EP0197214A2 - Carrier assembly for two-sided polishing operation - Google Patents
Carrier assembly for two-sided polishing operation Download PDFInfo
- Publication number
- EP0197214A2 EP0197214A2 EP85304348A EP85304348A EP0197214A2 EP 0197214 A2 EP0197214 A2 EP 0197214A2 EP 85304348 A EP85304348 A EP 85304348A EP 85304348 A EP85304348 A EP 85304348A EP 0197214 A2 EP0197214 A2 EP 0197214A2
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- EP
- European Patent Office
- Prior art keywords
- workpiece holder
- carrier assembly
- drive ring
- workpiece
- assembly according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/28—Work carriers for double side lapping of plane surfaces
Definitions
- This invention relates to a carrier assembly for holding workpieces for polishing, lapping or grinding operations and is particularly suited to two-sided operations. More specifically, the invention relates to a carrier assembly comprising a drive ring containing one or more workpiece holders in which the workpiece holders are of a softer material than the drive ring to diminish defect formation of the workpiece during the polishing, lapping or grinding operation.
- the present invention is intended primarily for use in double-sided operations in which both sides of a substrate simultaneously are polished, lapped or ground to produce flat, uniform surfaces.
- polish will be used herein somewhat generically to refer to the different types of polishing, lapping or grinding treatments, since the present invention can be used with any or all of them.
- Typical double-sided polishers use iron or steel plates and/or a variety of synthetic or natural polishing pads to effect the surface transformation of the workpiece to be polished.
- carrier assemblies which hold workpieces are driven by a drive mechanism comprising a stationary outer circular member with teeth arranged on the inner periphery of the circle. Concentric to and centrally located within the stationary member is a rotating drive member with teeth on its outer periphery. Carrier assemblies having a toothed perimeter are mounted in meshing relationship between the stationary and rotating members.
- the carrier assemblies are circular disks which include apertures that retain the workpieces, such as semiconductor wafers and aluminum plates for example.
- Typical materials of construction for durable, rigid carrier assemblies for two-sided polishing operations are steels and other metallic alloys, such as nickel alloys like INCONEL and MONEL, trademarked alloys'of International Nickel Company, Inc. Their great strength and rigidity are important factors in the production of exterior teeth that are able to withstand the severe forces building.up between the driving and driven teeth of the stationary and driving members and of the carrier assembly which build up during the polishing process. However, the same strength and durability which provide advantageous long life also create disadvantages which have yet to be overcome.
- the hard edge of the steel or other rigid metal forming the aperture in the carrier assembly coupled with rapid carrier movement and/or the movement of the substrate within the aperture, may produce chipping and/or cracking of the substrate edge.
- the interaction may produce substrate deformations that are not visible to the unassisted eye, but which render the substrate partially or totally useless for further processing.
- the carrier assembly entirely out of softer material, such as polyester, polyethylene, polycarbonate, nylon, polyvinylchloride, acrylate, polyurethane, epoxy, acetals (such as DELRIN, a trademark of E. I. du Pont de Nemours & Company), both unreinforced and reinforced with various fibers.
- softer material such as polyester, polyethylene, polycarbonate, nylon, polyvinylchloride, acrylate, polyurethane, epoxy, acetals (such as DELRIN, a trademark of E. I. du Pont de Nemours & Company), both unreinforced and reinforced with various fibers.
- DELRIN a trademark of E. I. du Pont de Nemours & Company
- the present invention overcomes the problems associated with the prior art in that it allows the use of a hard, durable material for an outer drive ring and a softer material used as workpiece holders to hold and protect the workpieces to be polished.
- the present invention includes a carrier assembly for use in polishing, lapping or grinding operations comprising a drive ring adapted to be mounted for rotation including drive connection means for drivingly connecting the drive ring to a driving source, the assembly characterized by the drive ring containing at least one aperture for retaining a workpiece holder, and a workpiece holder retained in the aperture, the workpiece holder being adapted to hold a workpiece in a cavity formed in the workpiece holder, the drive ring being made of a material relatively harder than a relatively softer material forming the workpiece holder, the relatively harder material being more capable of withstanding forces associated with the driving of the drive ring than the relatively softer material, the relatively softer material being more capable of protecting and cushioning against chipping and cracking any workpiece held within a workpiece holder formed thereof than the relatively hard material.
- the present invention thus isolates and allows the effective and efficient operation of the two functions of the previously inefficient prior art unitary double-sided carrier: (1) transmission of motion to the workpiece being polished, and (2) protection of that workpiece while it is being polished.
- a number of workpiece holders can be and preferably are used in one carrier assembly.
- the workpiece holders may include central cavities having different shapes to accommodate different shaped workpieces to be polished.
- the workpiece holders of the present invention preferably are removeable, replaceable and interchangeable within a carrier assembly.
- Individual workpiece holders could be fabricated of the best materials, shape and size to correspond to the requirements of a particular workpiece.
- the invention allows the use of a single set of relatively expensive drive rings to be engaged with a number of less expensive workpiece holders adapted for different workpieces.
- Carrier assembly 10 comprises a drive ring 12 having teeth 14 on its outer periphery. Teeth 14 are illustrated as gear teeth and may be of any known tooth shape, for example involute. A pin tooth structure could also be used if desired. Carrier assembly 10 of the present invention may be and preferably is used in double-sided polishing apparatus in place of currently available single-piece carrier assemblies.
- drive ring 12 Preferably, and as set forth below with respect to Figure 3, only one aperture is formed in drive ring. It is preferred that apertures 16 be milled or otherwise machined in drive ring 12, rather than pressure stamped. Milling or machining provides an aperture edge profile which is straight and true, resulting in a longer workpiece holder life.
- workpiece holder apertures 16 are discretionary, so long as there is a sufficient distance between the apertures and the perimeter of the drive ring and sufficient spacing between each of the adjacent apertures so as not to unduly weaken the drive ring or cause interference among the various polishing processes occuring in alignment with each of the apertures. It is presently preferred to space the apertures equidistant from each other as indicated in a circular orientation surrounding the center of the drive ring. Preferably, workpiece holder apertures 16 are arranged in a circular pattern in which the perimeter of the circle passes through the center of each.aperture whereby twice the distance from the center of the drive ring 12 to the center of any aperture 16 defines a dimension which may be called the workpiece holder circle diameter.
- Workpiece holders 18, 20, 22, 24 and 26 are inserted within and retained by apertures 16.
