EP0043265B1 - Gas separating material - Google Patents
Gas separating material Download PDFInfo
- Publication number
- EP0043265B1 EP0043265B1 EP19810302917 EP81302917A EP0043265B1 EP 0043265 B1 EP0043265 B1 EP 0043265B1 EP 19810302917 EP19810302917 EP 19810302917 EP 81302917 A EP81302917 A EP 81302917A EP 0043265 B1 EP0043265 B1 EP 0043265B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- gas
- formula
- dense film
- separating material
- imide polymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 title claims description 21
- 239000007789 gas Substances 0.000 claims description 55
- 229920000642 polymer Polymers 0.000 claims description 49
- -1 aromatic imide Chemical class 0.000 claims description 34
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 14
- 229910001873 dinitrogen Inorganic materials 0.000 claims description 10
- 229910002091 carbon monoxide Inorganic materials 0.000 claims description 8
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 claims description 7
- 125000004432 carbon atom Chemical group C* 0.000 claims description 7
- 230000035699 permeability Effects 0.000 claims description 7
- 229910001882 dioxygen Inorganic materials 0.000 claims description 6
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 claims description 5
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 5
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 4
- 239000010408 film Substances 0.000 description 62
- 150000003949 imides Chemical group 0.000 description 35
- 238000000034 method Methods 0.000 description 25
- 229920005575 poly(amic acid) Polymers 0.000 description 24
- 239000000203 mixture Substances 0.000 description 21
- 150000004984 aromatic diamines Chemical class 0.000 description 13
- 239000002904 solvent Substances 0.000 description 12
- 125000003118 aryl group Chemical group 0.000 description 11
- 238000006116 polymerization reaction Methods 0.000 description 11
- 229920001721 polyimide Polymers 0.000 description 9
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical class C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 8
- JVERADGGGBYHNP-UHFFFAOYSA-N 5-phenylbenzene-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C(C(=O)O)=CC(C=2C=CC=CC=2)=C1C(O)=O JVERADGGGBYHNP-UHFFFAOYSA-N 0.000 description 8
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 8
- JRBJSXQPQWSCCF-UHFFFAOYSA-N 3,3'-Dimethoxybenzidine Chemical group C1=C(N)C(OC)=CC(C=2C=C(OC)C(N)=CC=2)=C1 JRBJSXQPQWSCCF-UHFFFAOYSA-N 0.000 description 7
- 239000004642 Polyimide Substances 0.000 description 7
- 239000002798 polar solvent Substances 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- WXNZTHHGJRFXKQ-UHFFFAOYSA-N 4-chlorophenol Chemical compound OC1=CC=C(Cl)C=C1 WXNZTHHGJRFXKQ-UHFFFAOYSA-N 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 6
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 6
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 5
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 4
- 150000008064 anhydrides Chemical class 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 239000011541 reaction mixture Substances 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 150000000000 tetracarboxylic acids Chemical class 0.000 description 4
- NUIURNJTPRWVAP-UHFFFAOYSA-N 3,3'-Dimethylbenzidine Chemical compound C1=C(N)C(C)=CC(C=2C=C(C)C(N)=CC=2)=C1 NUIURNJTPRWVAP-UHFFFAOYSA-N 0.000 description 3
- UENRXLSRMCSUSN-UHFFFAOYSA-N 3,5-diaminobenzoic acid Chemical compound NC1=CC(N)=CC(C(O)=O)=C1 UENRXLSRMCSUSN-UHFFFAOYSA-N 0.000 description 3
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 description 3
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- HFACYLZERDEVSX-UHFFFAOYSA-N benzidine Chemical compound C1=CC(N)=CC=C1C1=CC=C(N)C=C1 HFACYLZERDEVSX-UHFFFAOYSA-N 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 150000002431 hydrogen Chemical class 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Natural products C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 150000002989 phenols Chemical class 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 150000003568 thioethers Chemical class 0.000 description 3
- AVQQQNCBBIEMEU-UHFFFAOYSA-N 1,1,3,3-tetramethylurea Chemical compound CN(C)C(=O)N(C)C AVQQQNCBBIEMEU-UHFFFAOYSA-N 0.000 description 2
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 2
- LDQMZKBIBRAZEA-UHFFFAOYSA-N 2,4-diaminobenzoic acid Chemical compound NC1=CC=C(C(O)=O)C(N)=C1 LDQMZKBIBRAZEA-UHFFFAOYSA-N 0.000 description 2
- ISPYQTSUDJAMAB-UHFFFAOYSA-N 2-chlorophenol Chemical compound OC1=CC=CC=C1Cl ISPYQTSUDJAMAB-UHFFFAOYSA-N 0.000 description 2
- TUAMRELNJMMDMT-UHFFFAOYSA-N 3,5-xylenol Chemical compound CC1=CC(C)=CC(O)=C1 TUAMRELNJMMDMT-UHFFFAOYSA-N 0.000 description 2
- LJGHYPLBDBRCRZ-UHFFFAOYSA-N 3-(3-aminophenyl)sulfonylaniline Chemical compound NC1=CC=CC(S(=O)(=O)C=2C=C(N)C=CC=2)=C1 LJGHYPLBDBRCRZ-UHFFFAOYSA-N 0.000 description 2
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 2
- LFBALUPVVFCEPA-UHFFFAOYSA-N 4-(3,4-dicarboxyphenyl)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)C(C(O)=O)=C1 LFBALUPVVFCEPA-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 2
- ZHNUHDYFZUAESO-UHFFFAOYSA-N Formamide Chemical compound NC=O ZHNUHDYFZUAESO-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Chemical compound BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000007872 degassing Methods 0.000 description 2
- 229940113088 dimethylacetamide Drugs 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 229940018564 m-phenylenediamine Drugs 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 230000001376 precipitating effect Effects 0.000 description 2
- 238000007363 ring formation reaction Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- FYSNRJHAOHDILO-UHFFFAOYSA-N thionyl chloride Chemical compound ClS(Cl)=O FYSNRJHAOHDILO-UHFFFAOYSA-N 0.000 description 2
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 2
- FHBXQJDYHHJCIF-UHFFFAOYSA-N (2,3-diaminophenyl)-phenylmethanone Chemical class NC1=CC=CC(C(=O)C=2C=CC=CC=2)=C1N FHBXQJDYHHJCIF-UHFFFAOYSA-N 0.000 description 1
- GGAUUQHSCNMCAU-ZXZARUISSA-N (2s,3r)-butane-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C[C@H](C(O)=O)[C@H](C(O)=O)CC(O)=O GGAUUQHSCNMCAU-ZXZARUISSA-N 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- NKNIZOPLGAJLRV-UHFFFAOYSA-N 2,2-diphenylpropane-1,1-diamine Chemical class C=1C=CC=CC=1C(C(N)N)(C)C1=CC=CC=C1 NKNIZOPLGAJLRV-UHFFFAOYSA-N 0.000 description 1
- BAHPQISAXRFLCL-UHFFFAOYSA-N 2,4-Diaminoanisole Chemical compound COC1=CC=C(N)C=C1N BAHPQISAXRFLCL-UHFFFAOYSA-N 0.000 description 1
- HGUYBLVGLMAUFF-UHFFFAOYSA-N 2-methoxybenzene-1,4-diamine Chemical compound COC1=CC(N)=CC=C1N HGUYBLVGLMAUFF-UHFFFAOYSA-N 0.000 description 1
- YCOXTKKNXUZSKD-UHFFFAOYSA-N 3,4-xylenol Chemical compound CC1=CC=C(O)C=C1C YCOXTKKNXUZSKD-UHFFFAOYSA-N 0.000 description 1
- NBAUUNCGSMAPFM-UHFFFAOYSA-N 3-(3,4-dicarboxyphenyl)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C1=CC=CC(C(O)=O)=C1C(O)=O NBAUUNCGSMAPFM-UHFFFAOYSA-N 0.000 description 1
- LXJLFVRAWOOQDR-UHFFFAOYSA-N 3-(3-aminophenoxy)aniline Chemical compound NC1=CC=CC(OC=2C=C(N)C=CC=2)=C1 LXJLFVRAWOOQDR-UHFFFAOYSA-N 0.000 description 1
- NDXGRHCEHPFUSU-UHFFFAOYSA-N 3-(3-aminophenyl)aniline Chemical group NC1=CC=CC(C=2C=C(N)C=CC=2)=C1 NDXGRHCEHPFUSU-UHFFFAOYSA-N 0.000 description 1
