EP0000244B1 - Vorrichtung für die Kühlung von Wärme erzeugenden elektrischen Komponenten - Google Patents

Vorrichtung für die Kühlung von Wärme erzeugenden elektrischen Komponenten Download PDF

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Publication number
EP0000244B1
EP0000244B1 EP78300020A EP78300020A EP0000244B1 EP 0000244 B1 EP0000244 B1 EP 0000244B1 EP 78300020 A EP78300020 A EP 78300020A EP 78300020 A EP78300020 A EP 78300020A EP 0000244 B1 EP0000244 B1 EP 0000244B1
Authority
EP
European Patent Office
Prior art keywords
heat
adapter
thermal
zones
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
EP78300020A
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English (en)
French (fr)
Other versions
EP0000244A1 (de
Inventor
Robert Edward Simons
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
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International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of EP0000244A1 publication Critical patent/EP0000244A1/de
Application granted granted Critical
Publication of EP0000244B1 publication Critical patent/EP0000244B1/de
Expired legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4338—Pistons, e.g. spring-loaded members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention relates to cooled electrical apparatus, that is electrical apparatus comprising a heat generating electrical component or components, a heat sink and a heat transfer path for transferring heat from the or each component to the heat sink.
  • U.S. specification No. 3,993,123 shows an example of electrical apparatus comprising a module including one or more heat generating electrical components mounted on a substrate.
  • a heat conductive cap is sealed to the substrate and encloses the heat generating components.
  • the wall of the cap opposite the substrate contains elongated openings therein extending towards the heat generating components and on the same centres with respect thereto.
  • a resilient member is located in each opening in the cap and acts against the inner end of the opening.
  • a thermal conductive element is located in each of the openings and is of a size to leave only a small peripheral gap between the peripheral opening wall and the associated thermal conductive element. Each resilient member urges its thermal conductive element into heat conducting pressure contact with the aligned heat generating component.
  • a thermal conductive inert gas is located within the cap filling the peripheral gaps and any spaces in the interfaces between the heat generating elements and thermal conductive elements. The heat is removed from the cap by external heat removal means e.g. a heat sink.
  • a heat conductive cap is sealed to the substrate and encloses the heat generating components to enhance heat transfer between the components and the cap, a series of similar conducting studs are soldered to the cap in line with the components and extend within the cap to reach to within a short distance of each component.
  • the space within the cap is filled with a conducting powder to increase heat transfer from the components to the studs and to the cap.
  • the apparatus disclosed in the TDB article has the same limitation as the apparatus disclosed in the aforesaid U.S. specification No. 3,993,123. This is that the cooling paths for all the components are similar and consequently variations in the power consumptions of the components cause variations in their operating temperatures.
  • United States specification No. 3,128,419 relates to individual semi-conductor devices, such as rectifiers and transistors and is concerned with the problem caused by the differential expansion between such devices and the mountings to which they are area soldered.
  • the solution disclosed in U.S. specification No. 3,128,419 consists in providing an expansion equalizing plate between the device and its mounting.
  • the plate consists of a multiplicity of cylindrical copper wire pieces held together by a ring.
  • the specification points out, as a positive disadvantage, that the plate reduces the thermal conductance between the device and its mounting but states that the increase in working temperature of the device can be accepted.
  • the present invention is concerned with the above problem of over cooling low-powered electrical components when a module containing both high-powered and low-powered electrical components is subject to one and the same cooling system.
  • the problem is overcome by the invention by providing predetermined thermal transmission characteristics to the cooling system such that one and the same system is suitable for cooling a module containing both high-powered and low-powered components at the same time.
