DK2150403T3 - Varmeisolerende strukturer - Google Patents
Varmeisolerende strukturer Download PDFInfo
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- DK2150403T3 DK2150403T3 DK08737136.5T DK08737136T DK2150403T3 DK 2150403 T3 DK2150403 T3 DK 2150403T3 DK 08737136 T DK08737136 T DK 08737136T DK 2150403 T3 DK2150403 T3 DK 2150403T3
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- contain
- phenolic resin
- structure according
- layer
- outer layer
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Claims (14)
1. Varmeisoleringsstruktur, som påføres et substrat til brug under vandet, hvor strukturen indeholder et fleksibelt indvendigt bindelag, som kan forbindes med substratet, hvor bindelaget er reaktionsproduktet af et første materiale, som indeholder en koldhærdende phenolharpiks, og et andet materiale, som indeholder en partiel phosphatester; et skumisolerende lag, som er reaktionsproduktet af en koldhærdende syntetisk phenolharpiks og en partiel phosphate-ster, og som indeholder mellem 15 og 30% glascenospherer og op til 20% af en nitrilbutadien-gummiblødgøringsmiddel, og et udvendigt beskyttende lag, som er reaktionsproduktet afen koldhærdende harpiks og en partiel phospha-tester.
2. Struktur ifølge krav 1, hvor bindelagets første materiale indeholder mellem 0,5 og 2,5% af silan-koblingsmidlet, og det isolerende lag og/eller udvendige lag kan indeholde op til 2,5% af silan-koblingsmidlet.
3. Struktur ifølge et hvilket som helst af de foregående krav, hvor bindelagets første materiale indeholder 50 - 75 vægt% phenolharpiks, og kan indeholde 65 - 70% phenolharpiks.
4. Struktur ifølge et hvilket som helst af de foregående krav, hvor phenolhar-piksen af bindelagets første materiale er en resol-phenolharpiks, kan have et vandindhold, der ikke er større end 16%, og/eller kan indeholde op til 2% et-handiol som blødgører.
5. Struktur ifølge et hvilket som helst af de foregående krav, hvor bindelagets første materiale indeholder op til 2% af et anti-perlingmiddel, kan indeholde mellem 1 og 4% røget silica, kan indeholde mellem 15 og 30% cenospherer, og kan nærmere bestemt indeholde mellem 23 og 28% cenospherer.
6. Struktur ifølge et hvilket som helst af de foregående krav, hvor cenosphere-skallerer en blanding af hvilken som helst af zirconium-, titan-, aluminium- eller jernoxider, og hvor cenosphererne kan have SG på mellem 0,005 og 0,02.
7. Struktur ifølge et hvilket som helst af de foregående krav, hvor bindelagets andet materiale indeholder hvilken som helst af: mellem 90 og 98% partiel phosphatester; op til 1% sulfonsyre som hærdningsaccelerator; og/eller op til 10% vand.
8. Struktur ifølge et hvilket som helst af de foregående krav, hvor hvilken som helst af: forholdet af første til andet materiale af bindelaget er mellem 5:1 og 10:1; forholdet af isolerende lag af første materiale til andet materiale er mellem 4:1 og 10:1; og/eller forholdet af første til andet materiale i det udvendige lag er mellem 10:1 og 20:1.
9. Struktur ifølge et hvilket som helst af de foregående krav, hvor : det isolerende lag af det første materiale indeholder mellem 35 og 75% phenolharpiks, og nærmere bestemt kan indeholde mellem 50 og 70% phenolharpiks; hvor phenolharpiksen af det isolerende lag af det første materiale kan være en re-sol-phenolharpiks; og/eller kan have et vandindhold, der ikke er større end 16%.
10. Struktur ifølge et hvilket som helst af de foregående krav, hvor det isolerende lag af det første materiale indeholder op til 7% diethyl-phosphonat som blødgører, og kan indeholde mellem 6 og 6.5% diethyl-phosphonat som blødgører.
11. Struktur ifølge et hvilket som helst af de foregående krav, hvor det isolerende lag af det første materiale indeholder: op til 2,5% af silan-koblingsmidlet; kan indeholde op til 5% glasstrenge, som kan være mellem 3 og 12mm lange, og kan være mellem 5 og 7mm lange; og kan indeholde op til 5% zirconiumdi-oxidfibre.
12. Struktur ifølge et hvilket som helst af de foregående krav, hvor det isolerende lag af andet materiale indeholder op til 3% para toluolsulfonsyre som hærdningsaccelerator; og kan indeholde vand.
13. Struktur ifølge et hvilket som helst af de foregående krav, hvor: det udvendige lag af det første materiale indeholder mellem 50 og 100% phenolharpiks, og kan indeholde mellem 63 og 69% phenolharpiks, phenolharpiksen af det udvendige lag af det første materiale kan være en resol-phenolharpiks; phenolharpiksen af det udvendige lag af det første materiale kan have et vandindhold, der ikke er større end 16%; det udvendige lag af det første materiale kan indeholde op til 2,5% af et silankoblingsmiddel; det udvendige lag af det første materiale kan indeholde op til 1% ethandiol; og/eller det udvendige lag af det første materiale kan indeholde op til 4% røget silica.
