EP0204099A1 - Process for the manufacture of a droplets-generating device for ink printer units - Google Patents

Abstract

A galvanoplastic comb arrangement, which is produced by means of a single-step method, consists of individual brackets (7) which serve as drive elements for ejecting ink droplets in ink writing devices.

Description

The invention relates to a method for producing a galvanoplastic, comb arrangement consisting of individual brackets (drive elements) for ejecting ink drops in ink printers in individual steps.

The German patent application P 35 00 985.3 is based on an arrangement for generating individual droplets in an ink writing device with an ink space common to a plurality of outlet openings (nozzles) and a number of conductor loops corresponding to the number of outlet openings. The outlet openings are designed as openings in the middle part of each loop. To eject a single droplet, the movable middle parts move against the direction of ejection of an ink droplet.

The invention has for its object to provide a manufacturing method for a principle mentioned in the patent application P 35 00 985.

• a) auf eine Grundplatte aus Glas durch Bedampfen oder Sputtem eine Metalldoppelschicht aufgebracht und aus dieser ein Streifen im späteren Düsenlochbereich strukturiert wird, dann eine weitere Metalldoppel schicht auf der ersten Doppelschicht abgeschieden wird;
• b) fotolithographisches Erzeugen von Positiv-Trockenresist-Strukturen, Belichten der Bereiche unter denen später die beiden Tintenkanäle geschaffen werden sollen, galvanisches Abscheiden des Kammes und seiner Zuleitungen zwischen den Fotoresiststrukturen;
• c) Ablösen der belichteten Fotoresistanteile, Abätzen der freigelegten Basismetallisierung zwischen und unter den Kammelementen;
• d) Ätzen der Tintenkanäle aus dem Glasträger mit Ultraschall;
• e) Entfernen des Fotoresists, Lösen der Bügel in ihrem Mittelteil vom verbliebenen Glassockel zwischen den Tintenkanälen durch selektives Ätzen der Zwischenschicht, Ätzen der Basismetallisierung zwischen der Kammstruktur und unter dem Bügelmittelteil.

This task is solved in the following individual steps:

• a) a metal double layer is applied to a base plate made of glass by vapor deposition or sputtering and a strip is structured from this in the later nozzle hole area, then a further metal double layer is deposited on the first double layer;
• b) photolithographic production of positive dry resist structures, exposure of the areas under which the two ink channels are later to be created, galvanic deposition of the comb and its leads between the photoresist structures;
• c) peeling off the exposed photoresist portions, etching off the exposed base metallization between and under the comb elements;
• d) ultrasonically etching the ink channels from the glass substrate;
• e) removing the photoresist, detaching the temple in its central part from the remaining glass base between the ink channels by selective etching of the intermediate layer, etching the base metallization between the comb structure and under the temple middle part.

The first metal double layer consists, for example, of 0.1 μm titanium and 1.0 μm aluminum, the second metal double layer of 0.1 μm titanium and 0.5 μm copper, the comb and the feed lines from 50 μm nickel. The ink channels are, for example, 200 µm deep.

With the method according to the invention, it is possible to realize in a simple manner in a compact design the arrangement described in patent application P 35 00 985 in such a way that an electrical adjustment of the individual brackets for leveling the vibration behavior becomes superfluous. The comb systems can also be produced in multiple arrangements on a glass support.

Further details of the invention are the subject of the dependent claims.

• Figur 1 ein Zwischenstadium der Herstellung eines Schreibkopfes,
• Figur 2 eine vergrößerte Einzelheit A der Figur 1,
• Figur 3 einen Ausschnitt im Bügelbereich des fertigen Schreibkopfes,
• Figur 4 die Unterseite eines bügelartigen Antriebselementes im Mittelteil und
• figur 5 im Stadium der Figur 1 den Schnitt durch einen Bügel längs der Verbindungsgeraden der Düsenlochmittelpunkte und senkrecht zur Grundplatte.

The invention is explained with reference to the figures. Show it:

• FIG. 1 shows an intermediate stage in the manufacture of a write head,
• FIG. 2 shows an enlarged detail A of FIG. 1,
• FIG. 3 shows a section in the temple area of the finished print head,
• Figure 4 shows the underside of a bracket-like drive element in the middle part and
• Figure 5 in the stage of Figure 1, the section through a bracket along the connecting straight line of the nozzle hole centers and perpendicular to the base plate.

In the figures, 1 denotes a glass support. A metal double layer 2, 3 structured in the form of a strip and a further metal double layer 4, 5 are applied thereon. 6 denotes an electrodeposited metal layer and 7 the bow-like drive elements (conductor loops).

The dash-dotted circle A in FIG. 1 roughly delimits the section of the layer structure shown enlarged in FIG. K denotes ink channels, D nozzle holes in the temples and F photoresist.

In order to improve the adhesion of the stirrups to the glass and to strengthen the cover in the areas not to be etched, a further metal layer 6 can optionally be electrodeposited onto the second metal double layer 4, 5.