  • the invention therefore provides electrical apparatus comprising a member through which heat from a plurality of heat generating electrical components is conducted to an interface with a heat sink, said components having different power ratings and generating different quantities of heat in use, characterised in that the interface comprises a thermal adapter positioned in the heat transfer path from the member to the heat sink selectively to introduce different thermal resistances into the individual heat conduction paths from the individual components to the heat sink, said adapter comprising a sheet or other planar device having a first pattern of zones introducing a thermal resistance of a first value into the heat conduction paths through those first zones and a second pattern of zones introducing a thermal resistance of a second and different value into the heat conduction paths through those second zones.
  • FIG. 1 there is shown a cross-sectional view of a gas encapsulated module for providing cooling of heat generating electrical or electronic components shown in the form of chips 10.
  • the chips 10 are integrated circuit components and consist of solid state circuits and devices which are densely packed on a semi-conductor substrate.
  • the power consumed in the circuits within a chip generates heat which must be removed from the chip. Since the various circuits have different power requirements and thus generate different amounts of heat, and since the integrated components thereon must be maintained within certain temperature ranges for reliable operation, the cooling must be of such character as to maintain the temperature of each chip within the required operating range.
  • the chips 10 are mounted on one side of a substrate 12, generally made of ceramic, which has pins 14 extending from the other side thereof, these connecting pins 14 permit the module to be plugged into a board (not shown) which may very well carry auxiliary circuits, etc.
  • a cap or housing 16 is attached to the substrate 12 by means of a flange 18 which surrounds the periphery of the substrate 12.
  • the cap 16 is made of a good heat conductive material such as copper or aluminium.
  • the cap 16 is sufficiently thick to provide openings opposite each of the closely spaced chips 10.
  • Springs 22 are located at the inner end of each of the openings 20 and provide a spring force against a piston element 26 located in the opening 20.
  • the spring force gives the piston element 26 a predetermined force at the outer end thereof where it contacts the back surface of the electronic chip 10 to be cooled.
  • a small annular gap 30 exists between the circumference of the piston element 26 and the sidewalls of the hole 20 in the cap 16. The gap 30 is sufficiently wide to allow a little play of the element 26 within the hole 20 so that the element 26 can attain relatively flat surface engagement with the chip 10. It should be noted that the thermal conductive piston element 26 can accommodate chips 10 of various heights because of the resiliency of the spring member 22.
  • Helium gas 32 is introduced into the open space between the substrate 12 and the cap 16. Helium gas is utilized for several reasons.
  • the gas has a low molecular weight and thus easily fills any voids or spaces in the interface 28 between the thermal conductive piston elements 26 and the chips 10.
  • the helium gas 32 fills the gap 30 between the periphery of the thermal conductive piston element 26 and the wall of the hole 20 thus forming a gaseous thermal conductive interface.
  • Helium gas is a good thermal conductor and therefore provides an inter- face having high heat conductivity. That is, the interfaces formed using helium gas have a relatively low thermal resistance.
  • Another feature of helium gas is that it is inert. By inert it is meant that the gas is electrically non-conductive, non- poisonous, non-corrosive, non-flammable, non- explosive and non-toxic.
  • Helium gas also has a high adhesion quality that essentially wets the surface with which it is in contact.
  • Other suitable low-molecular weight gases such as hydrogen or carbon dioxide could be used.
  • any voids in the pressure interface 28 are filled by the thermal conductive inert gas so that the interface provides a low-resistance to heat transfer.
  • the gap 30 around the periphery of the thermal conductive elements 26 contains helium gas which provides a good thermal inter- face.
  • the module is designed to obtain the required heat transfer rate to maintain all the chips 10 within their specified operating ranges.
  • the heat accumulated in the thermal conductive material cap 16 via the thermal conductive elements 26, is transferred to a cold plate 36 which is attached to the cap 16.
  • the surface of the cap 16 is relatively flat so that the cold plate 36 can be attached thereto in good thermal conductive relation.
  • the cold plate 36 has a cooling liquid 40 circulated therethrough which removes the heat transferred to the cold plate.
  • the heat transfer path for removing heat from the heat generating electronic component chips 10 is across the interfaces 28 between the chips 10 and the piston conductive elements 26, through the piston conductive elements 26 and across the interface 30 between the circumference of these elements and the walls of the openings 20 within the cap 16.
