EP0176054A2 - Hybrid coupler - Google Patents

Hybrid coupler Download PDF

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Publication number
EP0176054A2
EP0176054A2 EP85111954A EP85111954A EP0176054A2 EP 0176054 A2 EP0176054 A2 EP 0176054A2 EP 85111954 A EP85111954 A EP 85111954A EP 85111954 A EP85111954 A EP 85111954A EP 0176054 A2 EP0176054 A2 EP 0176054A2
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EP
European Patent Office
Prior art keywords
coupler
hybrid
outputs
hybrid coupler
carrier substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP85111954A
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German (de)
French (fr)
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EP0176054A3 (en
Inventor
Felix Anton Dipl.-Phys. Ing.Grad. Petz
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Siemens AG
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Siemens AG
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Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of EP0176054A2 publication Critical patent/EP0176054A2/en
Publication of EP0176054A3 publication Critical patent/EP0176054A3/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/12—Coupling devices having more than two ports
    • H01P5/16—Conjugate devices, i.e. devices having at least one port decoupled from one other port
    • H01P5/18—Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers
    • H01P5/184—Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers the guides being strip lines or microstrips
    • H01P5/187—Broadside coupled lines

Definitions

  • the invention relates to a hybrid coupler for at least two outputs.
  • Such hybrid couplers are used, for example, in power amplifiers in order to achieve a corresponding multiplication of power by connecting a plurality of power transistors in parallel.
  • the invention has for its object to provide a broadband hybrid coupler space-saving structure for at least two outputs and / or different coupling degree.
  • FIG. 1 shows a 3dB coupler in the circuit diagram, which has four connections.
  • Connection 1 forms the input for the signal (input)
  • connections 2 and 3 form the outputs of the coupler, from which half of the input power can be removed, but out of phase by 90 9 .
  • the technical implementation of the 3dB coupler is shown in FIG. 2.
  • the coupler consists of a circuit board P coated vertically on a carrier substrate (only indicated in the figure) with the length-to-height ratio a: b.
  • the circuit board P consists of a dielectric material of the relative dielectric constant ⁇ r ⁇ 2.3 ... 10. A value in the lower range of the numerical values mentioned is advantageously selected, which results in wider conductor tracks and thus a firmer coupling (stray electrical field is smaller).
  • the line connections of the coupler are applied as conductor tracks in the end region of the board P on the substrate and to the The conductor track 2 can, as shown in FIG. 2, also be passed through in isolation under the vertically arranged circuit board.
  • the coupling mechanism is the same as that of the conventional parallel line couplers, but a high degree of coupling is achieved due to the largely avoidance of field lines to the ground.
  • the space requirement is about ⁇ / 4 X substrate thickness, the electrical bandwidth is about 30% for 0.3 dB Ripple.
  • This type of coupler design allows the number of outputs to be increased in a very simple manner and the coupling degrees to be set differently.
  • FIGS. 3, 4 and. 5 An important coupler arrangement with 3 x (-4.7dB) and 0 °, 90 °, 180 ° for the parallel connection of three power transistors for tripling the power with a good standing wave ratio at the input and output is shown in the embodiment of the coupler according to FIGS. 3, 4 and. 5 These are, as it were, two series-connected couplers, the first coupler having a coupling degree of 4.7dB and the second one having 3dB, so that the three outputs have the same proportion of the power, namely 1/3 of the input power . These are then shifted in phase by 90 0 to each other. Connection 1 is again the connection for the input signal (input), connections 2, 3 and 4 are used for taking the output signals, connections 5 and 6 are terminated in terms of wave resistance and connected to ground (decoupled outputs).
  • the technical implementation of this embodiment according to FIG. 4 shows that the board P has a length of 2 ⁇ A / 4.
  • the connecting conductor track is extended along this to half the length of the board.
  • This section corresponds to the first coupler with a coupling degree of 4.7 dB.
  • the front side of the figure Circuit board P, on which the ⁇ / 4-long conductor track is guided along the substrate, is metallized throughout, while the circuit board side lying on the back in the figure has a recess (U) in the middle and thus separates the cable covering in half.
  • the connecting tracks for connections 2 and 3 are brought to one of these line coverings.
  • the connection for extracting the third signal component is located in the end region of the board P on the side lying at the front in the figure.
  • FIG. 5 shows a detailed representation of the metallization areas of the coupler board for the 4.7 dB coupler according to FIG. 4, which have different heights on both sides for the different degree of coupling.
  • the metallization areas are arranged at an increased mutual distance.

