DE9409517U1 - Heatsink - Google Patents

Heatsink

Info

Publication number
DE9409517U1
DE9409517U1 DE9409517U DE9409517U DE9409517U1 DE 9409517 U1 DE9409517 U1 DE 9409517U1 DE 9409517 U DE9409517 U DE 9409517U DE 9409517 U DE9409517 U DE 9409517U DE 9409517 U1 DE9409517 U1 DE 9409517U1
Authority
DE
Germany
Prior art keywords
heatsink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE9409517U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE9409517U priority Critical patent/DE9409517U1/en
Publication of DE9409517U1 publication Critical patent/DE9409517U1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
DE9409517U 1994-06-13 1994-06-13 Heatsink Expired - Lifetime DE9409517U1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE9409517U DE9409517U1 (en) 1994-06-13 1994-06-13 Heatsink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE9409517U DE9409517U1 (en) 1994-06-13 1994-06-13 Heatsink

Publications (1)

Publication Number Publication Date
DE9409517U1 true DE9409517U1 (en) 1994-07-28

Family

ID=6909766

Family Applications (1)

Application Number Title Priority Date Filing Date
DE9409517U Expired - Lifetime DE9409517U1 (en) 1994-06-13 1994-06-13 Heatsink

Country Status (1)

Country Link
DE (1) DE9409517U1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE9412460U1 (en) * 1994-08-02 1995-12-14 Hoogovens Aluminium Profiltech Cooling device for electrical or electronic components with a base plate and with cooling elements
US5682948A (en) * 1995-03-24 1997-11-04 Alusuisse Technology & Management Ltd. Heat exchanger for cooling semi-conductor elements or the like
US5791406A (en) * 1994-08-02 1998-08-11 Hoogovens Aluminium Profiltechnik, Gmbh Cooling device for electrical or electronic components having a base plate and cooling elements and method for manufacturing the same
US6279648B1 (en) 1996-01-27 2001-08-28 Manfred Diels Method of manufacturing cooling devices made up of several metal shaped-section elements for mounting on semiconductor components, shaped-section elements for use in the manufacture of such cooling devices, and cooling devices manufactured by the method
WO2008022712A1 (en) * 2006-08-21 2008-02-28 Alcan Technology & Management Ag Heat sink for semiconductor components or similar devices, and method for producing it

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE9412460U1 (en) * 1994-08-02 1995-12-14 Hoogovens Aluminium Profiltech Cooling device for electrical or electronic components with a base plate and with cooling elements
US5791406A (en) * 1994-08-02 1998-08-11 Hoogovens Aluminium Profiltechnik, Gmbh Cooling device for electrical or electronic components having a base plate and cooling elements and method for manufacturing the same
US5682948A (en) * 1995-03-24 1997-11-04 Alusuisse Technology & Management Ltd. Heat exchanger for cooling semi-conductor elements or the like
US6279648B1 (en) 1996-01-27 2001-08-28 Manfred Diels Method of manufacturing cooling devices made up of several metal shaped-section elements for mounting on semiconductor components, shaped-section elements for use in the manufacture of such cooling devices, and cooling devices manufactured by the method
WO2008022712A1 (en) * 2006-08-21 2008-02-28 Alcan Technology & Management Ag Heat sink for semiconductor components or similar devices, and method for producing it

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