- the workpiece holders may be retained in apertures 16 fairly loosely, such that they and the workpiece held within each workpiece holder generally will be supported by the lower polishing pad or platen, schematically represented at 30 in Figure 2. Hydraulic forces and other forces associated with the polishing processes may cause the workpiece and workpiece holder to be located somewhat above the lower pad or platen in some circumstances.
- the workpiece holders used in connection with any particular drive ring have a uniform outer diameter so that they may be removed and interchangeably replaced with other workpiece holders.
- the workpiece holders have a cavity formed therein in which workpieces or substrates 28, 30, 32, 34 and 36 are inserted.
- the workpieces or substrates can be either unitary substrates where both major surfaces are polished, or two substrates placed back to back within the cavity of the workpiece holder, with or without a polymeric film or fibrous paper separator. In this latter instance, only one major face of each substrate would be polished efficiently using a double-sided polishing machine.
- the workpiece holder cavities may be of the same shape and dimension as each other, as illustrated by workpiece holders 18, 20, 22, and 24, or may have a different shape and dimensions, as illustrated by workpiece holder 26.
- the substrates 28, 30, 32 and 34 are all circular in horizontal cross-section, while workpiece 36 is square in horizontal cross-section.
- the shapes shown in Figure 1 are for purposes of illustration only, since the cavity of any workpiece holder can be custom designed to correspond with the shape of the workpiece.
- workpiece holder 26 could be interchanged with any of the other workpiece holders illustrated in Figure 1.
- the workpiece holders in Figure 1 are illustrated as having a circular perimeter to correspond with the general shape of many substrates which are polished, however, other shapes for apertures 16, workpiece holders 18, 20, 22, 24 and 26 and workpieces 28, 30, 32, 34 and 36 may be used and the shapes need not be identical or similar in any given drive ring.
- drive ring 12 generally is the thinnest of the elements associated with the carrier assembly.
- the workpiece holders, such as workpiece holder 18 of Figure 2 generally are thicker than drive ring 12 to protect the workpiece, illustrated as workpiece 28 in Figure 2.
- the workpieces, such as workpiece 28 are thicker than all of the other elements of the carrier assembly so that they can be polished by the lower and upper polishing pads or platens schematically represented in phantom and identified by numerals 38 and 40, respectively.
- FIG. 3 illustrates another embodiment of a carrier assembly 110 according to the present invention.
- Carrier assembly 110 comprises drive ring 112 having teeth 114 around its perimeter.
- a single central aperture l16 is formed in drive ring 112.
- Workpiece holder 118 is inserted into and retained within aperture 116.
- Two cavities are formed within workpiece holder 118. Two cavities are shown in Figure 3 only for purposes of illustration, with the understanding that different sizes or shapes of cavities could be formed in workpiece holder 118. Workpiece 128 is retained by one cavity and workpiece 130 is retained by the other cavity.
- Figure 4 is a vertical sectional view of the carrier assembly illustrated in Figure 3 taken along line 4--4 of Figure 3.
- the Figure should be self- explanatory in view of the description of Figures 2 and 3 and illustrates the relative thicknesses of the various elements in relation to lower and upper polishing pads or platens schematically represented in phantom and identified by numerals 132 and 134, respectively.
- Figure 5 is a vertical sectional view of another embodiment of the present invention in which the various elements have different relative thicknesses than the previously described embodiments, but which in plan view is identical to Figure 3, for purposes of illustration.
- workpiece holder 218 is thinner than drive ring 212 and workpieces 228 and 230.
- the carrier assembly of Figure 5 may be particularly well suited for use in a polishing operation, as distinct from a lapping or grinding operation.
- the polishing pads not illustrated, may be subject to the formation of a glazed coating or layer of spent slurry, removed fines and other dross.
- the edges of aperture 216 may act to scrape or dress the pads to help remove the excess glazed coating or layer.
- Drive ring 12, 112 should be made of a hard, durable material, usually metal, such as steel, stainless steel, and any number of various metal alloys, such as INCONEL AND MONEL, for example.
- the material should be strong and hard enough to be capable of withstanding forces associated with the driving of the drive ring generated during polishing operations and, in any event, more capable of withstanding such forces than the relatively softer material forming the workpiece holders.
- the drive ring is made of a material relatively harder than the material used to make the workpiece holders.
- the drive ring may be made of a metal, such as steel, having a Brinnell hardness of at least 75. The drive ring should not wear prematurely or become brittle during the polishing operation.
- the workpiece holder should be made of a material relatively softer than the material forming the drive ring.
- the material forming the workpiece holder should also be softer than the'substrate being polished so as not to chip, crack, scratch or otherwise damage the substrate.
- the presently preferred materials used to make the workpiece holder are synthetic polymeric resins. Resins which could be used, for example, but without limitation, include polyurethane, polyester, polyethylene, polycarbonate, polyvinylchloride, nylon, epoxy, phenolic, melamine, acrylate and acetal (such as du Pont's DELRIN) polymers. Depending on the substrate to be polished, the preferred polymers may be reinforced, if desired, with various fibers, including for example fiberglass and carbon fibers.
- the material used to form the workpiece may be sufficiently soft and elastomeric to absorb shocks transmitted by the edge of the substrate toward the aperture by the polishing process.
- the material may be sufficiently soft whereby it can be cut to the appropriate shape and size in the field with rudimentary tools, such as a razor knife. This does not mean that the workpiece holder must be elastomeric, although that may be preferred with some substrates in some polishing operations.
- the workpiece holder may be fairly rigid to support the workpieces firmly, again depending on all of the circumstances associated with any given polishing operation.
- the selection of the appropriate material used to form the drive ring and the workpiece holder will depend upon several factors, including the type of substrate being polished, the substrate thickness, the size and horizontal and cross-sectional shape of the substrate, the type of machine in which the carrier assembly is to be mounted, the type of polishing medium being used, the temperature generated during polishing, and others known to those of ordinary skill in the art.
- the carrier assembly of the present invention provides a user with a great deal of flexibility.
- the drive ring is hard and durable and can withstand the forces built up during a polishing, lapping or grinding operation.
- the workpiece holders in any given carrier assembly preferably are removeable, replaceable and interchangeable. This allows for the maximum degree of use with a minimum amount of inventory and allows for on-site fabrication of appropriate workpiece holders to hold the particular substrates being polished.