- ZMPZWXKBGSQATE-UHFFFAOYSA-N 3-(4-aminophenyl)sulfonylaniline Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=CC(N)=C1 ZMPZWXKBGSQATE-UHFFFAOYSA-N 0.000 description 1
- CKOFBUUFHALZGK-UHFFFAOYSA-N 3-[(3-aminophenyl)methyl]aniline Chemical compound NC1=CC=CC(CC=2C=C(N)C=CC=2)=C1 CKOFBUUFHALZGK-UHFFFAOYSA-N 0.000 description 1
- DVXYMCJCMDTSQA-UHFFFAOYSA-N 3-[2-(3-aminophenyl)propan-2-yl]aniline Chemical compound C=1C=CC(N)=CC=1C(C)(C)C1=CC=CC(N)=C1 DVXYMCJCMDTSQA-UHFFFAOYSA-N 0.000 description 1
- JSIVTKBYJLGBPY-UHFFFAOYSA-N 3-aminobenzohydrazide Chemical compound NNC(=O)C1=CC=CC(N)=C1 JSIVTKBYJLGBPY-UHFFFAOYSA-N 0.000 description 1
- GMZKNRDHSHYMHG-UHFFFAOYSA-N 3-bromo-4-methylphenol Chemical compound CC1=CC=C(O)C=C1Br GMZKNRDHSHYMHG-UHFFFAOYSA-N 0.000 description 1
- OTUYBYTUBWJBLO-UHFFFAOYSA-N 3-bromo-5-methylphenol Chemical compound CC1=CC(O)=CC(Br)=C1 OTUYBYTUBWJBLO-UHFFFAOYSA-N 0.000 description 1
- MNOJRWOWILAHAV-UHFFFAOYSA-N 3-bromophenol Chemical compound OC1=CC=CC(Br)=C1 MNOJRWOWILAHAV-UHFFFAOYSA-N 0.000 description 1
- VQZRLBWPEHFGCD-UHFFFAOYSA-N 3-chloro-4-methylphenol Chemical compound CC1=CC=C(O)C=C1Cl VQZRLBWPEHFGCD-UHFFFAOYSA-N 0.000 description 1
- HORNXRXVQWOLPJ-UHFFFAOYSA-N 3-chlorophenol Chemical compound OC1=CC=CC(Cl)=C1 HORNXRXVQWOLPJ-UHFFFAOYSA-N 0.000 description 1
- WECDUOXQLAIPQW-UHFFFAOYSA-N 4,4'-Methylene bis(2-methylaniline) Chemical compound C1=C(N)C(C)=CC(CC=2C=C(C)C(N)=CC=2)=C1 WECDUOXQLAIPQW-UHFFFAOYSA-N 0.000 description 1
- UITKHKNFVCYWNG-UHFFFAOYSA-N 4-(3,4-dicarboxybenzoyl)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 UITKHKNFVCYWNG-UHFFFAOYSA-N 0.000 description 1
- AIVVXPSKEVWKMY-UHFFFAOYSA-N 4-(3,4-dicarboxyphenoxy)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1OC1=CC=C(C(O)=O)C(C(O)=O)=C1 AIVVXPSKEVWKMY-UHFFFAOYSA-N 0.000 description 1
- VILWHDNLOJCHNJ-UHFFFAOYSA-N 4-(3,4-dicarboxyphenyl)sulfanylphthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1SC1=CC=C(C(O)=O)C(C(O)=O)=C1 VILWHDNLOJCHNJ-UHFFFAOYSA-N 0.000 description 1
- AVCOFPOLGHKJQB-UHFFFAOYSA-N 4-(3,4-dicarboxyphenyl)sulfonylphthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1S(=O)(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 AVCOFPOLGHKJQB-UHFFFAOYSA-N 0.000 description 1
- MITHMOYLTXMLRB-UHFFFAOYSA-N 4-(4-aminophenyl)sulfinylaniline Chemical compound C1=CC(N)=CC=C1S(=O)C1=CC=C(N)C=C1 MITHMOYLTXMLRB-UHFFFAOYSA-N 0.000 description 1
- GEYAGBVEAJGCFB-UHFFFAOYSA-N 4-[2-(3,4-dicarboxyphenyl)propan-2-yl]phthalic acid Chemical compound C=1C=C(C(O)=O)C(C(O)=O)=CC=1C(C)(C)C1=CC=C(C(O)=O)C(C(O)=O)=C1 GEYAGBVEAJGCFB-UHFFFAOYSA-N 0.000 description 1
- ZYEDGEXYGKWJPB-UHFFFAOYSA-N 4-[2-(4-aminophenyl)propan-2-yl]aniline Chemical compound C=1C=C(N)C=CC=1C(C)(C)C1=CC=C(N)C=C1 ZYEDGEXYGKWJPB-UHFFFAOYSA-N 0.000 description 1
- WPBZMCGPFHZRHJ-UHFFFAOYSA-N 4-aminobenzohydrazide Chemical compound NNC(=O)C1=CC=C(N)C=C1 WPBZMCGPFHZRHJ-UHFFFAOYSA-N 0.000 description 1
- IWJGMJHAIUBWKT-UHFFFAOYSA-N 4-bromo-2-methylphenol Chemical compound CC1=CC(Br)=CC=C1O IWJGMJHAIUBWKT-UHFFFAOYSA-N 0.000 description 1
- GPOQODYGMUTOQL-UHFFFAOYSA-N 4-bromo-3-methylphenol Chemical compound CC1=CC(O)=CC=C1Br GPOQODYGMUTOQL-UHFFFAOYSA-N 0.000 description 1
- GZFGOTFRPZRKDS-UHFFFAOYSA-N 4-bromophenol Chemical compound OC1=CC=C(Br)C=C1 GZFGOTFRPZRKDS-UHFFFAOYSA-N 0.000 description 1
- RHPUJHQBPORFGV-UHFFFAOYSA-N 4-chloro-2-methylphenol Chemical compound CC1=CC(Cl)=CC=C1O RHPUJHQBPORFGV-UHFFFAOYSA-N 0.000 description 1
- CFKMVGJGLGKFKI-UHFFFAOYSA-N 4-chloro-m-cresol Chemical compound CC1=CC(O)=CC=C1Cl CFKMVGJGLGKFKI-UHFFFAOYSA-N 0.000 description 1
- FUXZRRZSHWQAAA-UHFFFAOYSA-N 5,5-dioxodibenzothiophene-3,7-diamine Chemical compound C1=C(N)C=C2S(=O)(=O)C3=CC(N)=CC=C3C2=C1 FUXZRRZSHWQAAA-UHFFFAOYSA-N 0.000 description 1
- OONJCAWRVJDVBB-UHFFFAOYSA-N 5-bromo-2-methylphenol Chemical compound CC1=CC=C(Br)C=C1O OONJCAWRVJDVBB-UHFFFAOYSA-N 0.000 description 1
- KKFPXGXMSBBNJI-UHFFFAOYSA-N 5-chloro-2-methylphenol Chemical compound CC1=CC=C(Cl)C=C1O KKFPXGXMSBBNJI-UHFFFAOYSA-N 0.000 description 1
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical group [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
- KZBUYRJDOAKODT-UHFFFAOYSA-N Chlorine Chemical compound ClCl KZBUYRJDOAKODT-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 238000000862 absorption spectrum Methods 0.000 description 1
- 150000004075 acetic anhydrides Chemical class 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 150000001408 amides Chemical group 0.000 description 1
- MYMCSQDRHUQQDW-UHFFFAOYSA-N bis(4-amino-3-methylphenyl)methanone Chemical compound C1=C(N)C(C)=CC(C(=O)C=2C=C(C)C(N)=CC=2)=C1 MYMCSQDRHUQQDW-UHFFFAOYSA-N 0.000 description 1
- ZLSMCQSGRWNEGX-UHFFFAOYSA-N bis(4-aminophenyl)methanone Chemical compound C1=CC(N)=CC=C1C(=O)C1=CC=C(N)C=C1 ZLSMCQSGRWNEGX-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 150000001718 carbodiimides Chemical class 0.000 description 1
- RECUKUPTGUEGMW-UHFFFAOYSA-N carvacrol Chemical compound CC(C)C1=CC=C(C)C(O)=C1 RECUKUPTGUEGMW-UHFFFAOYSA-N 0.000 description 1
- HHTWOMMSBMNRKP-UHFFFAOYSA-N carvacrol Natural products CC(=C)C1=CC=C(C)C(O)=C1 HHTWOMMSBMNRKP-UHFFFAOYSA-N 0.000 description 1
- 235000007746 carvacrol Nutrition 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 150000001896 cresols Chemical class 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical class C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 239000012510 hollow fiber Substances 0.000 description 1
- 239000012456 homogeneous solution Substances 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- WYXXLXHHWYNKJF-UHFFFAOYSA-N isocarvacrol Natural products CC(C)C1=CC=C(O)C(C)=C1 WYXXLXHHWYNKJF-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 150000004988 m-phenylenediamines Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 150000004987 o-phenylenediamines Chemical class 0.000 description 1
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical class CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 1
- 150000004989 p-phenylenediamines Chemical class 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- MIROPXUFDXCYLG-UHFFFAOYSA-N pyridine-2,5-diamine Chemical compound NC1=CC=C(N)N=C1 MIROPXUFDXCYLG-UHFFFAOYSA-N 0.000 description 1
- VHNQIURBCCNWDN-UHFFFAOYSA-N pyridine-2,6-diamine Chemical compound NC1=CC=CC(N)=N1 VHNQIURBCCNWDN-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229940086542 triethylamine Drugs 0.000 description 1
- 150000003739 xylenols Chemical class 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D71/00—Semi-permeable membranes for separation processes or apparatus characterised by the material; Manufacturing processes specially adapted therefor
- B01D71/06—Organic material
- B01D71/58—Other polymers having nitrogen in the main chain, with or without oxygen or carbon only
- B01D71/62—Polycondensates having nitrogen-containing heterocyclic rings in the main chain
- B01D71/64—Polyimides; Polyamide-imides; Polyester-imides; Polyamide acids or similar polyimide precursors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31721—Of polyimide
Definitions
- the present invention relates to a gas separating material. More particularly, it relates to a gas separating material in which a gas separating layer is composed of at least one dense film consisting essentially of a biphenyltetracarboxylic acid-type aromatic polyimide.
