DK0764984T3 - Beskyttelseshus til på et kredsløbssubstrat med bondtråd anbragte halvlederchips - Google Patents

Beskyttelseshus til på et kredsløbssubstrat med bondtråd anbragte halvlederchips

Info

Publication number
DK0764984T3
DK0764984T3 DK96114001T DK96114001T DK0764984T3 DK 0764984 T3 DK0764984 T3 DK 0764984T3 DK 96114001 T DK96114001 T DK 96114001T DK 96114001 T DK96114001 T DK 96114001T DK 0764984 T3 DK0764984 T3 DK 0764984T3
Authority
DK
Denmark
Prior art keywords
housing
cover
circuit substrate
wire
protective housing
Prior art date
Application number
DK96114001T
Other languages
English (en)
Inventor
Karl-Gerd Drekmeier
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Application granted granted Critical
Publication of DK0764984T3 publication Critical patent/DK0764984T3/da

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Wire Bonding (AREA)
  • Casings For Electric Apparatus (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Credit Cards Or The Like (AREA)
DK96114001T 1995-09-08 1996-08-30 Beskyttelseshus til på et kredsløbssubstrat med bondtråd anbragte halvlederchips DK0764984T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19533300 1995-09-08

Publications (1)

Publication Number Publication Date
DK0764984T3 true DK0764984T3 (da) 1999-06-28

Family

ID=7771658

Family Applications (1)

Application Number Title Priority Date Filing Date
DK96114001T DK0764984T3 (da) 1995-09-08 1996-08-30 Beskyttelseshus til på et kredsløbssubstrat med bondtråd anbragte halvlederchips

Country Status (4)

Country Link
EP (1) EP0764984B1 (da)
AT (1) ATE172578T1 (da)
DE (1) DE59600700D1 (da)
DK (1) DK0764984T3 (da)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0509483D0 (en) * 2005-05-10 2005-06-15 Pace Micro Tech Plc Protection means for a printed circuit board and method of use thereof
US9089051B2 (en) 2013-06-27 2015-07-21 International Business Machines Corporation Multichip module with stiffening frame and associated covers

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1021066A (en) * 1974-10-17 1977-11-15 James B. Morris (Sr.) Semiconductor chip interconnect package
DE3030286C2 (de) * 1980-08-09 1983-07-28 Bayerische Motoren Werke AG, 8000 München Gehäuse für elektronische Bausteine
NO911774D0 (no) * 1991-05-06 1991-05-06 Sensonor As Anordning ved innkapsling av et funksjonsorgan, samt fremgangsmaate for fremstilling av samme.

Also Published As

Publication number Publication date
DE59600700D1 (de) 1998-11-26
EP0764984B1 (de) 1998-10-21
EP0764984A3 (da) 1997-05-07
EP0764984A2 (de) 1997-03-26
ATE172578T1 (de) 1998-11-15

Similar Documents

Publication Publication Date Title
EP0778617A3 (en) Electronic device package enclosed by pliant medium laterally confined by a plastic rim member
MY117421A (en) Integral design features for heatsink attach for electronic packages
MY115170A (en) Semiconductor devices and methods of making the devices
DE59310040D1 (de) Elektronikmodul in Flachbauweise und Chipkarte
SG49842A1 (en) Wiring substrate film carrier semiconductor device made by using the film carrier and mounting structure comprising the semiconductor
DE3571535D1 (en) Integrated circuit semiconductor device formed on a wafer
CA2196268A1 (en) Package
EP0502590A3 (en) Semiconductor device comprising an organic material
SG47438A1 (en) Insulating adhesive tape and lead frame and semi-conductor device employing the tape
DE69501771T2 (de) Epoxidharzformmasse zur Einkapselung elektronischer Bauelemente und eingekapselte Halbleiteranordnung unter Verwendung dieser Formmasse
KR900011365A (ko) 평평한 패키지타입 ic의 장착장치
EP0456066A3 (en) Semiconductor chip mounted inside a device hole of a film carrier
EP0439171A3 (en) Epoxy resin composition and semiconductor device encapsulated therewith
DK0764984T3 (da) Beskyttelseshus til på et kredsløbssubstrat med bondtråd anbragte halvlederchips
DE3563150D1 (en) Mounting semi-conductor chips
DE3268183D1 (en) Method of producing a pedestal for mounting a semiconductor chip on the base of an encapsulating housing
ATE19564T1 (de) Gehaeuse mit kunststoffkappe fuer halbleiterbauelemente.
DE3473972D1 (en) Semiconductor device comprising a substrate
EP0085622A3 (en) Mounting support for integrated circuit-housing with external leads formed around the housing perimeter
EP0338213A3 (en) Semiconductor device with a metal package
JPS5610938A (en) Press-fit type semiconductor device
TW452196U (en) Improved structure of heat sink having integrated circuit device of plastic ball grid array type
DE50002658D1 (de) Chip-träger-verbund
ATE38920T1 (de) In einem gehaeuse montiertes integriertes schaltungsplaettchen.
GB2003321A (en) Integrated circuit package structures