- This example describes a carrier assembly to retain five 5.08 cm (2 inch) round semiconductor substrates during fine polishing. Each substrate is individually retained by its own workpiece holder nested in separate apertures within the drive ring.
- the diameter of the carrier assembly (including the teeth) is 22.38 cm (8.81 inches).
- the apertures are formed to have a workpiece holder circle diameter of 17.68 cm (6.96 inches).
- the diameter of the apertures is 6.439 cm (2.535 inches) and the outer diameter of the workpiece holders is 6.414 cm (2.525 inches).
- the cavity has a diameter of 5.144 +/- 0.013 cm (2.025 +/- 0.005 inches).
- the distance between the outer perimeter and the cavity of each workpiece holder is about 0.64 cm (0.25 inch).
- workpiece holder 26 would have a circular cavity, rather than a square cavity.
- the workpiece holders and cavity formed therein are formed in a milling operation so that the sides are straight and true.
- the cavities of the workpiece holders may be milled individually to accommodate an infinite variety of possible substrate diameters.
- the drive ring is prepared from 28 gauge (0.038 cm (0.015 inch) maximum thickness) type 304 stainless steel.
- the drive teeth are designed to interface with a pin drive double-sided polishing machine.
- the drive ring has 43 teeth with a pitch diameter of 21.8 cm (8.6 inches).
- the workpiece holders are prepared from a 0.038 cm (0.015 inch) thick sheet of fiberglass reinforced epoxy resin commercially available from several sources having a G-10 grade.
- This example illustrates the use of a workpiece holder which can accommodate a polygon or irregularly shaped workpiece. Such may be the case with GaAs semiconductor substrates which will fit within a 5.08 cm (2 inch) cavity formed in a workpiece holder.
- a drive ring is formed of the material and has the dimensions set forth in Example 1.
- the workpiece holders may be composed of cast, high density polyurethane resin which may be cut by firm pressure with a razor knife.
- the irregularly shaped substrate is placed on top of the workpiece holder in which no cavity previously has been milled or otherwise formed.
- the shape of the substrate is traced and the workpiece holder is cut with the razor knife.
- the traced and cut area is removed from the workpiece holder to form the, workpiece holder cavity which matches perfectly with the substrate to be polished. This matching operation can occur either at the site where the workpiece holders are manufactured or at the site of the actual polishing.
- This example describes a carrier assembly for use in lapping semiconductor substrates.
- the carrier assembly diameter is 31.45 cm (12.38 inches).
- the drive ring has 60 standard, involute teeth with a pitch diameter of 30.48 cm (12.00 inches).
- the diametral pitch is 5.
- the drive ring is made of 25 gauge cold rolled steel sheet with a maximum thickness of 0.0531 cm (0.0209 inches).
- a single aperture is formed in the drive ring to retain a single workpiece holder of the type generally illustrated in Figure 3.
- Interlocking notches and protrusions as illustrated in Figure 3 prevent rotation of the workpiece holder with respect to the drive ring. In this way, rotary motion is prevented which might otherwise eject the workpiece or the workpiece holder or defeat the transmission of the drive ring rotation to the workpiece holder.
- the workpiece holder is made of grade G-10 fiberglass reinforced epoxy composite laminate with a thickness of 0.053 cm (0.021 inches).
- the drive ring aperture diameter (not including the protrusions) is 26.759 cm (10.535 inches).
- the workpiece holder outer diameter is 26.734 cm (10.525 inches').
- six 7.62 cm (3 inch) round substrates are retained and lapped within the workpiece holder cavities.
- the workpiece holder cavity has a diameter of about 7.684 +/- 0.013 cm (3.025 +/- 0.005 inches).
- the center of the six cavities are spaced along a workpiece holder circle having a diameter of 17.40 cm (6.85 inches).
- the workpiece holder cavities are spaced from each other (about 1.02 cm; 0.4 inch) and from the outer perimeter of the workpiece holder (about 0.826 cm; 0.325 inch) by a sufficient distance so that there is adequate material to hold, support and retain the workpieces and to allow for lapping of each workpiece.
- This example illustrates the effectiveness of using a single workpiece holder which greatly simplifies wafer loading. This is particularly important for an operation such as lapping in which, typically, less care is taken, since the substrate is not as highly processed and, hence, is less valuable.
- an operation such as lapping in which, typically, less care is taken, since the substrate is not as highly processed and, hence, is less valuable.
- steel carriers are used almost exclusively with lapping processes.
- the use of a softer workpiece holder greatly diminishes the formation of defective semiconductor substrates.
- This'example illustrates that a carrier assembly carrying a single workpiece holder also may be applied to a polishing operation.
- a type 304 stainless steel 26 gauge drive ring with a maximum thickness of 0.0452 cm (0.0178 inch) is formed to have a carrier assembly diameter of 31.29 cm (12.32 inches).
- the drive ring includes 61 involute teeth with a diametral pitch of 5.
- a workpiece holder aperture similar to that illustrated in Figure 3 is formed in the drive ring to have a diameter of 27.521 cm (10.835 inches).
- a grade G-10 fiberglass epoxy composite laminate workpiece holder having a thickness of 0.46 cm (0.18 inch) and a diameter of 27.496 cm (10.825 inches) is retained within the aperture.
- the workpiece holder will help to maintain the in-plane shape of the stainless steel drive ring during polishing. Moreover, where the drive ring is toroidal and because it is strong yet reasonably flexible, if through inattentive handling or mounting, the drive ring may become distorted and may no longer lay flat on the lower polishing pad, the drive ring may be straightened to correct any out-of-plane distortion.
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Abstract
The present invention relates to a carrier assembly (10; 110) comprising a drive ring (12; 112; 212) made of a hard material in which at least one aperture (16; 116) is formed for retaining a preferably removeable workpiece holder (18, 20, 22,24,26; 118; 218) made of softer material than the material used to make the drive ring. The workpiece holder contains a cavity which holds and retains the workpiece (28, 30, 32, 34, 36; 128, 130; 228, 230). The softer material of the workpiece holder protects and cushions the workpiece while the drive ring made of hard material withstands the forces generated during polishing, lapping and grinding operations.
Description
- This invention relates to a carrier assembly for holding workpieces for polishing, lapping or grinding operations and is particularly suited to two-sided operations. More specifically, the invention relates to a carrier assembly comprising a drive ring containing one or more workpiece holders in which the workpiece holders are of a softer material than the drive ring to diminish defect formation of the workpiece during the polishing, lapping or grinding operation.