- the only aromatic polyimide dense film which has been hitherto known to be usable as a gas-separating film is a dense film prepared from pyromellitic acid and an aromatic diamine as disclosed in, for example, U.S.-A-4 113 628.
- this known aromatic polyimide dense film is unsatisfactory in its gas-separating property, because the dense film exhibits a ratio of gas permeability coefficient of hydrogen gas (PH z ) to that of carbon monoxide gas (PCO) of about 75 at the most and a ratio of gas permeability coefficient of oxygen gas (P0 2 ) to that of nitrogen gas (PN 2 ) of about 4.5 at the most.
- the aromatic polyimide has an excellent heat-resisting property, a superior chemical-resisting property and satisfactory mechanical properties. Accordingly, it is strongly desired by industry to provide an aromatic polyimide film having a satisfactory gas-separating property and an excellent durability at an elevated temperature.
- An object of the present invention is to provide a gas separating material having an excellent heat resistance, chemical resistance and mechanical strength.
- Another object of the present invention is to provide a gas separating material having an excellent capability of separating hydrogen gas from carbon monoxide gas and of separating oxygen gas from nitrogen gas.
- a further object of the present invention is to provide a gas separating material having an excellent durability at an elevated temperature.
- a gas separating material comprising a gas separating layer consisting of at least one dense film having a thickness of from 0.1 to 20 ⁇ m and comprising at least one aromatic imide polymer which comprises at least 80 molar % of at least one type of recurring unit of the formula (I): wherein R represents a divalent aromatic radical, characterised in that said dense film exhibits a ratio of gas permeability coefficient of hydrogen gas to that of carbon monoxide gas (PH z/ PCO) of 65 or more and a ratio of gas permeability coefficient of oxygen gas to that of nitrogen gas (PO 2 /PN 2 ) of 7.0 or more.
- PH z/ PCO carbon monoxide gas
- PO 2 /PN 2 nitrogen gas
- the ratio (PH z/ PCO) is in the range of from 70 to 200 and the ration (PO 2 /PN 2 ) is in the range of from 7.2 to 20.
- this is useful for separating various gases from one another and for concentrating various gases.
- the dense film comprises at least one aromatic imide polymer comprising at least 80 molar %, preferably at least 90 molar %, of at least one type of recurring unit of the formula (I): wherein R represents a divalent aromatic radical.
- the recurring unit of the formula (I) involves those of the formulae (II) and (III), preferably, the formula (II): and
- the divalent aromatic radical represented by R in the formula (I) is preferably selected from the group consisting of those of the formulae (IV) and (V): wherein R 1 and R 2 respectively represent, independently from each other, a member selected from the group consisting of a hydrogen atom, lower alkyl radical having 1 to 3 carbon atoms, and lower alkoxy radical having 1 to 3 carbon atoms, and A represents a divalent bond selected from the group consisting of -I-, -S-, -CO-, -SO 2- , -SO-, -CH2- and -C(CH 3 ) 2 -
- the aromatic imide polymer may comprise at least one type of recurring unit of the formula (I) in which R represents a divalent aromatic radical of the formula (IV) or (V) and at least one type of recurring unit of the formula (i) in which R represents a divalent aromatic radical selected from the group consisting of those of the formulae (VI) to (IX): and
- the dense film may be prepared in such a manner that at least one aromatic polyimide as defined above is dissolved in a concentration of from 3 to 30% by weight in a phenol type solvent, for example, phenol, cresols, xylenols, halogenated phenols to prepare a dope solution, the dope solution is coated or spread on a surface of a substrate to form a film of the dope solution, the dope solution film is dried by gradually evaporating the solvent, and, finally, the dried aromatic polyimide film is completely dried at a temperature of from 150° to 400° C, preferably, from 170° to 350° C.
- the aromatic imide polymer having 80 molar % or more of the recurring unit of the formula (I) has a logarithmic (inherent) viscosity of from 0.3 to 7, more preferably, from 0.4 to 5, determined in a concentration of 0.5 g per 100 ml of a solvent consisting of 4 parts by volume of p-chlorophenol and one part by volume of o-chlorophenol at a temperature of 30° C.
- the aromatic imide polymer may be one which has been prepared by the polymerization and the imide ring cyclization of a tetracarboxylic acid component comprising 80 molar %, or more preferably, 90 molar % or more, of biphenyl tetracarboxylic acid of the formula (XI): or its anhydride, salt or ester, with an aromatic diamine component consisting essentially of at least one member selected from the group consisting of diamine compounds of the formula (XII): wherein R is the same as that defined above.
- the biphenyl tetracarboxylic acid of the formula (XI) is selected from 2,3,3',4'-biphenyl tetracarboxylic acid and 3,3',4,4'-biphenyl tetracarboxylic acid.
- Each of the above-mentioned biphenyl tetracarboxylic acids may be in the form of its free acid, anhydride, salt or ester, preferably, anhydride.
- the tetracarboxylic acid component may contain 20 molar % or less, preferably, 10 molar % or less, of at least one additional tetracarboxylic acid selected from the group consisting of pyromellitic acid, 3,3',4,4'-benzophenone tetracarboxylic acid, 2,2-bis(3,4-dicarboxyphenyl)propane, bis(3,4-dicarboxyphenyl)sulfone, bis(3,4-dicarboxyphenyl)ether, bis(3,4-dicarboxyphenyl)thioether, butane tetracarboxylic acid, and anhydrides, salts and esters of the above-mentioned acids.
- additional tetracarboxylic acid selected from the group consisting of pyromellitic acid, 3,3',4,4'-benzophenone tetracarboxylic acid, 2,2-bis(3,4-dicarboxyphenyl)propane
- the aromatic diamine of the formula (XII) can be selected from the group consisting of those of the formulae (XIII) to (XIV): wherein R 1 and R 2 respectively represent, independently from each other, a member selected from the group consisting of a hydrogen atom, lower alkyl radical having 1 to 3 carbon atoms, and lower alkoxy radical having 1 to 3 carbon atoms, and A represents a divalent bond selected from the group consisting of -O-, -S-, -CO-, -SO z -, -SO-, -CH 2 - and -C(CH 3 ) 2 -, and; wherein R 1 and R Z are as defined above.
- the aromatic diamine component may comprise at least one aromatic diamine selected from the group consisting of those of the formulae (XIII) and (XIV) and at least one other aromatic diamine selected from the group consisting of those of the formulae (XV) to (XIX): and
- the aromatic diamine compound of the formula (XIII) may be selected from the group consisting of diamino-diphenyl ether compounds, for example, 4,4'-diaminodiphenyl ether, 3,3'-dimethyl-4,4'-diaminodiphenyl ether, 3,3'-diaminodiphenyl ether and 3,3'-diethoxy-4,4'-diaminodiphenyl ether; diaminodiphenyl thioether compounds, for example, 4,4'-diaminodiphenyl thioether, 3,3'-dimethyl-4,4'-diaminodiphenyl-thioether, 3,3'-diethoxy-4,4'-diaminodiphenyl-thioether, and, 3,3'-diaminodiphenyl thioether; diaminobenzophenone compounds, for example, 4,4'-diaminobenzophenone and 3,3'
- the aromatic diamine compound of the formula (XIV) may involve benzidine, 3,3'-dimethyl benzidine, 3,3'-dimethoxybenzidine and 3,3'-diaminobiphenyl.
