DK1681911T3 - Varmedissiperende indretning med isotermisk pladesamling af en forudbestemt facon og fremgangsmåde til fremstilling af samme - Google Patents
Varmedissiperende indretning med isotermisk pladesamling af en forudbestemt facon og fremgangsmåde til fremstilling af sammeInfo
- Publication number
- DK1681911T3 DK1681911T3 DK05000860T DK05000860T DK1681911T3 DK 1681911 T3 DK1681911 T3 DK 1681911T3 DK 05000860 T DK05000860 T DK 05000860T DK 05000860 T DK05000860 T DK 05000860T DK 1681911 T3 DK1681911 T3 DK 1681911T3
- Authority
- DK
- Denmark
- Prior art keywords
- predetermined shape
- plate assembly
- heat
- dissipating device
- same
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
- Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP05000860A EP1681911B1 (en) | 2005-01-17 | 2005-01-17 | Heat-dissipating device with isothermal plate assembly of predetermined shape and method for manufacturing the same |
Publications (1)
Publication Number | Publication Date |
---|---|
DK1681911T3 true DK1681911T3 (da) | 2007-10-29 |
Family
ID=34933338
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK05000860T DK1681911T3 (da) | 2005-01-17 | 2005-01-17 | Varmedissiperende indretning med isotermisk pladesamling af en forudbestemt facon og fremgangsmåde til fremstilling af samme |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP1681911B1 (da) |
AT (1) | ATE368372T1 (da) |
DE (1) | DE602005001761T2 (da) |
DK (1) | DK1681911T3 (da) |
ES (1) | ES2290790T3 (da) |
PL (1) | PL1681911T3 (da) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8776550B2 (en) | 2011-11-23 | 2014-07-15 | Corning Incorporated | Method and system for making glass articles |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL9400082A (nl) * | 1994-01-18 | 1995-09-01 | Wall Martinus C Van Der | Warmtepijp koelelement. |
JP4426684B2 (ja) * | 2000-02-07 | 2010-03-03 | ティーエス ヒートロニクス 株式会社 | ヒートシンク |
TW543828U (en) * | 2001-07-12 | 2003-07-21 | Foxconn Prec Components Co Ltd | Assembly of heating-tube heat sink |
-
2005
- 2005-01-17 DE DE602005001761T patent/DE602005001761T2/de active Active
- 2005-01-17 EP EP05000860A patent/EP1681911B1/en not_active Not-in-force
- 2005-01-17 AT AT05000860T patent/ATE368372T1/de not_active IP Right Cessation
- 2005-01-17 PL PL05000860T patent/PL1681911T3/pl unknown
- 2005-01-17 DK DK05000860T patent/DK1681911T3/da active
- 2005-01-17 ES ES05000860T patent/ES2290790T3/es active Active
Also Published As
Publication number | Publication date |
---|---|
DE602005001761D1 (de) | 2007-09-06 |
EP1681911A1 (en) | 2006-07-19 |
ES2290790T3 (es) | 2008-02-16 |
ATE368372T1 (de) | 2007-08-15 |
DE602005001761T2 (de) | 2008-04-30 |
PL1681911T3 (pl) | 2008-01-31 |
EP1681911B1 (en) | 2007-07-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2005100899A3 (en) | Multiple evaporator heat pipe assisted heat sink | |
DE502006001571D1 (de) | Wärmetauscher mit Rohren und Rippen sowie Herstellungsverfahren | |
FR2855599B1 (fr) | Echangeur de chaleur | |
HK1136862A1 (en) | Plate-type heat exchanger and method for producing the same | |
TW200606077A (en) | Container and method of manufacturing it | |
FR2856781B1 (fr) | Echangeur de chaleur | |
TW200625568A (en) | Solid cooling structure and formation thereof with integrated package | |
DK1681911T3 (da) | Varmedissiperende indretning med isotermisk pladesamling af en forudbestemt facon og fremgangsmåde til fremstilling af samme | |
DK1648654T3 (da) | Fremgangsmåde til fremstilling af en pladevarmeveksler | |
ITMI20021397A0 (it) | Scambiatore di calore a piastre avente produzione semplificata | |
DK1681527T3 (da) | Fremgangsmåde til fremstilling af et isotermisk pladeaggregat med forudbestemt form | |
CN106180410B (zh) | 环模压块机模套制作模具 | |
WO2009005284A3 (en) | Omega cooling apparatus for generator and manufacturing method thereby | |
TWI462690B (zh) | 多熱管蒸發部共平面之製造方法及其成品、治具 | |
WO2009082786A3 (en) | Heat exchanger | |
DE502005007801D1 (de) | Wärmeübertragungsrippe, Herstellungsverfahren und Wärmeübertrager | |
TW200618927A (en) | Isothermal plate assembly with predetermined shape and method for manufacturing the same | |
CN102984917B (zh) | 散热装置的制造方法 | |
TW200619907A (en) | A multi-shape equi-temperature heat dissipation module and its manufacturing method | |
TW200714195A (en) | A thermal dissipating device and method for manufacturing the same | |
FR2879487B1 (fr) | Procede de fabrication d'un collecteur d'echangeur thermique et dispositif de mise en oeuvre dudit procede de fabrication | |
EA200200280A1 (ru) | Способ изготовления теплообменников | |
RU2007106990A (ru) | Теплообменник с тепловыми u-образными трубами | |
TW200806417A (en) | Manufacturing method of heat pipe radiator | |
WO2011037412A3 (ko) | 전자부품용 냉각장치 |