EP0044755B1 - Encapsulating housing resistant against high external pressures for a hybrid circuit - Google Patents

Encapsulating housing resistant against high external pressures for a hybrid circuit Download PDF

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Publication number
EP0044755B1
EP0044755B1 EP81400904A EP81400904A EP0044755B1 EP 0044755 B1 EP0044755 B1 EP 0044755B1 EP 81400904 A EP81400904 A EP 81400904A EP 81400904 A EP81400904 A EP 81400904A EP 0044755 B1 EP0044755 B1 EP 0044755B1
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EP
European Patent Office
Prior art keywords
substrate
shells
circuit
encapsulation housing
hybrid circuit
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
EP81400904A
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German (de)
French (fr)
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EP0044755A3 (en
EP0044755A2 (en
Inventor
Jacques Le Ny
Christian Val
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Thales SA
Original Assignee
Thomson CSF SA
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Publication of EP0044755A2 publication Critical patent/EP0044755A2/en
Publication of EP0044755A3 publication Critical patent/EP0044755A3/en
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Publication of EP0044755B1 publication Critical patent/EP0044755B1/en
Expired legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/165—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
    • H01L23/08—Containers; Seals characterised by the material of the container or its electrical properties the material being an electrical insulator, e.g. glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Definitions

  • the present invention relates to an encapsulation unit more particularly intended for hybrid circuits which are called upon to operate under high pressures, uniform and of hydrostatic type.
  • the amplification electronics must be as close as possible to the sensor so as to transmit an amplified signal, less disturbed by noise or by local parasites. What is easily achievable at pressures close to atmospheric pressure becomes very delicate when the pressure of the medium in which the circuit is to operate is high and exceeds for example 10 7 Pa.
  • the components of the hybrid circuits are not made to operate normally under high pressures, and the integrated circuit or semiconductor pads, the capacitors and resistors reported on a hybrid circuit substrate break beyond a few bars as well as the substrate itself.
  • Non-limiting examples of circuits operating under high pressures are given by circuits submerged by two or three thousand meters of bottom, or by circuits introduced inside industrial installations under pressure, so as to measure flow rates or pressures for example.
  • the generally adopted solution consists in enclosing the electronic circuit in a metal case, often of round or cylindrical shape, intended to resist external pressure.
  • a thermowell which enters an industrial installation is an example, but which is not applicable to a circuit submerged under several thousand meters of water.
  • the cable connection then requires that the metal case be provided with so-called "glass / metal> 0" passages, that is to say metal connections sealed in the case by glass beads. This type of sealing and its passages are eminently fragile.
  • the invention provides a solution to this double problem of the operation of a hybrid circuit under high pressure and to its electrical connections with the outside, by proposing an airtight casing according to claim 1 and consisting of a flat, thin substrate on which the hybrid circuit is made on one or both sides, and on which are reported two enveloping covers of convex shape devoid of sharp angles, arranged face to face so as to pinch the substrate.
  • the substrate extends beyond the perimeter of the covers, which makes it possible to fix there pins of external connections, which are electrically connected to the hybrid circuit inside the case by metallic tracks of thin thickness, deposited on the substrate, which tracks pass between substrate and cover in the thickness of the closure joint.
  • the sealing of the two covers on the substrate is ensured by any means known to those skilled in the art: bonding with an epoxy type adhesive on an alumina part gives excellent results.
  • Figure 1 shows a hybrid circuit box, seen in space, with its adaptation to withstand external pressure.
  • the hybrid circuit proper is deposited on a substrate wafer 1 and is protected by a first cover 2 on one side of the substrate wafer and by a second cover 3, on the other side of the substrate wafer, the covers 2 and 3 being in opposition.
  • the external connections are taken by pins of a known type 4.
  • the most common hybrid circuits are square or rectangular, which naturally led to the design of covers 2 and 3 which themselves have a square shape or rectangular suitable for the hybrid circuit.
  • Figure 2 shows another circuit box hybrid in an attempt which was made to find a solution to the problems of high pressures.
  • This type of housing is inspired by the metallic power transistor housings and it consists of two half-shells 6 and 7 made of a resistant metal such as stainless steel or titanium, which half-shells are welded on their periphery.
  • One of the half-shells, 6 in FIG. 2 corresponds to the base of a power transistor: it is in its central part 8 that the hybrid circuit is soldered, hidden in the figure since it is located inside the housing.
  • the other half-shell, 7 in FIG. 2 corresponds to the cover of the power transistor housing.
  • the electrical connections with the outside are made via output terminals which are electrically insulated and sealed in the half-shell 6 by means of glass beads.
  • FIG. 3 represents a view in space of the hybrid circuit encapsulation box according to the invention.
  • the hybrid circuit which is intended to operate under high pressures, is produced on a substrate wafer 10 conforming to the rules of the art.
  • the connection pads of the hybrid circuit proper are joined to the external connection pins 11 by means which will be developed later, which means use metal strips deposited on the substrate 10.