- The present invention is intended primarily for use in double-sided operations in which both sides of a substrate simultaneously are polished, lapped or ground to produce flat, uniform surfaces. Unless otherwise indicated, for the sake of convenience, the term "polish" will be used herein somewhat generically to refer to the different types of polishing, lapping or grinding treatments, since the present invention can be used with any or all of them.
- Typical double-sided polishers use iron or steel plates and/or a variety of synthetic or natural polishing pads to effect the surface transformation of the workpiece to be polished. In a typical machine, carrier assemblies which hold workpieces are driven by a drive mechanism comprising a stationary outer circular member with teeth arranged on the inner periphery of the circle. Concentric to and centrally located within the stationary member is a rotating drive member with teeth on its outer periphery. Carrier assemblies having a toothed perimeter are mounted in meshing relationship between the stationary and rotating members. The carrier assemblies are circular disks which include apertures that retain the workpieces, such as semiconductor wafers and aluminum plates for example.
- Typical materials of construction for durable, rigid carrier assemblies for two-sided polishing operations are steels and other metallic alloys, such as nickel alloys like INCONEL and MONEL, trademarked alloys'of International Nickel Company, Inc. Their great strength and rigidity are important factors in the production of exterior teeth that are able to withstand the severe forces building.up between the driving and driven teeth of the stationary and driving members and of the carrier assembly which build up during the polishing process. However, the same strength and durability which provide advantageous long life also create disadvantages which have yet to be overcome.
- When polishing softer or friable materials, for example electronic substrates, such as silicon, GGG (gallium gadolinium garnet), GaAs, etc., the hard edge of the steel or other rigid metal forming the aperture in the carrier assembly, coupled with rapid carrier movement and/or the movement of the substrate within the aperture, may produce chipping and/or cracking of the substrate edge. The interaction may produce substrate deformations that are not visible to the unassisted eye, but which render the substrate partially or totally useless for further processing.
- Attempts have been made to construct the carrier assembly entirely out of softer material, such as polyester, polyethylene, polycarbonate, nylon, polyvinylchloride, acrylate, polyurethane, epoxy, acetals (such as DELRIN, a trademark of E. I. du Pont de Nemours & Company), both unreinforced and reinforced with various fibers. The use of the softer material helps prevent defects in the workpiece being polished, but results in excessive, premature wear of the carrier assembly teeth causing reduced lifetime and higher overall costs.
- Incorporating the two types of materials, a relatively hard metal and a relatively soft material mentioned above, into a carrier by coating the harder core material with a softer surface material is an effective alternative for thicker carriers and correspondingly thicker substrates being polished. For thinner substrates, however, the core material must be made so thin that the resultant carrier becomes flimsy and substantially useless.
- The present invention overcomes the problems associated with the prior art in that it allows the use of a hard, durable material for an outer drive ring and a softer material used as workpiece holders to hold and protect the workpieces to be polished.
- The present invention includes a carrier assembly for use in polishing, lapping or grinding operations comprising a drive ring adapted to be mounted for rotation including drive connection means for drivingly connecting the drive ring to a driving source, the assembly characterized by the drive ring containing at least one aperture for retaining a workpiece holder, and a workpiece holder retained in the aperture, the workpiece holder being adapted to hold a workpiece in a cavity formed in the workpiece holder, the drive ring being made of a material relatively harder than a relatively softer material forming the workpiece holder, the relatively harder material being more capable of withstanding forces associated with the driving of the drive ring than the relatively softer material, the relatively softer material being more capable of protecting and cushioning against chipping and cracking any workpiece held within a workpiece holder formed thereof than the relatively hard material.
- The present invention thus isolates and allows the effective and efficient operation of the two functions of the previously inefficient prior art unitary double-sided carrier: (1) transmission of motion to the workpiece being polished, and (2) protection of that workpiece while it is being polished.
- A number of workpiece holders can be and preferably are used in one carrier assembly. The workpiece holders may include central cavities having different shapes to accommodate different shaped workpieces to be polished. The workpiece holders of the present invention preferably are removeable, replaceable and interchangeable within a carrier assembly.
- Individual workpiece holders could be fabricated of the best materials, shape and size to correspond to the requirements of a particular workpiece. The invention allows the use of a single set of relatively expensive drive rings to be engaged with a number of less expensive workpiece holders adapted for different workpieces.
- For the purpose of illustrating the invention, there is shown in the drawings a form which is presently preferred; it being understood, however, that this invention is not limited to the precise arrangements and instrumentalities shown.
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- Figure 1 is a plan view of one embodiment of a carrier assembly according to the present invention.
- Figure 2 is a vertical sectional view of the carrier assembly of Figure 1 taken along the
line 2--2 in Figure 1 with polishing platens illustrated schematically in phantom. - Figure 3 is a plan view of a second embodiment of a carrier assembly according to the present invention.
- Figure 4 is a vertical sectional view of the carrier assembly of Figure 3 taken along
line 4--4 in Figure 3 with polishing platens illustrated schematically in phantom. - Figure 5 is a vertical sectional view of a third embodiment of a carrier assembly according to the present invention.
- Referring to the drawings in detail, wherein like numerals indicate like elements, there is shown in Figure 1 a
carrier assembly 10.Carrier assembly 10 comprises adrive ring 12 havingteeth 14 on its outer periphery.Teeth 14 are illustrated as gear teeth and may be of any known tooth shape, for example involute. A pin tooth structure could also be used if desired.Carrier assembly 10 of the present invention may be and preferably is used in double-sided polishing apparatus in place of currently available single-piece carrier assemblies. - One or alternately a plurality of
apertures 16, each adapted to retain a workpiece holder, are formed indrive ring 12. Preferably, and as set forth below with respect to Figure 3, only one aperture is formed in drive ring. It is preferred thatapertures 16 be milled or otherwise machined indrive ring 12, rather than pressure stamped. Milling or machining provides an aperture edge profile which is straight and true, resulting in a longer workpiece holder life. - The spacing and placement of
workpiece holder apertures 16 are discretionary, so long as there is a sufficient distance between the apertures and the perimeter of the drive ring and sufficient spacing between each of the adjacent apertures so as not to unduly weaken the drive ring or cause interference among the various polishing processes occuring in alignment with each of the apertures. It is presently preferred to space the apertures equidistant from each other as indicated in a circular orientation surrounding the center of the drive ring. Preferably,workpiece holder apertures 16 are arranged in a circular pattern in which the perimeter of the circle passes through the center of each.aperture whereby twice the distance from the center of thedrive ring 12 to the center of anyaperture 16 defines a dimension which may be called the workpiece holder circle diameter. -
Workpiece holders apertures 16. The workpiece holders may be retained inapertures 16 fairly loosely, such that they and the workpiece held within each workpiece holder generally will be supported by the lower polishing pad or platen, schematically represented at 30 in Figure 2. Hydraulic forces and other forces associated with the polishing processes may cause the workpiece and workpiece holder to be located somewhat above the lower pad or platen in some circumstances. - It is preferred that the workpiece holders used in connection with any particular drive ring have a uniform outer diameter so that they may be removed and interchangeably replaced with other workpiece holders. The workpiece holders have a cavity formed therein in which workpieces or
substrates - The workpieces or substrates can be either unitary substrates where both major surfaces are polished, or two substrates placed back to back within the cavity of the workpiece holder, with or without a polymeric film or fibrous paper separator. In this latter instance, only one major face of each substrate would be polished efficiently using a double-sided polishing machine.
