DK0928685T3 - Tryk- og PCB-elementer og fremgangsmåder til fremstilling af disse - Google Patents

Tryk- og PCB-elementer og fremgangsmåder til fremstilling af disse

Info

Publication number
DK0928685T3
DK0928685T3 DK99300262T DK99300262T DK0928685T3 DK 0928685 T3 DK0928685 T3 DK 0928685T3 DK 99300262 T DK99300262 T DK 99300262T DK 99300262 T DK99300262 T DK 99300262T DK 0928685 T3 DK0928685 T3 DK 0928685T3
Authority
DK
Denmark
Prior art keywords
making
methods
pressure
pcb elements
pcb
Prior art date
Application number
DK99300262T
Other languages
Danish (da)
English (en)
Inventor
Murray Figov
Serge Steinblatt
Original Assignee
Creo Il Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Creo Il Ltd filed Critical Creo Il Ltd
Application granted granted Critical
Publication of DK0928685T3 publication Critical patent/DK0928685T3/da

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
    • G03F7/2016—Contact mask being integral part of the photosensitive element and subject to destructive removal during post-exposure processing
    • G03F7/202—Masking pattern being obtained by thermal means, e.g. laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0585—Second resist used as mask for selective stripping of first resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Printing Plates And Materials Therefor (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
DK99300262T 1998-01-13 1999-01-13 Tryk- og PCB-elementer og fremgangsmåder til fremstilling af disse DK0928685T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IL12293098A IL122930A (en) 1998-01-13 1998-01-13 Printing and printed circuit board members and methods for producing same

Publications (1)

Publication Number Publication Date
DK0928685T3 true DK0928685T3 (da) 2004-06-28

Family

ID=11071085

Family Applications (1)

Application Number Title Priority Date Filing Date
DK99300262T DK0928685T3 (da) 1998-01-13 1999-01-13 Tryk- og PCB-elementer og fremgangsmåder til fremstilling af disse

Country Status (6)

Country Link
US (1) US6352816B1 (fr)
EP (1) EP0928685B1 (fr)
DE (1) DE69917083T2 (fr)
DK (1) DK0928685T3 (fr)
HK (1) HK1019573A1 (fr)
IL (1) IL122930A (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IL129076A (en) 1999-03-21 2002-02-10 Creoscitex Corp Ltd A printing plate with a socket method for short runs and a method for using it
WO2001025360A1 (fr) * 1999-10-07 2001-04-12 Karat Digital Press L.P. Nouveau revetement de decollage
EP1230089B8 (fr) * 1999-11-19 2003-09-17 Kba-Giori S.A. Plaque d'encrage pour machine d'impression rotative et procede de production d'une plaque d'encrage
US6450092B2 (en) 2000-02-01 2002-09-17 Creoscitex Corporation Ltd. Method of applying double-sided adhesive tape and gravure printing plates to gravure printing drums
JP5230886B2 (ja) 2000-07-06 2013-07-10 キャボット コーポレイション 修飾顔料生成物、その分散体、およびそれを含有する組成物
US20040241573A1 (en) * 2003-06-02 2004-12-02 Ray Kevin Barry Thermally sensitive, white light safe mask for use in flexography
WO2005103823A1 (fr) * 2004-04-23 2005-11-03 Showa Denko K.K. Composition photosensible pour matrice noire
CN102618168A (zh) * 2012-03-14 2012-08-01 曾宪雄 凹版制版的快干修版涂料及其制备

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5130290A (en) * 1989-03-27 1992-07-14 Kanzaki Paper Manufacturing Co., Ltd. Water-sensitive coloring sheet
US5262275A (en) * 1992-08-07 1993-11-16 E. I. Du Pont De Nemours And Company Flexographic printing element having an IR ablatable layer and process for making a flexographic printing plate
US5719009A (en) * 1992-08-07 1998-02-17 E. I. Du Pont De Nemours And Company Laser ablatable photosensitive elements utilized to make flexographic printing plates
DE4339010C2 (de) * 1993-06-25 2000-05-18 Pt Sub Inc Photohärtbares Erzeugnis für Druckplatten
US5493971A (en) 1994-04-13 1996-02-27 Presstek, Inc. Laser-imageable printing members and methods for wet lithographic printing
US6238837B1 (en) * 1995-05-01 2001-05-29 E.I. Du Pont De Nemours And Company Flexographic element having an infrared ablatable layer
US6143470A (en) * 1995-06-23 2000-11-07 Nguyen; My T. Digital laser imagable lithographic printing plates
DE19536805A1 (de) * 1995-10-02 1997-04-03 Basf Lacke & Farben Zur Herstellung von Flexodruckplatten durch digitale Informationsübertragung geeignetes mehrschichtiges Aufzeichnungselement
DE19536806A1 (de) 1995-10-02 1997-04-03 Basf Lacke & Farben Verfahren zur Herstellung von photopolymeren Tiefdruckplatten
DE19536808A1 (de) * 1995-10-02 1997-04-03 Basf Lacke & Farben Verfahren zur Herstellung von photopolymeren Hochdruckplatten
EP0864420B2 (fr) * 1997-03-11 2005-11-16 Agfa-Gevaert Elément d'enregistrement de l'image pour la fabrication de plaques lithographiques positives
US5919600A (en) * 1997-09-03 1999-07-06 Kodak Polychrome Graphics, Llc Thermal waterless lithographic printing plate
US6248503B1 (en) * 1997-11-07 2001-06-19 Agfa-Gevaert Method for making positive working printing plates from a heat mode sensitive imaging element
KR100390265B1 (ko) * 1998-01-23 2003-07-07 프레스텍, 인크. 습식 석판 인쇄용 레이저-화상 형성 인쇄 부재
US6120948A (en) * 1998-03-30 2000-09-19 Fuji Photo Film Co., Ltd. Laser ablative recording material
US6152036A (en) * 1998-05-28 2000-11-28 Agfa-Gevaert, N.V. Heat mode sensitive imaging element for making positive working printing plates
US6182570B1 (en) * 1998-09-21 2001-02-06 Presstek, Inc. Lithographic printing plates for use with laser imaging apparatus

Also Published As

Publication number Publication date
IL122930A0 (en) 1998-08-16
EP0928685A3 (fr) 1999-12-29
HK1019573A1 (en) 2000-02-18
US6352816B1 (en) 2002-03-05
DE69917083T2 (de) 2005-05-12
DE69917083D1 (de) 2004-06-17
EP0928685A2 (fr) 1999-07-14
EP0928685B1 (fr) 2004-05-12
IL122930A (en) 2000-12-06

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