- the aromatic diamine compound of the formula (XV) may be either 4-aminobenzhydrazide or 3-aminobenzhydrazide.
- the aromatic diamine compound of the formula (XVI) may be either 2,6-diaminopyridine or 2,5-diaminopyridine.
- the aromatic diamine compound of the formula (XVII) may be either 4-methoxy-1,3-diaminobenzene or 3-methoxy-1,4-diaminobenzene.
- the aromatic diamine compound of the formula (XVIII) may be either 3,5-diaminobenzoic acid or 2,4-diaminobenzoic acid.
- the aromatic diamine compound of the formula (XIX) may be selected from o-, p- and m-phenylene diamines.
- the aromatic diamine compound of the formula (XII) is selected preferably from the group consisting of 4,4'-diaminodiphenyl ether, 4,4'-diaminodiphenyl thioether, 4,4'-diaminodiphenvi methane, benzidine, 3,3'-dimethoxybenzidine and 3,3'-dimethylbenzidine.
- the aromatic diamine component may consist of 4,4'-diaminodiphenyl ether or 3,3'-dimethoxybenzidine alone, or a mixture of 40 molar % or more, preferably, 50 molar % or more, of 4,4'-diaminodiphenyl ether or 3,3'-dimethoxybenzidine with the balance consisting of at least one other aromatic diamine selected from the group consisting of p-phenylene diamine, m-phenylene diamine, 4,4'-diaminodiphenyl thioether, 4,4'-diaminodiphenyl methane, 3,3'-dimethyl-4,4'-diamino- diphenyl ether, 3,3'-dimethylbenzidine, benzidine, benzidine sulfone, 4,4'-diaminodiphenyl sulfone, 3,3'-diaminodiphenyl sulfone, and 3,5-dia
- the polymerization and the imide ring cyclization of the tetracarboxylic acid component with the aromatic diamine component can be carried out by any conventional process.
- a biphenyl tetracarboxylic acid component and an aromatic diamine component which are in approximately equal molar amounts to each other, are dissolved in an organic polar solvent, for example, N-methylpyrrolidone, pyridine, N,N-dimethylacetamine N,N-dimethylformamide, dimethyl sulfoxide and tetramethyl urea, the solution is heated temperature of 80° C or less, preferably 0° to 60° C, so as to allow the biphenyl tetracarboxylic , component and the aromatic diamine component to be polymerized with each other to prov: 3 polyamic acid having a logarithmic viscosity of 0.3 or more, preferably, 0.7 to 7.0, determined a a concentration of 0.5
- the solution of the polyamic acid in the organic polar solvent which solution has been prepared by the above-mentioned process and which has a logarithmic viscosity of 0.5 or more, determined at a concentration of 0.5 g per 100 ml of N-methylpyrrolidone at a temperature of 30°C, is mixed with a large amount of a precipitating agent consisting of acetone or an alcohol so as to allow the polyamic acid to precipitate from the solution, or the solution of the polyamic acid is mixed with the precipitating agent after evaporating the organic polar solvent from the solution so as to allow the polyamic acid to precipitate from the reaction mixture; the polyamic acid precipitate is isolated from the reaction mixture, and the isolated polyamic acid is heated at a temperature of from 150° to 300° C, preferably from 160° to 250° C, until the degree of imidization of the resultant imide polymer reaches 90% or more.
- a biphenyltetracarboxylic acid component consisting of 2,3,3',4'- and/or 3,3',4,4'-biphenyltetracarboxylic acid and an aromatic diamine component consisting of at least one diamine compound of the formula (XII) are polymerized and imide ring cyclized in single step in a solvent consisting of at least one phenol compound in the state of a liquid or melt, at a temperature of from 120° to 400°C, preferably, from 150° to 300°C.
- This imide polymer-producing process is most preferable for the present invention, because the resultant solution (dope) of the imide polymer in the phenol compound from this imide polymer-producing process can be directly utilized for the process of the present invention.
- the aromatic imide polymer is dissolved in a phenol type solvent to provide a dope solution.
- the phenol type solvent consists of at least one phenol compound preferably having a melting point not exceeding 100°C, more preferably, not exceeding 80°C. It is also preferable that the phenol compound have a boiling point not exceeding 300°C, more preferably, not exceeding 280°C, under atmospheric pressure.
- the phenol compound may be selected from the group consisting of phenol, o-, m-, and p- cresols, 3,5-xylenol, 1,4-xylenol, carvacrol, thimol and halogenated phenol compounds.
- halogenated phenol compounds are preferable of the formulae: and wherein R4 represents a member selected from the group consisting of a hydrogen atom, and alkyl radicals having 1 to 3 carbon atoms, for example, methyl, ethyl and propyl radicals, and X represents a halogen atom, such as a chlorine, bromine, fluorine or iodine atom.
- the preferable halogenated phenol compound may involve 3-chlorophenol, 4-chlorophenol, 3-bromophenol, 4-bromophenol, 2-chloro-4-hydroxytoluene, 2-chloro-5-hydroxytoluene, 3-chloro-6-hydroxytoluene, 4-chloro-2-hydroxytoluene, 2-bromo-4-hydroxytoluene, 2-bromo-5-hydroxytoluene, 3-bromo-5-hydroxytoluene, 3-bromo-6-hydroxytoluene and 4-bromo-2-hydroxytoluene.
- an aromatic polyamic acid which comprises at least one type of the recurring unit of the formula (I) and at least 30 molar %, preferable at least 40 molar %, of at least one type of recurring unit of the formula (XX): wherein R is as defined hereinbefore, the sum of the amount of the recurring units of the formulae (I) and (XX) being 80 molar % or more, preferably, 90 molar % or more, is dissolved in a concentration of from about 3 to about 30% by weight in an organic polar solvent.
- the resultant dope solution is coated or spread on a surface of a substrate at a temperature of from about 10° to about 100° C.
- the resultant film of the dope solution is dried by gradually evaporating the solvent while gradually elevating the temperature of the dope solution film.
- the dried solid film is heated at a temperature of from 150° to 400°C, preferably, from 170° to 350°C to completely dry it. This procedure causes the amide-acid structure in the recurring unit of the formula (XX) to be converted into an imide cyclic structure.
- the aromatic polyamic acid has a logarithmic (inherent) viscosity of from 0.3 to 7, more preferably, from 0.4 to 5, determined at a concentration of 0.5 g per 100 ml of a solvent consisting of N-methylpyrrolidone at a temperature of 30° C.
- the organic polar solvent for the aromatic polyamic acid consists of at least one polar compound selected from the group consisting of N-methylpyrrolidone, N,N-dimethyl acetamide, formamide, dimethyl sulfoxide and tetramethyl urea.
- the above-mentioned type of aromatic polyamic acid can be prepared by polymerizing the above-mentioned biphenyltetracarboxylic acid component with the above-mentioned aromatic diamine in an organic polar solvent at a temperature of about 150°C or less, preferably, 100° or less, more preferably, about 60° C or less, in any conventional polymerization method.
- the final completely drying procedure should be carried out at a temperature lower than the melting point of the aromatic imide polymer dense film.
- This final drying procedure is carried out most preferably ⁇ -c a temperature of from 180° to 350°C for from 30 minutes to 10 hours. This final drying procedure is effective for remarkably enhancing the gas separating property of the dense film.
- the solution of the polymer is coated or spread on a smooth surface of the substrate.
- the substrate may be a glass plate, a copper plate having a polished smooth surface thereof or a metal roll or belt having a polished smooth peripheral surface thereof.
- the resultant film of the aromatic imide polymer is peeled off from the surface of the substrate to provide a thin dense film of the aromatic imide polymer.
- the resultant dense film can be used as a gas separating film or may be laminated on a porous material to form a composite gas separating material.
- the resultant product composed of the dense film laminated on the porous substrate can be used as a gas separating material.
- the gas separating material of the present invention may be composed of at least one dense film alone. Otherwise, the gas separating material may be composed of at least one dense film laminated on a porous material. Also, the gas separating material of the present invention may be in the form of a flat sheet or in the form of a tube or hollow fiber.
- the dense film of the present invention has a thickness variable in a range of from 0.1 to 20 ⁇ m, preferably, from 0.2 to 15 ⁇ m, depending on the use of the gas separating material. If the thickness is less than 0.1 gm, the dense film exhibits a poor gas-separating property. Also, it is known that the larger the thickness of the gas separating layer, the smaller the gas permeating rate of the layer. When the thickness is more than 20 ⁇ m, the dense film exhibits a remarkably reduced gas permeating rate and is no good for practical use.