  • the heat is then conveyed through the cap 16 and through the interface between the top of the cap 16 and the wall of the cold plate 36.
  • the heat moves through the wall of the cold plate 36 into the liquid 40 which flows through the cold plate 36 which is the ultimate heat sink.
  • the rate of heat removal must be such as to keep the electronic components or chips 10 within their thermal operating range.
  • the adapter 42 is provided by a plate formed of material having a relatively high thermal conductivity i.e. high in relation to air.
  • the adapter plate 42 will be described hereinafter with particular reference to Figures 3 and 4.
  • FIG. 2 shows a combination of low-power and high-power chips 10 to be cooled within the same module and Figure 3 shows the plate 42.
  • the low-power chips are designated with an X drawn therethrough and the high-power chips just by squares. It can be seen that the low-power chips are arranged in groups 56, and 58 on the substrate 12.
  • a higher resistance heat path in the module adjacent to the low-power chips groupings is obtained by including a thermal inteiface adapter, provided by plate 42, which has cut-out portions 60 and 62 therein of the same shape and location as the low-power chip groupings 56 and 58 on the substrate 12.
  • cut-outs 60, 62 will be in the direct thermal path associated with the low-power chip groupings 56, 58 and introduce a higher thermal resistance in the path which will cause the low-power chips to operate at a higher temperature so as to be above the minimum operating temperature thereof.
  • thermal adapter 42 between the top of the cap 16 and the cold plate 36, creates an interface 44 between the top of the cap 16 and the adapter 42 and a further interface 46 between the top of the adapter 42 and the cold plate 36.
  • the interfaces 44, 46 and the adapter 42 introduce thermal resistance in the heat path between the cap 16 and the cold plate 36.
  • the ratio of the thermal resistance of the heat paths through the material of the adapter and through the medium in the apertures depends on the material from which the adapter is made.
  • the thermal inter- face adapter can be made of a number of different materials, such as poor heat conductors polycarbonate, polytetrafluorethylene, mica or good heat conductors stainless steel aluminium etc.
  • FIG 4 is a schematic diagram showing a cross-section view taken along the zig-zag line IV-IV of Figure 3.
  • the adapter 42 is shown within the module and the heat transfer flow is represented by arrows.
  • the heat does not pass through the cut-out portions but is conducted through the cap or housing to the contact areas between the cap or housing and the thermal interface adapter before passing to the cold plate.
  • the thermal resistance of the heat transfer path is increased by the introduction of the cut-out areas and, accordingly, the low-power chips adjacent the cut-out portions operate at a higher temperature due to the higher resistance path which must be followed because of the cut-out portions in the thermal interface adapter within the heat transfer path.
  • thermal interface adapters on interface resistance is shown in Figure 5 where the thermal interface resistance in degrees Celsius per Watt versus contact area in square centimeter is plotted.
  • Figure 5 is plotted for a 100% contact area of the thermal interface adapter, which would be 111 x 10-4 sq.m., and is intended simply to illustrate the effect of contact pressure.
  • the two curves shown represent two different torques applied to the bolts holding the thermal interface adapter to the module housing.
  • One curve is identified as a 1.5Nm (Newton meter) torque per bolt while the other is identified as 0.7 Nm torque per bolt. It can be seen from the curves in Figure 5 that the thermal interface resistance increases sharply as the contact area decreases.
  • Figure 6 is similar to Figure 5 and is intended simply to illustrate the effect of material on thermal interface adapter performance.
  • the graph shows the thermal inter- face resistance in degrees Celsius per Watt versus the contact area in square centimeters.
  • the curves in descending order represent polycarbonate, polytetrafluoroethylene, mica, stainless steel and aluminium. From the curves it can be seen that polycarbonate gives the highest overall thermal interface resistance.
  • a polycarbonate adapter, 7.6 x 10- 4 m thick with 90 square centimeters of contact area provides an interface resistance of 0.5°C per watt.
  • a polytetrafluoroethylene adapter, 7.6 x 10- 4 m thick with 68 square centimeters of contact area provides an interface resistance of 9.5°C per.
  • watt or mica adapter 7.6 x 10- 4 m thick with 42 square centimeters of contact area provides an interface resistance of 0.5°C per watt.
  • the invention is not limited to the cold plate 36 type of heat sink for exterior heat removal, and in fact could employ an air cooled heat sink.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Claims (4)