- The workpiece holder cavities may be of the same shape and dimension as each other, as illustrated by
workpiece holders workpiece holder 26. Thus, thesubstrates workpiece 36 is square in horizontal cross-section. The shapes shown in Figure 1 are for purposes of illustration only, since the cavity of any workpiece holder can be custom designed to correspond with the shape of the workpiece. Moreover, despite the different shape ofworkpiece 36 and the corresponding different shape of the cavity inworkpiece holder 26,workpiece holder 26 could be interchanged with any of the other workpiece holders illustrated in Figure 1. - The workpiece holders in Figure 1 are illustrated as having a circular perimeter to correspond with the general shape of many substrates which are polished, however, other shapes for
apertures 16,workpiece holders workpieces - As illustrated in Figure 2,
drive ring 12 generally is the thinnest of the elements associated with the carrier assembly. The workpiece holders, such asworkpiece holder 18 of Figure 2, generally are thicker thandrive ring 12 to protect the workpiece, illustrated asworkpiece 28 in Figure 2. Generally, the workpieces, such asworkpiece 28, are thicker than all of the other elements of the carrier assembly so that they can be polished by the lower and upper polishing pads or platens schematically represented in phantom and identified bynumerals - Figure 3 illustrates another embodiment of a
carrier assembly 110 according to the present invention.Carrier assembly 110 comprisesdrive ring 112 havingteeth 114 around its perimeter. A single central aperture l16 is formed indrive ring 112.Workpiece holder 118 is inserted into and retained withinaperture 116. - In many instances, it is desired to prevent the rotation of a workpiece holder in the drive ring. One means for preventing such rotation would be to have noncircular apertures and corresponding workpiece holders with noncircular outer peripheries. Another way of preventing rotation is illustrated in Figure 3 by providing
aperture 116 with a plurality ofprotrusions 117 which mate with a plurality ofnotches 119 formed inworkpiece 118. It should be apparent that the protrusions and notches could be formed in the opposite members. - Two cavities are formed within
workpiece holder 118. Two cavities are shown in Figure 3 only for purposes of illustration, with the understanding that different sizes or shapes of cavities could be formed inworkpiece holder 118.Workpiece 128 is retained by one cavity andworkpiece 130 is retained by the other cavity. - Figure 4 is a vertical sectional view of the carrier assembly illustrated in Figure 3 taken along
line 4--4 of Figure 3. The Figure should be self- explanatory in view of the description of Figures 2 and 3 and illustrates the relative thicknesses of the various elements in relation to lower and upper polishing pads or platens schematically represented in phantom and identified bynumerals 132 and 134, respectively. - Figure 5 is a vertical sectional view of another embodiment of the present invention in which the various elements have different relative thicknesses than the previously described embodiments, but which in plan view is identical to Figure 3, for purposes of illustration. In this embodiment,
workpiece holder 218 is thinner thandrive ring 212 andworkpieces - While the type of material used to make the drive ring on the one hand and the workpiece holders on the other hand are not crucial in an absolute sense, they must have the following important characteristics in accordance with the present invention.
- Drive
ring - The workpiece holder should be made of a material relatively softer than the material forming the drive ring. The material forming the workpiece holder should also be softer than the'substrate being polished so as not to chip, crack, scratch or otherwise damage the substrate. The presently preferred materials used to make the workpiece holder are synthetic polymeric resins. Resins which could be used, for example, but without limitation, include polyurethane, polyester, polyethylene, polycarbonate, polyvinylchloride, nylon, epoxy, phenolic, melamine, acrylate and acetal (such as du Pont's DELRIN) polymers. Depending on the substrate to be polished, the preferred polymers may be reinforced, if desired, with various fibers, including for example fiberglass and carbon fibers.
- The material used to form the workpiece may be sufficiently soft and elastomeric to absorb shocks transmitted by the edge of the substrate toward the aperture by the polishing process. The material may be sufficiently soft whereby it can be cut to the appropriate shape and size in the field with rudimentary tools, such as a razor knife. This does not mean that the workpiece holder must be elastomeric, although that may be preferred with some substrates in some polishing operations. The workpiece holder may be fairly rigid to support the workpieces firmly, again depending on all of the circumstances associated with any given polishing operation.
- The selection of the appropriate material used to form the drive ring and the workpiece holder will depend upon several factors, including the type of substrate being polished, the substrate thickness, the size and horizontal and cross-sectional shape of the substrate, the type of machine in which the carrier assembly is to be mounted, the type of polishing medium being used, the temperature generated during polishing, and others known to those of ordinary skill in the art.
- The carrier assembly of the present invention provides a user with a great deal of flexibility. The drive ring is hard and durable and can withstand the forces built up during a polishing, lapping or grinding operation. The workpiece holders in any given carrier assembly preferably are removeable, replaceable and interchangeable. This allows for the maximum degree of use with a minimum amount of inventory and allows for on-site fabrication of appropriate workpiece holders to hold the particular substrates being polished.
- The present invention will now be described further by reference to the following prospective, specific, non-limiting examples.
