DK2329319T3 - Forbedret nanoimprint fremgangsmåde - Google Patents

Forbedret nanoimprint fremgangsmåde

Info

Publication number
DK2329319T3
DK2329319T3 DK09782221.7T DK09782221T DK2329319T3 DK 2329319 T3 DK2329319 T3 DK 2329319T3 DK 09782221 T DK09782221 T DK 09782221T DK 2329319 T3 DK2329319 T3 DK 2329319T3
Authority
DK
Denmark
Prior art keywords
nanoimprint
procedure
improved
nanoimprint procedure
improved nanoimprint
Prior art date
Application number
DK09782221.7T
Other languages
English (en)
Inventor
Namil Koo
Jung Wuk Kim
Christian Moormann
Original Assignee
Amo Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Amo Gmbh filed Critical Amo Gmbh
Application granted granted Critical
Publication of DK2329319T3 publication Critical patent/DK2329319T3/da

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/24612—Composite web or sheet

Landscapes

  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Mathematical Physics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Theoretical Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Toxicology (AREA)
  • Oral & Maxillofacial Surgery (AREA)
  • Thermal Sciences (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)
DK09782221.7T 2008-08-27 2009-08-26 Forbedret nanoimprint fremgangsmåde DK2329319T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008041623 2008-08-27
PCT/EP2009/061005 WO2010023227A1 (de) 2008-08-27 2009-08-26 Verbessertes nanoimprint-verfahren

Publications (1)

Publication Number Publication Date
DK2329319T3 true DK2329319T3 (da) 2013-10-21

Family

ID=41258238

Family Applications (1)

Application Number Title Priority Date Filing Date
DK09782221.7T DK2329319T3 (da) 2008-08-27 2009-08-26 Forbedret nanoimprint fremgangsmåde

Country Status (9)

Country Link
US (1) US8795775B2 (da)
EP (1) EP2329319B1 (da)
JP (1) JP2012501084A (da)
KR (1) KR101512876B1 (da)
CN (1) CN102144188B (da)
AU (1) AU2009286690A1 (da)
CA (1) CA2734952A1 (da)
DK (1) DK2329319T3 (da)
WO (1) WO2010023227A1 (da)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9337100B2 (en) * 2009-06-03 2016-05-10 Qualcomm Incorporated Apparatus and method to fabricate an electronic device
DE102010044133B4 (de) * 2010-11-18 2016-03-03 Schott Ag Ätzverfahren zur Oberflächenstrukturierung und Ätzmaske
US20130189428A1 (en) * 2011-06-27 2013-07-25 Cedric TROADEC Method for transferring target particles between substrates
DE102014100005A1 (de) 2013-05-29 2014-12-04 Amo Gmbh Beschichtung aus Resist auf ein Substrat für ultrahochauflösende Lithographie
CN104690969B (zh) * 2015-02-10 2017-04-19 西安交通大学 基于3d喷射打印技术的仿生异型微纳复合结构制造工艺
CN106876277B (zh) * 2017-02-20 2020-03-17 武汉华星光电技术有限公司 薄膜晶体管的制备方法、显示面板的制备方法
CN112794277A (zh) * 2021-03-05 2021-05-14 深圳清华大学研究院 一种大尺度超滑器件及其加工制作方法
TW202343134A (zh) 2022-04-28 2023-11-01 聯華電子股份有限公司 利用二次奈米壓印在基板上製作圖案的方法

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5116548A (en) * 1989-08-29 1992-05-26 American Bank Note Holographics, Inc. Replicaton of microstructures by casting in controlled areas of a substrate
JPH0580530A (ja) * 1991-09-24 1993-04-02 Hitachi Ltd 薄膜パターン製造方法
US5330799A (en) * 1992-09-15 1994-07-19 The Phscologram Venture, Inc. Press polymerization of lenticular images
DE69405451T2 (de) * 1993-03-16 1998-03-12 Koninkl Philips Electronics Nv Verfahren und Vorrichtung zur Herstellung eines strukturierten Reliefbildes aus vernetztem Photoresist auf einer flachen Substratoberfläche
US6180239B1 (en) * 1993-10-04 2001-01-30 President And Fellows Of Harvard College Microcontact printing on surfaces and derivative articles
EP1003078A3 (en) * 1998-11-17 2001-11-07 Corning Incorporated Replicating a nanoscale pattern
WO2002003142A2 (en) 2000-06-30 2002-01-10 President And Fellows Of Harvard College Electric microcontact printing method and apparatus
JP4683769B2 (ja) * 2001-05-31 2011-05-18 三井金属鉱業株式会社 銅メッキ回路層付銅張積層板及びその銅メッキ回路層付銅張積層板を用いたプリント配線板の製造方法
US6714350B2 (en) * 2001-10-15 2004-03-30 Eastman Kodak Company Double sided wire grid polarizer
US7144539B2 (en) * 2002-04-04 2006-12-05 Obducat Ab Imprint method and device
CN100454141C (zh) * 2002-08-27 2009-01-21 奥博杜卡特股份公司 用于将图案转印到物体的设备
KR100950133B1 (ko) * 2002-12-27 2010-03-30 엘지디스플레이 주식회사 인쇄방식에 의한 패턴형성방법
US7070406B2 (en) * 2003-04-29 2006-07-04 Hewlett-Packard Development Company, L.P. Apparatus for embossing a flexible substrate with a pattern carried by an optically transparent compliant media
US6860956B2 (en) * 2003-05-23 2005-03-01 Agency For Science, Technology & Research Methods of creating patterns on substrates and articles of manufacture resulting therefrom
JP4733134B2 (ja) * 2004-09-08 2011-07-27 ニル テクノロジー エイピーエス 柔軟なナノインプリントスタンプ
US7811505B2 (en) * 2004-12-07 2010-10-12 Molecular Imprints, Inc. Method for fast filling of templates for imprint lithography using on template dispense
SG125214A1 (en) * 2005-02-17 2006-09-29 Agency Science Tech & Res Method of low temperature imprinting process with high pattern transfer yield
JP2008194838A (ja) * 2007-02-08 2008-08-28 Sii Nanotechnology Inc ナノインプリントリソグラフィーのモールド検査方法及び樹脂残渣除去方法
US20080229941A1 (en) * 2007-03-19 2008-09-25 Babak Heidari Nano-imprinting apparatus and method
US8027086B2 (en) * 2007-04-10 2011-09-27 The Regents Of The University Of Michigan Roll to roll nanoimprint lithography
US8142702B2 (en) * 2007-06-18 2012-03-27 Molecular Imprints, Inc. Solvent-assisted layer formation for imprint lithography

Also Published As

Publication number Publication date
EP2329319A1 (de) 2011-06-08
EP2329319B1 (de) 2013-07-17
KR101512876B1 (ko) 2015-04-16
CN102144188B (zh) 2013-05-01
WO2010023227A1 (de) 2010-03-04
CA2734952A1 (en) 2010-03-04
US8795775B2 (en) 2014-08-05
AU2009286690A1 (en) 2010-03-04
JP2012501084A (ja) 2012-01-12
KR20110061585A (ko) 2011-06-09
US20110171432A1 (en) 2011-07-14
CN102144188A (zh) 2011-08-03

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