EP0180090A3 - System and method for automatically monitoring and maintaining desired concentrations of metal plating baths - Google Patents
System and method for automatically monitoring and maintaining desired concentrations of metal plating baths Download PDFInfo
- Publication number
- EP0180090A3 EP0180090A3 EP85113091A EP85113091A EP0180090A3 EP 0180090 A3 EP0180090 A3 EP 0180090A3 EP 85113091 A EP85113091 A EP 85113091A EP 85113091 A EP85113091 A EP 85113091A EP 0180090 A3 EP0180090 A3 EP 0180090A3
- Authority
- EP
- European Patent Office
- Prior art keywords
- tank
- plating
- sensing
- cell
- bath
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1617—Purification and regeneration of coating baths
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Automation & Control Theory (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Chemically Coating (AREA)
- Control Of Non-Electrical Variables (AREA)
Abstract
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US66651284A | 1984-10-30 | 1984-10-30 | |
US666512 | 1984-10-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0180090A2 EP0180090A2 (en) | 1986-05-07 |
EP0180090A3 true EP0180090A3 (en) | 1987-03-18 |
Family
ID=24674376
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP85113091A Withdrawn EP0180090A3 (en) | 1984-10-30 | 1985-10-15 | System and method for automatically monitoring and maintaining desired concentrations of metal plating baths |
Country Status (2)
Country | Link |
---|---|
EP (1) | EP0180090A3 (en) |
JP (1) | JPS61110799A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110863237B (en) * | 2019-11-06 | 2021-05-11 | 江门荣信电路板有限公司 | Fool-proof system for automatically adding electroplating solution and use method thereof |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4908242A (en) * | 1986-10-31 | 1990-03-13 | Kollmorgen Corporation | Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures |
EP0265895B1 (en) * | 1986-10-31 | 1993-02-10 | AMP-AKZO CORPORATION (a Delaware corp.) | Method for electrolessly depositing high quality copper |
US5296123A (en) * | 1992-09-16 | 1994-03-22 | Hughes Aircraft Company | In-tank electrochemical sensor |
WO1999057340A2 (en) * | 1998-05-01 | 1999-11-11 | Dj Parker Company, Inc. | Chemical mixing, replenishment, and waste management system |
US6746589B2 (en) * | 2000-09-20 | 2004-06-08 | Ebara Corporation | Plating method and plating apparatus |
US6746579B2 (en) | 2001-11-21 | 2004-06-08 | Hitachi Kyowa Engineering Co., Ltd. | Electrolytic gold plating method and apparatus therefor |
US7851222B2 (en) | 2005-07-26 | 2010-12-14 | Applied Materials, Inc. | System and methods for measuring chemical concentrations of a plating solution |
ES2353706B1 (en) * | 2008-11-21 | 2012-01-25 | Universidad Politecnica De Valencia | ELECTROCHEMICAL CELL OF GAS GENERATION FOR THE ANALYSIS OF ELECTROCHEMICAL PROCESSES. |
JP5509120B2 (en) * | 2011-02-28 | 2014-06-04 | メルテックス株式会社 | Method for measuring the concentration of sulfur compounds in electroless nickel plating solution |
JP5443409B2 (en) * | 2011-02-28 | 2014-03-19 | トヨタ自動車株式会社 | Method and system for managing sulfur compounds |
CN102998353B (en) * | 2011-09-15 | 2016-08-10 | 上海宝钢工业技术服务有限公司 | In tin plate coating, lead measures sample treatment automatic test equipment |
JP6373157B2 (en) * | 2014-10-14 | 2018-08-15 | 日置電機株式会社 | Electrochemical sensor and electrochemical measuring device |
CN107227468A (en) * | 2017-07-31 | 2017-10-03 | 赣州市恒源科技股份有限公司 | A kind of automatic electrolysis installation of rare earth metal |
CN112030196B (en) * | 2020-08-20 | 2021-09-14 | 中南大学 | Precise electroforming system and control method |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2371522B1 (en) * | 1976-11-22 | 1980-02-15 | Kollmorgen Tech Corp | |
DE2911073A1 (en) * | 1979-03-21 | 1980-10-02 | Siemens Ag | BATHROOM GUIDE FOR A BATH FOR ELECTRICALLY DEPOSITING COPPER |
US4406249A (en) * | 1979-11-14 | 1983-09-27 | C. Uyemura & Co., Ltd. | Apparatus for controlling electroless plating bath |
-
1985
- 1985-07-16 JP JP60155291A patent/JPS61110799A/en active Pending
- 1985-10-15 EP EP85113091A patent/EP0180090A3/en not_active Withdrawn
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2371522B1 (en) * | 1976-11-22 | 1980-02-15 | Kollmorgen Tech Corp | |
DE2911073A1 (en) * | 1979-03-21 | 1980-10-02 | Siemens Ag | BATHROOM GUIDE FOR A BATH FOR ELECTRICALLY DEPOSITING COPPER |
US4406249A (en) * | 1979-11-14 | 1983-09-27 | C. Uyemura & Co., Ltd. | Apparatus for controlling electroless plating bath |
Non-Patent Citations (1)
Title |
---|
JOURNAL OF ELECTROCHEMICAL SOCIETY, vol. 127, no. 2, February 1980, pages 365-369; M. PAUNOVIC "An electrochemical control system for electroless copper bath" * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110863237B (en) * | 2019-11-06 | 2021-05-11 | 江门荣信电路板有限公司 | Fool-proof system for automatically adding electroplating solution and use method thereof |
Also Published As
Publication number | Publication date |
---|---|
JPS61110799A (en) | 1986-05-29 |
EP0180090A2 (en) | 1986-05-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
AK | Designated contracting states |
Kind code of ref document: A2 Designated state(s): DE FR GB |
|
17P | Request for examination filed |
Effective date: 19860819 |
|
PUAL | Search report despatched |
Free format text: ORIGINAL CODE: 0009013 |
|
AK | Designated contracting states |
Kind code of ref document: A3 Designated state(s): DE FR GB |
|
17Q | First examination report despatched |
Effective date: 19890216 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 19890627 |
|
RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: BINDRA, PERMINDER SINGH Inventor name: ARBACH, GARY VINCENT Inventor name: LIGHT, DAVID NOEL Inventor name: RATH, DAVID LEE Inventor name: ROLDAN, JUDITH MARIE |