DK114845B - Method for placing printed circuits on layered compressed fabrics. - Google Patents

Method for placing printed circuits on layered compressed fabrics.

Info

Publication number
DK114845B
DK114845B DK298167A DK298167A DK114845B DK 114845 B DK114845 B DK 114845B DK 298167 A DK298167 A DK 298167A DK 298167 A DK298167 A DK 298167A DK 114845 B DK114845 B DK 114845B
Authority
DK
Denmark
Prior art keywords
printed circuits
placing printed
layered compressed
fabrics
compressed fabrics
Prior art date
Application number
DK298167A
Other languages
Danish (da)
Inventor
K Orfgen
E Schneider
K Krieger
A Franz
Original Assignee
Dynamit Nobel Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dynamit Nobel Ag filed Critical Dynamit Nobel Ag
Publication of DK114845B publication Critical patent/DK114845B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0158—Polyalkene or polyolefin, e.g. polyethylene [PE], polypropylene [PP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Laminated Bodies (AREA)
  • Braking Arrangements (AREA)
DK298167A 1966-06-08 1967-06-07 Method for placing printed circuits on layered compressed fabrics. DK114845B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DED0050272 1966-06-08

Publications (1)

Publication Number Publication Date
DK114845B true DK114845B (en) 1969-08-11

Family

ID=7052519

Family Applications (1)

Application Number Title Priority Date Filing Date
DK298167A DK114845B (en) 1966-06-08 1967-06-07 Method for placing printed circuits on layered compressed fabrics.

Country Status (10)

Country Link
AT (1) AT266964B (en)
BE (1) BE699592A (en)
CH (1) CH488375A (en)
DE (1) DE1590305A1 (en)
DK (1) DK114845B (en)
FI (1) FI47441C (en)
LU (1) LU53469A1 (en)
NL (1) NL6706411A (en)
NO (1) NO118858B (en)
SE (1) SE311943B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2239829C2 (en) * 1972-08-12 1982-06-03 Aeg Isolier- Und Kunststoff Gmbh, 3500 Kassel Base material for PCB mfr. - using a non-stick agent on the aluminium cover foil
DE3012889C2 (en) * 1979-04-30 1984-01-12 Kollmorgen Technologies Corp., 75201 Dallas, Tex. Base material for the manufacture of printed circuits

Also Published As

Publication number Publication date
CH488375A (en) 1970-03-31
NO118858B (en) 1970-02-23
FI47441C (en) 1973-11-12
FI47441B (en) 1973-07-31
LU53469A1 (en) 1967-06-20
DE1590305A1 (en) 1970-06-04
NL6706411A (en) 1967-12-11
AT266964B (en) 1968-12-10
SE311943B (en) 1969-06-30
BE699592A (en) 1967-11-16

Similar Documents

Publication Publication Date Title
DK119465B (en) Gravure printing apparatus.
DK125122B (en) Printing apparatus for electrically printing a graphic figure.
DK122997B (en) Method for making resoribles.
CH428877A (en) Leveled printed circuit
DK135071B (en) Method for manufacturing semiconductor devices.
DK117360B (en) Method for manufacturing a printed circuit component.
DK108235C (en) Apparatus for indicating unwanted posture.
DK140869B (en) Method for producing an integrated monolith circuit.
DK127028B (en) Connecting means for thin film circuits.
NL162751C (en) LITHOGRAPHIC PRINTING METHOD.
DK118780B (en) Copper-plated plastic plate for the production of printed circuits.
DK114845B (en) Method for placing printed circuits on layered compressed fabrics.
DK119744B (en) Apparatus for making multilayer bag lengths.
DK127917B (en) Data registration apparatus for printing forms.
DK119932B (en) Electrical component for printed circuits.
DK127143B (en) Method for placing an electrode on a semiconductor device.
CH450488A (en) Receiver for receiving discrete information steps
DK120164B (en) Electrical device for testing components.
DK121304B (en) Stencil duplicator.
DK135309B (en) Method for embossing latex foam.
DK129958B (en) Electronic selection apparatus.
FR1523390A (en) Matrix circuit improvements
DK118003B (en) Method for producing an offset printing form.
DK118275B (en) Apparatus for electrically perforating a stencil.
DK129420B (en) Method for manufacturing sliding surfaces on machine elements.