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  • Microwave Amplifiers (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

The invention relates to a hybrid coupler for at least two outputs. Such a coupler should have a broad bandwidth and be space-saving in its construction, as well as having different levels of coupling. The invention provides that a sheet plate (P) with a metallic, conductive coating on both sides is applied vertically onto a carrier substrate provided with conductor paths, to which sheet plate (P) the conductor paths of the carrier substrate are supplied, at intervals of approximately lambda /4, as connections of the coupler. <IMAGE>

Description

Die Erfindung bezieht sich auf einen Hybridkoppler für wenigstens zwei Ausgänge. Solche Hybridkoppler werden beispielsweise in Leistungsverstärkern verwendet, um durch Parallelschaltung mehrerer Leistungstransistoren eine entsprechende Leistungsvervielfachung zu erreichen.The invention relates to a hybrid coupler for at least two outputs. Such hybrid couplers are used, for example, in power amplifiers in order to achieve a corresponding multiplication of power by connecting a plurality of power transistors in parallel.

Der Erfindung liegt die Aufgabe zugrunde, einen breitbandigen Hybridkoppler raumsparenden Aufbaus für wenigstens zwei Ausgänge und/oder unterschiedlichen Koppelgrad zu schaffen.The invention has for its object to provide a broadband hybrid coupler space-saving structure for at least two outputs and / or different coupling degree.

Diese Aufgabe wird gemäß der Erfindung gelöst durch eine auf ein mit Leiterbahnen versehenes Substrat vertikal aufgebrachte, beidseitig mit einem metallisch leitenden Belag beschichtete Platine der Lange n λ/4 (n-ganzzahlig, n = 1 für 90°-Hybrid mit 2 Ausgängen), an die im Abstand von etwa λ/4 die Leiterbahnen des Trägersubstrats als Anschlüsse des Kopplers beiderseits herangeführt sind.This object is achieved according to the invention by a circuit board of length n λ / 4 (n-integer, n = 1 for 90 ° hybrid with 2 outputs) vertically applied to a substrate provided with conductor tracks and coated on both sides with a metallically conductive coating, to which the conductor tracks of the carrier substrate are guided as connections of the coupler on both sides at a distance of approximately λ / 4.

Vorteilhafte Ausgestaltungen und Weiterbildungen des Erfindungsgegenstandes sind in den Unteransprüchen angegeben.Advantageous refinements and developments of the subject matter of the invention are specified in the subclaims.

Nachstehend wird die Erfindung anhand von in der Zeichnung dargestellten Ausführungsbeispielen näher erläutert.The invention is explained in more detail below on the basis of exemplary embodiments illustrated in the drawing.

Es zeigen

  • Fig. 1 und 2 einen 3dB-Koppler mit zwei Ausgängen im Schaltbild und in der technischen Realisierung,
  • Fig. 3,4 u. 5 einen 4,7dB-Koppler mit drei Ausgängen im Schaltbild und in der technischen Realisierung.
Show it
  • 1 and 2 a 3dB coupler with two outputs in the circuit diagram and in the technical implementation,
  • Fig. 3.4 u. 5 a 4.7 dB coupler with three outputs in the circuit diagram and in the technical implementation.

Figur 1 zeigt einen 3dB-Koppler im Schaltbild, der vier Anschlüsse aufweist. Anschluß 1 bildet dabei den Eingang für das Signal (Input), die Anschlüsse 2 und 3 bilden die Ausgänge des Kopplers, an denen jeweils die Hälfte der Eingangsleistung, jedoch um 909 phasenverschoben, entnehmbar ist. Am Anschluß 4, auch als entkoppelter Ausgang (Isolator) bezeichnet, tritt keine Leistung auf.FIG. 1 shows a 3dB coupler in the circuit diagram, which has four connections. Connection 1 forms the input for the signal (input), connections 2 and 3 form the outputs of the coupler, from which half of the input power can be removed, but out of phase by 90 9 . No power occurs at connection 4, also known as a decoupled output (isolator).