- This example describes a carrier assembly to retain five 5.08 cm (2 inch) round semiconductor substrates during fine polishing. Each substrate is individually retained by its own workpiece holder nested in separate apertures within the drive ring. The diameter of the carrier assembly (including the teeth) is 22.38 cm (8.81 inches). The apertures are formed to have a workpiece holder circle diameter of 17.68 cm (6.96 inches). The diameter of the apertures is 6.439 cm (2.535 inches) and the outer diameter of the workpiece holders is 6.414 cm (2.525 inches). The cavity has a diameter of 5.144 +/- 0.013 cm (2.025 +/- 0.005 inches). The distance between the outer perimeter and the cavity of each workpiece holder is about 0.64 cm (0.25 inch). The general arrangement is illustrated in Figure 1, although
workpiece holder 26 would have a circular cavity, rather than a square cavity. The workpiece holders and cavity formed therein are formed in a milling operation so that the sides are straight and true. However, the cavities of the workpiece holders may be milled individually to accommodate an infinite variety of possible substrate diameters. - The drive ring is prepared from 28 gauge (0.038 cm (0.015 inch) maximum thickness) type 304 stainless steel. The drive teeth are designed to interface with a pin drive double-sided polishing machine. The drive ring has 43 teeth with a pitch diameter of 21.8 cm (8.6 inches).
- The workpiece holders are prepared from a 0.038 cm (0.015 inch) thick sheet of fiberglass reinforced epoxy resin commercially available from several sources having a G-10 grade.
- This example illustrates the use of a workpiece holder which can accommodate a polygon or irregularly shaped workpiece. Such may be the case with GaAs semiconductor substrates which will fit within a 5.08 cm (2 inch) cavity formed in a workpiece holder.
- A drive ring is formed of the material and has the dimensions set forth in Example 1. The workpiece holders may be composed of cast, high density polyurethane resin which may be cut by firm pressure with a razor knife. The irregularly shaped substrate is placed on top of the workpiece holder in which no cavity previously has been milled or otherwise formed. The shape of the substrate is traced and the workpiece holder is cut with the razor knife. The traced and cut area is removed from the workpiece holder to form the, workpiece holder cavity which matches perfectly with the substrate to be polished. This matching operation can occur either at the site where the workpiece holders are manufactured or at the site of the actual polishing.
- This example describes a carrier assembly for use in lapping semiconductor substrates. The carrier assembly diameter is 31.45 cm (12.38 inches). The drive ring has 60 standard, involute teeth with a pitch diameter of 30.48 cm (12.00 inches). The diametral pitch is 5. The drive ring is made of 25 gauge cold rolled steel sheet with a maximum thickness of 0.0531 cm (0.0209 inches).
- A single aperture is formed in the drive ring to retain a single workpiece holder of the type generally illustrated in Figure 3. Interlocking notches and protrusions as illustrated in Figure 3 prevent rotation of the workpiece holder with respect to the drive ring. In this way, rotary motion is prevented which might otherwise eject the workpiece or the workpiece holder or defeat the transmission of the drive ring rotation to the workpiece holder. The workpiece holder is made of grade G-10 fiberglass reinforced epoxy composite laminate with a thickness of 0.053 cm (0.021 inches).
- The drive ring aperture diameter (not including the protrusions) is 26.759 cm (10.535 inches). The workpiece holder outer diameter is 26.734 cm (10.525 inches'). Unlike the holder illustrated in Figure 3, six 7.62 cm (3 inch) round substrates are retained and lapped within the workpiece holder cavities. The workpiece holder cavity has a diameter of about 7.684 +/- 0.013 cm (3.025 +/- 0.005 inches). The center of the six cavities are spaced along a workpiece holder circle having a diameter of 17.40 cm (6.85 inches). With this spacing, the workpiece holder cavities are spaced from each other (about 1.02 cm; 0.4 inch) and from the outer perimeter of the workpiece holder (about 0.826 cm; 0.325 inch) by a sufficient distance so that there is adequate material to hold, support and retain the workpieces and to allow for lapping of each workpiece.
- This example illustrates the effectiveness of using a single workpiece holder which greatly simplifies wafer loading. This is particularly important for an operation such as lapping in which, typically, less care is taken, since the substrate is not as highly processed and, hence, is less valuable. Currently, steel carriers are used almost exclusively with lapping processes. The use of a softer workpiece holder greatly diminishes the formation of defective semiconductor substrates.
- This'example illustrates that a carrier assembly carrying a single workpiece holder also may be applied to a polishing operation.
- A type 304
stainless steel 26 gauge drive ring with a maximum thickness of 0.0452 cm (0.0178 inch) is formed to have a carrier assembly diameter of 31.29 cm (12.32 inches). The drive ring includes 61 involute teeth with a diametral pitch of 5. A workpiece holder aperture similar to that illustrated in Figure 3 is formed in the drive ring to have a diameter of 27.521 cm (10.835 inches). A grade G-10 fiberglass epoxy composite laminate workpiece holder having a thickness of 0.46 cm (0.18 inch) and a diameter of 27.496 cm (10.825 inches) is retained within the aperture. - Two cavities, each with a diameter of 12.637 cm (4.975 inches), are milled in the workpiece holder with the centers spaced 13.34 cm (5.25 inches) apart. The minimum distance between the workpiece holders is 0.699 cm (0.275 inch).
- The workpiece holder will help to maintain the in-plane shape of the stainless steel drive ring during polishing. Moreover, where the drive ring is toroidal and because it is strong yet reasonably flexible, if through inattentive handling or mounting, the drive ring may become distorted and may no longer lay flat on the lower polishing pad, the drive ring may be straightened to correct any out-of-plane distortion.
Claims (17)
1. A carrier assembly (10; 110) for use in polishing, lapping or grinding operations comprising a drive ring (12; 112; 212) adapted to be mounted for rotation including drive connection means (14; 114; 214) for drivingly connecting the drive ring to a driving source, the assembly characterized by the drive ring containing at least one aperture (16; 116) for retaining a workpiece holder, and a workpiece holder (18, 20, 22, 24, 26; 118; 218) retained in the aperture, the workpiece holder being adapted to hold a workpiece (28, 30, 32, 34, 36; 128, 130; 228, 230) in a cavity formed in the workpiece holder, the drive ring being made of a material relatively harder than a relatively softer material forming the workpiece holder, the relatively harder material being more capable of withstanding forces associated with the driving of the drive ring than the relatively softer material, the relatively softer material being more capable of protecting and cushioning against chipping and cracking any workpiece held within a workpiece holder formed thereof than the relatively hard material.
2. A carrier assembly according to claim 1, characterized by the workpiece holder (18, 20, 22, 24, 26; 118, 218) being removably retained in the aperture (16; 116).
