49 fiber (obtained from E.I. duPont de Nemours, Inc., Wilmington, DE), and silicon carbide fibers.
• the epoxy resin in this invention is prepared by standard methods, such as that described in U.S. -A-2,951,822 and also in an article by W.T. Hodges et al., SAMPE Quarterly, October 1985, pages 21-25.
• the method entails reacting an aromatic diamine with a 4 to 20 molar excess of epichlorohydrin at elevated temperature, generally 50 to 100°C. This is followed by dehydrochlorination of the intermediate chlorohydrin amine with aqueous base. The product is then isolated by diluting with a water immiscible solvent, washing with water, drying with a suitable desicant, and concentrating to obtain a resinous product.
• the epoxide thus obtained generally is found by titration to contain 70 to 90% of the theoretical amount of epoxy groups. This is due to formation of oligomeric residues and/or incomplete reaction of the monomeric diamine with epichlorohydrin.
• Epoxy resin systems are prepared by heating and stirring the epoxy resin to 60 to 120°C and adding the hardener. If the hardener is a solid, it is preferably added as a fine powder. An inert diluent such as N,N-dimethyl formamide or N-methylpyrrolidone may be used if desired. Reaction of the epoxy and hardener occur as the mixture is heated. For prepreg, the mixture is B-staged or partially reacted (i.e. typically 3 to 15 percent of the epoxy groups are reacted) in order to obtain a resin system with the required physical properties (i.e. viscosity and tack).
• An inert diluent such as N,N-dimethyl formamide or N-methylpyrrolidone may be used if desired. Reaction of the epoxy and hardener occur as the mixture is heated. For prepreg, the mixture is B-staged or partially reacted (i.e. typically 3 to 15 percent of the epoxy groups are reacted) in order
• Prepregs according to the present invention can be made by embedding filaments or fibers into, or by coating woven or non-woven webs, rovings, tows, or the like, with a curable epoxy resin resin matrix which is ultimately manipulated and cured to a solid composite.
• a curable epoxy resin resin matrix which is ultimately manipulated and cured to a solid composite.
• Particular selection of the filament, fiber, or textile material, epoxy compound, and curing agent can give a range of curable composites which can be tailored to suit a given need or application.
• the B-staged epoxy resin system may conveniently first be applied to long sheets of differential release paper, i.e. paper to which a release agent such as any of several of the silicone formulations well known in the art, has been applied.
• a prepreg machine resin coated on the release paper is tranferred to a web of fiber. This is done by sandwiching the web between plies of coated release paper and passing the material through a set of heated rollers. The resulting prepreg is then cooled and taken up on a spool.
• the total amount of resin applied to the fiber reinfocement is preferably between about 20 and about 50 wt. percent of resin solids based on the weight of the uncured composite.
• the prepreg may at this point be cooled to -18°C (0 OF) or less by exposure to any convenient cryogenic material (such as dry ice) for shipping or storage.
• the prepreg can then be used to make structural parts such as airplane wings or fuselage components.
• the prepreg may also be used to make other useful articles such as golf shafts, tennis rackets, musical instruments, satellite components, and rocket motors.
• the prepreg may be cut into strips and then laid up (e.g. on a mold surface) to create the desired shape.
• the shaped, layered composite is then fully cured at pressures between atmospheric to 34.5 bar (500 psi) and temperatures between 100°C to 300°C in an oven, autoclave, or heated pressure mold.
• a modifying thermoplastic polymer, polymer blend, or elastomer may be used to adjust the viscosity of the resin and to desirably enhance processability and mechanical properties, particularly toughness and damage tolerance.