  • the encapsulation box according to the invention consists , inter alia, to be attached to the two main faces of the substrate 10, two identical half-shells or covers, 13 and 14, which have a convex shape devoid of sharp angles, these covers being fixed on either side of the substrate , so that the pressure exerted on the substrate, at the joint, by one of the covers is canceled by the pressure exerted by the other cover, and so that the central part of the substrate is thus inside the housing , outside the high pressure area.
  • each of the covers 13 and 14 is that which is best suited to the resistance to pressure, since all the forces are also distributed and perpendicular to the wall of the cover. Furthermore, the radius of the bulge of each of the covers is adapted to the pressure to be supported: this bulge can be fairly light for pressures of for example of the order of 5.10 6 Pa and reach a semi-spherical shape for pressures much more high.
  • the substrate of a hybrid circuit being conventionally made of alumina or a ceramic material
  • the two covers 13 and 14 are also and advantageously made of alumina or of a ceramic homogeneous with that of the substrate so that the mechanical and thermal characteristics are identical.
  • each of the two parts which serve as covers is adapted to the pressure to be supported: it is in any case sufficient on the edge of the covers which come into contact with the substrate 10 to allow sealing, either directly by means of an adhesive, either by means of sealing by welding, which then requires insulating joints to prevent the welding from short-circuiting between them the connection tracks 12.
  • each of the covers calls for the substrate to be square.
  • the square shape which is possible, is not happy, because the substrate then has four curvilinear triangles which are fragile, which is why it has been found that an octagonal shape is particularly advantageous: on the one hand , it makes it possible to fix output pins 11 on one to eight sides if necessary, these output pins being aligned on each of the sides, which corresponds to the traditional layout of the output pins.
  • the octagonal shape allows easier production of the substrates which are cut, either by laser or by striping, in the form of a square, in an alumina plate, and the four corners of which are then cut again so as to give octagons. This octagonal shape is therefore industrially more interesting than a square or round shape which is difficult to produce and the octagon inscribed fairly well inside its sides, the round shape of the covers.
  • Figure 4 shows an exploded view of the same hybrid circuit as that of Figure 3 in its housing resistant to high pressures.
  • Figure 4 has the further advantage of showing, thanks to a half-shell 13 which is shown in cutaway, the shape of the half-shells which serve as upper and lower covers for the housing resistant to high pressures according to the invention.
  • the half-shell 13 highlights on the one hand its internal concavity, which corresponds to the volume of the hybrid circuit which it is necessary to protect against pressure, and on the other hand, the thickness of the edge of this half-shell . Indeed, the thickness of each half-shell 13 and 14 has a double function in the invention.
  • the sealing of the half-shells 13 and 14 on the substrate 10 is done by the edge of the half-shells and the sealing is ensured by means of a seal with a certain surface of glue, surface necessary for the glue can withstand the effect of external pressure.
  • the two half-shells work in force opposition on either side of the substrate and, if they were too thin, there could be, for example following a bad bonding of two half-shells shells which are not exactly in opposition, shearing effect and breakage of the substrate.
  • the adhesive tape by which they adhere to the substrate would not be sufficient to withstand the external pressure exerted on the adhesive joint.
  • the conductive metal strips 12 being thin, a very small thickness of adhesive is sufficient to ensure the sealing and the bonding of the half-shells on the substrate and a thickness of a few tens of microns is largely sufficient and withstands pressure tests. .
  • the external connection terminals 11 shown in FIGS. 3 and 4 are metal pins of a known model frequent in hybrid circuits. However, they are outside the realm of the invention and they can be replaced by any other system suitable for the use requested for the hybrid circuit such as a wire connection directly welded to the metal strips 12, or by a taken by multiple connector.
  • FIG. 4 shows only a single hybrid circuit mounted on one face of the substrate 10. However, if the number of external connections allows it and if necessary, two hybrid circuits can be mounted respectively on each of the faces of the substrate, and the external pins are shared between those which are joined to a first hybrid circuit on a first face of the substrate, by means of a certain number of metal strips 12 on this first face of the substrate and those which are joined to a second hybrid circuit on the second face of the substrate by means of other metal strips 12 situated on the other face of the substrate.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Casings For Electric Apparatus (AREA)

Description

La présente invention concerne un boîtier d'encapsulation plus particulièrement destiné aux circuits hybrides qui sont appelés à fonctionner sous de fortes pressions, uniformes et de type hydrostatique.The present invention relates to an encapsulation unit more particularly intended for hybrid circuits which are called upon to operate under high pressures, uniform and of hydrostatic type.

Il est connu que dans le cas de mesures à faibles niveaux, l'électronique d'amplification doit se trouver le plus près possible du capteur de façon à transmettre un signal amplifié, moins perturbé par le bruit ou par des parasites locaux. Ce qui est facilement réalisable à des pressions proches de la pression atmosphérique devient très délicat lorsque la pression du milieu dans lequel doit fonctionner le circuit est élevée et dépasse par exemple 107 Pa.It is known that in the case of measurements at low levels, the amplification electronics must be as close as possible to the sensor so as to transmit an amplified signal, less disturbed by noise or by local parasites. What is easily achievable at pressures close to atmospheric pressure becomes very delicate when the pressure of the medium in which the circuit is to operate is high and exceeds for example 10 7 Pa.

