EP0007068B1 - Electromechanical component, particularly a relay - Google Patents
Electromechanical component, particularly a relay Download PDFInfo
- Publication number
- EP0007068B1 EP0007068B1 EP79102274A EP79102274A EP0007068B1 EP 0007068 B1 EP0007068 B1 EP 0007068B1 EP 79102274 A EP79102274 A EP 79102274A EP 79102274 A EP79102274 A EP 79102274A EP 0007068 B1 EP0007068 B1 EP 0007068B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- base plate
- component
- channels
- casting resin
- openings
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011347 resin Substances 0.000 claims abstract description 27
- 229920005989 resin Polymers 0.000 claims abstract description 27
- 238000005266 casting Methods 0.000 claims abstract description 23
- 230000001681 protective effect Effects 0.000 claims description 6
- 230000002093 peripheral effect Effects 0.000 claims 3
- 239000000945 filler Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H50/00—Details of electromagnetic relays
- H01H50/02—Bases; Casings; Covers
- H01H50/023—Details concerning sealing, e.g. sealing casing with resin
Definitions
- the invention relates to an electromechanical component, in particular a relay, in which openings provided for the implementation of connecting pins in the base plate are sealed with casting resin.
- the object of the invention is to provide an electromechanical component of the type mentioned in the introduction in such a way that the casting resin is well introduced to the bushings to be sealed without any additional part; the component height should not be increased and the amount of cast resin should be kept as low as possible.
- this object is achieved in that a channel system for receiving the casting resin is provided on the outer surface of the base plate, narrow capillary channels leading from relatively wide filler channels to the openings for the connecting pins.
- This channel system consists of channels with two different widths. Channels are used to fill the casting resin, and their width enables them to be filled easily using filling nozzles. From these filling channels, however, narrow capillary channels branch off, which lead to the connection pins and around them and, through their capillary action, lead the casting resin precisely to the points to be sealed, namely to the openings in the base plate. Thus, the casting resin is brought to the desired location without the filling nozzles having to be brought too close to the connecting pins and these u. Contaminate with casting resin.
- the bottom surfaces of the filling channels can each have an inclination towards the capillary channels. This improves the flow behavior in the desired direction.
- the channel system can have a circumferential channel in the area of the edge gaps between the base plate and a protective cap of the component.
- the channel floor can each have a slope towards the marginal gap.
- the in the F i g. 1 and 2 shown component for example a relay, has a base body 1 with a base plate 2 and a protective cap 3.
- a base body 1 with a base plate 2 and a protective cap 3.
- openings 4 are provided for pins 5.
- round connecting pins 5 ' can also be guided in correspondingly round openings 4'.
- the base plate 2 has a channel system with longitudinal filling channels 7 and transverse capillary channels 8, which lead from the filling channels to the openings 4 and 4 '.
- the casting resin is brought into the filling channels 7 via nozzles and flows from there due to the capillary action of the capillary channels 8 to the openings 4 and 4 ', the connecting pins 5 and 5' flowing around and being sealed all around.
- An oblique design of the channel bottom in the filler channels 7 facilitates the flow of the casting resin to the capillary channels 8.
- the marginal gaps 6 are sealed via an marginal channel 9.
- additional filling channels 7 ' are also provided in the floor areas without connecting pins.
- the edge channel also has a bottom slope 10, which allows the casting resin to flow towards the edge gap 6.
- F i g. 3 shows the filling of the casting resin.
- the component is placed so that the base plate with the connection pins points upwards. Then the component is moved under the metering head of a cast resin metering system in the longitudinal direction, so that each filler channel 7 or 7 'is moved along under a filler nozzle 11. Casting resin is continuously fed into the filling channels from the filling nozzles 11.
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Casings For Electric Apparatus (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
- Insulation, Fastening Of Motor, Generator Windings (AREA)
- Organic Insulating Materials (AREA)
- Switch Cases, Indication, And Locking (AREA)
- Control Of Electric Motors In General (AREA)
- Burglar Alarm Systems (AREA)
- Iron Core Of Rotating Electric Machines (AREA)
- Insulating Bodies (AREA)
- Insulated Conductors (AREA)
Abstract
Description
Die Erfindung bezieht sich auf ein elektromechanisches Bauelement, insbesondere ein Relais, bei dem für die Durchführung von Anschlußstiften in der Bodenplatte vorgesehene Durchbrüche mit Gießharz abgedichtet sind.The invention relates to an electromechanical component, in particular a relay, in which openings provided for the implementation of connecting pins in the base plate are sealed with casting resin.