Die technische Realisierung des 3dB-Koppler zeigt Figur 2. Der Koppler besteht aus einer vertikal auf ein Trägersubstrat ( in der Figur nur angedeutet) aufgebrachten, beidseitig Cu-beschichteten Platine P mit dem Länge-HöhenVerhältnis a:b. Die Länge a entspricht "A./4, die Höhe b läßt sich aus dem Wellenwiderstand ZO=50 Ohm zweier parallel laufender Leitungen ermitteln. Die Platine P besteht aus einem dielektrischen Material der relativen Dielektrizitätskonstante εr≈2,3...10. Es wird vorteilhafterweise ein Wert im unteren Bereich der genannten Zahlenwerte gewählt, wodurch sich breitere Leiterbahnen und damit eine festere Kopplung (elektrisches Streufeld ist kleiner) ergeben. Die Leitungsanschlüsse des Kopplers sind als Leiterbahnen etwa im Endbereich der Platine P auf dem Substrat aufgebracht und an die Platine herangeführt. Die Leiterbahn 2 kann auch, wie in der Fig. 2 gezeichnet, isoliert unter der vertikal angeordneten Platine hindurchgeführt werden.The technical implementation of the 3dB coupler is shown in FIG. 2. The coupler consists of a circuit board P coated vertically on a carrier substrate (only indicated in the figure) with the length-to-height ratio a: b. The length a corresponds to "A./4, the height b can be determined from the characteristic impedance ZO = 50 ohms of two lines running in parallel. The circuit board P consists of a dielectric material of the relative dielectric constant ε r ≈2.3 ... 10. A value in the lower range of the numerical values mentioned is advantageously selected, which results in wider conductor tracks and thus a firmer coupling (stray electrical field is smaller). The line connections of the coupler are applied as conductor tracks in the end region of the board P on the substrate and to the The conductor track 2 can, as shown in FIG. 2, also be passed through in isolation under the vertically arranged circuit board.

Der Koppelmechanismus ist der gleiche wie bei den herkömmlichen Parallel-Line-Kopplern, jedoch wird wegen der weitgehenden Vermeidung von Feldlinien zur Masse ein hoher Koppelgrad erreicht. Der flächenmäßige Raumbedarf beträgt etwa λ/4 X Substratdicke, die elektrische Bandbreite dabei ist für 0,3dB Ripple etwa 30%.The coupling mechanism is the same as that of the conventional parallel line couplers, but a high degree of coupling is achieved due to the largely avoidance of field lines to the ground. The space requirement is about λ / 4 X substrate thickness, the electrical bandwidth is about 30% for 0.3 dB Ripple.

Diese Art des Koppleraufbaus erlaubt es, auch in einfachster Weise die Anzahl der Ausgänge zu erhöhen und auch die Koppelgrade unterschiedlich einzustellen. Dabei ist die Anzahl der Ausgänge nicht binär begrenzt, also 2n (n=1,2,...), wie dies beim Zusammenschalten von einfachen Ringhybriden der Fall ist.This type of coupler design allows the number of outputs to be increased in a very simple manner and the coupling degrees to be set differently. The number of outputs is not limited in binary terms, i.e. 2 n (n = 1,2, ...), as is the case when interconnecting simple ring hybrids.