En effet, les composants des circuits hybrides ne sont pas réalisés pour fonctionner normalement sous de fortes pressions, et les pastilles de circuits intégrés ou de semiconducteurs, les condensateurs et résistances rapportées sur un substrat de circuit hybride cassent au-delà de quelques bars ainsi que le substrat lui-même.Indeed, the components of the hybrid circuits are not made to operate normally under high pressures, and the integrated circuit or semiconductor pads, the capacitors and resistors reported on a hybrid circuit substrate break beyond a few bars as well as the substrate itself.

Des exemples, non limitatifs, de circuits fonctionnant sous de fortes pressions sont donnés par les circuits immergés par deux ou trois mille mètres de fond, ou par les circuits introduits à l'intérieur d'installations industrielles sous pression, de façon à mesurer des débits ou pressions par exemple.Non-limiting examples of circuits operating under high pressures are given by circuits submerged by two or three thousand meters of bottom, or by circuits introduced inside industrial installations under pressure, so as to measure flow rates or pressures for example.

La solution généralement adoptée consiste à enfermer le circuit électronique dans un boîtier métallique, souvent de forme ronde ou cylindrique, prévu pour résister à la pression externe. Un doigt de gant qui pénètre dans une installation industrielle en est un exemple, mais qui n'est pas applicable à un circuit immergé sous plusieurs milliers de mètres d'eau. Dans ce cas, la liaison par câble nécessite alors que le boîtier métallique soit muni de passages dits « verre/métal >0, c'est-à-dire de connexions métalliques scellées dans le boîtier par des perles de verre. Ce type de scellement et ses passages sont éminemment fragiles.The generally adopted solution consists in enclosing the electronic circuit in a metal case, often of round or cylindrical shape, intended to resist external pressure. A thermowell which enters an industrial installation is an example, but which is not applicable to a circuit submerged under several thousand meters of water. In this case, the cable connection then requires that the metal case be provided with so-called "glass / metal> 0" passages, that is to say metal connections sealed in the case by glass beads. This type of sealing and its passages are eminently fragile.

L'invention apporte une solution à ce double problème du fonctionnement d'un circuit hybride sous forte pression et à ses connexions électriques avec l'extérieur, en proposant un boîtier hermétique conforme à la revendication 1 et constitué par un substrat plan, mince, sur lequel le circuit hybride est réalisé sur l'une ou les deux faces, et sur lequel sont rapportés deux couvercles enveloppants de forme bombée dépourvue d'angles vifs, disposés face à face de façon à pincer le substrat.The invention provides a solution to this double problem of the operation of a hybrid circuit under high pressure and to its electrical connections with the outside, by proposing an airtight casing according to claim 1 and consisting of a flat, thin substrate on which the hybrid circuit is made on one or both sides, and on which are reported two enveloping covers of convex shape devoid of sharp angles, arranged face to face so as to pinch the substrate.

En outre, le substrat déborde le périmètre des couvercles, ce qui permet d'y fixer des broches de connexions externes, lesquelles sont reliées électriquement au circuit hybride à l'intérieur du boîtier par des pistes métalliques de faible épaisseur, déposées sur le substrat, lesquelles pistes passent entre substrat et couvercle dans l'épaisseur du joint de fermeture. Le scellement des deux couvercles sur le substrat est assuré par tout moyen connu de l'homme de l'art: un collage par une colle du type époxy sur pièce en alumine donne d'excellents résultats.In addition, the substrate extends beyond the perimeter of the covers, which makes it possible to fix there pins of external connections, which are electrically connected to the hybrid circuit inside the case by metallic tracks of thin thickness, deposited on the substrate, which tracks pass between substrate and cover in the thickness of the closure joint. The sealing of the two covers on the substrate is ensured by any means known to those skilled in the art: bonding with an epoxy type adhesive on an alumina part gives excellent results.

De façon plus précise, l'invention concerne un boîtier d'encapsulation résistant à de fortes pressions externes, pour circuit hybride réalisé sur substrat (10) plan en matériau de type céramique, caractérisé :