Bei Bauelementen dieser Art ist es bereits bekannt, die Gehäusekappe über den Rand der Bodenplatte überstehen zu lassen und den gesamten Raum zwischen den überstehenden Rändern mit Gießharz auszufüllen. Um bei dieser Methode auch sicher alle Anschlußstifte abzudichten, muß eine relativ dicke Gießharzschicht aufgebracht werden. Das heißt, daß sich die Gesamthöhe des Bauelements vergrößert, und daß eine große Menge an Gießharz verbraucht wird.In the case of components of this type, it is already known to let the housing cap protrude beyond the edge of the base plate and to fill the entire space between the protruding edges with casting resin. In order to securely seal all pins with this method, a relatively thick cast resin layer must be applied. That is, the overall height of the device increases and a large amount of resin is consumed.
Will man die Menge des Gießharzes beschränken, so ergibt sich das Problem, dieses Gießharz auf der Oberfläche der Bodenplatte gut zu verteilen und vor allem in genügendem Maße, an die abzudichtenden Stellen, nämlich an die Durchbrüche für die Anschlußstifte, zu bringen. Das Gießharz soll auch nicht zu dünnflüssig sein, da es sonst in unerwünschter Weise durch die Durchbrüche in das Bauteilinnere fließt. Zur Lösung dieses Problems wurde bereits vorgeschlagen, zur Verteilung des Gießharzes ein Vlies mit hoher kapillarer Saugkraft auf die Bodenplatte aufzubringen (DE-B-26 16 299). Dieses Vlies ist allerdings ein Zusatzteil, welches in einem eigenen Arbeitsgang aufgesetzt werden muß. Daneben wurde auch bereits vorgeschlagen, eine Schutzwanne aus schrumpfbarem Kunststoff zu verwenden (DE-B-2504021). Die Innenoberfläche der dort verwendeten Schutzwanne ist mit einem Kunststoffkleber beschichtet, der sich während des Aufschrumpfens verflüssigt und beim Abkühlen aushärtet oder verfestigt. Auch hierbei ist also ein zusätzliches Teil, nämlich die speziell hergestellte und aufgebrachte Schrumpfwanne, erforderlich.If you want to limit the amount of casting resin, the problem arises of distributing this casting resin well on the surface of the base plate and, above all, to bring it to a sufficient extent to the points to be sealed, namely to the openings for the connecting pins. The casting resin should also not be too thin, since it would otherwise flow undesirably through the openings into the interior of the component. To solve this problem, it has already been proposed to apply a nonwoven with high capillary suction to the base plate to distribute the casting resin (DE-B-26 16 299). However, this fleece is an additional part, which must be put on in a separate operation. In addition, it has also already been proposed to use a protective trough made of shrinkable plastic (DE-B-2504021). The inner surface of the protective trough used there is coated with a plastic adhesive that liquefies during shrinking and hardens or solidifies when it cools down. An additional part, namely the specially manufactured and applied shrink tray, is also required here.
Aufgabe der Erfindung ist es, ein elektromechanisches Bauelement der eingangs erwähnten Art so auszubilden, daß das Gießharz ohne zusätzliches teil gut an die abzudichtenden Durchführungen herangeführt wird; dabei soll die Bauteilhöhe nicht vergrößert und die Gießharzmenge möglichst gering gehalten werden.The object of the invention is to provide an electromechanical component of the type mentioned in the introduction in such a way that the casting resin is well introduced to the bushings to be sealed without any additional part; the component height should not be increased and the amount of cast resin should be kept as low as possible.
Erfindungsgemäß wird diese Aufgabe dadurch gelöst, daß auf der Außenoberfläche der Bodenplatte ein Kanalsystem zur Aufnahme des Gießharzes vorgesehen ist, wobei von relativ breiten Einfüllkanälen enge Kapillarkanäle zu den Durchbrüchen für die Anschlußstifte führen.According to the invention, this object is achieved in that a channel system for receiving the casting resin is provided on the outer surface of the base plate, narrow capillary channels leading from relatively wide filler channels to the openings for the connecting pins.
