DK149926C - sputtering - Google Patents

sputtering

Info

Publication number
DK149926C
DK149926C DK469976A DK469976A DK149926C DK 149926 C DK149926 C DK 149926C DK 469976 A DK469976 A DK 469976A DK 469976 A DK469976 A DK 469976A DK 149926 C DK149926 C DK 149926C
Authority
DK
Denmark
Prior art keywords
sputtering
Prior art date
Application number
DK469976A
Other languages
Danish (da)
Other versions
DK469976A (en
DK149926B (en
Inventor
Manfred Rudolf Kuehnle
Original Assignee
Coulter Systems Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US05/641,481 external-priority patent/US4014779A/en
Application filed by Coulter Systems Corp filed Critical Coulter Systems Corp
Publication of DK469976A publication Critical patent/DK469976A/en
Publication of DK149926B publication Critical patent/DK149926B/en
Application granted granted Critical
Publication of DK149926C publication Critical patent/DK149926C/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32733—Means for moving the material to be treated
    • H01J37/32752—Means for moving the material to be treated for moving the material across the discharge
    • H01J37/32761—Continuous moving
    • H01J37/3277—Continuous moving of continuous material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3438—Electrodes other than cathode

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physical Vapour Deposition (AREA)
  • Electrostatic Spraying Apparatus (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
DK469976A 1975-12-17 1976-10-19 sputtering DK149926C (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US05/641,481 US4014779A (en) 1974-11-01 1975-12-17 Sputtering apparatus
US64148175 1975-12-17

Publications (3)

Publication Number Publication Date
DK469976A DK469976A (en) 1977-06-18
DK149926B DK149926B (en) 1986-10-27
DK149926C true DK149926C (en) 1987-09-28

Family

ID=24572585

Family Applications (1)

Application Number Title Priority Date Filing Date
DK469976A DK149926C (en) 1975-12-17 1976-10-19 sputtering

Country Status (17)

Country Link
JP (1) JPS6035429B2 (en)
AT (1) AT344501B (en)
AU (1) AU511961B2 (en)
BE (1) BE847413A (en)
CA (1) CA1077437A (en)
CH (1) CH617965A5 (en)
DD (1) DD127637A5 (en)
DE (1) DE2647149C2 (en)
DK (1) DK149926C (en)
FR (1) FR2335615A1 (en)
GB (1) GB1503301A (en)
IL (1) IL50722A (en)
IT (1) IT1066543B (en)
LU (1) LU76026A1 (en)
MX (1) MX145314A (en)
NL (1) NL7611563A (en)
SE (1) SE429108B (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4151059A (en) * 1977-12-27 1979-04-24 Coulter Stork U.S.A., Inc. Method and apparatus for sputtering multiple cylinders simultaneously
FR2527233A1 (en) * 1982-05-24 1983-11-25 Asu Composants Sa Plant for depositing coating on substrate - with removable walls for introducing substrates and target
US4417968A (en) * 1983-03-21 1983-11-29 Shatterproof Glass Corporation Magnetron cathode sputtering apparatus
FR2548589B1 (en) * 1983-07-07 1987-02-20 Aerospatiale METHOD AND DEVICE FOR METALLIC IMPREGNATION OF A SUBSTRATE IN THE FORM OF A PATCH OF FIBERS CONDUCTING ELECTRIC CURRENT
US4443318A (en) * 1983-08-17 1984-04-17 Shatterproof Glass Corporation Cathodic sputtering apparatus
EP0157991A1 (en) * 1984-04-10 1985-10-16 INTERPATENT ANSTALT (INDELEC Abteilung) Apparatus for the continuous and selective metallization of parts, especially for electronics
JPS6162117A (en) * 1984-09-03 1986-03-31 Brother Ind Ltd Keyboard
FR2940321B1 (en) * 2008-12-19 2011-12-23 Carewave Shielding Technologies VACUUM DEPOSITION MACHINE ON SUBSTRATE OF THIN LAYER MATERIALS BY CATHODIC SPRAYING.
JP5969953B2 (en) * 2013-05-31 2016-08-17 株式会社神戸製鋼所 Deposition equipment

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL136984C (en) * 1964-06-04
DE2115590A1 (en) * 1971-03-31 1972-10-05 Leybold Heraeus Gmbh & Co Kg Cathode sputtering device - has cathode with projecting rim
US3829373A (en) * 1973-01-12 1974-08-13 Coulter Information Systems Thin film deposition apparatus using segmented target means
US3905887A (en) * 1973-01-12 1975-09-16 Coulter Information Systems Thin film deposition method using segmented plasma

Also Published As

Publication number Publication date
DE2647149A1 (en) 1977-06-30
IT1066543B (en) 1985-03-12
JPS5275669A (en) 1977-06-24
DE2647149C2 (en) 1983-08-25
CA1077437A (en) 1980-05-13
FR2335615A1 (en) 1977-07-15
FR2335615B1 (en) 1981-12-04
DK469976A (en) 1977-06-18
DD127637A5 (en) 1977-10-05
AU2059876A (en) 1978-06-22
MX145314A (en) 1982-01-27
CH617965A5 (en) 1980-06-30
BE847413A (en) 1977-04-19
SE7611581L (en) 1977-06-18
AT344501B (en) 1978-07-25
IL50722A0 (en) 1976-12-31
JPS6035429B2 (en) 1985-08-14
DK149926B (en) 1986-10-27
ATA776076A (en) 1977-11-15
GB1503301A (en) 1978-03-08
SE429108B (en) 1983-08-15
IL50722A (en) 1979-05-31
NL7611563A (en) 1977-06-21
LU76026A1 (en) 1978-05-16
AU511961B2 (en) 1980-09-18

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Legal Events

Date Code Title Description
PBP Patent lapsed