• the classes of resins which are broadly useful includes poly(aryl ether) resins as disclosed, for example, in U.S.
• thermoplastic poly(aryl ether sulfones) available commercially under the registered trademark UDELO from Union Carbide Corporation
• polyetherimides available, for example, under the registered trademark ULTEMO from General Electric
• phenoxy resins of the type commercially available under the registered trademark UCARS from Union Carbide Corporation
• polyurethanes butadiene/styrene/acrylonitrile terpolymers
• nylons butadiene/acrylonitrile liquid rubbers
• HYCARO CTBN from B.F. Goodrich and the like.
• thermoplastic resin employed will generally fall in a range of about 1 to about 30 wt.% based on the weight of the epoxy resin system, although amounts above or below this range may be desired in certain applications.
• Preferred thermoplastic resins include poly(aryl ether sulfones), polyetherimides, phenoxy resins, and butadiene/acrylonitrile liquid rubbers.
• the thermoplastic resin is generally added to the epoxy compound and mixed therewith prior to addition of the polyamine curing agent.
• the modifier will often be miscible with the epoxy compound, although it will also often be occluded as a dispersion within the final cured epoxy resin once the resin is thermoset.
• Co-epoxides may also be used in the epoxy resin system.
• the co-epoxy compounds (or resins), when employed, may be present in an amount up to about 40 wt.%, preferably up to about 30 wt.%, based on the amount of (cured or uncured) tetraglycidate used.
• Co-epoxy compounds which may be used herein contain two or more epoxy groups having the following formula:
• the epoxy groups can be terminal epoxy groups or internal epoxy groups.
• the epoxides are of two general types: polyglycidyl compounds or products derived from epoxidation of dienes or polyenes.
• Polyglycidyl compounds contain a plurality of 1,2-epoxide groups derived from the reaction of a polyfunctional active hydrogen containing compound with an excess of an epihalohydrin under basic conditions.
• the active hydrogen compound is a polyhydric alcohol or phenol
• the resulting epoxide composition contains glycidyl ether groups.
• a preferred group of polyglycidyl compounds are made via condensation reactions with 2,2- bis(4-hydroxyphenyl) propane, also known as bisphenol A, and have structures such as III, where n has a value from 0 to 15.
• bisphenol A 2,2- bis(4-hydroxyphenyl) propane
• n has a value from 0 to 15.
• epoxides are bisphenol-A epoxy resins. They are available commercially under the trade names such as "Epon 828,” “Epon 1001", and “Epon 1009” from Shell Chemical Co. and as "DER 331”, “DER 332", and "DER 334" from Dow Chemical Co.
• the most preferred bisphenol A epoxy resins have an "n" value between 0 and 10.
• Polyepoxides which are polyglycidyl ethers of 4,4'-dihydroxydiphenyl methane, 4,4'-dihydroxydiphenyl sulfone, 4,4'-biphenol, 4,4'-dihydroxydiphenyl sulfide, phenolphthalein, resorcinol, 4,2'-biphenol, or tris(4-hydroxyphenyl) methane , are useful in this invention.
• EPON 1031 a tetraglycidyl derivative of 1,1,2,2-tetrakis(hydroxyphenyl)ethane from Shell Chemical Company
• Apogen 101 a methylolated bisphenol A resin from Schaefer Chemical Co.
• Halogenated polyglycidyl compounds such as D.E.R. 542 (a brominated bisphenol A epoxy resin from Dow Chemical Company) are also useful.
• suitable epoxy resins include polyepoxides prepared from polyols such as pentaerythritol, glycerol, butanediol or trimethylolpropane and an epihalohydrin.
• the former are commercially available as D.E.N. 431, D.E.N. 438, and D.E.N 485 from Dow Chemical Company.
• the latter are available as, for example, ECN 1235, ECN 1273, and ECN 1299 (obtained from Ciba-Geigy Corporation, Ardsley, NY).
• Epoxidized novolaks made from bisphenol A and formaldehyde such as SU-8 obtained from Celanese Polymer Specialties Company, Louisville, KY) are also suitable.
• polyfunctional active hydrogen compounds besides phenols and alcohols may be used to prepare the polyglycidyl adducts useful in this invention. They include amines, aminoalcohols and polycarboxylic acids.