Dieses Kanalsystem besteht also aus Kanälen mit zwei unterschiedlichen Breiten. Zum Einfüllen des Gießharzes dienen Kanäle, die durch ihre Breite ein problemloses Auffüllen mittels Einfülldüsen ermöglichen. Von diesen Einfüllkanälen zweigen aber enge Kapillarkanäle ab, die zu den Anschlußstiften und um diese herum führen und durch ihre Kapillarwirkung das Gießharz genau an die abzudichtenden Stellen, nämlich an die Durchbrüche der Bodenplatte, hinführen. Somit wird das Gießharz an den gewünschten Ort gebracht, ohne daß die Einfülldüsen allzu nahe an die Anschlußstifte herangebracht werden müssen und diese u. U. mit Gießharz verunreinigen.This channel system consists of channels with two different widths. Channels are used to fill the casting resin, and their width enables them to be filled easily using filling nozzles. From these filling channels, however, narrow capillary channels branch off, which lead to the connection pins and around them and, through their capillary action, lead the casting resin precisely to the points to be sealed, namely to the openings in the base plate. Thus, the casting resin is brought to the desired location without the filling nozzles having to be brought too close to the connecting pins and these u. Contaminate with casting resin.
In einer Weiterbildung können die Bodenflächen der Einfüllkanäle jeweils eine Neigung zu den Kapillarkanälen hin besitzen. Dadurch wird das Fließverhalten in die gewünschte Richtung verbessert. Weiterhin kann das Kanalsystem einen umlaufenden Kanal im Bereich der Randspalte zwischen Bodenplatte und einer Schutzkappe des Bauelementes besitzen. Auch hier kann der Kanalboden jeweils eine Schräge zur Randspalte hin besitzen.In a further development, the bottom surfaces of the filling channels can each have an inclination towards the capillary channels. This improves the flow behavior in the desired direction. Furthermore, the channel system can have a circumferential channel in the area of the edge gaps between the base plate and a protective cap of the component. Here, too, the channel floor can each have a slope towards the marginal gap.
Die Erfindung wird nachfolgend an einem Ausführungsbeispiel näher erläutert.The invention is explained in more detail using an exemplary embodiment.
Es zeigt
- F i g. 1 und 2 ein erfindungsgemäß gestaltetes Bauelement in einer Ansicht auf die Anschlußseite und im Schnitt,
- F i g. 3 eine Anordnung zur Abdichtung des Bauelementes von F i g. 1.
- F i g. 1 and 2 a component designed according to the invention in a view of the connection side and in section,
- F i g. 3 shows an arrangement for sealing the component from FIG. 1.
Das in den F i g. 1 und 2 dargestellte Bauelement, beispielsweise ein Relais, besitzt einen Grundkörper 1 mit einer Bodenplatte 2 und einer Schutzkappe 3. In der Bodenplatte 2 sind Durchbrüche 4 für Anschlußstifte 5 vorgesehen. Neben den flachen Anschlußstiften 5 können auch runde Anschlußstifte 5' in entsprechend runden Durchbrüchen 4' geführt sein. Diese Durchbrüche 4 bzw. 4' sollen ebenso wie die Randspalte 6 zwischen Grundplatte 2 und Schutzkappe 3 mit Gießharz abgedichtet werden.The in the F i g. 1 and 2 shown component, for example a relay, has a base body 1 with a
Zum Einfüllen des Gießharzes besitzt die Bodenplatte 2 ein Kanalsystem mit längs verlaufenden Einfüllkanälen 7 und quer verlaufenden Kapillarkanälen 8, welche von den Einfüllkanälen zu den Durchbrüchen 4 bzw. 4' führen. Das Gießharz wird über Düsen in die Einfüllkanäle 7 gebracht und fließt von da aus aufgrund der Kapillarwirkung der Kapillarkanäle 8 zu den Durchbrüchen 4 bzw. 4', wobei die Anschlußstifte 5 bzw. 5' ringsum umflossen und abgedichtet werden. Eine schräge Gestaltung des Kanalbodens in den Einfüllkanälen 7 erleichtert das Abfließen des Gießharzes zu den Kapillarkanälen 8. Gleichzeitig wird die Randspalte 6 über einen Randkanal 9 abgedichtet. Um hierbei ebenfalls eine gleichmäßige Verteilung des Gießharzes zu ermöglichen, sind auch in den Bodenbereichen ohne Anschlußstifte zusätzliche Einfüllkanäle 7' vorgesehen. Auch der Randkanal besitzt eine Bodenschräge 10, welche das Gießharz zur Randspalte 6 hin fließen läßt.To fill the casting resin, the
F i g. 3 zeigt das Einfüllen des Gießharzes. Das Bauelement wird so gelegt, daß die Bodenplatte mit den Anschlußstiften nach oben weist. Dann wird das Bauelement unter dem Dosierkopf einer Gießharzdosieranlage in Längsrichtung bewegt, so daß jeder Einfüllkanal 7 bzw. 7' unter einer Einfülldüse 11 entlang bewegt wird. Dabei wird kontinuierlich aus den Einfülldüsen 11 Gießharz in die Einfüllkanäle geleitet.F i g. 3 shows the filling of the casting resin. The component is placed so that the base plate with the connection pins points upwards. Then the component is moved under the metering head of a cast resin metering system in the longitudinal direction, so that each filler channel 7 or 7 'is moved along under a filler nozzle 11. Casting resin is continuously fed into the filling channels from the filling nozzles 11.