Eine wichtige Koppleranordnung mit 3 x (-4,7dB) und 0°, 90°, 180° zur Parallelschaltung von drei Leistungstransistoren zur Leistungsverdreifachung bei gleichzeitig gutem Stehwellenverhältnis am Ein- und Ausgang zeigt die Ausführungsform des Kopplers nach den Figuren 3, 4 u. 5 Dabei handelt es sich gleichsam um zwei seriell hintereinandergeschaltete Koppler, wobei der erste Koppler einen Koppelgrad von 4,7dB und der zweite einen von 3dB aufweist, so daß an den drei Ausgängen jeweils gleiche Anteile der Leistung, nämlich 1/3 der Eingangsleistung, erscheinen. Diese sind dann phasenmäßig um jeweils 900 zueinander verschoben. Anschluß 1 ist dabei wiederum der Anschluß für das Eingangssignal (Input), die Anschlüsse 2, 3 und 4 dienen der Entnahme der Ausgangssignale, die Anschlüsse 5 und 6 sind wellenwiderstandsmäßig abgeschlossen und an Masse gelegt (entkoppelte Ausgänge).An important coupler arrangement with 3 x (-4.7dB) and 0 °, 90 °, 180 ° for the parallel connection of three power transistors for tripling the power with a good standing wave ratio at the input and output is shown in the embodiment of the coupler according to FIGS. 3, 4 and. 5 These are, as it were, two series-connected couplers, the first coupler having a coupling degree of 4.7dB and the second one having 3dB, so that the three outputs have the same proportion of the power, namely 1/3 of the input power . These are then shifted in phase by 90 0 to each other. Connection 1 is again the connection for the input signal (input), connections 2, 3 and 4 are used for taking the output signals, connections 5 and 6 are terminated in terms of wave resistance and connected to ground (decoupled outputs).

Die technische Realisierung dieser Ausführungsform gemäß Figur 4 zeigt, daß die Platine P hierbei die Länge 2 x A/4 aufweist. Auf der dem Eingangsanschluß 1 zugekehrten Seite ist die Anschlußleiterbahn über die Hälfte der Platinenlänge längs zu dieser weitergeführt. Dieser Auschnitt entspricht dem ersten Koppler mit einem Koppelgrad von 4,7dB. Die in der Figur vordere Seite der Platine P, an der die λ/4-lange Leiterbahn auf dem Substrat entlanggeführt ist, ist durchgehend metallisiert, während die in der Figur rückseitig liegende Platinenseite in der Mitte eine Ausnehung (U) aufweist und so den Leitungsbelag in zwei Hälften auftrennt. An jeweils einen dieser Leitungsbeläge sind die Anschlußbahnen für die Anschlüsse 2 und 3 herangeführt. Der Anschluß zur Entnahme des dritten Signalanteiles befindet sich im Endbereich der Platine P an der in der Figur vorn liegenden Seite.The technical implementation of this embodiment according to FIG. 4 shows that the board P has a length of 2 × A / 4. On the side facing the input connection 1, the connecting conductor track is extended along this to half the length of the board. This section corresponds to the first coupler with a coupling degree of 4.7 dB. The front side of the figure Circuit board P, on which the λ / 4-long conductor track is guided along the substrate, is metallized throughout, while the circuit board side lying on the back in the figure has a recess (U) in the middle and thus separates the cable covering in half. The connecting tracks for connections 2 and 3 are brought to one of these line coverings. The connection for extracting the third signal component is located in the end region of the board P on the side lying at the front in the figure.

Fig. 5 zeigt 'n einer Detaildarstellung die Metallisierungsflächen der Kopplerplatine für den 4,7-dB-Koppler nach Fig. 4, die auf beiden Seiten für den unterschiedlichen Kopplungsgrad verschiedene Höhen aufweisen. Die Metallisierungsflächen sind dabei unter einem vergrößerten gegenseitigen Abstand angeordnet.FIG. 5 shows a detailed representation of the metallization areas of the coupler board for the 4.7 dB coupler according to FIG. 4, which have different heights on both sides for the different degree of coupling. The metallization areas are arranged at an increased mutual distance.

Claims (6)