- the gas separating material of the present invention has many various uses, for example, in separating and concentrating oxygen gas from air or in increasing the concentration of hydrogen gas in a hydrogen-carbon monoxide gas mixture, at an elevated temperature.
- the logarithmic viscosity of imide polymers or polyamic acid was determined by the following method.
- the polymer is dissolved at a concentration of 0.5 g in 100 ml of N-methyl-2-pyrrolidone.
- the viscosity of the solution was measured at a temperature of 30° C.
- the polymer was dissolved at a concentration of 0.5 g in 100 ml of a mixture of 4 parts by volume of p-chlorophenol and 1 part by volume of o-chlorophenol. The viscosity of the solution was measured at a temperature of 30° C.
- the measured value of the viscosity of the solution was converted into a logarithmic (inherent) viscosity of the polymer in accordance with the following equation.
- the degree of imidization of the polyimide was determined by the following method.
- An imide polymer in the form of fine particles was subjected to an infrared-ray absorption spectrum analysis.
- the amount of the imide structure was determined from heights of absorption peaks at 1780cm-' and 1720cm-', and the amount of the amide structure was determined from height of absorption peaks at 3300 cm -1 and 1640 cm -1 .
- the permeability coefficient of the gas separating material was calculated in accordance with the equation: wherein X represents an amount in cm 3 of gas passed through the film, Th represents a thickness in cm of the film, A represents an area in cm 2 of the film through which the gas passed, T represents a time in seconds during which the gas passed through the film, and D represents a difference between the pressures in cmHg of the gas before and after it passed through the film.
- a separable flask with a stirrer and a conduit for introducing thereinto nitrogen gas was charged with a mixture of 40 millimoles of 3,3',4,4'-biphenyl tetracarboxylic dianhydride, 40 millimoles of 4,4'-diaminodiphenyl ether and 170 ml of dimethyl acetamide.
- the mixture was subjected to a polymerization procedure at a temperature of 20° C for five hours while flowing nitrogen gas through the conduit and the flask, to prepare polyamic acid.
- the resultant polymerization mixture was cooled to a temperature of 10°C or less and, then, mixed with 100 ml of dimethyl acetamide 240 millimoles of acetic anhydrides and 240 millimoles of pyridine.
- the mixture was homogenized by fully stirring it. Thereafter, the mixture was gradually heated to and maintained at a temperature of about 30° C for about 20 minutes while allowing the resultant incompletely imidized polymer to precipitate in the form of fine particles in the polymerization mixture.
- the polymerization mixture was heated to and maintained at a temperature of from 70° to 80° C for 30 minutes or more to complete the imidization reaction.
- the polymerization mixture containing the imide polymer particles was mixed into a large amount of methyl alcohol. The mixture was filtered to separate the imide polymer particles. The imide polymer particles were washed with methyl alcohol and, then, dried under a reduced pressure, to prepare an imide polymer powder.
- the imide polymer powder exhibited a degree of imidization of 90% or more and a logarithmic viscosity of 1.90.
- a separable flask equipped with a stirrer was charged with a mixture of 10 g of the imide polymer powder and 90 g of p-chlorophenol. The mixture was heated to a temperature of about 100° C while stirring it, to prepare a homogeneous solution of the imide polymer, the solution was refined by filtering and by degassing it, to prepare a dope solution.
- the dope solution was spread on a surface of a glass plate placed horizontally to form a thin film of the dope solution having a uniform thickness.
- the dope solution film was maintained at a temperature of about 100°C in a nitrogen gas atmosphere for 2 hours, to gradually evaporate the solvent, and, then the resultant solid film on the glass plate was completely dried at a temperature of 200° C for 5 hours.
- the resultant imide polymer dense film had a thickness of 10 ⁇ m.
- the resultant imide polymer dense film was subjected to gas permeating tests for hydrogen, carbon monoxide, oxygen and nitrogen gases.
- the dense film had excellent ratios PH 2 /PCO and PO 2 /PN 2 .
- Example 2 The same separable flask as that described in Example 1 was charged with a mixture of 40 millimoles of 3,3',4,4'-biphenyltetracarboxylic dianhydride, 40 millimoles of 4,4'-diaminodiphenyl ether and 163 ml of a solvent consisting of N-methyl pyrrolidone. The mixture was subjected to a polymerization procedure at a temperature of 25° C for five hours. A solution containing 10% by weight of polyamic acid was obtained.
- the polyamic acid in the solution exhibited a degree of imidization of 10% or less and a logarithmic viscosity of 2.41.
- the polyamic acid solution was refined by filtering and degassing it, to prepare a dope solution.
- the dope solution was spread on a horizontal surface of a glass plate to form a film of the dope solution, having a uniform thickness.
- the dopesolution film was allowed to stand in a nitrogen gas atmosphere at a temperature of about 60° C for two hours, to gradually evaporate the solvent.
- the resultant solid film was completely dried at a temperature of 240° C for 5 hours to complete the imidization reaction.
- the resultant imide polymer dense film had a thickness of 5 ⁇ m.
- the imide polymer dense film was subjected to gas permeating tests on hydrogen, carbon monoxide, oxygen and nitrogen gases. The results are indicated in Table 2.
- the dense film had excellent ratios PH 2/ PCO and P0 2/ PH 2 .
- the resultant polyamic acid exhibited a degree of imidization of 10% or less and a logarithmic viscosity of 2.15.
- the dense film exhibited satisfactory ratios PH 2/ PCO and PO z/ PH z .
- Example 2 The same procedures as those described in Example 2 for producing the polyamic acid solution was carried out, except that 3,3',4,4'-biphenyltetracarboxylic dianhydride was replaced by pyromellitic acid.
- the polyamic acid had a degree of imidization of 10% or less and a logarithmic viscosity of 1.98.
- the ratios PH 2 /PCO and PO 2 /PN 2 of the comparative dense film were unsatisfactory.
- Example 2 The same separable flask as that described in Example 1 was charged with 20 millimoles of 3,3',4,4'-biphenyltetracarboxylic dianhydride, 20 millimoles of 3,3'-dimethoxybenzidine (0-DAN) and 90 g of p-chlorophenol.
- the mixture was subjected to a polymerization-imidization procedure in which the mixture was heated from room temperature to 180°C within about 50 minutes while flowing nitrogen gas through the flask and stirring the mixture, and, then, the temperature of the mixture was maintained at the level of 180°C for 7 hours so as to carry out the polymerization and imidization reactions in one single step procedure. A viscous imide polymer solution was obtained.
- the imide polymer solution had a concentration of the polymer of about 10% by weight.
- the imide polymer had a logarithmic viscosity of 1.54 and a degree of imidization of 95% or more.
- the imide polymer solution was used as a dope solution.
- the dope solution was uniformly spread on the surface of a glass plate by using a doctor blade to form a thin film of the dope solution having a thickness of 0.2 mm.
- the dope solution film was maintained at a temperature of about 100° C for 3 hours, to gradually evaporate the solvent and, then, the resultant solid film was completely dried at a temperature of 200°C for 3 hours.
- the resultant imide polymer dense film had a thickness of about 20 um.
- the resultant imide polymer dense film was subjected to gas permeating tests for hydrogen, carbon monoxide, oxygen and nitrogen gas.
- the resultant heat-treated dense film exhibited the following gas permeating properties.
- a viscous imide polymer solution was obtained, which contained an imide polymer in a concentration of about 10% by weight.
- the imide polymer exhibited a logarithmic viscosity of 1.35 and a degree of imidization of 95% or more.
- the imide polymer solution was used as a dope solution.
- the same procedure for producing a dense film as that described in Example 4 was carried out by using the dope solution.
- a dense film having a thickness of about 20 ⁇ m was obtained.
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Separation Using Semi-Permeable Membranes (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
Description
- The present invention relates to a gas separating material. More particularly, it relates to a gas separating material in which a gas separating layer is composed of at least one dense film consisting essentially of a biphenyltetracarboxylic acid-type aromatic polyimide.
- The only aromatic polyimide dense film which has been hitherto known to be usable as a gas-separating film, is a dense film prepared from pyromellitic acid and an aromatic diamine as disclosed in, for example, U.S.-A-4 113 628. However, this known aromatic polyimide dense film is unsatisfactory in its gas-separating property, because the dense film exhibits a ratio of gas permeability coefficient of hydrogen gas (PHz) to that of carbon monoxide gas (PCO) of about 75 at the most and a ratio of gas permeability coefficient of oxygen gas (P02) to that of nitrogen gas (PN2) of about 4.5 at the most.
