EA200401489A1 - PIPE COATING METHOD - Google Patents

PIPE COATING METHOD

Info

Publication number
EA200401489A1
EA200401489A1 EA200401489A EA200401489A EA200401489A1 EA 200401489 A1 EA200401489 A1 EA 200401489A1 EA 200401489 A EA200401489 A EA 200401489A EA 200401489 A EA200401489 A EA 200401489A EA 200401489 A1 EA200401489 A1 EA 200401489A1
Authority
EA
Eurasian Patent Office
Prior art keywords
coating
coating method
pipe coating
tin layer
tin
Prior art date
Application number
EA200401489A
Other languages
Russian (ru)
Other versions
EA008451B1 (en
Inventor
Алекси Салминен
Original Assignee
Оутокумпу Ойй
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Оутокумпу Ойй filed Critical Оутокумпу Ойй
Publication of EA200401489A1 publication Critical patent/EA200401489A1/en
Publication of EA008451B1 publication Critical patent/EA008451B1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1614—Process or apparatus coating on selected surface areas plating on one side
    • C23C18/1616—Process or apparatus coating on selected surface areas plating on one side interior or inner surface
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C23C18/1637—Composition of the substrate metallic substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C23C18/1676—Heating of the solution
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C23C18/1678—Heating of the substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C23C18/1682—Control of atmosphere
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/54—Contact plating, i.e. electroless electrochemical plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Rigid Pipes And Flexible Pipes (AREA)
  • Extrusion Moulding Of Plastics Or The Like (AREA)

Abstract

The invention relates to a method for coating the inner surface of a tube made of copper or copper alloy by a tin layer, according to which method the tin layer is formed by chemical tin coating. The coating of the inner tube surface is carried out in one coating step so that the tin layer is formed as the coating solution circulates on the inner tube surface
EA200401489A 2003-12-12 2004-12-10 Method for coating tubes EA008451B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20031821A FI120268B (en) 2003-12-12 2003-12-12 A method for coating a tube

Publications (2)

Publication Number Publication Date
EA200401489A1 true EA200401489A1 (en) 2005-06-30
EA008451B1 EA008451B1 (en) 2007-06-29

Family

ID=29763516

Family Applications (1)

Application Number Title Priority Date Filing Date
EA200401489A EA008451B1 (en) 2003-12-12 2004-12-10 Method for coating tubes

Country Status (7)

Country Link
EP (1) EP1541710B1 (en)
AT (1) ATE447631T1 (en)
DE (1) DE602004023913D1 (en)
EA (1) EA008451B1 (en)
ES (1) ES2336103T3 (en)
FI (1) FI120268B (en)
PL (1) PL1541710T3 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109576703A (en) * 2018-12-29 2019-04-05 烟台南山学院 A kind of manual tin plating method of nonstandard copper pipe

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2282511A (en) * 1940-03-20 1942-05-12 American Brass Co Coating cupreous surfaces with tin
DE3800918A1 (en) * 1988-01-14 1989-07-27 Siemens Ag Bath for currentless deposition of tin
RU2061790C1 (en) * 1992-07-10 1996-06-10 Екатеринбургский завод по обработке цветных металлов Method for application of silver coatings
DE19501274A1 (en) * 1995-01-18 1996-07-25 Km Europa Metal Ag Process for manufacturing an installation pipe made of copper
WO1996028686A1 (en) * 1995-03-16 1996-09-19 Kabushiki Kaisha Kobe Seiko Sho Copper alloy pipe for water/hot water supply equipped with protective film on its inner surface, production thereof, and heat-exchanger for hot water supply
AU2792697A (en) * 1996-06-05 1998-01-05 Sumitomo Light Metal Industries, Ltd. Internally tin-plated copper pipe manufacturing method
DE19653765A1 (en) * 1996-12-23 1998-06-25 Km Europa Metal Ag Tinned copper pipe and process for coating a copper pipe
JP3277846B2 (en) * 1997-05-19 2002-04-22 日立電線株式会社 Plating method for inner surface Sn or Sn alloy plating tube

Also Published As

Publication number Publication date
ES2336103T3 (en) 2010-04-08
FI120268B (en) 2009-08-31
PL1541710T3 (en) 2010-04-30
FI20031821A (en) 2005-06-13
EP1541710B1 (en) 2009-11-04
EP1541710A2 (en) 2005-06-15
FI20031821A0 (en) 2003-12-12
DE602004023913D1 (en) 2009-12-17
EP1541710A3 (en) 2006-08-02
ATE447631T1 (en) 2009-11-15
EA008451B1 (en) 2007-06-29

Similar Documents

Publication Publication Date Title
TW200639269A (en) Plating method
ATE552763T1 (en) CHEMICAL RAGS
ECSP055913A (en) INHIBITORS OF THE VIVIC POLYMERASES
EG25300A (en) Process for the manufacture of 1,2-dichloroethane.
EG25281A (en) Process for the manufacture of 1,2-dichloroethane.
DE60234001D1 (en) Process for vapor deposition of a copper film.
BRPI0507968A (en) oxidation of organic compounds at high ph
ATE453293T1 (en) METHOD FOR TRANSFERRING A DESTINATION USER PART UNAVAILABLE MESSAGE
NO20052092D0 (en) Process for reducing the viscosity of a well processing fluid
TW200721327A (en) Semiconductor device and method of manufacturing the same
DE502005003957D1 (en) Spray powder and bearing part of a bearing device coated with the spray powder
WO2005098087A3 (en) Method for selective coating of a composite surface production of microelectronic interconnections using said method and integrated circuits
DK1649079T3 (en) Method for inhibiting corrosion using quaternary ammonium carbonates
FR2902576B1 (en) METHOD FOR MODIFYING THE INTERFACIAL RESISTANCE OF A METAL LITHIUM ELECTRODE
WO2010027406A3 (en) Copper layer processing
SE0300567D0 (en) A method of generating metal chelating affinity ligands
BRPI0908415A2 (en) multifunctional coating of aluminum parts
ATE474944T1 (en) SOLDERING PROCESS USING AN IMIDAZOLE COMPOUND
NO20052471D0 (en) Process for the preparation of 3-methylthiopropanal.
EP1293589A3 (en) Apparatus for pretreatment prior to painting
EA200401489A1 (en) PIPE COATING METHOD
JP2004169157A5 (en)
WO2005028718A3 (en) Power supply device in a device for electrochemical treatment
EP1690859A4 (en) Method of efficiently producing ascopyrone p
ATE403370T1 (en) ELEMENT FOR CARRYING ELECTRONIC SAFE COMPONENTS

Legal Events

Date Code Title Description
MM4A Lapse of a eurasian patent due to non-payment of renewal fees within the time limit in the following designated state(s)

Designated state(s): AM AZ BY KZ KG MD TJ TM

PC4A Registration of transfer of a eurasian patent by assignment
MM4A Lapse of a eurasian patent due to non-payment of renewal fees within the time limit in the following designated state(s)

Designated state(s): RU