1. Hybridkoppler für wenigstens zwei Ausgänge, gekennzeichnet durch eine auf ein mit Leiterbahnen versehenes Trägersubstrat vertikal aufgebrachte,beidseitig mit einem metallisch leitenden Belag beschichtete Platine (P) der Länge n λ/4 (n-ganzzahlig), an die im Abstand von etwa λ/4 die Leiterbahnen des Trägersubstrats als Anschlüsse des Kopplers beiderseits herangeführt sind.1. Hybrid coupler for at least two outputs, characterized by a circuit board (P) vertically applied to a carrier substrate provided with conductor tracks and coated on both sides with a metallic conductive coating of length n λ / 4 (n-integer), to which at a distance of approximately λ / 4 the conductor tracks of the carrier substrate are brought in as connections of the coupler on both sides. 2. Hybridkoppler nach Anspruch 1, gekennzeichnet durch seinen Aufbau als 3dB-90°Hybrid, bei dem die als Koppleranschlüsse dienenden Leiterbahnen des Substrats im Endbereich der Platine (P) an diese herangeführt sind.2. Hybrid coupler according to claim 1, characterized by its construction as a 3dB-90 ° hybrid, in which the conductor tracks of the substrate serving as coupler connections in the end region of the board (P) are brought up to the latter. 3. Hybridkoppler nach Anspruch 1, dadurch gekennzeichnet , daß bei seiner Ausbildung als Hybrid mit drei Ausgängen vom Anschluß des Kopplereingangs eine λ/4-lange Leiterbahn auf dem Trägersubstrat längs einer Seite der Platine (P) geführt ist.3. Hybrid coupler according to claim 1, characterized in that in its design as a hybrid with three outputs from the connection of the coupler input, a λ / 4-long conductor track is guided on the carrier substrate along one side of the circuit board (P). 4. Hybridkoppler nach Anspruch 3, dadurch gekennzeichnet, daß die Metallisierung auf der der λ/4-langen Leiterbahn gegenüberliegenden Seite der Platine (P) durch eine senkrecht zur Längsausdehnung verlaufende Unterbrechnung (U) aufgetrennt ist.4. Hybrid coupler according to claim 3, characterized in that the metallization on the λ / 4-long conductor track opposite side of the board (P) is separated by an interruption (U) extending perpendicular to the longitudinal extent. 5. Hybridkoppler nach Anspruch 4, dadurch gekennzeichnet , daß der erste Kopplerabschnitt einen Koppelgrad von 4,7dB und der zweite Kopplerabschnitt einen Koppelgrad von 3dB aufweist.5. Hybrid coupler according to claim 4, characterized in that the first coupler section has a coupling degree of 4.7dB and the second coupler section has a coupling degree of 3dB. 6. Hybridkoppler nach einem der vorhergrhenden Ansprüche, dadurch gekennzeichnet , daß die Platine (P) aus einem dielektrischen Material niedriger Dielektrizitätskonstante besteht.6. Hybrid coupler according to one of the preceding claims, characterized in that the circuit board (P) consists of a dielectric material with a low dielectric constant.
EP85111954A 1984-09-26 1985-09-20 Hybrid coupler Withdrawn EP0176054A3 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3435312 1984-09-26
DE19843435312 DE3435312A1 (en) 1984-09-26 1984-09-26 HYBRID COUPLER

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EP0176054A2 true EP0176054A2 (en) 1986-04-02
EP0176054A3 EP0176054A3 (en) 1988-06-01

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4823097A (en) * 1986-07-04 1989-04-18 Uniden Corporation Microwave directional coupler

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1909092A1 (en) * 1968-02-28 1969-09-11 Western Electric Co Hybrid coupler with 90 ° phase shift
US4150345A (en) * 1977-12-02 1979-04-17 Raytheon Company Microstrip coupler having increased coupling area
JPS55147804A (en) * 1979-05-08 1980-11-18 Nec Corp Branching circuit
US4323863A (en) * 1978-01-16 1982-04-06 Rockwell International Corporation N-Way power divider/combiner

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1909092A1 (en) * 1968-02-28 1969-09-11 Western Electric Co Hybrid coupler with 90 ° phase shift
US4150345A (en) * 1977-12-02 1979-04-17 Raytheon Company Microstrip coupler having increased coupling area
US4323863A (en) * 1978-01-16 1982-04-06 Rockwell International Corporation N-Way power divider/combiner
JPS55147804A (en) * 1979-05-08 1980-11-18 Nec Corp Branching circuit

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN, Band 5, Nr. 19 (E-44)[691], 4. Februar 1981; & JP-A-55 147 804 (NIPPON DENKI K.K.) 18-11-1980 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4823097A (en) * 1986-07-04 1989-04-18 Uniden Corporation Microwave directional coupler

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DE3435312A1 (en) 1986-04-03
EP0176054A3 (en) 1988-06-01

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