DK1813634T3 - Hærdningsmiddel for epoxyharpikser samt epoxyharpikssammensætning - Google Patents

Hærdningsmiddel for epoxyharpikser samt epoxyharpikssammensætning

Info

Publication number
DK1813634T3
DK1813634T3 DK07001597T DK07001597T DK1813634T3 DK 1813634 T3 DK1813634 T3 DK 1813634T3 DK 07001597 T DK07001597 T DK 07001597T DK 07001597 T DK07001597 T DK 07001597T DK 1813634 T3 DK1813634 T3 DK 1813634T3
Authority
DK
Denmark
Prior art keywords
resin composition
curing agent
epoxy
epoxy resin
epoxy resins
Prior art date
Application number
DK07001597T
Other languages
Danish (da)
English (en)
Inventor
Shun Ogawa
Hisayuki Kuwahara
Original Assignee
Mitsubishi Gas Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co filed Critical Mitsubishi Gas Chemical Co
Application granted granted Critical
Publication of DK1813634T3 publication Critical patent/DK1813634T3/da

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5026—Amines cycloaliphatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
    • C08G59/184—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Paints Or Removers (AREA)
DK07001597T 2006-01-27 2007-01-25 Hærdningsmiddel for epoxyharpikser samt epoxyharpikssammensætning DK1813634T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006019358 2006-01-27

Publications (1)

Publication Number Publication Date
DK1813634T3 true DK1813634T3 (da) 2009-07-06

Family

ID=37907340

Family Applications (1)

Application Number Title Priority Date Filing Date
DK07001597T DK1813634T3 (da) 2006-01-27 2007-01-25 Hærdningsmiddel for epoxyharpikser samt epoxyharpikssammensætning

Country Status (6)

Country Link
US (1) US7598325B2 (fr)
EP (1) EP1813634B1 (fr)
KR (1) KR101288792B1 (fr)
DE (1) DE602007000866D1 (fr)
DK (1) DK1813634T3 (fr)
TW (1) TWI400263B (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8431653B2 (en) * 2005-12-16 2013-04-30 Mitsubishi Electric Company, Inc. Curing agent composition for epoxy resins and epoxy resin composition
AU2008295553B2 (en) * 2007-08-31 2012-09-06 Swimc Llc Amine functional adducts and curable compositions comprising same
US9102787B2 (en) 2009-11-13 2015-08-11 Blue Cube Ip Llc Curable compositions
WO2014066457A2 (fr) * 2012-10-24 2014-05-01 Dow Global Technologies Llc Revêtements résistant aux intempéries, durcissant à température ambiante
CN105408384A (zh) * 2013-05-16 2016-03-16 蓝立方知识产权有限责任公司 具有改善的耐化学性的胺类硬化剂
EP3313912A4 (fr) * 2015-06-23 2019-06-19 Arkema, Inc. Polymères hydrosolubles et produits d'addition polymères avec leurs solutions aqueuses
EP3381963A1 (fr) 2017-03-31 2018-10-03 Worlée-Chemie GmbH Durcisseur pour résine époxyde
CN111417667B (zh) * 2017-12-07 2023-05-23 三菱瓦斯化学株式会社 环氧树脂固化剂、环氧树脂组合物及其固化物、以及纤维增强复合材料
JP2023514488A (ja) 2020-02-24 2023-04-06 シーカ テクノロジー アクチェンゲゼルシャフト アミン－エポキシ樹脂付加生成物
CN115926112A (zh) * 2022-11-17 2023-04-07 万华化学集团股份有限公司 一种ipda改性潜伏性固化剂、制备方法及其应用

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4348505A (en) * 1980-07-23 1982-09-07 Ciba-Geigy Corporation Adducts from amines and di- and polyepoxides
EP0507735B1 (fr) 1991-04-04 1997-08-20 Ciba SC Holding AG Adducts de résines époxydes et d'amines
DE19520855A1 (de) * 1995-05-02 1996-11-07 Hoechst Ag Aliphatische Epoxid-Amin-Addukte mit hoher Seitenkettenverzweigung, Verfahren zu ihrer Herstellung sowie ihre Verwendung
DE19630277A1 (de) 1996-07-26 1998-01-29 Hoechst Ag Härter für wasserverdünnbare Epoxidharzsysteme mit Topfzeit-Anzeige
DE19631370A1 (de) 1996-08-02 1998-02-05 Hoechst Ag Härtungsmittel für Epoxidharz-Systeme
KR20010042508A (ko) * 1999-02-08 2001-05-25 하기와라 세이지 수지 조성물
US7572506B2 (en) * 2004-06-30 2009-08-11 E. I. Du Pont De Nemours And Company Aqueous primer surfacer compositions

Also Published As

Publication number Publication date
US7598325B2 (en) 2009-10-06
KR20070078703A (ko) 2007-08-01
TWI400263B (zh) 2013-07-01
US20070179258A1 (en) 2007-08-02
EP1813634A1 (fr) 2007-08-01
KR101288792B1 (ko) 2013-07-29
DE602007000866D1 (de) 2009-05-28
EP1813634B1 (fr) 2009-04-15
TW200745194A (en) 2007-12-16

Similar Documents

Publication Publication Date Title
DK1813634T3 (da) Hærdningsmiddel for epoxyharpikser samt epoxyharpikssammensætning
EP2025695A4 (fr) Composition de résine époxy et résine époxy durcie
HK1118303A1 (en) Latent hardener for epoxy resin and epoxy resin composition
EP1731545A4 (fr) Durcisseur pour resine d'epoxy et composition de la resine d'epoxy
TWI367899B (en) Epoxy resin curing agent and epoxy resin composition
EP2253666A4 (fr) Composition de résine durcissable et résine durcie
DE602006000562D1 (de) Härtungsmittelzusammensetzung für Epoxidharz und Epoxidharzzusammensetzung
HK1128483A1 (en) Hardening resin composition
TWI369368B (en) Epoxy resin, epoxy resin composition and cured object thereof
EP2392603A4 (fr) Composition de résine époxy, agent de vulcanisation et accélérateur de vulcanisation
DE602006021707D1 (de) Epoxidharzzusammensetzung, daraus erhaltenes gehäres phenolharz und neues epoxidharz
EP2226347A4 (fr) Agent de durcissement pour résines époxy, son procédé de production et composition de résine époxy
HK1170514A1 (en) Epoxy resin composition
EP2251369A4 (fr) Composition de résine époxy de type à un composant et son utilisation
HK1141042A1 (en) Amine epoxy resin curing agent, gas barrier epoxy resin composition comprising the curing agent, coating agent, and adhesive agent for laminate
EP1837365A4 (fr) Resine epoxy poreuse durcie
HK1086851A1 (en) Curable resin composition, curable film and cured film
EP1995271A4 (fr) Composition durcissable de resine epoxy pour pre-impregne
EP1795558A4 (fr) Formulation de resine epoxy modifiee
DE602006009810D1 (de) Harzzusammensetzung
EP2017307A4 (fr) Composition de resine thermodurcissable et son utilisation
EP2009058A4 (fr) Formule de résine polyimide thermodurcissable et produit durci obtenu à partir de ladite formule
BRPI0823106A2 (pt) Composição de resina de epóxi
EP2216355A4 (fr) Agent de durcissement époxy contenant de la silice et corps durci en résine époxy
NO20083540L (no) Herdemidler for epoksyfunksjonelle forbindelser