  • - d'une part en ce qu'il est constitué par deux demi-coquilles identiques (13 et 14), en un matériau rigide et isolant électrique, de forme bombée dépourvue d'angles vifs et présentant une concavité interne de dimensions adaptées au circuit à protéger (15), ces demi-coquilles étant disposées symétriquement sur les deux faces du substrat du circuit hybride, créant ainsi à l'intérieur du boîtier une zone hors pression, de déformation nulle ;
  • - d'autre part, en ce que les liaisons électriques, entre le circuit hybride (15) et les broches de connexions extérieures (11) sont assurées par des conducteurs métalliques (12) plats et minces, déposés sur au moins une face du substrat (10), et qui traversent le boîtier d'encapsulation dans le plan du joint de scellement d'une demi-coquille sur le substrat.
More specifically, the invention relates to an encapsulation box resistant to high external pressures, for a hybrid circuit produced on a flat substrate (10) made of ceramic type material, characterized:
  • - on the one hand in that it is constituted by two identical half-shells (13 and 14), in a rigid and electrically insulating material, of convex shape devoid of sharp angles and having an internal concavity of dimensions adapted to the circuit to be protected (15), these half-shells being arranged symmetrically on the two faces of the substrate of the hybrid circuit, thus creating inside the housing an area without pressure, of zero deformation;
  • - on the other hand, in that the electrical connections, between the hybrid circuit (15) and the external connection pins (11) are provided by flat and thin metallic conductors (12), deposited on at least one face of the substrate (10), and which pass through the encapsulation box in the plane of the sealing joint of a half-shell on the substrate.

L'invention sera mieux comprise par la description qui en suit laquelle s'appuie sur des figures d'exemples de réalisation qui concernent :

  • figure 1 un boîtier de circuit hybride selon l'art connu, en céramique, adapté pour résister à une pression externe ;
  • figure 2 un boîtier de circuit hybride selon l'art connu, métallique ;
  • figure 3 une vue dans l'espace du boîtier de circuit hybride selon l'invention, muni de ses couvercles résistant aux hautes pressions ;
  • figure 4 une vue en éclaté d'un circuit hybride selon l'invention avec ses deux couvercles.
The invention will be better understood from the description which follows, which is based on figures of exemplary embodiments which relate to:
  • Figure 1 a hybrid circuit housing according to the known art, ceramic, adapted to withstand external pressure;
  • Figure 2 a hybrid circuit housing according to the known art, metallic;
  • Figure 3 a view in space of the hybrid circuit housing according to the invention, provided with its covers resistant to high pressures;
  • Figure 4 an exploded view of a hybrid circuit according to the invention with its two covers.

La figure 1 représente un boîtier de circuit hybride, vu dans l'espace, avec son adaptation pour résister à une pression externe.Figure 1 shows a hybrid circuit box, seen in space, with its adaptation to withstand external pressure.

Le circuit hybride à proprement parler est déposé sur une plaquette de substrat 1 et est protégé par un premier couvercle 2 d'un côté de la plaquette de substrat et par un second couvercle 3, de l'autre côté de la plaquette de substrat, les couvercles 2 et 3 étant en opposition. Les connexions externes sont prises par des broches d'un type connu 4. Les circuits hybrides les plus répandus sont de forme carrée ou rectangulaire, ce qui a amené tout naturellement à concevoir des couvercles 2 et 3 qui ont eux-mêmes une forme carrée ou rectangulaire adaptée au circuit hybride.The hybrid circuit proper is deposited on a substrate wafer 1 and is protected by a first cover 2 on one side of the substrate wafer and by a second cover 3, on the other side of the substrate wafer, the covers 2 and 3 being in opposition. The external connections are taken by pins of a known type 4. The most common hybrid circuits are square or rectangular, which naturally led to the design of covers 2 and 3 which themselves have a square shape or rectangular suitable for the hybrid circuit.

En fait, si ce type de microboîtier, ou de protection externe, convient pour de faibles pressions, il ne résiste pas lorsque les pressions s'élèvent et atteignent par exemple 107 Pa, car alors il y a accumulation de contraintes dans les angles vifs 5 des couvercles qui sont disloqués et pulvérisés par la pression.In fact, if this type of micro-housing, or external protection, is suitable for low pressures, it does not resist when the pressures rise and reach for example 10 7 Pa, because then there is accumulation of stresses in the sharp corners 5 of the covers which are dislocated and sprayed by pressure.

La figure 2 représente un autre boîtier de circuit hybride dans une tentative qui a été faite pour trouver une solution aux problèmes de hautes pressions.Figure 2 shows another circuit box hybrid in an attempt which was made to find a solution to the problems of high pressures.

Ce type de boîtier est inspiré des boîtiers de transistors de puissance métalliques et il est constitué par deux demi-coquilles 6 et 7 en un métal résistant tel qu'un acier inoxydable ou du titane, lesquelles demi-coquilles sont soudées sur leur périphérie. L'une des demi-coquilles, 6 sur la figure 2, correspond à l'embase d'un transistor de puissance : c'est dans sa partie centrale 8 qu'est soudé le circuit hybride, caché sur la figure puisque celui-ci se trouve à l'intérieur du boîtier. L'autre demi-coquille, 7 sur la figure 2, correspond au couvercle du boîtier du transistor de puissance. Les connexions électriques avec l'extérieur se font par l'intermédiaire de bornes de sortie qui sont isolées électriquement et scellées dans la demi-coquille 6 au moyen de perles de verre.This type of housing is inspired by the metallic power transistor housings and it consists of two half-shells 6 and 7 made of a resistant metal such as stainless steel or titanium, which half-shells are welded on their periphery. One of the half-shells, 6 in FIG. 2, corresponds to the base of a power transistor: it is in its central part 8 that the hybrid circuit is soldered, hidden in the figure since it is located inside the housing. The other half-shell, 7 in FIG. 2, corresponds to the cover of the power transistor housing. The electrical connections with the outside are made via output terminals which are electrically insulated and sealed in the half-shell 6 by means of glass beads.