• Adducts derived from amines include N,N-diglycidyl aniline, N,N-diglycidyl toluidine, N,N,N',N'- tetraglycidylxylylene diamine, (i.e., VI) N,N,N',N'-tetraglycidyl-bis (methylamino) cyclohexane (i.e. VII) , N,N,N',N'-tetraglycidyl-4,4'-methylene dianiline, (i.e.
• N,N,N',N'-tetraglycidyl-3,3'-diaminodiphenyl sulfone, and N,N'-dimethyl-N,N'-diglycidyl-4,4'-diaminodiphenyl methane Commercially available resins of this type include Glyamine 135 and Glyamine 125 (obtained from F.I.C. Corporation, San Fransisco, CA.), Araldite MY-720 (obtained from Ciba Geigy Corporation) and PGA-X and PGA-C (obtained from The Sherwin-Williams Co., Chicago, Illinois).
• Suitable polyglycidyl adducts derived from aminoalcohols include O,N,N-triglycidyl-4 aminophenol, available as Aratdite® 0500 or Araldite® 0510 (obtained from Ciba Geigy Corporation) and O,N,N-triglycidyl-3-aminophenol (available as Glyamine® 115 from F.I.C. Corporation).
• glycidyl esters of carboxylic acids include, for example, diglycidyl phthalate, diglycidyl terephthalate, diglycidyl isophthalate, and diglycidyl adipate.
• polyepoxides such as triglycidyl cyanurates and isocyanurates, N,N-diglycidyl oxamides, N,N'-diglycidyl derivatives of hydantoins such as "XB 2793" (obtained from Ciba Geigy Corporation), diglycidyl esters of cycloaliphatic dicarboxylic acids, and polyglycidyl thioethers of polythiols.
• polyepoxides such as triglycidyl cyanurates and isocyanurates, N,N-diglycidyl oxamides, N,N'-diglycidyl derivatives of hydantoins such as "XB 2793" (obtained from Ciba Geigy Corporation), diglycidyl esters of cycloaliphatic dicarboxylic acids, and polyglycidyl thioethers of polythiols.
• epoxy-containing materials are copolymers of acrylic acid esters of glycidol such as glycidyl acrylate and glycidyl methacrylate with one or more copolymerizable vinyl compounds.
• examples of such copolymers are 1:1 styrene-glycidyl methacrylate, 1:1 methyl methacrylate-glycidyl acrylate and 62.5:24:13.5 methyl methacrylate:ethyl acrylate:glycidyl methacrylate.
• Silicone resins containing epoxy functionality e.g., 2,4,6,8,10-pentakis [3-(2,3-epoxypropoxy)propyl]-2,4,8,8,10-pentamethylcyclopentasiloxane and the diglycidyl ether of 1,3-bis-(3-hydroxypropyl)-tetramethyldisiloxane) are also useable.
• epoxy functionality e.g., 2,4,6,8,10-pentakis [3-(2,3-epoxypropoxy)propyl]-2,4,8,8,10-pentamethylcyclopentasiloxane and the diglycidyl ether of 1,3-bis-(3-hydroxypropyl)-tetramethyldisiloxane
• the second group of epoxy resins is prepared by epoxidation of dienes or polyenes.
• Resins of this type include bis(2,3-epoxycyciopentyl) ether, IX, copolymers of IX with ethylene glycol which are described in U.S. - A - 3,398,102, 5(6)-glycidyl-2-(12-epoxyethyl)bicyclo[2.2.1]heptane, X, and dicyclopentadiene diepoxide.
• epoxides include vinycyclohexene dioxide, e.g., "ERL-4206® (obtained from Union Carbide Corp.), 3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexane carboxylate, e.g., "ERL-4221” (obtained from Union Carbide Corp.), 3,4-epoxy-6-methylcyclohexylmethyl 3,4-epoxy-6-methylcyclohexane carboxylate, e.g., "ERL-4201 (obtained from Union Carbide Corp.), bis(3,4-epoxy-6-methylcyclohexylmethyl) adipate, e.g., "ERL-4289” (obtained from Union Carbide Corp.), dipentene dioxide, e.g., "ERL-4269” (obtained from Union Carbide Corp.) 2-(3,4-epoxycyclohexyl-5,5-
• Suitable cycloaliphatic epoxides include those described in U.S. - A - 2,750,395; 2,890,194; and 3,318,822 and the following:
• Suitable epoxides include: where n is 1 to 4, m is (5-n), and R is H, halogen, or C, to C ⁇ alkyl.
• Reactive diluents containing one epoxide group such as t-butylphenyl glycidyl ether, may also be used.
• the reactive diluent may comprise up to 25 percent by weight of the epoxide component.
• the preferred co-epoxy resins are bisphenol A epoxy resins of formula III where n is between 0 and 5, epoxidized novolak resins of formula IV and V where n is between 0 and 3, N,N,N',N'-tetraglycidyl xylylene diamine, and diglycidyl pthalate.