- Generally, the aromatic polyimide has an excellent heat-resisting property, a superior chemical-resisting property and satisfactory mechanical properties. Accordingly, it is strongly desired by industry to provide an aromatic polyimide film having a satisfactory gas-separating property and an excellent durability at an elevated temperature.
- An object of the present invention is to provide a gas separating material having an excellent heat resistance, chemical resistance and mechanical strength.
- Another object of the present invention is to provide a gas separating material having an excellent capability of separating hydrogen gas from carbon monoxide gas and of separating oxygen gas from nitrogen gas.
- A further object of the present invention is to provide a gas separating material having an excellent durability at an elevated temperature.
- According to the present invention a gas separating material is provided, comprising a gas separating layer consisting of at least one dense film having a thickness of from 0.1 to 20 µm and comprising at least one aromatic imide polymer which comprises at least 80 molar % of at least one type of recurring unit of the formula (I):
- Preferably, the ratio (PHz/PCO) is in the range of from 70 to 200 and the ration (PO2/PN2) is in the range of from 7.2 to 20.
- Accordingly, due to the excellent gas separating property of the gas separating material of the present invention, this is useful for separating various gases from one another and for concentrating various gases.
- The dense film comprises at least one aromatic imide polymer comprising at least 80 molar %, preferably at least 90 molar %, of at least one type of recurring unit of the formula (I):
- The aromatic imide polymer may comprise at least one type of recurring unit of the formula (I) in which R represents a divalent aromatic radical of the formula (IV) or (V) and at least one type of recurring unit of the formula (i) in which R represents a divalent aromatic radical selected from the group consisting of those of the formulae (VI) to (IX):
- In the case where the dense film is prepared by the above-mentioned process, it is preferable that the aromatic imide polymer having 80 molar % or more of the recurring unit of the formula (I) has a logarithmic (inherent) viscosity of from 0.3 to 7, more preferably, from 0.4 to 5, determined in a concentration of 0.5 g per 100 ml of a solvent consisting of 4 parts by volume of p-chlorophenol and one part by volume of o-chlorophenol at a temperature of 30° C.
- In the above-mentioned case, the aromatic imide polymer may be one which has been prepared by the polymerization and the imide ring cyclization of a tetracarboxylic acid component comprising 80 molar %, or more preferably, 90 molar % or more, of biphenyl tetracarboxylic acid of the formula (XI):
- The biphenyl tetracarboxylic acid of the formula (XI) is selected from 2,3,3',4'-biphenyl tetracarboxylic acid and 3,3',4,4'-biphenyl tetracarboxylic acid. Each of the above-mentioned biphenyl tetracarboxylic acids may be in the form of its free acid, anhydride, salt or ester, preferably, anhydride.
- The tetracarboxylic acid component may contain 20 molar % or less, preferably, 10 molar % or less, of at least one additional tetracarboxylic acid selected from the group consisting of pyromellitic acid, 3,3',4,4'-benzophenone tetracarboxylic acid, 2,2-bis(3,4-dicarboxyphenyl)propane, bis(3,4-dicarboxyphenyl)sulfone, bis(3,4-dicarboxyphenyl)ether, bis(3,4-dicarboxyphenyl)thioether, butane tetracarboxylic acid, and anhydrides, salts and esters of the above-mentioned acids.
- The aromatic diamine of the formula (XII) can be selected from the group consisting of those of the formulae (XIII) to (XIV):
-
- The aromatic diamine compound of the formula (XIII) may be selected from the group consisting of diamino-diphenyl ether compounds, for example, 4,4'-diaminodiphenyl ether, 3,3'-dimethyl-4,4'-diaminodiphenyl ether, 3,3'-diaminodiphenyl ether and 3,3'-diethoxy-4,4'-diaminodiphenyl ether; diaminodiphenyl thioether compounds, for example, 4,4'-diaminodiphenyl thioether, 3,3'-dimethyl-4,4'-diaminodiphenyl-thioether, 3,3'-diethoxy-4,4'-diaminodiphenyl-thioether, and, 3,3'-diaminodiphenyl thioether; diaminobenzophenone compounds, for example, 4,4'-diaminobenzophenone and 3,3'-dimethyl-4,4'-diaminobenzophenone; diaminodiphenyl methane compounds, for example, 4,4'-diaminodiphenyl methane, 3,3'-diaminodiphenyl methane, 3,3'-dimethoxy-4,4'-diaminodiphenyl methane and 3,3'-dimethyl-4,4'-diaminodiphenyl methane; diaminodiphenyl propane compounds, for example, 2,2-bis(4'-aminophenyl)propane and 2,2-bis(3'-aminophenyl)propane; 4,4'-diaminodiphenyl sulfoxide, and; diaminodiphenyl sulfons, for example, 4,4'-diaminodiphenyl sulfone; 3,3'-diamino diphenyl sulfone, and 3,4'-diaminodiphenyl sulfone.
- The aromatic diamine compound of the formula (XIV) may involve benzidine, 3,3'-dimethyl benzidine, 3,3'-dimethoxybenzidine and 3,3'-diaminobiphenyl.
- The aromatic diamine compound of the formula (XV) may be either 4-aminobenzhydrazide or 3-aminobenzhydrazide.
- The aromatic diamine compound of the formula (XVI) may be either 2,6-diaminopyridine or 2,5-diaminopyridine.
- The aromatic diamine compound of the formula (XVII) may be either 4-methoxy-1,3-diaminobenzene or 3-methoxy-1,4-diaminobenzene.
- The aromatic diamine compound of the formula (XVIII) may be either 3,5-diaminobenzoic acid or 2,4-diaminobenzoic acid.
- The aromatic diamine compound of the formula (XIX) may be selected from o-, p- and m-phenylene diamines.
- Generally, the aromatic diamine compound of the formula (XII) is selected preferably from the group consisting of 4,4'-diaminodiphenyl ether, 4,4'-diaminodiphenyl thioether, 4,4'-diaminodiphenvi methane, benzidine, 3,3'-dimethoxybenzidine and 3,3'-dimethylbenzidine.
- The aromatic diamine component may consist of 4,4'-diaminodiphenyl ether or 3,3'-dimethoxybenzidine alone, or a mixture of 40 molar % or more, preferably, 50 molar % or more, of 4,4'-diaminodiphenyl ether or 3,3'-dimethoxybenzidine with the balance consisting of at least one other aromatic diamine selected from the group consisting of p-phenylene diamine, m-phenylene diamine, 4,4'-diaminodiphenyl thioether, 4,4'-diaminodiphenyl methane, 3,3'-dimethyl-4,4'-diamino- diphenyl ether, 3,3'-dimethylbenzidine, benzidine, benzidine sulfone, 4,4'-diaminodiphenyl sulfone, 3,3'-diaminodiphenyl sulfone, and 3,5-diaminobenzoic acid.
- The polymerization and the imide ring cyclization of the tetracarboxylic acid component with the aromatic diamine component can be carried out by any conventional process. In a very preferable process for producing an imide polymer, a biphenyl tetracarboxylic acid component and an aromatic diamine component, which are in approximately equal molar amounts to each other, are dissolved in an organic polar solvent, for example, N-methylpyrrolidone, pyridine, N,N-dimethylacetamine N,N-dimethylformamide, dimethyl sulfoxide and tetramethyl urea, the solution is heated temperature of 80° C or less, preferably 0° to 60° C, so as to allow the biphenyl tetracarboxylic , component and the aromatic diamine component to be polymerized with each other to prov: 3 polyamic acid having a logarithmic viscosity of 0.3 or more, preferably, 0.7 to 7.0, determined a a concentration of 0.5 g per 100 ml of N-methyl pyrrolidone at a temperature of 30° C; the solution of the polyamic acid in the organic polar solvent, which solution can be the above-mentioned polymerization reaction mixture itself, is subjected to an imidization reaction at a temperature of from 5° to 150°C by using an imidization accelerator consisting of at least one member selected from trimethyl amine, triethyl amine, pyridine, acetic anhydride, thionylchloride and carbodiimide, or at a temperature of from 100° to 300°C, preferably, from 120° to 250°C, without using the imidization accelerator, to provide an imide polymer having a degree of imidization of 90% or more, and the resultant imide polymer is isolated from the reaction mixture by means of precipitation.
