DK3402319T3 - Kølemodul og effektomformer, der omfatter et sådan kølemodul - Google Patents

Kølemodul og effektomformer, der omfatter et sådan kølemodul Download PDF

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Publication number
DK3402319T3
DK3402319T3 DK18171546.7T DK18171546T DK3402319T3 DK 3402319 T3 DK3402319 T3 DK 3402319T3 DK 18171546 T DK18171546 T DK 18171546T DK 3402319 T3 DK3402319 T3 DK 3402319T3
Authority
DK
Denmark
Prior art keywords
cooling module
power converter
cooling
module
converter
Prior art date
Application number
DK18171546.7T
Other languages
English (en)
Inventor
Yannick Moison
Mickael Debeze
Jérome Giolat
Jean-Luc Dubelloy
Original Assignee
Mersen France Sb Sas
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mersen France Sb Sas filed Critical Mersen France Sb Sas
Application granted granted Critical
Publication of DK3402319T3 publication Critical patent/DK3402319T3/da

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20263—Heat dissipaters releasing heat from coolant
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20281—Thermal management, e.g. liquid flow control
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Rectifiers (AREA)
  • Power Conversion In General (AREA)
DK18171546.7T 2017-05-11 2018-05-09 Kølemodul og effektomformer, der omfatter et sådan kølemodul DK3402319T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1754142A FR3066355B1 (fr) 2017-05-11 2017-05-11 Module de refroidissement et convertisseur de puissance comprenant un tel module de refroidissement

Publications (1)

Publication Number Publication Date
DK3402319T3 true DK3402319T3 (da) 2021-06-28

Family

ID=59297083

Family Applications (1)

Application Number Title Priority Date Filing Date
DK18171546.7T DK3402319T3 (da) 2017-05-11 2018-05-09 Kølemodul og effektomformer, der omfatter et sådan kølemodul

Country Status (7)

Country Link
US (1) US10674628B2 (da)
EP (1) EP3402319B1 (da)
JP (1) JP7158888B2 (da)
CN (1) CN108882619B (da)
DK (1) DK3402319T3 (da)
ES (1) ES2880395T3 (da)
FR (1) FR3066355B1 (da)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11234343B2 (en) * 2018-05-03 2022-01-25 Intel Corporation Thermal management solutions for stacked integrated circuit devices using unidirectional heat transfer devices
KR102602925B1 (ko) * 2018-12-11 2023-11-15 현대자동차주식회사 전력변환 장치용 냉각 시스템

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06268127A (ja) * 1993-03-15 1994-09-22 Toshiba Corp 電力用半導体素子の冷却体
SE9802564L (sv) * 1998-07-17 2000-01-18 Abb Ab Kylelement
US6942018B2 (en) * 2001-09-28 2005-09-13 The Board Of Trustees Of The Leland Stanford Junior University Electroosmotic microchannel cooling system
US6994151B2 (en) * 2002-10-22 2006-02-07 Cooligy, Inc. Vapor escape microchannel heat exchanger
AU2003286855A1 (en) * 2002-11-01 2004-06-07 Cooligy, Inc. Method and apparatus for achieving temperature uniformity and hot spot cooling in a heat producing device
JP4041437B2 (ja) 2003-07-22 2008-01-30 株式会社日本自動車部品総合研究所 半導体素子の冷却装置
US20060096738A1 (en) 2004-11-05 2006-05-11 Aavid Thermalloy, Llc Liquid cold plate heat exchanger
US7808780B2 (en) * 2008-02-28 2010-10-05 International Business Machines Corporation Variable flow computer cooling system for a data center and method of operation
JP5700034B2 (ja) 2009-08-10 2015-04-15 富士電機株式会社 半導体モジュール及び冷却器
FR2949642B1 (fr) * 2009-08-27 2012-05-04 Alstom Transport Sa Convertisseur de puissance electrique pour un vehicule ferroviaire
JP2012109495A (ja) 2010-11-19 2012-06-07 Toshiba Teli Corp 水冷式冷却器
US8482919B2 (en) * 2011-04-11 2013-07-09 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronics card assemblies, power electronics modules, and power electronics devices
US9042100B2 (en) 2013-03-14 2015-05-26 Aavid Thermalloy, Llc System and method for cooling heat generating components
US9437523B2 (en) * 2014-05-30 2016-09-06 Toyota Motor Engineering & Manufacturing North America, Inc. Two-sided jet impingement assemblies and power electronics modules comprising the same
DE112015004284T5 (de) * 2014-11-13 2017-06-01 Hitachi Automotive Systems, Ltd. Leistungsumsetzer
US9445526B2 (en) * 2014-12-22 2016-09-13 Toyota Motor Engineering & Manufacturing North America, Inc. Modular jet impingement assemblies with passive and active flow control for electronics cooling
CN205385017U (zh) * 2015-12-21 2016-07-13 南京熊猫电子股份有限公司 一种高效散热的ltcc基板微流道结构
CN205211737U (zh) 2015-12-21 2016-05-04 思源清能电气电子有限公司 一种igbt模块水冷散热器

Also Published As

Publication number Publication date
JP7158888B2 (ja) 2022-10-24
EP3402319A1 (fr) 2018-11-14
US10674628B2 (en) 2020-06-02
CN108882619A (zh) 2018-11-23
ES2880395T3 (es) 2021-11-24
EP3402319B1 (fr) 2021-04-14
CN108882619B (zh) 2021-08-17
US20180332736A1 (en) 2018-11-15
FR3066355B1 (fr) 2020-02-07
JP2018190984A (ja) 2018-11-29
FR3066355A1 (fr) 2018-11-16

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