DK105308C - Vandigt, kemisk nikkelpletteringsbad og fremgangsmåde til plettering med dette bad. - Google Patents
Vandigt, kemisk nikkelpletteringsbad og fremgangsmåde til plettering med dette bad.Info
- Publication number
- DK105308C DK105308C DK519862AA DK519862A DK105308C DK 105308 C DK105308 C DK 105308C DK 519862A A DK519862A A DK 519862AA DK 519862 A DK519862 A DK 519862A DK 105308 C DK105308 C DK 105308C
- Authority
- DK
- Denmark
- Prior art keywords
- bath
- plating
- aqueous
- chemical nickel
- nickel plating
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Chemical Treatment Of Metals (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US159745A US3121644A (en) | 1961-12-15 | 1961-12-15 | Chemical nickel plating of magnesium and its alloys |
Publications (1)
Publication Number | Publication Date |
---|---|
DK105308C true DK105308C (da) | 1966-09-12 |
Family
ID=22573836
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK519862AA DK105308C (da) | 1961-12-15 | 1962-11-30 | Vandigt, kemisk nikkelpletteringsbad og fremgangsmåde til plettering med dette bad. |
Country Status (9)
Country | Link |
---|---|
US (1) | US3121644A (fr) |
AT (1) | AT247683B (fr) |
CH (1) | CH419771A (fr) |
DK (1) | DK105308C (fr) |
ES (1) | ES282772A1 (fr) |
FI (1) | FI42656B (fr) |
GB (1) | GB989250A (fr) |
LU (1) | LU42802A1 (fr) |
SE (1) | SE304892B (fr) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4171393A (en) * | 1977-06-20 | 1979-10-16 | Eastman Kodak Company | Electroless plating method requiring no reducing agent in the plating bath |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2694017A (en) * | 1952-09-16 | 1954-11-09 | Gen American Transporation Cor | Process of chemical nickel plating of aluminum and its alloys and baths therefor |
US2762723A (en) * | 1953-06-03 | 1956-09-11 | Gen American Transporation Cor | Processes of chemical nickel plating and baths therefor |
US2766138A (en) * | 1953-09-18 | 1956-10-09 | Gen Am Transport | Processes of chemical nickel plating |
US2935425A (en) * | 1954-12-29 | 1960-05-03 | Gen Am Transport | Chemical nickel plating processes and baths therefor |
US2884344A (en) * | 1957-10-07 | 1959-04-28 | Reynolds Metals Co | Nickel plating |
US2916401A (en) * | 1958-02-10 | 1959-12-08 | Gen Motors Corp | Chemical reduction nickel plating bath |
US2983634A (en) * | 1958-05-13 | 1961-05-09 | Gen Am Transport | Chemical nickel plating of magnesium and its alloys |
US2994369A (en) * | 1959-04-02 | 1961-08-01 | Pittsburgh Plate Glass Co | Nickel plating chemical composition |
-
1961
- 1961-12-15 US US159745A patent/US3121644A/en not_active Expired - Lifetime
-
1962
- 1962-11-08 GB GB42228/62A patent/GB989250A/en not_active Expired
- 1962-11-24 ES ES282772A patent/ES282772A1/es not_active Expired
- 1962-11-26 FI FI2122/62A patent/FI42656B/fi active
- 1962-11-29 CH CH1403962A patent/CH419771A/fr unknown
- 1962-11-30 DK DK519862AA patent/DK105308C/da active
- 1962-12-03 LU LU42802D patent/LU42802A1/xx unknown
- 1962-12-04 AT AT950462A patent/AT247683B/de active
- 1962-12-04 SE SE13057/62A patent/SE304892B/xx unknown
Also Published As
Publication number | Publication date |
---|---|
GB989250A (en) | 1965-04-14 |
CH419771A (fr) | 1966-08-31 |
FI42656B (fr) | 1970-06-01 |
ES282772A1 (es) | 1963-03-16 |
SE304892B (fr) | 1968-10-07 |
LU42802A1 (fr) | 1963-02-04 |
US3121644A (en) | 1964-02-18 |
AT247683B (de) | 1966-06-27 |
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