1. Elektrische Vorrichtung mit einem Bauelement, über das Wärme von einer Anzahl wärmeerzeugender elektrischer Bauteile nach einer Trenn- oder Berührungsfläche mit einer Wärmesenke ableitbar ist, wobei diese Bauteile unterschiedliche Nennleistungen aufweisen und im Betrieb unterschiedliche Wärmemengen erzeugen, dadurch gekennzeichnet, daß in dem von dem Bauelement nach der Wärmesenke führenden Wärmeableitpfad an der Trennfläche ein Wärmeübertragungs-Adapter (42) vorgesehen ist der für die einzelnen von den elektrischen Bauteilen nach der Wärmesenke führenden Wärmeableitpfade unterschiedliche Wärmeableitwiderstände darstellt, und daß dieser Wärmeübertragungs-Adapter aus einer Folie oder Platte besteht, die ein erstes Muster aus Zonen enthält, die für die durch diese ersten Zonen führenden Wärmeableitpfade einen ersten Wärmewiderstandswert darstellen, sowie ein zweites Muster aus Zonen enthält, die für die durch diese zweiten Zonen führenden Wärmeableitpfade einen zweiten unterschiedlichen Wärmewiderstandswert darstellen.
2. Elektrische Vorrichtung nach Anspruch 1, dadurch gekennzeichnet, daß das erste Muster von Zonen durch ein Muster von in dem Adapter vorgesehenen Offnungen gebildet ist und daß die übrigen Teile des Adapters das zweite Muster von Zonen bilden.
3. Elektrische Vorrichtung nach Anspruch 2, dadurch gekennzeichnet, daß der Adapter aus Polycarbonat, Polytetrafluoraethylen oder Glimmer besteht.
4. Elektrische Vorrichtung nach Anspruch 2, dadurch gekennzeichnet, daß der Adapter aus rostfreiem Stahl oder Aluminium besteht.
EP78300020A 1977-06-16 1978-06-06 Vorrichtung für die Kühlung von Wärme erzeugenden elektrischen Komponenten Expired EP0000244B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US05/807,096 US4167771A (en) 1977-06-16 1977-06-16 Thermal interface adapter for a conduction cooling module
US807096 1977-06-16

