DK1701388T3 - Light emitting diode - Google Patents

Light emitting diode

Info

Publication number
DK1701388T3
DK1701388T3 DK05005252T DK05005252T DK1701388T3 DK 1701388 T3 DK1701388 T3 DK 1701388T3 DK 05005252 T DK05005252 T DK 05005252T DK 05005252 T DK05005252 T DK 05005252T DK 1701388 T3 DK1701388 T3 DK 1701388T3
Authority
DK
Denmark
Prior art keywords
light emitting
emitting diode
diode
units
light guidance
Prior art date
Application number
DK05005252T
Other languages
Danish (da)
Inventor
Martin Dr Klenke
Original Assignee
Nanogate Advanced Materials Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nanogate Advanced Materials Gmbh filed Critical Nanogate Advanced Materials Gmbh
Application granted granted Critical
Publication of DK1701388T3 publication Critical patent/DK1701388T3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Diffracting Gratings Or Hologram Optical Elements (AREA)
  • Planar Illumination Modules (AREA)
  • Light Guides In General And Applications Therefor (AREA)
  • Led Devices (AREA)
  • Led Device Packages (AREA)
  • Optical Communication System (AREA)
  • Peptides Or Proteins (AREA)
  • Coloring Foods And Improving Nutritive Qualities (AREA)

Abstract

The diode has a light production unit supported by a carrier, and a light guidance body arranged in an emitting direction of the unit. The body has diffractive light guidance units (30) that are arranged at an upper surface of the body and are made of hardening varnish that is introduced on the upper surface. The units are arranged and/or designed in such a manner that a reflected beam angle of the diode is determined.
DK05005252T 2005-03-10 2005-03-10 Light emitting diode DK1701388T3 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP05005252A EP1701388B1 (en) 2005-03-10 2005-03-10 Light emitting diode

Publications (1)

Publication Number Publication Date
DK1701388T3 true DK1701388T3 (en) 2010-01-11

Family

ID=35385572

Family Applications (1)

Application Number Title Priority Date Filing Date
DK05005252T DK1701388T3 (en) 2005-03-10 2005-03-10 Light emitting diode

Country Status (10)

Country Link
EP (1) EP1701388B1 (en)
JP (1) JP2008533713A (en)
KR (1) KR20070115902A (en)
CN (1) CN101138102B (en)
AT (1) ATE442671T1 (en)
DE (1) DE502005008099D1 (en)
DK (1) DK1701388T3 (en)
ES (1) ES2333231T3 (en)
PL (1) PL1701388T3 (en)
WO (1) WO2006094983A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007004807A1 (en) * 2007-01-31 2008-08-07 Osram Opto Semiconductors Gmbh LED for use in electronic printed circuit board, has stand connected integrally with lens and extending in direction, which exhibits direction portion, which is aligned in direction of semiconductor chip
AT509562A1 (en) * 2010-02-24 2011-09-15 Thallner Erich LIGHTING DEVICE AND METHOD FOR PRODUCING SUCH A
US8455888B2 (en) 2010-05-20 2013-06-04 Industrial Technology Research Institute Light emitting diode module, and light emitting diode lamp
CN105280789A (en) * 2015-09-18 2016-01-27 创维液晶器件(深圳)有限公司 Quantum dot LED

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55113387A (en) * 1979-02-22 1980-09-01 Sanyo Electric Co Ltd Light emitting diode indicator
JPS63283174A (en) * 1987-05-15 1988-11-21 Omron Tateisi Electronics Co Light emitting diode
JPH05102528A (en) * 1991-10-11 1993-04-23 Omron Corp Optical semiconductor element
JP3652945B2 (en) * 1999-12-28 2005-05-25 松下電器産業株式会社 Optical information processing equipment
GB0017658D0 (en) * 2000-07-19 2000-09-06 Secr Defence Light emitting diodes
EP1420462A1 (en) * 2002-11-13 2004-05-19 Heptagon Oy Light emitting device

Also Published As

Publication number Publication date
JP2008533713A (en) 2008-08-21
DE502005008099D1 (en) 2009-10-22
EP1701388A1 (en) 2006-09-13
CN101138102A (en) 2008-03-05
WO2006094983A1 (en) 2006-09-14
ES2333231T3 (en) 2010-02-18
PL1701388T3 (en) 2010-02-26
KR20070115902A (en) 2007-12-06
CN101138102B (en) 2011-04-13
ATE442671T1 (en) 2009-09-15
EP1701388B1 (en) 2009-09-09

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