14. Struktur ifølge et hvilket som helst af de foregående krav, hvor fiberforstærkning indeholdes i det udvendige lag, og fibrene kan være af glas, Kevlar eller carbon.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB0708471A GB2448901A (en) | 2007-05-02 | 2007-05-02 | Thermal Insulation Structure |
| PCT/GB2008/001498 WO2008135724A2 (en) | 2007-05-02 | 2008-04-30 | Thermal insulating structures |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DK2150403T3 true DK2150403T3 (da) | 2018-10-29 |
Family
ID=38171049
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DK08737136.5T DK2150403T3 (da) | 2007-05-02 | 2008-04-30 | Varmeisolerende strukturer |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9067382B2 (da) |
| EP (1) | EP2150403B1 (da) |
| DK (1) | DK2150403T3 (da) |
| ES (1) | ES2691648T3 (da) |
| GB (2) | GB2448901A (da) |
| WO (1) | WO2008135724A2 (da) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014014723A2 (en) * | 2012-07-17 | 2014-01-23 | Momentive Specialty Chemicals Inc. | Flame resistant composite structure |
| DE102012109704A1 (de) * | 2012-10-11 | 2014-04-17 | Epcos Ag | Keramisches Bauelement mit Schutzschicht und Verfahren zu dessen Herstellung |
| US10550220B2 (en) | 2015-03-19 | 2020-02-04 | Zephyros, Inc. | Esterified acids for use in polymeric materials |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3787351A (en) * | 1972-02-28 | 1974-01-22 | Minnesota Mining & Mfg | Use of soluble fluoroaliphatic oligomers in resin composite articles |
| GB2150495B (en) | 1983-11-25 | 1987-04-08 | Bristol Composite Mat | Structural panel |
| US4595623A (en) * | 1984-05-07 | 1986-06-17 | Hughes Aircraft Company | Fiber-reinforced syntactic foam composites and method of forming same |
| GB9312926D0 (en) * | 1993-06-23 | 1993-08-04 | Alderley Materials Ltd | Duplex and sandwich fire resistant materials and fire protective coatings from lightweight cold curing syntactic foams |
| US5665295A (en) * | 1994-08-04 | 1997-09-09 | Teijin Limited | Process for the production of composite molded article |
| US6058979A (en) * | 1997-07-23 | 2000-05-09 | Cuming Corporation | Subsea pipeline insulation |
| EP1090066A1 (en) * | 1998-05-01 | 2001-04-11 | Textron Systems Corporation | Epoxy-syntactic-foam-insulated metal pipes |
| JP3243461B2 (ja) * | 1999-07-30 | 2002-01-07 | 川崎重工業株式会社 | サンドイッチ構造 |
| CA2399736A1 (en) | 2000-02-07 | 2001-08-16 | Nagoya Oilchemical Co., Ltd. | A molding material and a molded article |
| AUPQ824100A0 (en) * | 2000-06-20 | 2000-07-13 | De Toffol, Roberto | A method of manufacturing syntactic foam |
| GB2391600B (en) * | 2001-04-27 | 2005-09-21 | Fiberspar Corp | Buoyancy control systems for tubes |
| US6864297B2 (en) * | 2002-07-22 | 2005-03-08 | University Of Southern California | Composite foam made from polymer microspheres reinforced with long fibers |
| GB0226773D0 (en) | 2002-11-18 | 2002-12-24 | Pyro Technologies Ltd | A syntactic phenolic foam composition |
| US7087703B2 (en) * | 2004-07-26 | 2006-08-08 | Georgia-Pacific Resins, Inc. | Phenolic resin compositions containing etherified hardeners |
| US20070032575A1 (en) * | 2005-08-08 | 2007-02-08 | Texas Research International, Inc. | Syntactic foam |
-
2007
- 2007-05-02 GB GB0708471A patent/GB2448901A/en not_active Withdrawn
-
2008
- 2008-04-30 GB GB0920841A patent/GB2463813B/en not_active Expired - Fee Related
- 2008-04-30 WO PCT/GB2008/001498 patent/WO2008135724A2/en active Application Filing
- 2008-04-30 ES ES08737136.5T patent/ES2691648T3/es active Active
- 2008-04-30 US US12/598,028 patent/US9067382B2/en active Active
- 2008-04-30 DK DK08737136.5T patent/DK2150403T3/da active
- 2008-04-30 EP EP08737136.5A patent/EP2150403B1/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| WO2008135724A3 (en) | 2009-04-02 |
| EP2150403B1 (en) | 2018-08-01 |
| US20100129637A1 (en) | 2010-05-27 |
| GB0708471D0 (en) | 2007-06-06 |
| EP2150403A2 (en) | 2010-02-10 |
| GB2463813B (en) | 2012-01-04 |
| GB0920841D0 (en) | 2010-01-13 |
| WO2008135724A2 (en) | 2008-11-13 |
| GB2448901A (en) | 2008-11-05 |
| GB2463813A (en) | 2010-03-31 |
| US9067382B2 (en) | 2015-06-30 |
| ES2691648T3 (es) | 2018-11-28 |
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