Publications (2)

Publication Number Publication Date
EP0000244A1 EP0000244A1 (de) 1979-01-10
EP0000244B1 true EP0000244B1 (de) 1980-07-23

Family

ID=25195564

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Application Number Title Priority Date Filing Date
EP78300020A Expired EP0000244B1 (de) 1977-06-16 1978-06-06 Vorrichtung für die Kühlung von Wärme erzeugenden elektrischen Komponenten

Country Status (4)

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US (1) US4167771A (de)
EP (1) EP0000244B1 (de)
JP (1) JPS546774A (de)
DE (1) DE2860051D1 (de)

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US4193445A (en) * 1978-06-29 1980-03-18 International Business Machines Corporation Conduction cooled module
US4246597A (en) * 1979-06-29 1981-01-20 International Business Machines Corporation Air cooled multi-chip module having a heat conductive piston spring loaded against the chips
US4327398A (en) * 1979-09-04 1982-04-27 Product Technologies, Inc. Cooling system for automatic bowling pin spotter
US4339260A (en) * 1981-01-12 1982-07-13 Owens-Illinois, Inc. Environmentally protected electronic control for a glassware forming machine
DE3378871D1 (en) * 1982-09-09 1989-02-09 Siemens Ag Cooling device for a plurality of integrated components assembled as a flat structure
EP0103067B1 (de) * 1982-09-09 1989-01-04 Siemens Aktiengesellschaft Einrichtung zum Kühlen einer Mehrzahl von zu Flachbaugruppen zusammengefassten integrierten Bausteinen
US4694119A (en) * 1983-09-07 1987-09-15 Sundstrand Data Control, Inc. Heat shielded memory unit for an aircraft flight data recorder
US4649990A (en) * 1985-05-06 1987-03-17 Hitachi, Ltd. Heat-conducting cooling module
US4768581A (en) * 1987-04-06 1988-09-06 International Business Machines Corporation Cooling system for semiconductor modules
CA1283225C (en) * 1987-11-09 1991-04-16 Shinji Mine Cooling system for three-dimensional ic package
US7083612B2 (en) * 2003-01-15 2006-08-01 Cryodynamics, Llc Cryotherapy system
US7410484B2 (en) * 2003-01-15 2008-08-12 Cryodynamics, Llc Cryotherapy probe
US7273479B2 (en) * 2003-01-15 2007-09-25 Cryodynamics, Llc Methods and systems for cryogenic cooling
JP5083088B2 (ja) * 2008-07-23 2012-11-28 富士通株式会社 電子部品ユニットおよび連結機構
JP6127429B2 (ja) * 2012-09-28 2017-05-17 富士通株式会社 冷却装置及び電子装置
WO2015047961A2 (en) 2013-09-24 2015-04-02 Adagio Medical, Inc. Endovascular near critical fluid based cryoablation catheter and related methods
WO2015160574A1 (en) 2014-04-17 2015-10-22 Adagio Medical, Inc. Endovascular near critical fluid based cryoablation catheter having plurality of preformed treatment shapes
BR112017009586B1 (pt) 2014-11-13 2022-09-20 Adagio Medical, Inc. Sistema de crioablação
WO2017048965A1 (en) 2015-09-18 2017-03-23 Adagio Medical Inc. Tissue contact verification system
WO2017095756A1 (en) 2015-11-30 2017-06-08 Adagio Medical, Inc. Ablation method for creating elongate continuous lesions enclosing multiple vessel entries
EP3211668B1 (de) 2016-02-23 2019-04-17 ABB Schweiz AG Anordnung für unterwasserkühlung von halbleitermodulen
JP2020532408A (ja) 2017-09-05 2020-11-12 アダージョ メディカル インコーポレイテッドＡｄａｇｉｏ Ｍｅｄｉｃａｌ，Ｉｎｃ． 形状記憶スタイレットを有するアブレーションカテーテル
BR112020013967A2 (pt) 2018-01-10 2020-12-01 Adagio Medical, Inc. elemento de crioablação com forro condutivo
US11776876B2 (en) * 2021-01-25 2023-10-03 International Business Machines Corporation Distributing heatsink load across a processor module with separable input/output (I/O) connectors

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US3062507A (en) * 1957-11-18 1962-11-06 Smith Corp A O Multi-layer vessel having a heat transfer material disposed between layers
DE1141029B (de) * 1960-06-23 1962-12-13 Siemens Ag Halbleiteranordnung und Verfahren zu ihrer Herstellung
US3264534A (en) * 1964-04-21 1966-08-02 Vitramon Inc Electrical component and thermal construction
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US3629549A (en) * 1969-12-29 1971-12-21 Minnesota Mining & Mfg Heating device
US3993123A (en) * 1975-10-28 1976-11-23 International Business Machines Corporation Gas encapsulated cooling module

Also Published As

Publication number Publication date
JPS546774A (en) 1979-01-19
US4167771A (en) 1979-09-11
JPS5631895B2 (de) 1981-07-24
EP0000244A1 (de) 1979-01-10
DE2860051D1 (en) 1980-11-13

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