EP0074406A1 - Spindle tilting control device for plane and spherical rotary grinding machine, fine grinding machine, lapping machine, and polishing machine - Google Patents

Spindle tilting control device for plane and spherical rotary grinding machine, fine grinding machine, lapping machine, and polishing machine Download PDF

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Publication number
EP0074406A1
EP0074406A1 EP81900634A EP81900634A EP0074406A1 EP 0074406 A1 EP0074406 A1 EP 0074406A1 EP 81900634 A EP81900634 A EP 81900634A EP 81900634 A EP81900634 A EP 81900634A EP 0074406 A1 EP0074406 A1 EP 0074406A1
Authority
EP
European Patent Office
Prior art keywords
machine
spindle
plane
tilting
lapping
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP81900634A
Other languages
German (de)
French (fr)
Other versions
EP0074406A4 (en
Inventor
Yoshio Ishimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHIBAYAMA KIKAI CO Ltd
Original Assignee
SHIBAYAMA KIKAI CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SHIBAYAMA KIKAI CO Ltd filed Critical SHIBAYAMA KIKAI CO Ltd
Publication of EP0074406A1 publication Critical patent/EP0074406A1/en
Publication of EP0074406A4 publication Critical patent/EP0074406A4/en
Ceased legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0084—Other grinding machines or devices the grinding wheel support being angularly adjustable

Definitions

  • This invention is to provide a spindle tilting control device for a plane and spherical rotary grinding machine, fine gliding machine, lapping machine and polishing machine, which device can machine these semiconductor materials such as silicon, magnetic materials such as ferrite and Sendust, ceramics and hard metals or the like, to a super precise planeness or sphericity.
  • a device of this invention is to provide improved models of a conventional plane and spherical rotary grinding machine, fine gliding machine, lapping machine and polishing machine and is developed in order to achieve a super precise plane and an extreme machining precision by freely tilting its spindle in four quarter directions.
  • Fig. 1 is a right side view of a spindle tilting control device of this invention
  • F ig. 2 is a front view of the spindle tilting control device of this invention.
  • numeral 1 represents a rotary table
  • numeral 2 represents a grindstone or surface plate
  • numeral 3 represents a spindle head
  • numeral 4 and 5 represent clamp bolts
  • numeral 6 represents a motor
  • numeral 7 represents a joint for tilting a spindle.
  • Numeral 1 represents a rotary table for retaining a work magnetically or by vacuum and revolving the work
  • numeral 2 represents a grindstone or a lapping or polishing surface plate for grinding, lapping or polishing the work
  • numeral 3 represents a spindle head for revolving the grindstone or surface plate 2
  • numerals 4 and 5 represent clamp bolts for clamping on tilting the spindle head in one of four quarter directions or on setting the spindle completely perpendicular to the rotary table
  • numeral 6 represents a motor for driving a spindle head 3.
  • the device according to this invention is thus composed and can be used for a spherical grinding machine as the angle between the rotary table and a spindle shaft can be adjusted within a degree of a by tilting the spindle head 3 in one of four quarter directions with use of a joint 7 provided for tilting the spindle as illustrated in a detailed drawing in Fig. 1 differring from those in the conventional plane, spherical and rotary grinding machines, and also can achieve a complete planeness or sphericity of the work as the plane of the grindstone or the lapping or polishing surface plate and the plane of the rotary table can be kept completely in parallel to each other by setting the spindle completely perpendicular to the rotary table l.
  • the device according to this invention will be required to be improved with a growing necessity for higher-grade machine tools for producing further extremely precise microminiature electronic part components, and the development for such improved machines is an urgent necessity.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)

Abstract

O A spindle tilting control device for a plane and spherical rotary grinding machine, fine gliding machine, lapping machine and polishing machine, which are super precise machines for manufacturing microminiature electronic part components, which device employs a joint (7) for tilting a spindle, can perpendicularly secure a rotary table (1) with respect to the spindle (3) by clamping crank bolts (4), (5), tilts a grind-stone or surface plate (2) with a spindle tilting joint (7), thereby machining a spherical surface together with electric and chemical methods. This machine can extremely precisely machine semiconductor material, magnetic material, ceramics, superhard alloys, or the like.

