DK3583622T3 - Indretning til varmespredning og elektrisk isolering - Google Patents
Indretning til varmespredning og elektrisk isolering Download PDFInfo
- Publication number
- DK3583622T3 DK3583622T3 DK17708996.8T DK17708996T DK3583622T3 DK 3583622 T3 DK3583622 T3 DK 3583622T3 DK 17708996 T DK17708996 T DK 17708996T DK 3583622 T3 DK3583622 T3 DK 3583622T3
- Authority
- DK
- Denmark
- Prior art keywords
- electrical insulation
- heat distribution
- distribution
- heat
- insulation
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20472—Sheet interfaces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- Materials Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Theoretical Computer Science (AREA)
- Thermal Sciences (AREA)
- Ceramic Engineering (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/EP2017/053804 WO2018149512A1 (en) | 2017-02-20 | 2017-02-20 | Thermal dissipation and electrical isolating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DK3583622T3 true DK3583622T3 (da) | 2021-05-25 |
Family
ID=58231576
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DK17708996.8T DK3583622T3 (da) | 2017-02-20 | 2017-02-20 | Indretning til varmespredning og elektrisk isolering |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP3583622B1 (da) |
| DK (1) | DK3583622T3 (da) |
| WO (1) | WO2018149512A1 (da) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10986723B2 (en) * | 2018-10-16 | 2021-04-20 | Ingersoll-Rand Industrial U.S., Inc. | Heat sink tray for printed circuit boards |
| CN110267502A (zh) * | 2019-07-10 | 2019-09-20 | 东莞市源冠塑胶模具有限公司 | 一种新型电子设备散热贴片 |
| US11483948B2 (en) | 2019-08-28 | 2022-10-25 | Laird Technologies, Inc. | Thermal interface materials including memory foam cores |
| DE102019215644A1 (de) * | 2019-10-11 | 2021-04-15 | Robert Bosch Gmbh | Elektronische Baugruppe, insbesondere für Elektrofahrzeuge oder Hybridfahrzeuge |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7303820B2 (en) * | 2003-10-14 | 2007-12-04 | Graftech International Holdings Inc. | Heat spreader for display device |
| US20050270746A1 (en) * | 2004-06-04 | 2005-12-08 | Reis Bradley E | Insulating structure having combined insulating and heat spreading capabilities |
| JP2006188022A (ja) * | 2005-01-07 | 2006-07-20 | Taisei Laminator Co Ltd | カーボングラファイトシート |
| WO2008149920A1 (ja) | 2007-06-07 | 2008-12-11 | Kaneka Corporation | グラファイト複合フィルム |
| JP5142367B2 (ja) * | 2007-11-06 | 2013-02-13 | 北川工業株式会社 | 薄膜熱拡散シート |
| CN101712217B (zh) | 2009-05-12 | 2013-07-31 | 大连丽昌新材料有限公司 | 一种石墨导热界面材料的制造工艺 |
| JP5903984B2 (ja) * | 2012-03-29 | 2016-04-13 | Dic株式会社 | 着色粘着テープおよびグラファイト複合シート |
| CN103043301A (zh) | 2012-11-30 | 2013-04-17 | 苏州安洁科技股份有限公司 | 一种新型石墨导热片 |
| CN106133901B (zh) * | 2014-04-08 | 2019-05-03 | 松下知识产权经营株式会社 | 热传导片及其制造方法 |
| JP6454587B2 (ja) | 2015-03-31 | 2019-01-16 | リンテック株式会社 | グラファイトシート積層体の製造方法、グラファイトシート積層体の個片化物の製造方法、グラファイトシート積層体の個片化物封止粘着シートの製造方法およびグラファイトシート積層体封止粘着シートの個片化物の製造方法 |
| JP6543803B2 (ja) * | 2015-05-18 | 2019-07-17 | パナソニックＩｐマネジメント株式会社 | 熱伝導シート |
-
2017
- 2017-02-20 WO PCT/EP2017/053804 patent/WO2018149512A1/en unknown
- 2017-02-20 EP EP17708996.8A patent/EP3583622B1/en active Active
- 2017-02-20 DK DK17708996.8T patent/DK3583622T3/da active
Also Published As
| Publication number | Publication date |
|---|---|
| EP3583622A1 (en) | 2019-12-25 |
| EP3583622B1 (en) | 2021-04-14 |
| WO2018149512A1 (en) | 2018-08-23 |
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