• the epoxy resin system may additionally contain an accelerator to increase the rate of cure.
• Accelerators which may be used herein include Lewis acid:amine complexes such as BF3.monoethylamine, BF3.piperdine, BF,.2-methylimidazole; amines, such as imidazole and its derivatives such as 4-ethyl-2-methylimidazole, 1-methylimidazole, 2-methylimidazole; N,N-dimethylbenzylamine; acid salts of tertiary amines, such as the p-toluene sulfonic acid:imidazole complex, salts of trifluoro methane sulfonic acid, such as FC-520 (obtained from 3M.
• the amount of cure accelerator may be from 0.02 to 10 percent of the weight of the epoxy resin system (i.e., epoxy plus hardener).
• the epoxy resin systems may also contain particulate fillers such as talc, mica, calcium carbonate, aluminum trihydrate, glass microballoons, phenolic thermospheres, pigments, dyes, and carbon black. In prepregs, up to half of the weight of structural fiber in the composition may be replaced by filler. Thixotropic agents such as fumed silica may also be used.
• the proportion of epoxy resins can be 95 to 30 percent by weight, preferably 80 to 35 wt. percent, and the proportion of hardener can be from 5 to 70 wt. percent, preferably 15 to 60 wt. percent.
• the percent by weight of the epoxy resin system can be from 20 to 80 percent by weight, based on the weight of the prepreg or composite, preferably 25 to 60 wt. percent.
• the structural fiber comprises 80 to 20 wt. percent, preferably 75 to 40 wt. percent of the total composition.
• This example describes the synthesis of 4,4'-bis (4,4'-aminophenoxy)-2,2-diphenylpropane tetraglycidate (BAPPTG) from 4,4'-bis(4,4'-aminophenoxy)-2,2-diphenylpropane (BAPP) and epichlorohydrin.
• BAPP epichlorohydrin (800 ml) ethanol (350 ml), and 50 ml of water were placed into a 2L three-neck round-bottom flask that was equipped with a mechanical stirrer, addition funnel, and a thermometer that was connected to a Therm-o-watch temperature controller.
• the mixture was placed under a blanket of nitrogen and heated to reflux with gentle stirring.
• the reaction mixture was a slurry initially but quickly became homogeneous as the reflux temperature was approached. After the mixture had refluxed for 4 hours, the temperature was lowered to 60°C and 300 g of 50% aqueous sodium hydroxide were added at such a rate that the temperature was maintained at 60°C.
• This example describes the preparation of unreinforced castings of BAPPTG and a polyamine curing agent have the formula and herein designated by the acronym DADE.
• Glass transition temperatures were determined on a DuPont 982 thermal analyzer as the maximum of the loss modulus peak of a DMA scan. Water sensitivity was determined by soaking a 51x51x3.2 mm -2.0" x 0.5" x 1/8" coupon in water for 2 weeks at 71.1 °C. (160°F). The percent weight gain of the coupon was determined after soak.
• This example is comparative and describes the preparation of unreinforced castings from an epoxy resin having the trade designation MY-720 and having as its major constituent a compound of the formula
• Table I lists physical data for the castings of Example 2 and Control A.
• thermosetting composition of BAPPTG, 4,4-diaminodiphenylsulfone (DDS), and a reactive diluent.
• thermoset resin was prepared as in Example 3 with 40 g of Glycel A 100, 48 g DDS, and 160 g of MY-720. This resin has the same NH/epoxide stoichiometry and weight ratio of epoxies as that of Example 3. An unreinforced casting prepared as in Control A was too brittle to test.
• This example describes the preparation of unreinforced castings of BAPPTG, MY-720, and 4,4-diaminodiphenylsulfone.
• This example is comparative and describes the preparation of an unreinforced casting of only M-720 and DDS.
• a resin system containing 130 g of MY-720 and 35g DDS was prepared and cured as in Example 4.
• Table III lists the physical data for Example 4 and Control C.
• This example describes the preparation of unidirectional epoxy-graphite prepreg.