Il s'agit là d'une adaptation de boîtiers hybrides dans une encapsulation connue depuis longtemps, adaptation qui ne pose aucun problème pour des circuits hybrides qui doivent fonctionner à la pression atmosphérique, mais qui doivent par exemple être protégés de la corrosion par un boîtier étanche ; par contre, cette adaptation pose de délicats problèmes de résistance des passages verre/métal, ou des perles de verre 9, lorsque les pressions sont élevées, 2 à 4.107 Pa par exemple.This is an adaptation of hybrid boxes in an encapsulation known for a long time, an adaptation which poses no problem for hybrid circuits which must operate at atmospheric pressure, but which must for example be protected from corrosion by a housing. waterproof; on the other hand, this adaptation poses delicate problems of resistance of the glass / metal passages, or of the glass beads 9, when the pressures are high, 2 to 4.10 7 Pa for example.

En outre, cette adaptation d'un boîtier connu présente industriellement l'inconvénient de nécessiter un usinage des demi-coquilles, un polissage des surfaces en contact pour la soudure et d'être réalisée dans des matériaux et au moyen de procédés coûteux, ce qui en rend, dans bien des cas, le prix prohibitif.In addition, this adaptation of a known housing has the drawback industrially of requiring machining of the half-shells, polishing of the surfaces in contact for welding and being carried out in materials and by means of expensive methods, which In many cases, the price is prohibitive.

La figure 3 représente une vue dans l'espace du boîtier d'encapsulation de circuit hybride selon l'invention.FIG. 3 represents a view in space of the hybrid circuit encapsulation box according to the invention.

Le circuit hybride qui est destiné à fonctionner sous de fortes pressions, est réalisé sur une plaquette de substrat 10 conforme aux règles de l'art. Les plots de connexion du circuit hybride à proprement parler sont réunis aux broches de connexions externes 11 par des moyens qui seront développés ultérieurement, lesquels moyens mettent en oeuvre des bandes métalliques déposées sur le substrat 10. Le boîtier d'encapsulation selon l'invention consiste, entre autre, à rapporter sur les deux faces principales du substrat 10, deux demi-coquilles ou couvercles identiques, 13 et 14, qui ont une forme bombée dépourvue d'angles vifs, ces couvercles étant fixés de part et d'autre du substrat, de telle façon que la pression exercée sur le substrat, au niveau du joint, par l'un des couvercles soit annulée par la pression exercée par l'autre couvercle, et que la partie centrale du substrat soit ainsi à l'intérieur du boîtier, hors zone de fortes pressions.The hybrid circuit, which is intended to operate under high pressures, is produced on a substrate wafer 10 conforming to the rules of the art. The connection pads of the hybrid circuit proper are joined to the external connection pins 11 by means which will be developed later, which means use metal strips deposited on the substrate 10. The encapsulation box according to the invention consists , inter alia, to be attached to the two main faces of the substrate 10, two identical half-shells or covers, 13 and 14, which have a convex shape devoid of sharp angles, these covers being fixed on either side of the substrate , so that the pressure exerted on the substrate, at the joint, by one of the covers is canceled by the pressure exerted by the other cover, and so that the central part of the substrate is thus inside the housing , outside the high pressure area.

La forme circulaire de chacun des couvercles 13 et 14 est celle qui est le mieux adaptée à la résistance à la pression, puisque toute les forces sont également réparties et perpendiculaires à la paroi du couvercle. Par ailleurs, le rayon du bombement de chacun des couvercles est adapté à la pression à supporter : ce bombement peut être assez léger pour des pressions par exemple de l'ordre de 5.106 Pa et atteindre une forme demi-sphérique pour des pressions beaucoup plus élevées.The circular shape of each of the covers 13 and 14 is that which is best suited to the resistance to pressure, since all the forces are also distributed and perpendicular to the wall of the cover. Furthermore, the radius of the bulge of each of the covers is adapted to the pressure to be supported: this bulge can be fairly light for pressures of for example of the order of 5.10 6 Pa and reach a semi-spherical shape for pressures much more high.

Le substrat d'un circuit hybride étant classiquement en alumine ou en un matériau céramique, les deux couvercles 13 et 14 sont également et avantageusement réalisés en alumine ou en une céramique homogène avec celle du substrat de façon à ce que les caractéristiques mécaniques et thermiques soient identiques.The substrate of a hybrid circuit being conventionally made of alumina or a ceramic material, the two covers 13 and 14 are also and advantageously made of alumina or of a ceramic homogeneous with that of the substrate so that the mechanical and thermal characteristics are identical.

