DK0454620T3 - Method and plant for cutting plate-shaped material - Google Patents

Method and plant for cutting plate-shaped material

Info

Publication number
DK0454620T3
DK0454620T3 DK91810281.5T DK91810281T DK0454620T3 DK 0454620 T3 DK0454620 T3 DK 0454620T3 DK 91810281 T DK91810281 T DK 91810281T DK 0454620 T3 DK0454620 T3 DK 0454620T3
Authority
DK
Denmark
Prior art keywords
flat material
plant
shaped material
cutting plate
gripper
Prior art date
Application number
DK91810281.5T
Other languages
Danish (da)
Inventor
Ernst Zumstein
Original Assignee
Bystronic Laser Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bystronic Laser Ag filed Critical Bystronic Laser Ag
Application granted granted Critical
Publication of DK0454620T3 publication Critical patent/DK0454620T3/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/04Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
    • B23K37/0408Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work for planar work
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/10Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam

Abstract

The flat material (15) to be cut hangs on one or more grippers (13, 14) and is supported in a perpendicular or slightly inclined position at its bottom margin by a guide (16). The flat material (15) is free of any support between the gripper (13, 14) and the guide (16) and can be machined by a cutting head (11) without hindrance. Parts cut free can be removed by means of a gripper (24) or else they can drop freely onto a conveyor belt (17) which discharges them. The flat material can be transported in a perpendicular position from a store into the machining unit. <IMAGE>
DK91810281.5T 1990-04-23 1991-04-16 Method and plant for cutting plate-shaped material DK0454620T3 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH136090 1990-04-23

Publications (1)

Publication Number Publication Date
DK0454620T3 true DK0454620T3 (en) 1994-01-31

Family

ID=4208624

Family Applications (1)

Application Number Title Priority Date Filing Date
DK91810281.5T DK0454620T3 (en) 1990-04-23 1991-04-16 Method and plant for cutting plate-shaped material

Country Status (6)

Country Link
EP (1) EP0454620B1 (en)
JP (1) JPH04228282A (en)
AT (1) ATE97049T1 (en)
DE (1) DE59100570D1 (en)
DK (1) DK0454620T3 (en)
ES (1) ES2046876T3 (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995008416A1 (en) * 1993-09-20 1995-03-30 Massachusetts Institute Of Technology Process for rapidly forming laminated dies and said dies
JP3287223B2 (en) * 1996-05-28 2002-06-04 松下電器産業株式会社 Laser processing machine
IT1291187B1 (en) * 1997-03-12 1998-12-29 Crea Srl LASER CUTTING SHEET METAL EQUIPMENT
IT1292282B1 (en) 1997-04-24 1999-01-29 Crea Srl PROCEDURE FOR CUTTING A WINDOW IN A VERTICAL SHEET MATERIAL, PARTICULARLY OF SHEET.
US6559411B2 (en) * 2001-08-10 2003-05-06 First Solar, Llc Method and apparatus for laser scribing glass sheet substrate coatings
EP1413380A1 (en) * 2002-10-25 2004-04-28 European Steel Mill Services Process for oxygen cutting of slabs and device for implementing this process
EP1413379A1 (en) * 2002-10-25 2004-04-28 European Steel Mill Services Process for oxygen cutting of slabs and device for implementing this process
CH702772B1 (en) * 2004-12-21 2011-09-15 Karl Merz A method for cutting material plates, in particular metal sheets, and cutting machine for performing the method.
WO2007106935A1 (en) * 2006-03-21 2007-09-27 Paul Robert Mccleary Cutting apparatus
CN102179633B (en) * 2011-04-28 2013-10-23 江苏大学 Hand type laser cutting head with clamping function
DE102012208240A1 (en) * 2012-05-16 2013-11-21 Areva Gmbh Method for disassembling a component
CN105081357A (en) * 2015-08-20 2015-11-25 昆山—邦泰汽车零部件制造有限公司 Waste recovery punch head cutter
CN105397369B (en) * 2015-12-16 2017-07-28 沈阳中辰钢结构工程有限公司 A kind of steel box-girder top plate unit part welding anti-distortion technique
JP6809140B2 (en) * 2016-10-31 2021-01-06 株式会社豊田自動織機 Electrode cutting device
JP7276943B1 (en) * 2022-09-24 2023-05-18 株式会社ひごいち Conveyor for laser processed material

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3848104A (en) * 1973-04-09 1974-11-12 Avco Everett Res Lab Inc Apparatus for heat treating a surface
US4383168A (en) * 1980-06-02 1983-05-10 Raytheon Company Automatic focusing apparatus
JPS62168689A (en) * 1986-01-17 1987-07-24 Sanoyasu:Kk Cutting method using laser beam

Also Published As

Publication number Publication date
DE59100570D1 (en) 1993-12-16
EP0454620B1 (en) 1993-11-10
ES2046876T3 (en) 1994-02-01
EP0454620A1 (en) 1991-10-30
ATE97049T1 (en) 1993-11-15
JPH04228282A (en) 1992-08-18

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Legal Events

Date Code Title Description
AHS Application shelved for other reasons than non-payment