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AT79102274T ATE308T1 (en) | 1978-07-18 | 1979-07-04 | ELECTROMECHANICAL COMPONENT, ESPECIALLY RELAYS. |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE7821508U | 1978-07-18 | ||
DE7821508U DE7821508U1 (en) | 1978-07-18 | 1978-07-18 | Electromechanical component, in particular relay |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0007068A1 EP0007068A1 (en) | 1980-01-23 |
EP0007068B1 true EP0007068B1 (en) | 1981-10-14 |
Family
ID=6693408
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP79102274A Expired EP0007068B1 (en) | 1978-07-18 | 1979-07-04 | Electromechanical component, particularly a relay |
Country Status (7)
Country | Link |
---|---|
US (1) | US4366345A (en) |
EP (1) | EP0007068B1 (en) |
JP (1) | JPS5517995A (en) |
AT (1) | ATE308T1 (en) |
DE (2) | DE7821508U1 (en) |
ES (1) | ES481701A0 (en) |
YU (1) | YU173079A (en) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU529316B2 (en) * | 1978-08-29 | 1983-06-02 | Sds Relais Ag | Electromagnetic relay |
DE2942258A1 (en) * | 1979-10-19 | 1981-05-07 | Robert Bosch Gmbh, 7000 Stuttgart | ELECTRICAL DEVICE, PREFERABLY RELAY FOR MOTOR VEHICLES |
DE3026371C2 (en) * | 1980-07-11 | 1990-07-12 | Siemens AG, 1000 Berlin und 8000 München | Housing for an electrical component and method for its sealing |
DE3111311A1 (en) * | 1981-03-23 | 1982-09-30 | Siemens AG, 1000 Berlin und 8000 München | Method for sealing electromechanical components |
DE3212315A1 (en) * | 1982-04-02 | 1983-10-13 | Rausch & Pausch, 8672 Selb | Relay having a covering cap or a housing |
DE3319329C2 (en) * | 1983-05-27 | 1985-05-30 | Haller-Relais GmbH, 7209 Wehingen | Relay with wash-tight base plate |
DE3333684A1 (en) * | 1983-09-17 | 1985-04-04 | Standard Elektrik Lorenz Ag, 7000 Stuttgart | HOUSING FOR AN ELECTROMECHANICAL COMPONENT, IN PARTICULAR RELAY |
US4594644A (en) * | 1984-10-22 | 1986-06-10 | Electronic Instrument & Specialty Corp. | Electrical component encapsulation package |
DE3544533A1 (en) * | 1985-12-17 | 1987-06-19 | Hengstler Gmbh | Relay with installation-simplifying retention on a board |
US4729739A (en) * | 1986-09-15 | 1988-03-08 | Texas Instruments Incorporated | Connector for a chip carrier unit |
US4810831A (en) * | 1986-09-30 | 1989-03-07 | Siemens-Albis Aktiengesellschaft | Housing for an electrical component, and method for sealing same |
DE8912130U1 (en) * | 1989-10-12 | 1989-11-23 | Hella KG Hueck & Co, 4780 Lippstadt | Housing for an electromagnetic component, in particular relay |
DE9011111U1 (en) * | 1990-07-27 | 1991-11-21 | Siemens AG, 8000 München | Housing for an electrical component, in particular a relay |
US5833903A (en) | 1996-12-10 | 1998-11-10 | Great American Gumball Corporation | Injection molding encapsulation for an electronic device directly onto a substrate |
US20070084633A1 (en) * | 2005-09-21 | 2007-04-19 | Tyco Electronic Corporation | Electromagnetic relay with noise reducing sealant |
DE102015102696B3 (en) * | 2015-02-25 | 2016-08-11 | Phoenix Contact Gmbh & Co. Kg | Sealed housing for receiving an electronic component, in particular a relay, component with such a housing and method for its production |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE7007056U (en) * | 1970-02-26 | 1970-08-27 | Sauer Hans | HERMETICALLY SEALED RELAY. |