L'épaisseur de chacune des deux pièces qui servent de couvercles est adaptée à la pression à supporter : elle est en tout cas suffisante sur le bord des couvercles qui entrent en contact avec le substrat 10 pour permettre un scellement, soit directement au moyen d'une colle, soit par l'intermédiaire d'un scellement par soudure, lequel nécessite alors des joints isolants pour éviter que la soudure ne court-circuite entre elles les pistes de connexion 12.The thickness of each of the two parts which serve as covers is adapted to the pressure to be supported: it is in any case sufficient on the edge of the covers which come into contact with the substrate 10 to allow sealing, either directly by means of an adhesive, either by means of sealing by welding, which then requires insulating joints to prevent the welding from short-circuiting between them the connection tracks 12.

La forme ronde de chacun des couvercles appelle que le substrat soit carré. En fait, la forme carrée, qui est possible, n'est pas heureuse, car le substrat présente alors quatre triangles curvilignes qui sont fragiles, c'est pourquoi il a été trouvé qu'une forme octogonale est particulièrement avantageuse : d'une part, elle permet de fixer des broches de sortie 11 sur un à huit côtés si nécessaire, ces broches de sortie étant alignées sur chacun des côtés, ce qui correspond à l'implantation traditionnelle des broches de sortie. D'autre part, la forme octogonale permet une réalisation plus aisée des substrats qui sont découpés, soit au laser, soit par rayage, sous forme de carré, dans une plaque d'alumine, et dont les quatre coins sont ensuite redécoupés de façon à donner des octogones. Cette forme octogonale est donc industriellement plus intéressante qu'une forme carrée ou ronde délicate à réaliser et l'octogone inscrit assez bien à l'intérieur de ses côtés, la forme ronde des couvercles.The round shape of each of the covers calls for the substrate to be square. In fact, the square shape, which is possible, is not happy, because the substrate then has four curvilinear triangles which are fragile, which is why it has been found that an octagonal shape is particularly advantageous: on the one hand , it makes it possible to fix output pins 11 on one to eight sides if necessary, these output pins being aligned on each of the sides, which corresponds to the traditional layout of the output pins. On the other hand, the octagonal shape allows easier production of the substrates which are cut, either by laser or by striping, in the form of a square, in an alumina plate, and the four corners of which are then cut again so as to give octagons. This octagonal shape is therefore industrially more interesting than a square or round shape which is difficult to produce and the octagon inscribed fairly well inside its sides, the round shape of the covers.

La figure 4 représente une vue en éclaté du même circuit hybride que celui de la figure 3 dans son boîtier résistant aux fortes pressions.Figure 4 shows an exploded view of the same hybrid circuit as that of Figure 3 in its housing resistant to high pressures.

Cette figure permet de mieux distinguer le substrat 10 sur lequel la pastille de circuit hybride 15 est soudée selon la technologie habituelle et classique de tous les circuits hybrides aux broches de connexions extérieures 11, par l'intermédiaire des bandes métalliques plates et minces 12, au moyen de fils de connexion 16. Les bandes métalliques 12 sont représentées rectilignes, mais leur dessin peut être différent et adapté aux nécessités de la connexion du circuit hybride 15. De la même façon, on peut très bien concevoir que le circuit hybride 15 soit réuni aux broches 11 et aux bornes métalliques 12 par un système de soudure collective du style TAB, c'est-à-dire par une soudure collective au moyen d'un film pour transfert automatique sur bande.This figure makes it possible to better distinguish the substrate 10 on which the hybrid circuit patch 15 is soldered according to the usual and conventional technology of all the hybrid circuits to the external connection pins 11, by means of the flat and thin metal strips 12, at the means of connection wires 16. The metal strips 12 are shown to be rectilinear, but their design may be different and adapted to the requirements of the connection of the hybrid circuit 15. In the same way, it is very conceivable that the hybrid circuit 15 is combined to pins 11 and to metal terminals 12 by a collective welding system of the TAB style, that is to say by a collective welding by means of a film for automatic transfer to tape.

La figure 4 a en outre l'avantage de montrer, grâce à une demi-coquille 13 qui est représentée en écorché, la forme des demi-coquilles qui servent de couvercles supérieur et inférieur pour le boîtier résistant aux fortes pressions selon l'invention.Figure 4 has the further advantage of showing, thanks to a half-shell 13 which is shown in cutaway, the shape of the half-shells which serve as upper and lower covers for the housing resistant to high pressures according to the invention.