- In another process for producing the aromatic imide polymer, the solution of the polyamic acid in the organic polar solvent, which solution has been prepared by the above-mentioned process and which has a logarithmic viscosity of 0.5 or more, determined at a concentration of 0.5 g per 100 ml of N-methylpyrrolidone at a temperature of 30°C, is mixed with a large amount of a precipitating agent consisting of acetone or an alcohol so as to allow the polyamic acid to precipitate from the solution, or the solution of the polyamic acid is mixed with the precipitating agent after evaporating the organic polar solvent from the solution so as to allow the polyamic acid to precipitate from the reaction mixture; the polyamic acid precipitate is isolated from the reaction mixture, and the isolated polyamic acid is heated at a temperature of from 150° to 300° C, preferably from 160° to 250° C, until the degree of imidization of the resultant imide polymer reaches 90% or more.
- In still another process for producing the imide polymer, a biphenyltetracarboxylic acid component consisting of 2,3,3',4'- and/or 3,3',4,4'-biphenyltetracarboxylic acid and an aromatic diamine component consisting of at least one diamine compound of the formula (XII) are polymerized and imide ring cyclized in single step in a solvent consisting of at least one phenol compound in the state of a liquid or melt, at a temperature of from 120° to 400°C, preferably, from 150° to 300°C. This imide polymer-producing process is most preferable for the present invention, because the resultant solution (dope) of the imide polymer in the phenol compound from this imide polymer-producing process can be directly utilized for the process of the present invention.
- When the dense film is prepared, the aromatic imide polymer is dissolved in a phenol type solvent to provide a dope solution.
- The phenol type solvent consists of at least one phenol compound preferably having a melting point not exceeding 100°C, more preferably, not exceeding 80°C. It is also preferable that the phenol compound have a boiling point not exceeding 300°C, more preferably, not exceeding 280°C, under atmospheric pressure. For example, the phenol compound may be selected from the group consisting of phenol, o-, m-, and p- cresols, 3,5-xylenol, 1,4-xylenol, carvacrol, thimol and halogenated phenol compounds.
- The halogenated phenol compounds are preferable of the formulae:
- The preferable halogenated phenol compound may involve 3-chlorophenol, 4-chlorophenol, 3-bromophenol, 4-bromophenol, 2-chloro-4-hydroxytoluene, 2-chloro-5-hydroxytoluene, 3-chloro-6-hydroxytoluene, 4-chloro-2-hydroxytoluene, 2-bromo-4-hydroxytoluene, 2-bromo-5-hydroxytoluene, 3-bromo-5-hydroxytoluene, 3-bromo-6-hydroxytoluene and 4-bromo-2-hydroxytoluene.
- In another method for producing the dense film, an aromatic polyamic acid which comprises at least one type of the recurring unit of the formula (I) and at least 30 molar %, preferable at least 40 molar %, of at least one type of recurring unit of the formula (XX):
- The resultant dope solution is coated or spread on a surface of a substrate at a temperature of from about 10° to about 100° C. The resultant film of the dope solution is dried by gradually evaporating the solvent while gradually elevating the temperature of the dope solution film. Finally, the dried solid film is heated at a temperature of from 150° to 400°C, preferably, from 170° to 350°C to completely dry it. This procedure causes the amide-acid structure in the recurring unit of the formula (XX) to be converted into an imide cyclic structure.
- In the case where the dense film is prepared by the above-mentioned method, it is preferable that the aromatic polyamic acid has a logarithmic (inherent) viscosity of from 0.3 to 7, more preferably, from 0.4 to 5, determined at a concentration of 0.5 g per 100 ml of a solvent consisting of N-methylpyrrolidone at a temperature of 30° C.
- Also, it is preferable that the organic polar solvent for the aromatic polyamic acid, consists of at least one polar compound selected from the group consisting of N-methylpyrrolidone, N,N-dimethyl acetamide, formamide, dimethyl sulfoxide and tetramethyl urea.
- The above-mentioned type of aromatic polyamic acid can be prepared by polymerizing the above-mentioned biphenyltetracarboxylic acid component with the above-mentioned aromatic diamine in an organic polar solvent at a temperature of about 150°C or less, preferably, 100° or less, more preferably, about 60° C or less, in any conventional polymerization method.
- In the above-mentioned two different methods for producing the dense film, the final completely drying procedure should be carried out at a temperature lower than the melting point of the aromatic imide polymer dense film. This final drying procedure is carried out most preferably α-c a temperature of from 180° to 350°C for from 30 minutes to 10 hours. This final drying procedure is effective for remarkably enhancing the gas separating property of the dense film.
- In the preparation of the dense film, the solution of the polymer is coated or spread on a smooth surface of the substrate. The substrate may be a glass plate, a copper plate having a polished smooth surface thereof or a metal roll or belt having a polished smooth peripheral surface thereof. After the drying procedure, the resultant film of the aromatic imide polymer is peeled off from the surface of the substrate to provide a thin dense film of the aromatic imide polymer. The resultant dense film can be used as a gas separating film or may be laminated on a porous material to form a composite gas separating material.
- When the dope solution is coated or spread on a surface of a porous substrate and the resultant dope solution film is dried, the resultant product composed of the dense film laminated on the porous substrate can be used as a gas separating material.
- That is, the gas separating material of the present invention may be composed of at least one dense film alone. Otherwise, the gas separating material may be composed of at least one dense film laminated on a porous material. Also, the gas separating material of the present invention may be in the form of a flat sheet or in the form of a tube or hollow fiber.
- The dense film of the present invention has a thickness variable in a range of from 0.1 to 20 µm, preferably, from 0.2 to 15 µm, depending on the use of the gas separating material. If the thickness is less than 0.1 gm, the dense film exhibits a poor gas-separating property. Also, it is known that the larger the thickness of the gas separating layer, the smaller the gas permeating rate of the layer. When the thickness is more than 20 µm, the dense film exhibits a remarkably reduced gas permeating rate and is no good for practical use.
- The gas separating material of the present invention has many various uses, for example, in separating and concentrating oxygen gas from air or in increasing the concentration of hydrogen gas in a hydrogen-carbon monoxide gas mixture, at an elevated temperature.
- The specific examples presented below will serve to more fully elaborate how the present invention can be practically used. However, it should be understood that the examples are only illustrative and in no way limit the present invention.
- In the following examples, the logarithmic viscosity of imide polymers or polyamic acid was determined by the following method.
- In the case of a polyamic acid, the polymer is dissolved at a concentration of 0.5 g in 100 ml of N-methyl-2-pyrrolidone. The viscosity of the solution was measured at a temperature of 30° C.
- In the case of polyimide, the polymer was dissolved at a concentration of 0.5 g in 100 ml of a mixture of 4 parts by volume of p-chlorophenol and 1 part by volume of o-chlorophenol. The viscosity of the solution was measured at a temperature of 30° C.
-
- The degree of imidization of the polyimide was determined by the following method.
- An imide polymer in the form of fine particles was subjected to an infrared-ray absorption spectrum analysis. The amount of the imide structure was determined from heights of absorption peaks at 1780cm-' and 1720cm-', and the amount of the amide structure was determined from height of absorption peaks at 3300 cm-1 and 1640 cm-1. Also, the permeability coefficient of the gas separating material was calculated in accordance with the equation:
- A separable flask with a stirrer and a conduit for introducing thereinto nitrogen gas, was charged with a mixture of 40 millimoles of 3,3',4,4'-biphenyl tetracarboxylic dianhydride, 40 millimoles of 4,4'-diaminodiphenyl ether and 170 ml of dimethyl acetamide. The mixture was subjected to a polymerization procedure at a temperature of 20° C for five hours while flowing nitrogen gas through the conduit and the flask, to prepare polyamic acid. The resultant polymerization mixture was cooled to a temperature of 10°C or less and, then, mixed with 100 ml of dimethyl acetamide 240 millimoles of acetic anhydrides and 240 millimoles of pyridine. The mixture was homogenized by fully stirring it. Thereafter, the mixture was gradually heated to and maintained at a temperature of about 30° C for about 20 minutes while allowing the resultant incompletely imidized polymer to precipitate in the form of fine particles in the polymerization mixture. The polymerization mixture was heated to and maintained at a temperature of from 70° to 80° C for 30 minutes or more to complete the imidization reaction.
- The polymerization mixture containing the imide polymer particles was mixed into a large amount of methyl alcohol. The mixture was filtered to separate the imide polymer particles. The imide polymer particles were washed with methyl alcohol and, then, dried under a reduced pressure, to prepare an imide polymer powder.
- The imide polymer powder exhibited a degree of imidization of 90% or more and a logarithmic viscosity of 1.90.
- A separable flask equipped with a stirrer was charged with a mixture of 10 g of the imide polymer powder and 90 g of p-chlorophenol. The mixture was heated to a temperature of about 100° C while stirring it, to prepare a homogeneous solution of the imide polymer, the solution was refined by filtering and by degassing it, to prepare a dope solution.
