DK114915B - Fremgangsmåde til fremstilling af tilslutningselementer til kompakte kredsløbsenheder af enhver art og til fremstilling af sammensatte komponenter bestående af sådanne enheder og andre sammenkoblingsorganer. - Google Patents

Fremgangsmåde til fremstilling af tilslutningselementer til kompakte kredsløbsenheder af enhver art og til fremstilling af sammensatte komponenter bestående af sådanne enheder og andre sammenkoblingsorganer.

Info

Publication number
DK114915B
DK114915B DK26566AA DK26566A DK114915B DK 114915 B DK114915 B DK 114915B DK 26566A A DK26566A A DK 26566AA DK 26566 A DK26566 A DK 26566A DK 114915 B DK114915 B DK 114915B
Authority
DK
Denmark
Prior art keywords
units
manufacturing
kinds
connection elements
composite components
Prior art date
Application number
DK26566AA
Other languages
Danish (da)
English (en)
Inventor
D Grabbe
Original Assignee
Photocircuits Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Photocircuits Corp filed Critical Photocircuits Corp
Publication of DK114915B publication Critical patent/DK114915B/da

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07554—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Solid State Image Pick-Up Elements (AREA)
DK26566AA 1965-01-19 1966-01-18 Fremgangsmåde til fremstilling af tilslutningselementer til kompakte kredsløbsenheder af enhver art og til fremstilling af sammensatte komponenter bestående af sådanne enheder og andre sammenkoblingsorganer. DK114915B (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US426506A US3386009A (en) 1965-01-19 1965-01-19 Interconnection structure for integrated circuits and the like
US64977567A 1967-05-26 1967-05-26

Publications (1)

Publication Number Publication Date
DK114915B true DK114915B (da) 1969-08-18

Family

ID=27027080

Family Applications (1)

Application Number Title Priority Date Filing Date
DK26566AA DK114915B (da) 1965-01-19 1966-01-18 Fremgangsmåde til fremstilling af tilslutningselementer til kompakte kredsløbsenheder af enhver art og til fremstilling af sammensatte komponenter bestående af sådanne enheder og andre sammenkoblingsorganer.

Country Status (4)

Country Link
US (2) US3386009A (enExample)
DK (1) DK114915B (enExample)
FR (1) FR1464482A (enExample)
GB (1) GB1143531A (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3469148A (en) * 1967-11-08 1969-09-23 Gen Motors Corp Protectively covered hybrid microcircuits
US3849880A (en) * 1969-12-12 1974-11-26 Communications Satellite Corp Solar cell array
US4423467A (en) * 1980-12-15 1983-12-27 Rockwell International Corporation Connection array for interconnecting hermetic chip carriers to printed circuit boards using plated-up pillars
FR2629665B1 (fr) * 1988-03-30 1991-01-11 Bendix Electronics Sa Boitier pour circuit electronique
JP3488038B2 (ja) * 1996-10-17 2004-01-19 矢崎総業株式会社 リレーの実装構造
JP5501174B2 (ja) * 2009-09-17 2014-05-21 株式会社半導体エネルギー研究所 半導体装置
US9461186B2 (en) * 2010-07-15 2016-10-04 First Solar, Inc. Back contact for a photovoltaic module

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3195026A (en) * 1962-09-21 1965-07-13 Westinghouse Electric Corp Hermetically enclosed semiconductor device
US3239719A (en) * 1963-07-08 1966-03-08 Sperry Rand Corp Packaging and circuit connection means for microelectronic circuitry
US3307239A (en) * 1964-02-18 1967-03-07 Bell Telephone Labor Inc Method of making integrated semiconductor devices

Also Published As

Publication number Publication date
US3434204A (en) 1969-03-25
FR1464482A (fr) 1966-12-30
GB1143531A (enExample)
US3386009A (en) 1968-05-28

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