Description

    Title of the Invention
  • Spindle tilting control device for plane and' spherical rotary grinding machine, fine gliding machine, lapping machine and polishing machine. _ _
    • Field of the Art
  • According to the advance of electronics, the development of semiconductors has remarkably progressed. It has been necessary to gradually miniaturize computers, microcomputers and office computers by the shift from miniaturization and precision to microminiaturization and super precision, namely the shift from transitors to ICs, ICs to LSIs and LSIs to super LSIs. Super precise machines have been required for producing these microminiature electronic part components.
  • This invention is to provide a spindle tilting control device for a plane and spherical rotary grinding machine, fine gliding machine, lapping machine and polishing machine, which device can machine these semiconductor materials such as silicon, magnetic materials such as ferrite and Sendust, ceramics and hard metals or the like, to a super precise planeness or sphericity.
    • Background of the Art
  • These processing had been chiefly done by hands and depended on the skilled in the art. After a flat lapping machine was invented in the United States in 1919, several kinds of grinding machines, lapping machines and polishing machines have subsequently appeared, and the processing is now being in rapid progress of the mechanization.
    • Disclosure of the Invention
  • A device of this invention is to provide improved models of a conventional plane and spherical rotary grinding machine, fine gliding machine, lapping machine and polishing machine and is developed in order to achieve a super precise plane and an extreme machining precision by freely tilting its spindle in four quarter directions.
    • Brief Description of the Drawings
  • The drawings show an embodiment according to this invention.
  • Fig. 1 is a right side view of a spindle tilting control device of this invention,
  • Fig. 2 is a front view of the spindle tilting control device of this invention.
  • In these drawings, numeral 1 represents a rotary table, numeral 2 represents a grindstone or surface plate, numeral 3 represents a spindle head, numeral 4 and 5 represent clamp bolts, numeral 6 represents a motor and numeral 7 represents a joint for tilting a spindle.
    • Best Form for Working the Invention
  • The actions and effects of the device according to this invention will be explained with reference to these drawings, as follows.
  • Numeral 1 represents a rotary table for retaining a work magnetically or by vacuum and revolving the work, numeral 2 represents a grindstone or a lapping or polishing surface plate for grinding, lapping or polishing the work, numeral 3 represents a spindle head for revolving the grindstone or surface plate 2, numerals 4 and 5 represent clamp bolts for clamping on tilting the spindle head in one of four quarter directions or on setting the spindle completely perpendicular to the rotary table and numeral 6 represents a motor for driving a spindle head 3.
  • The device according to this invention is thus composed and can be used for a spherical grinding machine as the angle between the rotary table and a spindle shaft can be adjusted within a degree of a by tilting the spindle head 3 in one of four quarter directions with use of a joint 7 provided for tilting the spindle as illustrated in a detailed drawing in Fig. 1 differring from those in the conventional plane, spherical and rotary grinding machines, and also can achieve a complete planeness or sphericity of the work as the plane of the grindstone or the lapping or polishing surface plate and the plane of the rotary table can be kept completely in parallel to each other by setting the spindle completely perpendicular to the rotary table l.
    • Applicability in Industry
  • The device according to this invention will be required to be improved with a growing necessity for higher-grade machine tools for producing further extremely precise microminiature electronic part components, and the development for such improved machines is an urgent necessity.

Claims (1)

  1. A spindle tilting control device for a plane and spherical rotary grinding machine, fine gliding machine, lapping machine and polishing machine, which device can perpendicularly secure a spindle with respect to a rotary table by clamp bolts and can machine a spherical surface by tilting the spindle employing a - - spindle tilting joint with use of electric and chemical methods.
EP19810900634 1981-03-10 1981-03-10 Spindle tilting control device for plane and spherical rotary grinding machine, fine grinding machine, lapping machine, and polishing machine. Ceased EP0074406A4 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP1981/000053 WO1982003039A1 (en) 1981-03-10 1981-03-10 Spindle tilting control device for plane and spherical rotary grinding machine,fine gliding machine,lapping machine,and polishing machine

Publications (2)

Publication Number Publication Date
EP0074406A1 true EP0074406A1 (en) 1983-03-23
EP0074406A4 EP0074406A4 (en) 1984-09-05

Family

ID=13734200

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19810900634 Ceased EP0074406A4 (en) 1981-03-10 1981-03-10 Spindle tilting control device for plane and spherical rotary grinding machine, fine grinding machine, lapping machine, and polishing machine.

Country Status (2)

Country Link
EP (1) EP0074406A4 (en)
WO (1) WO1982003039A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105522471B (en) * 2016-01-17 2018-06-05 浙江陀曼智造科技有限公司 A kind of Superfinishing machine main shaft
CN112476128A (en) * 2020-10-20 2021-03-12 江苏鼎旭节能建材科技有限公司 Rock wool processing unhairing limit device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1096210A (en) * 1953-02-18 1955-06-16 Head for machines with a grinding wheel, such as a grinder or sharpener
FR1394279A (en) * 1964-02-21 1965-04-02 Tool head for grinding machine and universal grinding machine comprising
DE1446067A1 (en) * 1962-04-27 1969-01-23 Telefunken Patent Process for polishing semiconductor wafers with simultaneous application of an electrolytic and a mechanical treatment
DE1812312A1 (en) * 1967-12-15 1970-02-26 Karl Marx Stadt Tech Hochschul Methods and tools for external cylindrical machining, especially by electrolytic grinding

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB674718A (en) * 1950-12-01 1952-06-25 Jack Frye Improvements in or relating to surface grinding machines
GB971336A (en) * 1961-01-26 1964-09-30 Hjalmar Emanuel Sjostrand Surface grinding machine

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1096210A (en) * 1953-02-18 1955-06-16 Head for machines with a grinding wheel, such as a grinder or sharpener
DE1446067A1 (en) * 1962-04-27 1969-01-23 Telefunken Patent Process for polishing semiconductor wafers with simultaneous application of an electrolytic and a mechanical treatment
FR1394279A (en) * 1964-02-21 1965-04-02 Tool head for grinding machine and universal grinding machine comprising
DE1812312A1 (en) * 1967-12-15 1970-02-26 Karl Marx Stadt Tech Hochschul Methods and tools for external cylindrical machining, especially by electrolytic grinding

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO8203039A1 *

Also Published As

Publication number Publication date
WO1982003039A1 (en) 1982-09-16
EP0074406A4 (en) 1984-09-05

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Inventor name: ISHIMURA, YOSHIO