DK0597323T3 - - Google Patents

Info

Publication number
DK0597323T3
DK0597323T3 DK93117434T DK93117434T DK0597323T3 DK 0597323 T3 DK0597323 T3 DK 0597323T3 DK 93117434 T DK93117434 T DK 93117434T DK 93117434 T DK93117434 T DK 93117434T DK 0597323 T3 DK0597323 T3 DK 0597323T3
Authority
DK
Denmark
Application number
DK93117434T
Other languages
Danish (da)
Inventor
Hans-Walter Dipl-Ing Altendorf
Guenther Moritz
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Application granted granted Critical
Publication of DK0597323T3 publication Critical patent/DK0597323T3/da

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4031—Packaged discrete devices, e.g. to-3 housings, diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DK93117434T 1992-11-09 1993-10-27 DK0597323T3 (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19924237763 DE4237763C2 (de) 1992-11-09 1992-11-09 Vorrichtung zur isolierten Befestigung von wärmeerzeugenden Halbleiter-Bauteilen

Publications (1)

Publication Number Publication Date
DK0597323T3 true DK0597323T3 (sv) 1997-02-24

Family

ID=6472427

Family Applications (1)

Application Number Title Priority Date Filing Date
DK93117434T DK0597323T3 (sv) 1992-11-09 1993-10-27

Country Status (3)

Country Link
EP (1) EP0597323B1 (sv)
DE (2) DE4237763C2 (sv)
DK (1) DK0597323T3 (sv)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19904279B4 (de) * 1999-02-03 2005-09-01 Sew-Eurodrive Gmbh & Co. Kg Halbleitervorrichtung
DE102021127641A1 (de) 2021-10-25 2023-04-27 Rolls-Royce Deutschland Ltd & Co Kg Leiterplattenanordnung und Verfahren zu dessen Herstellung
DE102021127647A1 (de) 2021-10-25 2023-04-27 Rolls-Royce Deutschland Ltd & Co Kg Leiterplatte und Verfahren zu deren Herstellung

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1855779U (de) * 1961-06-21 1962-08-02 Licentia Gmbh Halbleitereinrichtung mit einem aluminiumgehaeuse, auf das die halbleiter montiert sind.
US3641474A (en) * 1970-05-11 1972-02-08 Rca Corp Semiconductor mounting structure
DE2918845A1 (de) * 1979-05-10 1980-11-20 Licentia Gmbh Verfahren zum anschrauben eines halbleiter-bauteils an ein kuehlblech und schrauber fuer das verfahren
US4266267A (en) * 1979-11-19 1981-05-05 General Electric Company Mounting arrangement for transistors and the like
DE3028722C2 (de) * 1980-07-29 1985-02-21 Siemens AG, 1000 Berlin und 8000 München Einrichtung zur Befestigung eines Hochspannungs-Leistungstransistors an einem Kühlkörper
DD204001A1 (de) * 1981-08-05 1983-11-09 Inst Regelungstechnik Hybridbauelement fuer den einsatz auf leiterplatten
DE3237878C2 (de) * 1982-10-13 1984-11-15 ANT Nachrichtentechnik GmbH, 7150 Backnang Anordnung zur Abführung der Verlustwärme eines auf einer Leiterplatte montierten Halbleiterbauelementes
US4546408A (en) * 1983-05-16 1985-10-08 Illinois Tool Works Inc. Electrically insulated heat sink assemblies and insulators used therein
DE3342924A1 (de) * 1983-11-26 1985-06-05 Philips Patentverwaltung Gmbh, 2000 Hamburg Elektrisches geraet
DE3416348A1 (de) * 1984-05-03 1985-11-07 Siemens AG, 1000 Berlin und 8000 München Kompaktbaugruppe, bei welcher eine leiterplatte mit einem kuehlkoerper verbunden ist
DE8500718U1 (de) * 1985-01-14 1992-09-03 Horn, Hans-Joachim, 8500 Nürnberg Kühlkörper für elektronische Bauelemente
US4707726A (en) * 1985-04-29 1987-11-17 United Technologies Automotive, Inc. Heat sink mounting arrangement for a semiconductor
CA1307355C (en) * 1988-05-26 1992-09-08 David C. Degree Soft-faced semiconductor component backing
DE8908678U1 (de) * 1989-07-17 1990-11-15 Siemens AG, 1000 Berlin und 8000 München Leistungsbaugruppe
DE9114268U1 (de) * 1991-11-15 1992-01-09 Siemens AG, 8000 München Hochspannungs-Isolierscheibe

Also Published As

Publication number Publication date
DE59303643D1 (de) 1996-10-10
EP0597323B1 (de) 1996-09-04
DE4237763A1 (de) 1994-05-11
DE4237763C2 (de) 1996-01-25
EP0597323A1 (de) 1994-05-18

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