- The dope solution was spread on a surface of a glass plate placed horizontally to form a thin film of the dope solution having a uniform thickness. The dope solution film was maintained at a temperature of about 100°C in a nitrogen gas atmosphere for 2 hours, to gradually evaporate the solvent, and, then the resultant solid film on the glass plate was completely dried at a temperature of 200° C for 5 hours. The resultant imide polymer dense film had a thickness of 10 µm.
- The resultant imide polymer dense film was subjected to gas permeating tests for hydrogen, carbon monoxide, oxygen and nitrogen gases.
-
- The dense film had excellent ratios PH2/PCO and PO2/PN2.
- The same separable flask as that described in Example 1 was charged with a mixture of 40 millimoles of 3,3',4,4'-biphenyltetracarboxylic dianhydride, 40 millimoles of 4,4'-diaminodiphenyl ether and 163 ml of a solvent consisting of N-methyl pyrrolidone. The mixture was subjected to a polymerization procedure at a temperature of 25° C for five hours. A solution containing 10% by weight of polyamic acid was obtained.
- The polyamic acid in the solution exhibited a degree of imidization of 10% or less and a logarithmic viscosity of 2.41. the polyamic acid solution was refined by filtering and degassing it, to prepare a dope solution.
- The dope solution was spread on a horizontal surface of a glass plate to form a film of the dope solution, having a uniform thickness. The dopesolution film was allowed to stand in a nitrogen gas atmosphere at a temperature of about 60° C for two hours, to gradually evaporate the solvent. The resultant solid film was completely dried at a temperature of 240° C for 5 hours to complete the imidization reaction. The resultant imide polymer dense film had a thickness of 5 µm.
-
- The same procedures for producing polyamic acid solution as those described in Example 2 were carried out, except that 4,4'-diaminodiphenyl ether was replaced by m-phenylene diamine.
- The resultant polyamic acid exhibited a degree of imidization of 10% or less and a logarithmic viscosity of 2.15.
- The same procedure for preparing a dense film as those described in Example 2 were carried out by using the polyamic acid solution.
-
- The dense film exhibited satisfactory ratios PH2/PCO and POz/PHz.
- The same procedures as those described in Example 2 for producing the polyamic acid solution was carried out, except that 3,3',4,4'-biphenyltetracarboxylic dianhydride was replaced by pyromellitic acid.
- The polyamic acid had a degree of imidization of 10% or less and a logarithmic viscosity of 1.98.
- The same dense film-forming procedures and gas permeating tests as those described in Example 2 were carried out, by using the above-mentioned polyamic acid solution.
-
- The ratios PH2/PCO and PO2/PN2 of the comparative dense film were unsatisfactory.
- The same separable flask as that described in Example 1 was charged with 20 millimoles of 3,3',4,4'-biphenyltetracarboxylic dianhydride, 20 millimoles of 3,3'-dimethoxybenzidine (0-DAN) and 90 g of p-chlorophenol. The mixture was subjected to a polymerization-imidization procedure in which the mixture was heated from room temperature to 180°C within about 50 minutes while flowing nitrogen gas through the flask and stirring the mixture, and, then, the temperature of the mixture was maintained at the level of 180°C for 7 hours so as to carry out the polymerization and imidization reactions in one single step procedure. A viscous imide polymer solution was obtained.
- The imide polymer solution had a concentration of the polymer of about 10% by weight. The imide polymer had a logarithmic viscosity of 1.54 and a degree of imidization of 95% or more.
- The imide polymer solution was used as a dope solution. The dope solution was uniformly spread on the surface of a glass plate by using a doctor blade to form a thin film of the dope solution having a thickness of 0.2 mm. The dope solution film was maintained at a temperature of about 100° C for 3 hours, to gradually evaporate the solvent and, then, the resultant solid film was completely dried at a temperature of 200°C for 3 hours. The resultant imide polymer dense film had a thickness of about 20 um.
- The resultant imide polymer dense film was subjected to gas permeating tests for hydrogen, carbon monoxide, oxygen and nitrogen gas.
-
-
- A mixture of 20 millimoles of 3,3',4,4'-biphenyltetracarboxylic dianhydride, 12 millimoles of 3,3'-dimethoxybenzidine (o-DAN), 8 millimoles of 3,5-diaminobenzoic acid and 85 g of p-chlorophenol, was subjected to the same polymerization-imidization one single step procedure as that described in Example 4. A viscous imide polymer solution was obtained, which contained an imide polymer in a concentration of about 10% by weight. The imide polymer exhibited a logarithmic viscosity of 1.35 and a degree of imidization of 95% or more.
- The imide polymer solution was used as a dope solution. The same procedure for producing a dense film as that described in Example 4 was carried out by using the dope solution. A dense film having a thickness of about 20 µm was obtained.
-
Claims (5)
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JP8852980A JPS5715819A (en) | 1980-07-01 | 1980-07-01 | Gas separating material |
JP88529/80 | 1980-07-01 |
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EP (1) | EP0043265B1 (en) |
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JPH08225645A (en) * | 1995-12-18 | 1996-09-03 | Nitto Denko Corp | Colorless clear polyimide molding and production thereof |
US5700310A (en) | 1995-12-29 | 1997-12-23 | Mg Generon, Inc. | Removal of oil from compressed gas with macroporous polymeric adsorbent |
US5716677A (en) * | 1996-03-21 | 1998-02-10 | Ohio Aerospace Institute | Protective coatings for polyimide composites |
WO2006025327A1 (en) | 2004-08-30 | 2006-03-09 | National University Corporation Nagoya Institute Of Technology | Multibranched polyimide hybrid material |
US7803214B2 (en) * | 2006-07-21 | 2010-09-28 | Ube Industries, Ltd. | Asymmetric hollow-fiber gas separation membrane, gas separation method and gas separation membrane module |
KR101444694B1 (en) * | 2009-05-25 | 2014-10-01 | 에스케이이노베이션 주식회사 | Flexible metal-clad laminate manufacturing method thereof |
JP2017064711A (en) * | 2015-09-30 | 2017-04-06 | 東京応化工業株式会社 | Filtration filter and filtration method, and method for producing purified product of chemical solution for lithography |
KR20180093203A (en) | 2017-02-10 | 2018-08-21 | 삼성디스플레이 주식회사 | Polyamic acid, polyimide film and fabrication method for the same |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5825690B2 (en) * | 1972-07-20 | 1983-05-28 | イ− アイ デユポン デ ニモアス アンド カンパニ− | polyimide material |
FR2193634A1 (en) * | 1972-07-20 | 1974-02-22 | Du Pont | Polyimide semi-permeable membranes |
US3822202A (en) * | 1972-07-20 | 1974-07-02 | Du Pont | Heat treatment of membranes of selected polyimides,polyesters and polyamides |
US4113628A (en) * | 1974-06-05 | 1978-09-12 | E. I. Du Pont De Nemours And Company | Asymmetric polyimide membranes |
GB2032926B (en) * | 1978-08-17 | 1983-03-02 | Ube Industries | Aromatic polyimide resin composition |
DE3062739D1 (en) * | 1979-07-26 | 1983-05-19 | Ube Industries | Process for preparing aromatic polyimide semipermeable membranes |
-
1980
- 1980-07-01 JP JP8852980A patent/JPS5715819A/en active Granted
-
1981
- 1981-06-26 EP EP19810302917 patent/EP0043265B1/en not_active Expired
- 1981-06-26 CA CA000380678A patent/CA1169193A/en not_active Expired
- 1981-06-26 DE DE8181302917T patent/DE3162960D1/en not_active Expired
- 1981-06-29 US US06/278,071 patent/US4378400A/en not_active Expired - Fee Related
- 1981-07-01 KR KR1019810002388A patent/KR840001609B1/en active
Non-Patent Citations (1)
Title |
---|
INDUSTRIAL AND ENGINEERING CHEMISTRY PROCESS DESIGN AND DEVELOPMENT, vol. 11, no. 4, 1972, Washington, US F.P. McCANDLESS "Separation of binary mixtures of CO and H2 by permeation through polymeric films", pages 470-478 * |
Also Published As
Publication number | Publication date |
---|---|
DE3162960D1 (en) | 1984-05-10 |
JPS6355974B2 (en) | 1988-11-07 |
US4378400A (en) | 1983-03-29 |
CA1169193A (en) | 1984-06-12 |
JPS5715819A (en) | 1982-01-27 |
KR830005890A (en) | 1983-09-14 |
EP0043265A1 (en) | 1982-01-06 |
KR840001609B1 (en) | 1984-10-11 |
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