DE7144972U (en) * | 1971-11-30 | 1972-08-10 | Sds Elektro Gmbh | Hermetically sealed relay |
DE2353444B2 (en) * | 1973-10-25 | 1975-10-02 | Hans 8024 Deisenhofen Sauer | Electromagnetic relay embedded in insulating material |
DE2461884B2 (en) * | 1974-12-30 | 1977-01-13 | Sds-Elektro Gmbh, 8024 Deisenhofen | ELECTROMAGNETIC SWITCHING DEVICE |
JPS5355768A (en) * | 1976-10-29 | 1978-05-20 | Matsushita Electric Works Ltd | Method of sealing case to be sealed |
JPS5377338U (en) * | 1976-11-30 | 1978-06-28 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2733479A (en) * | 1956-02-07 | english | ||
US2672653A (en) * | 1952-03-26 | 1954-03-23 | Essex Wire Corp | Injection mold |
US3331912A (en) * | 1965-09-17 | 1967-07-18 | Component with standoff and method of making same | |
US3668299A (en) * | 1971-04-29 | 1972-06-06 | Beckman Instruments Inc | Electrical circuit module and method of assembly |
DE2616299C2 (en) * | 1976-04-13 | 1978-04-27 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Wash-proof protective device for an electromechanical component and method for its sealing |
JPS535255A (en) * | 1976-07-05 | 1978-01-18 | Hitachi Ltd | Mold for molding resin |
DE7735936U1 (en) * | 1976-11-30 | 1978-03-09 | Sds-Elektro Gmbh, 8024 Deisenhofen | Housing for an electrical component |
CH625381A5 (en) * | 1977-12-02 | 1981-09-15 | Standard Telephon & Radio Ag | |
JPS5941561U (en) * | 1982-09-06 | 1984-03-17 | 結城 茂夫 | Magic notebook with clips for reading markers |
-
1978
- 1978-07-18 DE DE7821508U patent/DE7821508U1/en not_active Expired
-
1979
- 1979-04-26 US US06/033,733 patent/US4366345A/en not_active Expired - Lifetime
- 1979-06-20 ES ES481701A patent/ES481701A0/en active Granted
- 1979-07-04 EP EP79102274A patent/EP0007068B1/en not_active Expired
- 1979-07-04 AT AT79102274T patent/ATE308T1/en not_active IP Right Cessation
- 1979-07-04 DE DE7979102274T patent/DE2960992D1/en not_active Expired
- 1979-07-10 YU YU01730/79A patent/YU173079A/en unknown
- 1979-07-17 JP JP9088779A patent/JPS5517995A/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE7007056U (en) * | 1970-02-26 | 1970-08-27 | Sauer Hans | HERMETICALLY SEALED RELAY. |
DE7144972U (en) * | 1971-11-30 | 1972-08-10 | Sds Elektro Gmbh | Hermetically sealed relay |
DE2353444B2 (en) * | 1973-10-25 | 1975-10-02 | Hans 8024 Deisenhofen Sauer | Electromagnetic relay embedded in insulating material |
DE2461884B2 (en) * | 1974-12-30 | 1977-01-13 | Sds-Elektro Gmbh, 8024 Deisenhofen | ELECTROMAGNETIC SWITCHING DEVICE |
JPS5355768A (en) * | 1976-10-29 | 1978-05-20 | Matsushita Electric Works Ltd | Method of sealing case to be sealed |
JPS5377338U (en) * | 1976-11-30 | 1978-06-28 |
Also Published As
Publication number | Publication date |
---|---|
YU173079A (en) | 1982-06-30 |
ES8106376A1 (en) | 1980-08-16 |
ES481701A0 (en) | 1980-08-16 |
EP0007068A1 (en) | 1980-01-23 |
ATE308T1 (en) | 1981-10-15 |
US4366345A (en) | 1982-12-28 |
JPS5517995A (en) | 1980-02-07 |
DE7821508U1 (en) | 1978-10-26 |
DE2960992D1 (en) | 1981-12-24 |
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