DK3777494T3 - Installation af et serverboard - Google Patents

Installation af et serverboard Download PDF

Info

Publication number
DK3777494T3
DK3777494T3 DK19762043.8T DK19762043T DK3777494T3 DK 3777494 T3 DK3777494 T3 DK 3777494T3 DK 19762043 T DK19762043 T DK 19762043T DK 3777494 T3 DK3777494 T3 DK 3777494T3
Authority
DK
Denmark
Prior art keywords
installation
server board
server
board
Prior art date
Application number
DK19762043.8T
Other languages
English (en)
Inventor
Madhusudan Krishnan Iyengar
Avinash Panga
Original Assignee
Google Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Google Llc filed Critical Google Llc
Application granted granted Critical
Publication of DK3777494T3 publication Critical patent/DK3777494T3/da

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0208—Interlock mechanisms; Means for avoiding unauthorised use or function, e.g. tamperproof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1401—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1485—Servers; Data center rooms, e.g. 19-inch computer racks
    • H05K7/1487—Blade assemblies, e.g. blade cases or inner arrangements within a blade
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1485—Servers; Data center rooms, e.g. 19-inch computer racks
    • H05K7/1488—Cabinets therefor, e.g. chassis or racks or mechanical interfaces between blades and support structures
    • H05K7/1489—Cabinets therefor, e.g. chassis or racks or mechanical interfaces between blades and support structures characterized by the mounting of blades therein, e.g. brackets, rails, trays
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
DK19762043.8T 2018-09-24 2019-08-16 Installation af et serverboard DK3777494T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US16/139,789 US10863651B2 (en) 2018-09-24 2018-09-24 Installing a server board
PCT/US2019/046792 WO2020068296A1 (en) 2018-09-24 2019-08-16 Installing a server board

Publications (1)

Publication Number Publication Date
DK3777494T3 true DK3777494T3 (da) 2024-01-02

Family

ID=67809705

Family Applications (1)

Application Number Title Priority Date Filing Date
DK19762043.8T DK3777494T3 (da) 2018-09-24 2019-08-16 Installation af et serverboard

Country Status (6)

Country Link
US (2) US10863651B2 (da)
EP (1) EP3777494B1 (da)
CN (1) CN112740840B (da)
DK (1) DK3777494T3 (da)
FI (1) FI3777494T3 (da)
WO (1) WO2020068296A1 (da)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7012499B2 (ja) * 2017-10-18 2022-01-28 日本通信電材株式会社 トレイユニット
US11032949B2 (en) * 2019-09-30 2021-06-08 Baidu Usa Llc Method for deploying liquid cooling solution in an air-cooled data center room
US11852270B2 (en) 2021-07-30 2023-12-26 Raytheon Company Compact, blind-mate fluid fitting
CN113710032A (zh) * 2021-08-31 2021-11-26 中国电子科技集团公司第十四研究所 一种耐磨机箱
US20230075362A1 (en) * 2021-09-08 2023-03-09 Baidu Usa Llc Cooling plate with coaxial fluid port
US20230180421A1 (en) * 2021-12-02 2023-06-08 Intel Corporation Back interface for rack shelf

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0767601A1 (en) 1995-10-02 1997-04-09 General Electric Company Mechanical arrangement of fluid cooled electronic circuit
US6629855B1 (en) * 1999-07-01 2003-10-07 Silicon Graphics, Inc. Memory system including guides that receive memory modules
US6646883B2 (en) * 2001-08-21 2003-11-11 Hewlett-Packard Development Company, L.P. Insertion latch and ejectable pull handle for rack mounted electronic devices
GB2381953B (en) * 2001-11-08 2004-04-28 Sun Microsystems Inc Rack-mountable systems
JP3670630B2 (ja) * 2002-07-16 2005-07-13 富士通株式会社 電子機器ユニット着脱機構及びディスクアレイ装置
EP1802188B1 (de) * 2005-12-23 2008-03-19 Schroff GmbH Steckbaugruppe mit Hebelziehgriff
WO2007098077A2 (en) * 2006-02-16 2007-08-30 Cooligy, Inc. Liquid cooling loops for server applications
US8649180B2 (en) * 2006-05-30 2014-02-11 Hewlett-Packard Development Company, L.P. System and method for tool-less mounting of a bezel with an electronic device
US7381074B1 (en) * 2006-12-19 2008-06-03 International Business Machines Corporation Locking and activation mechanism for a hot swappable daughter card
US9943014B2 (en) * 2013-03-15 2018-04-10 Coolit Systems, Inc. Manifolded heat exchangers and related systems
TWI559843B (zh) * 2008-04-21 2016-11-21 液體冷卻解決方案股份有限公司 用於電子裝置液體浸沒冷卻之陣列連接式殼體及機架系統
US8593827B1 (en) * 2009-12-15 2013-11-26 Emc Corporation Compressible engagement assembly
CN102281735B (zh) * 2010-06-08 2016-03-30 赛恩倍吉科技顾问（深圳）有限公司 服务器固定结构
US8611103B2 (en) * 2011-10-27 2013-12-17 Cisco Technology, Inc. Latching injector/ejector
WO2014142865A1 (en) * 2013-03-14 2014-09-18 Hewlett-Packard Development Company, L.P. Support member
US8820351B1 (en) 2013-06-25 2014-09-02 Chilldyne, Inc. No drip hot swap connector and method of use
US9125318B2 (en) * 2013-11-26 2015-09-01 Lenovo Enterprise Solutions (Singapore) Pte. Ltd. Handle lockout mechanism for scaling blade-style servers
US9351428B2 (en) 2014-08-29 2016-05-24 Lenovo Enterprise Solutions (Singapore) Pte. Ltd. Blind docking apparatus to enable liquid cooling in compute nodes
US20160128238A1 (en) 2014-10-27 2016-05-05 Ebullient, Llc Hot-swappable server with cooling line assembly
US10356957B2 (en) * 2014-10-31 2019-07-16 Hewlett Packard Enterprise Development Lp Adaptive cooling assembly
US9696235B2 (en) * 2015-03-18 2017-07-04 Lenovo Enterprise Solutions (Singapore) Pte. Ltd. Managing water leakage from a water cooling system within a compute node

Also Published As

Publication number Publication date
US11564334B2 (en) 2023-01-24
CN112740840B (zh) 2024-03-29
CN112740840A (zh) 2021-04-30
US20210092872A1 (en) 2021-03-25
WO2020068296A1 (en) 2020-04-02
EP3777494A1 (en) 2021-02-17
US10863651B2 (en) 2020-12-08
FI3777494T3 (fi) 2024-01-08
EP3777494B1 (en) 2023-10-04
US20200100392A1 (en) 2020-03-26

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