• 3.05 m (12 inch) wide unidirectional prepreg tape was made by forming a ribbon of 78 tows of carbon fiber and contacting it between 2 plies of epoxy-coated release paper in a prepreg machine. In the prepreg machine, the sandwich of fiber and coated release paper passed over a series of heated rollers to melt the resin into the fibers. The finished tape contained about 64 percent by weight of fiber. Its thickness was about 0.007 inches.
• the fiber was a polyacrylonitrile-based fiber with a tensile strength of 379 x 5 kN/cm 2 - (5.5 x 10 5 psi) and a tensile modulus of 2484 kN/ CM 2 (35 x 10 6 psi).
• This example is comparative and describes the preparation of unidirectional epoxy/graphite prepreg.
• thermosetting composition like that of Control A was prepared by blending 1227 g of MY-720 and 773g of DADE. The resin was advanced by heating for 100 minutes at 100°C. After the mixture cooled to 70°C, it was coated on 343 mm (13.5 inch) wide release paper (type 2-60-SF-157 and 168A, obtained from Daubert Coated Products Dixon, IL) at a coating weight of 104 g/m 2.
• Twelve-inch wide unidirectional prepreg tape was made by forming a ribbon of 78 tows of carbon fiber and contacting it between 2 plies of epoxy-coated release paper in a prepreg machine. In the prepreg machine, the sandwich of fiber and coated release paper passed over a series of heated rollers to melt the resin into the fibers.
• the finished tape contained about 70 percent by weight of fiber. Its thickness was about 0.178 mm (0.007 inches).
• the fiber was a polyacrylonitrile-based fiber with a tensile strength of 379 x 5 kN/cm 2 (5.5 x 10 5 psi) and a tensile modulus of 2484 kN/cm 2 (35 x 10' psi).
• This example describes the cured unidirectional laminates made from the prepreg of Example 5.
• the laminate was cured in an autoclave at 180°C (355°F) for 2 hours.
• Seven plies of prepreg were used to make the specimen.
• Compressive properties were measured using a modified ASTM-D695 procedure.
• Unidirectional graphite/epoxy tabs were added to prevent the sample ends from crushing. A gage length of approximately 4.8 mm (0.188 inches) was used.
• End tabs on compressive samples were adhered using FM-300 film adhesive (obtained from American Cyanamid Company, Havre de Grace, MD), which was cured at 177°C for 1 hour.
• the longitudinal compressive strengths of unidirectional laminates of Example 6 is shown in Table IV.
• This example demonstrates the compressive strength after impact of quasiisotropic laminate fabricated with the composition of this invention, a prepreg prepared as in Example 5, and with a control made with prepreg prepared as in control D.
• the test employed measures the damage tolerance of composites. The latter depends on the choice of 152 x 102 x 5 mm (6 x 4 x approximately 02 inches). The panels were 4 x approximately 0.2 inches. The panels were impacted in the center with a Gardner type Impact Tester (Gardner Laboratories, Bethesda, MD) having a 15.9 mm (5/8 inch) diameter spherical indenter. The impact was normal to the plane of the fibers.

Landscapes

• Chemical & Material Sciences (AREA)
• Organic Chemistry (AREA)
• Health & Medical Sciences (AREA)
• Chemical Kinetics & Catalysis (AREA)
• Medicinal Chemistry (AREA)
• Polymers & Plastics (AREA)
• Epoxy Resins (AREA)
• Epoxy Compounds (AREA)
• Reinforced Plastic Materials (AREA)

Applications Claiming Priority (2)

Publications (2)

Family

ID=25270333

Family Applications (1)

Country Status (5)

Families Citing this family (8)

Citations (1)

Family Cites Families (7)

• 1986
  • 1986-03-03 US US06/835,735 patent/US4721799A/en not_active Expired - Fee Related
• 1987
  • 1987-02-24 CA CA000530513A patent/CA1281730C/en not_active Expired
  • 1987-03-02 DE DE8787102917T patent/DE3760419D1/de not_active Expired
  • 1987-03-02 JP JP62045400A patent/JPS62265277A/ja active Pending
  • 1987-03-02 EP EP87102917A patent/EP0239804B1/de not_active Expired

Patent Citations (1)

Non-Patent Citations (1)

Also Published As

Similar Documents

Legal Events