La demi-coquille 13 met en évidence d'une part sa concavité interne, laquelle correspond au volume du circuit hybride qu'il est nécessaire de protéger contre la pression, et d'autre part, l'épaisseur du bord de cette demi-coquille. En effet, l'épaisseur de chaque demi-coquille 13 et 14 a une double fonction dans l'invention. En premier lieu, le scellement des demi-coquilles 13 et 14 sur le substrat 10 se fait par le bord des demi-coquilles et l'étanchéité est assurée grâce à un joint d'une certaine surface de colle, surface nécessaire pour que la colle puisse résister à l'effet de la pression extérieure. D'autre part, les deux demi-coquilles travaillent en opposition de force de part et d'autre du substrat et, si elles étaient trop minces, il pourrait y avoir, par exemple à la suite d'un mauvais collage de deux demi-coquilles qui ne seraient pas exactement en opposition, effet de cisaillement et cassure du substrat. En outre, si les demi-coquilles étaient minces, le ruban de colle par lequel elles adhèrent sur le substrat ne serait pas suffisant pour résister à la pression externe qui s'exerce sur le joint de colle. Toutefois, les bandes métalliques conductrices 12 étant minces, une très faible épaisseur de colle est suffisante pour assurer l'étanchéité et le collage des demi-coquilles sur le substrat et une épaisseur de quelques dizaines de microns est largement suffisante et résiste aux essais en pression.The half-shell 13 highlights on the one hand its internal concavity, which corresponds to the volume of the hybrid circuit which it is necessary to protect against pressure, and on the other hand, the thickness of the edge of this half-shell . Indeed, the thickness of each half-shell 13 and 14 has a double function in the invention. First, the sealing of the half-shells 13 and 14 on the substrate 10 is done by the edge of the half-shells and the sealing is ensured by means of a seal with a certain surface of glue, surface necessary for the glue can withstand the effect of external pressure. On the other hand, the two half-shells work in force opposition on either side of the substrate and, if they were too thin, there could be, for example following a bad bonding of two half-shells shells which are not exactly in opposition, shearing effect and breakage of the substrate. In addition, if the half-shells were thin, the adhesive tape by which they adhere to the substrate would not be sufficient to withstand the external pressure exerted on the adhesive joint. However, the conductive metal strips 12 being thin, a very small thickness of adhesive is sufficient to ensure the sealing and the bonding of the half-shells on the substrate and a thickness of a few tens of microns is largely sufficient and withstands pressure tests. .

Les bornes de connexion extérieures 11 représentées sur les figures 3 et 4 sont des broches métalliques d'un modèle connu fréquent dans les circuits hybrides. Cependant, elles sortent du domaine de l'invention à proprement parler et elles peuvent être remplacées par tout autre système convenant à l'usage demandé pour le circuit hybride tel qu'une liaison par fil directement soudé sur les bandes métalliques 12, ou par une prise par connecteur multiple.The external connection terminals 11 shown in FIGS. 3 and 4 are metal pins of a known model frequent in hybrid circuits. However, they are outside the realm of the invention and they can be replaced by any other system suitable for the use requested for the hybrid circuit such as a wire connection directly welded to the metal strips 12, or by a taken by multiple connector.

La figure 4 ne laisse voir qu'un seul circuit hybride monté sur une face du substrat 10. Cependant, si le nombre de connexions externes le permet et si cela est nécessaire, deux circuits hybrides peuvent être montés respectivement sur chacune des faces du substrat, et les broches externes sont partagées entre celles qui sont réunies à un premier circuit hybride sur une première face du substrat, par l'intermédiaire d'un certain nombre de bandes métalliques 12 sur cette première face du substrat et celles qui sont réunies à un second circuit hybride sur la seconde face du substrat par l'intermédiaire d'autres bandes métalliques 12 situées sur l'autre face du substrat.FIG. 4 shows only a single hybrid circuit mounted on one face of the substrate 10. However, if the number of external connections allows it and if necessary, two hybrid circuits can be mounted respectively on each of the faces of the substrate, and the external pins are shared between those which are joined to a first hybrid circuit on a first face of the substrate, by means of a certain number of metal strips 12 on this first face of the substrate and those which are joined to a second hybrid circuit on the second face of the substrate by means of other metal strips 12 situated on the other face of the substrate.

L'invention ne se limite pas à la description qui en a été faite en s'appuyant sur un exemple de réalisation, mais d'autres avantages et caractéristiques de l'invention ressortiront des revendications ci-après.The invention is not limited to the description which has been made thereof based on an exemplary embodiment, but other advantages and characteristics of the invention will emerge from the claims below.

Claims (7)