3. A carrier assembly according to claim 2, characterized by the drive ring (12; 112; 212) containing a plurality of apertures (16; 116), each aperture retaining a workpiece holder (18, 20, 22, 24, 26; 118; 218).
4. A carrier assembly according to claim 2, characterized by a first workpiece holder (18) having a peripheral shape corresponding to the shape of the aperture (16) and a cavity shaped to correspond to the shape of a first workpiece (28), the first workpiece holder (18) being replaceable by a second workpiece holder (26) having a peripheral shape corresponding to the shape of the aperture (16) and a cavity shape different than the cavity shape of the first workpiece holder (18) to correspond to the shape of a second workpiece (36).
5. A carrier assembly according to claim 4, characterized by the drive ring (12; 112; 212) being made of metal and the workpiece holder (18, 20, 22, 24, 26; 118, 218) being made of synthetic polymeric resin.
6. A carrier assembly according to claim 5, characterized by the drive ring (12; 112; 212) being made of a metal selected from the group consisting of steel, stainless steel and nickel alloys, and the workpiece holder (18, 20, 22, 24, 26; 118; 218) being made of a synthetic polymeric resin selected from the group consisting of polyurethane, polyester, polyethylene, polycarbonate, polyvinlychloride, acetal, nylon, epoxy, phenolic, melamine and acrylate polymers.
7. A carrier assembly according to claim 6, characterized by the synthetic polymeric resin being fiber reinforced.
8. A carrier assembly according to claim 1, characterized by the drive ring (12; 112; 212) being made of metal and the workpiece holder (18, 20, 22, 24, 26; 118; 218) being made of synthetic polymeric resin.
9. A carrier assembly according to claim 8, characterized by the drive ring (12; 112; 212) being made of a metal selected from the group consisting of steel, stainless steel and nickel alloys, and the workpiece holder (18, 20, 22, 24, 26; 118; 218) being made of a synthetic polymeric resin selected from the group consisting of polyurethane, polyester, polyethylene, polycarbonate, polyvinlychloride, acetal, nylon, epoxy, phenolic, melamine and acrylate polymers.
10. A carrier assembly according to claim 9, characterized by the synthetic polymeric resin is fiber reinforced.
11. A carrier assembly according to claim 1 characterized by the aperture (116, 117) and the outer periphery of the workpiece holder (118, 119) having complementary shapes to prevent rotation of the workpiece holder in the aperture.
12. A carrier assembly according to claim 11, characterized by the drive ring (12; 112; 212) being made of metal and the workpiece holder (18, 20, 22, 24, 26; 118; 218) being made of synthetic polymeric resin.
13. A carrier assembly according to claim 12, characterized by the drive ring (12; 112; 212) being made of a metal selected from the group consisting of steel, stainless steel and nickel alloys, and the workpiece holder (18, 20, 22, 24, 26; 118; 218) being made of a synthetic polymeric resin selected from the group consisting of polyurethane, polyester, polyethylene, polycarbonate, polyvinlychloride, acetal, nylon, epoxy, phenolic, melamine and acrylate polymers.
14. A carrier assembly according to claim 13, characterized by the synthetic polymeric resin being fiber reinforced.
15. A carrier assembly according to claim 1, wherein the drive connecting means (14; 114; 214) comprises drive teeth (14; 114; 214) formed along the outer periphery of the drive ring (12; 112; 212).
16. A carrier assembly according to claim 1 wherein the workpiece holder (18, 20, 22, 24, 26; 118} is thinner than the workpiece (28, 30, 32, 34, 36; 128, 130) and thicker than the drive ring (12; 112).
17. A carrier assembly according to claim 1 wherein the workpiece holder (218) is thinner than both the workpiece (228, 230) and the drive ring (212).
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US72064485A | 1985-04-08 | 1985-04-08 | |
US720644 | 1985-04-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
EP0197214A2 true EP0197214A2 (en) | 1986-10-15 |
Family
ID=24894768
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP85304348A Withdrawn EP0197214A2 (en) | 1985-04-08 | 1985-06-18 | Carrier assembly for two-sided polishing operation |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0197214A2 (en) |
JP (1) | JPS61230852A (en) |
KR (1) | KR860008003A (en) |
CN (1) | CN85105523A (en) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0379214A2 (en) * | 1989-01-20 | 1990-07-25 | Nkk Corporation | Method for lapping two surfaces of a titanium disk |
EP0849039A2 (en) * | 1996-12-19 | 1998-06-24 | Shin-Etsu Handotai Company Limited | Lapping apparatus and lapping method |
CN1073911C (en) * | 1995-02-15 | 2001-10-31 | 大宇电子株式会社 | Apparatus for polishing dielectric layer formed on substrate |
DE10023002A1 (en) * | 2000-05-11 | 2001-11-29 | Wacker Siltronic Halbleitermat | Process for double-sided polishing of semiconductor wafers and rotor disks for carrying out the process |
DE102005034119B3 (en) * | 2005-07-21 | 2006-12-07 | Siltronic Ag | Semiconductor wafer processing e.g. lapping, method for assembly of electronic components, involves processing wafer until it is thinner than rotor plate and thicker than layer, with which recess of plate is lined for wafer protection |
DE102007049811A1 (en) | 2007-10-17 | 2009-04-23 | Siltronic Ag | Rotor disc, method for coating a rotor disc and method for the simultaneous double-sided material removing machining of semiconductor wafers |
DE102009047927A1 (en) | 2009-10-01 | 2011-01-27 | Siltronic Ag | Rotor disk for supporting one or multiple disks for conditioning polishing cloth in polishing machine, has core made of material, which have high rigidity and core is fully and partially provided with coating |
US8113913B2 (en) | 2007-03-19 | 2012-02-14 | Siltronic Ag | Method for the simultaneous grinding of a plurality of semiconductor wafers |
DE102012206398A1 (en) | 2012-04-18 | 2012-06-21 | Siltronic Ag | Method for performing two-sided planarization of semiconductor material e.g. wafer, involves providing the insert inside recesses in rotary disc, while supplying the polishing agent in the recess |
