EP0180090A3 - System and method for automatically monitoring and maintaining desired concentrations of metal plating baths - Google Patents

System and method for automatically monitoring and maintaining desired concentrations of metal plating baths Download PDF

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Publication number
EP0180090A3
EP0180090A3 EP85113091A EP85113091A EP0180090A3 EP 0180090 A3 EP0180090 A3 EP 0180090A3 EP 85113091 A EP85113091 A EP 85113091A EP 85113091 A EP85113091 A EP 85113091A EP 0180090 A3 EP0180090 A3 EP 0180090A3
Authority
EP
European Patent Office
Prior art keywords
tank
plating
sensing
cell
bath
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP85113091A
Other languages
German (de)
French (fr)
Other versions
EP0180090A2 (en
Inventor
Gary Vincent Arbach
Perminder Singh Bindra
David Noel Light
David Lee Rath
Judith Marie Roldan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of EP0180090A2 publication Critical patent/EP0180090A2/en
Publication of EP0180090A3 publication Critical patent/EP0180090A3/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1617—Purification and regeneration of coating baths
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Chemically Coating (AREA)
  • Control Of Non-Electrical Variables (AREA)

Abstract

A system for the automatic, on-line analysis and control of additives in chemical processing solutions in manufactur­ ing processes is disclosed.
The automatic control system embodiment includes a sensing system such as measuring a cell (10) in which appropriate sensors are located. For electrochemical mea­ surements, a three electrode cell with a rotating disk sensor is employed to control agitation of the sample solution. Other sensors on electrodes are used to measure pH and a thermometer is provided to monitor temperature. The sensing process, like the sampling process, is automatically controlled by a controller (18).
The system, in addition to the sensing means and con­ troller, further includes a plating tank (20), a mixing tank (22), a pump or control valve (24) and a reservoir (26). The measuring cell (10) may be disposed in the bath in a stan­ dard plating tank in which the plating bath solution is con­ tained. Alternatively, a flow through tank may be used in which the plating solution may flow into and from as desired.
When the sensing means so determines, a replenish­ ment bath from the reservoir can be pumped into the mixing tank by means of the pump or control valve means under the command of signals from the controller which in turn re­ ceives output signals from the measuring cell.
EP85113091A 1984-10-30 1985-10-15 System and method for automatically monitoring and maintaining desired concentrations of metal plating baths Withdrawn EP0180090A3 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US66651284A 1984-10-30 1984-10-30
US666512 1984-10-30

Publications (2)

Publication Number Publication Date
EP0180090A2 EP0180090A2 (en) 1986-05-07
EP0180090A3 true EP0180090A3 (en) 1987-03-18

Family

ID=24674376

Family Applications (1)

Application Number Title Priority Date Filing Date
EP85113091A Withdrawn EP0180090A3 (en) 1984-10-30 1985-10-15 System and method for automatically monitoring and maintaining desired concentrations of metal plating baths

Country Status (2)

Country Link
EP (1) EP0180090A3 (en)
JP (1) JPS61110799A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110863237B (en) * 2019-11-06 2021-05-11 江门荣信电路板有限公司 Fool-proof system for automatically adding electroplating solution and use method thereof

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4908242A (en) * 1986-10-31 1990-03-13 Kollmorgen Corporation Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
EP0265895B1 (en) * 1986-10-31 1993-02-10 AMP-AKZO CORPORATION (a Delaware corp.) Method for electrolessly depositing high quality copper
US5296123A (en) * 1992-09-16 1994-03-22 Hughes Aircraft Company In-tank electrochemical sensor
KR20010052287A (en) * 1998-05-01 2001-06-25 디제이 파커 컴파니, 인코포레이티드 두잉 비즈니스 애즈 파커 시스템즈 Chemical mixing, replenishment, and waste management system
US6746589B2 (en) * 2000-09-20 2004-06-08 Ebara Corporation Plating method and plating apparatus
US6746579B2 (en) 2001-11-21 2004-06-08 Hitachi Kyowa Engineering Co., Ltd. Electrolytic gold plating method and apparatus therefor
US7851222B2 (en) 2005-07-26 2010-12-14 Applied Materials, Inc. System and methods for measuring chemical concentrations of a plating solution
ES2353706B1 (en) * 2008-11-21 2012-01-25 Universidad Politecnica De Valencia ELECTROCHEMICAL CELL OF GAS GENERATION FOR THE ANALYSIS OF ELECTROCHEMICAL PROCESSES.
JP5509120B2 (en) * 2011-02-28 2014-06-04 メルテックス株式会社 Method for measuring the concentration of sulfur compounds in electroless nickel plating solution
JP5443409B2 (en) * 2011-02-28 2014-03-19 トヨタ自動車株式会社 Method and system for managing sulfur compounds
CN102998353B (en) * 2011-09-15 2016-08-10 上海宝钢工业技术服务有限公司 In tin plate coating, lead measures sample treatment automatic test equipment
JP6373157B2 (en) * 2014-10-14 2018-08-15 日置電機株式会社 Electrochemical sensor and electrochemical measuring device
CN107227468A (en) * 2017-07-31 2017-10-03 赣州市恒源科技股份有限公司 A kind of automatic electrolysis installation of rare earth metal
CN112030196B (en) * 2020-08-20 2021-09-14 中南大学 Precise electroforming system and control method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2371522B1 (en) * 1976-11-22 1980-02-15 Kollmorgen Tech Corp
DE2911073A1 (en) * 1979-03-21 1980-10-02 Siemens Ag BATHROOM GUIDE FOR A BATH FOR ELECTRICALLY DEPOSITING COPPER
US4406249A (en) * 1979-11-14 1983-09-27 C. Uyemura & Co., Ltd. Apparatus for controlling electroless plating bath

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2371522B1 (en) * 1976-11-22 1980-02-15 Kollmorgen Tech Corp
DE2911073A1 (en) * 1979-03-21 1980-10-02 Siemens Ag BATHROOM GUIDE FOR A BATH FOR ELECTRICALLY DEPOSITING COPPER
US4406249A (en) * 1979-11-14 1983-09-27 C. Uyemura & Co., Ltd. Apparatus for controlling electroless plating bath

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JOURNAL OF ELECTROCHEMICAL SOCIETY, vol. 127, no. 2, February 1980, pages 365-369; M. PAUNOVIC "An electrochemical control system for electroless copper bath" *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110863237B (en) * 2019-11-06 2021-05-11 江门荣信电路板有限公司 Fool-proof system for automatically adding electroplating solution and use method thereof

Also Published As

Publication number Publication date
JPS61110799A (en) 1986-05-29
EP0180090A2 (en) 1986-05-07

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Inventor name: BINDRA, PERMINDER SINGH

Inventor name: ARBACH, GARY VINCENT

Inventor name: LIGHT, DAVID NOEL

Inventor name: RATH, DAVID LEE

Inventor name: ROLDAN, JUDITH MARIE