In operation, when the lifted-off bracket is pushed back onto the glass base between the two channels K, part of the ink between the base and the bracket is expelled through the nozzle hole D in the bracket. This amount of ink can be increased by creating a cavity on the striking surface of the bracket with the aid of the layers 5, 6. To do this, the procedure described must be expanded as follows:

After the layers 4 and 5 have been deposited, rectangular or oval photoresist structures (for example 10 μm high) are produced in the later nozzle hole area. Galvanic deposition of the metal layer 6 around the photoresist and at the same height. Deposition (vapor deposition, sputtering) of a further layer (not shown) (for example 0.5 μm copper) over the layer 6 and the photoresist (likewise not shown).

This is followed by steps b to d unchanged.

Removal of the photoresist between the bracket arrangement 7 (the resist under the nozzle hole between the layers 5 and the further layer, not shown, is not yet accessible). -Etching the layer, not shown, furthermore the layers 6, 5, 4 between the bracket arrangement. -Remove the resist under the nozzle hole and etch the underlying part of layer 5 through the nozzle hole. -Release the bracket 7 in its middle part from the glass base by selective etching of the intermediate layer 3.-Etching off the layers 2 and 4 between the glass and the middle part of the bracket.

In response to the demand for smooth-walled, funnel-shaped nozzle holes in the frame and frame spacing of less than 30 µm and a frame height of 50 µm, the photoresist structure is tailored as follows: the resist structures developed are tempered in a resist-specific manner so that they flow easily, become wider, their flanks flatten and flatten Smooth their surfaces. The resist structure of the nozzle hole is bell-shaped. The electrodeposited layer also grows laterally over the resist structure.

By removing the layers 4, 5, 6 even under the brackets before the glass etching, the glass can be removed from top to bottom at any point, so that the ink channels have a flat bottom. Only the ultrasound enables the necessary etching exchange through the narrow intermediate spaces between the glasses, the even removal of glass and the removal of the etching products.

When using titanium as the first metal layer on the glass, the inclination of the glass flanks can be varied within a wide range in glass etching by choosing the titanium thickness and / or the concentration of the hydrofluoric glass sets. Decreasing titanium thickness and / or increasing glass etching concentration make the glass flanks steeper. This principle applies regardless of the glass composition and the use of ultrasound in glass etching.

If a unipolar current pulse is to be used to move the stirrups, the stirrup material must be ferromagnetic. In this case, the electrodepositable nickel is particularly suitable. Copper is suitable as a non-ferronagnetic strap material for the manufacturing process described.

The manufacturing method described for comb arrangements is suitable for all embodiments of the movable conductor loops mentioned in German patent application P 35 00 985 (angular, straight, single-row or multi-row nozzle arrangement).

Claims (6)

1. A method for producing a galvanoplastic comb arrangement consisting of individual brackets (drive elements) for ejecting ink drops in ink printers in the following individual steps, characterized in that a) a metal double layer (2, 3) is applied to a base plate (1) made of glass by vapor deposition or sputtering and, after structuring these layers, a further metal double layer (4, 5) is deposited on the first double layer; b) photolithographic production of positive dry resist structures, exposure of the areas under which the ink channels (K) are later to be created, galvanic deposition of the comb and its supply lines (7) between the photoresist structures; c) peeling off the exposed photoresist portions, etching off the exposed base metallization (4 to 6) between the comb elements; d) etching the ink channels (K) from the glass carrier with ultrasound; e) removing the photoresist, detaching the temple - (7) in its middle part from the glass (1) by selective etching of the intermediate layer (3), etching the base metallization (5, 4, 2) between the comb structure and under the temple middle part. 2. The method according to claim 1, characterized in that optionally a further metal layer (6) is electroplated onto the second metal double layer (4, 5). 3. The method according to claim 1, characterized in that after the deposition of the second metal double layer (4, 5) in the subsequent nozzle hole region (D) photoresist structures, for example rectangular or oval, are produced; galvanic deposition of the metal layer (6) around the photoresist and at the same height; Separation (vapor deposition, sputtering) of another Layer over layer (6) and photoresist; Steps b to d according to claim 1; Removing the photoresist between the bracket assembly (7); Etching the additionally deposited layer and the layers (6, 5, 4) between the bracket arrangement; Removing the resist under the nozzle hole and etching the underlying part of the layer - (5) through the nozzle hole; Detaching the bracket (7) in its central part from the glass by selective etching of the intermediate layer (3); Etch off the layers (2 and 4) between the glass and the middle part of the iron. 4. Process according to claims 1 to 3, characterized in that the resist developed is tempered resist-specifically so that it flows, becomes wider, flatten its flanks and smoothes its surface. 5. The method according to claims 1 to 4, characterized in that the layers (4, 5, 6) are also removed before the glass etching under the brackets. 6. The method according to claim 1, characterized in that the first layer of the second metal double layer (4) is titanium and the inclination of the glass flanks is varied by choosing the titanium thickness and / or the concentration of the glass acid containing hydrofluoric acid.

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