1. Encapsulation housing withstanding high external pressures for an hybride circuit (15) formed on a plane substrate (10) of material of ceramic type, characterized :
- on the one hand, in that it is formed of two identical half-shells (13 and 14) of a rigid and electrically insulating material and of regularly bulged shape without acute angles and having an internal concavity of dimensions adapted to the circuit to be protected, these half-shells (13, 14) being symmetrically disposed on the two faces of the substrate (10) of the hybride circuit (15), said substrate (10) having dimensions exceeding those of the half-shells (13, 14) forming the housing ;
- and on the other hand, in that the electrical connections between the hybride circuit (15) and the outer terminals (11) are ensured by thin metallic flat conductors (12) formed by serigraphy on the substrate (10) and crossing the encapsulation housing in the plane of the sealing junction of one half-shell on the substrat.
2. Encapsulation housing according to claim 1, characterized in that the two half-shells (13 and 14) have a round bulged shape.
3. Encapsulation housing according to claim 1, characterized in that the two half-shells (13 and 14) have an oval shape.
4. Encapsulation housing according to claim 1, characterized in that the two half-shells (13 and 14) have the same diameter and dimensions smaller than the substrate (10), this latter being divided into two zones :
- one zone inside the housing, but not subjected to pressure, which bears the hybrid circuit and the internal part of the metallic conductors (12) ;
- one zone outside the housing, subjected to pressure, that bears on its periphery the connections (11) and the external part of the metallic conductors (12). '
5. Encapsulation housing according to claim 1, characterized in that the mechanical and thermal characteristics of the substrate (10) and of the two half-shells (13 and 14) are identical, the substrate and the housing being formed of the same rigid and electrically insulating material such as alumina.
6. Encapsulation housing according to claim 1, characterized in that the thickness and the convexity of the two half-shells (13 and 14) are adapted to the external pressure.
7. Encapsulation housing according to claim 1, characterized in that the two half-shells (13 and 14) are assembled on the substrate (10) by bonding using an adhesive of epoxy type which is electrically insulating and ensures the tightness at the metallic conductors (12).
EP81400904A 1980-06-19 1981-06-05 Encapsulating housing resistant against high external pressures for a hybrid circuit Expired EP0044755B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR8013596A FR2485262A1 (en) 1980-06-19 1980-06-19 ENCAPSULATION HOUSING RESISTANT TO HIGH EXTERNAL PRESSURES
FR8013596 1980-06-19

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EP0044755A2 EP0044755A2 (en) 1982-01-27
EP0044755A3 EP0044755A3 (en) 1982-02-10
EP0044755B1 true EP0044755B1 (en) 1984-06-13

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EP81400904A Expired EP0044755B1 (en) 1980-06-19 1981-06-05 Encapsulating housing resistant against high external pressures for a hybrid circuit

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US (1) US4518818A (en)
EP (1) EP0044755B1 (en)
DE (1) DE3164131D1 (en)
FR (1) FR2485262A1 (en)

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FR2591801B1 (en) * 1985-12-17 1988-10-14 Inf Milit Spatiale Aeronaut ENCAPSULATION BOX OF AN ELECTRONIC CIRCUIT
FR2688629A1 (en) * 1992-03-10 1993-09-17 Thomson Csf Method and device for three-dimensional encapsulation of semiconductor chips
FR2709020B1 (en) * 1993-08-13 1995-09-08 Thomson Csf Method for interconnecting three-dimensional semiconductor wafers, and component resulting therefrom.
FR2719967B1 (en) * 1994-05-10 1996-06-07 Thomson Csf Three-dimensional interconnection of electronic component boxes using printed circuits.
FR2802706B1 (en) * 1999-12-15 2002-03-01 3D Plus Sa METHOD AND DEVICE FOR THREE-DIMENSIONAL INTERCONNECTION OF ELECTRONIC COMPONENTS
FR2832136B1 (en) * 2001-11-09 2005-02-18 3D Plus Sa DEVICE FOR HERMETIC ENCAPSULATION OF COMPONENT TO BE PROTECTED FROM ANY STRESS
FR2875672B1 (en) * 2004-09-21 2007-05-11 3D Plus Sa Sa ELECTRONIC DEVICE WITH INTEGRATED HEAT DISTRIBUTOR
FR2884049B1 (en) * 2005-04-01 2007-06-22 3D Plus Sa Sa LOW THICK ELECTRONIC MODULE COMPRISING A STACK OF CONNECTING BIT ELECTRONIC BOXES
FR2894070B1 (en) * 2005-11-30 2008-04-11 3D Plus Sa Sa 3D ELECTRONIC MODULE
FR2895568B1 (en) * 2005-12-23 2008-02-08 3D Plus Sa Sa COLLECTIVE MANUFACTURING METHOD OF 3D ELECTRONIC MODULES
FR2905198B1 (en) * 2006-08-22 2008-10-17 3D Plus Sa Sa COLLECTIVE MANUFACTURING METHOD OF 3D ELECTRONIC MODULES
FR2911995B1 (en) * 2007-01-30 2009-03-06 3D Plus Sa Sa METHOD FOR INTERCONNECTING ELECTRONIC WAFERS
FR2923081B1 (en) * 2007-10-26 2009-12-11 3D Plus PROCESS FOR VERTICAL INTERCONNECTION OF 3D ELECTRONIC MODULES BY VIAS.
FR2940521B1 (en) 2008-12-19 2011-11-11 3D Plus COLLECTIVE MANUFACTURING METHOD OF ELECTRONIC MODULES FOR SURFACE MOUNTING
FR2943176B1 (en) 2009-03-10 2011-08-05 3D Plus METHOD FOR POSITIONING CHIPS WHEN MANUFACTURING A RECONSTITUTED PLATE

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Also Published As

Publication number Publication date
EP0044755A3 (en) 1982-02-10
FR2485262A1 (en) 1981-12-24
FR2485262B1 (en) 1984-10-26
DE3164131D1 (en) 1984-07-19
EP0044755A2 (en) 1982-01-27
US4518818A (en) 1985-05-21

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