DE102011080323A1 (en) | 2011-08-03 | 2013-02-07 | Siltronic Ag | Method for simultaneously abrasive processing e.g. front surface of single crystalline silicon wafer in semiconductor industry, involves locating wafer and ring in recess of rotor disk such that edge of recess of disk guides wafer and ring |
DE102012218745A1 (en) | 2012-10-15 | 2014-04-17 | Siltronic Ag | Method for simultaneous two-sided material-removing machining of surfaces of disc of e.g. semiconductor wafer, involves conducting disc of semiconductor material during co-material-machining of surfaces of recess in rotor disc |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH0247156U (en) * | 1988-09-29 | 1990-03-30 | ||
JPH10249719A (en) * | 1997-03-05 | 1998-09-22 | Mitsubishi Rayon Co Ltd | Fiber reinforced plastic carrier plate |
US7198548B1 (en) * | 2005-09-30 | 2007-04-03 | Applied Materials, Inc. | Polishing apparatus and method with direct load platen |
KR100746373B1 (en) * | 2005-12-13 | 2007-08-03 | 주식회사 실트론 | Structure of carrier plate of double side polishing apparatus |
JP4904960B2 (en) * | 2006-07-18 | 2012-03-28 | 信越半導体株式会社 | Carrier for double-side polishing apparatus, double-side polishing apparatus and double-side polishing method using the same |
CN204366726U (en) * | 2015-01-04 | 2015-06-03 | 京东方光科技有限公司 | Polishing clamp |
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CN106239367B (en) * | 2016-09-22 | 2018-11-27 | 烟台亚捷模具有限公司 | A kind of frock clamp of light guide plate twin polishing |
CN109794837B (en) * | 2019-03-19 | 2023-07-21 | 陕西科技大学 | Polishing machine special for metal 3D printing substrate |
CN113510614A (en) * | 2021-08-03 | 2021-10-19 | 菲特晶(南京)电子有限公司 | Two-sided grinding machine trip wheel structure |
-
1985
- 1985-06-07 KR KR1019850003972A patent/KR860008003A/en not_active Application Discontinuation
- 1985-06-18 EP EP85304348A patent/EP0197214A2/en not_active Withdrawn
- 1985-07-10 CN CN85105523A patent/CN85105523A/en not_active Withdrawn
- 1985-08-05 JP JP60171280A patent/JPS61230852A/en active Pending
Cited By (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0379214A2 (en) * | 1989-01-20 | 1990-07-25 | Nkk Corporation | Method for lapping two surfaces of a titanium disk |
EP0379214A3 (en) * | 1989-01-20 | 1990-10-31 | Nkk Corporation | Method for lapping two surfaces of a titanium disk |
US5159787A (en) * | 1989-01-20 | 1992-11-03 | Nkk Corporation | Method for lapping two surfaces of a titanium disk |
CN1073911C (en) * | 1995-02-15 | 2001-10-31 | 大宇电子株式会社 | Apparatus for polishing dielectric layer formed on substrate |
EP0849039A2 (en) * | 1996-12-19 | 1998-06-24 | Shin-Etsu Handotai Company Limited | Lapping apparatus and lapping method |
EP0849039A3 (en) * | 1996-12-19 | 1998-12-30 | Shin-Etsu Handotai Company Limited | Lapping apparatus and lapping method |
US5941759A (en) * | 1996-12-19 | 1999-08-24 | Shin-Etsu Handotai Co., Ltd. | Lapping method using upper and lower lapping turntables |
DE10023002A1 (en) * | 2000-05-11 | 2001-11-29 | Wacker Siltronic Halbleitermat | Process for double-sided polishing of semiconductor wafers and rotor disks for carrying out the process |
US6514424B2 (en) | 2000-05-11 | 2003-02-04 | WACKER SILTRONIC GESELLSCHAFT FüR HALBLEITERMATERIALIEN AG | Process for the double-side polishing of semiconductor wafers and carrier for carrying out the process |
DE10023002B4 (en) * | 2000-05-11 | 2006-10-26 | Siltronic Ag | Set of carriers and its use |
DE102005034119B3 (en) * | 2005-07-21 | 2006-12-07 | Siltronic Ag | Semiconductor wafer processing e.g. lapping, method for assembly of electronic components, involves processing wafer until it is thinner than rotor plate and thicker than layer, with which recess of plate is lined for wafer protection |
US7541287B2 (en) | 2005-07-21 | 2009-06-02 | Siltronic Ag | Method for machining a semiconductor wafer on both sides in a carrier, carrier, and a semiconductor wafer produced by the method |
US8113913B2 (en) | 2007-03-19 | 2012-02-14 | Siltronic Ag | Method for the simultaneous grinding of a plurality of semiconductor wafers |
DE102007056628B4 (en) | 2007-03-19 | 2019-03-14 | Siltronic Ag | Method and apparatus for simultaneously grinding a plurality of semiconductor wafers |
DE102007049811A1 (en) | 2007-10-17 | 2009-04-23 | Siltronic Ag | Rotor disc, method for coating a rotor disc and method for the simultaneous double-sided material removing machining of semiconductor wafers |
DE102007049811B4 (en) * | 2007-10-17 | 2016-07-28 | Peter Wolters Gmbh | Rotor disc, method for coating a rotor disc and method for the simultaneous double-sided material removing machining of semiconductor wafers |
US9539695B2 (en) | 2007-10-17 | 2017-01-10 | Siltronic Ag | Carrier, method for coating a carrier, and method for the simultaneous double-side material-removing machining of semiconductor wafers |
DE102009047927A1 (en) | 2009-10-01 | 2011-01-27 | Siltronic Ag | Rotor disk for supporting one or multiple disks for conditioning polishing cloth in polishing machine, has core made of material, which have high rigidity and core is fully and partially provided with coating |
DE102011080323A1 (en) | 2011-08-03 | 2013-02-07 | Siltronic Ag | Method for simultaneously abrasive processing e.g. front surface of single crystalline silicon wafer in semiconductor industry, involves locating wafer and ring in recess of rotor disk such that edge of recess of disk guides wafer and ring |
DE102012206398A1 (en) | 2012-04-18 | 2012-06-21 | Siltronic Ag | Method for performing two-sided planarization of semiconductor material e.g. wafer, involves providing the insert inside recesses in rotary disc, while supplying the polishing agent in the recess |
DE102012218745A1 (en) | 2012-10-15 | 2014-04-17 | Siltronic Ag | Method for simultaneous two-sided material-removing machining of surfaces of disc of e.g. semiconductor wafer, involves conducting disc of semiconductor material during co-material-machining of surfaces of recess in rotor disc |
Also Published As
Publication number | Publication date |
---|---|
KR860008003A (en) | 1986-11-10 |
JPS61230852A (en) | 1986-10-15 |
CN85105523A (en) | 1986-07-02 |
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