DE9406227U1 - Thermal shock testing device - Google Patents

Thermal shock testing device

Info

Publication number
DE9406227U1
DE9406227U1 DE9406227U DE9406227U DE9406227U1 DE 9406227 U1 DE9406227 U1 DE 9406227U1 DE 9406227 U DE9406227 U DE 9406227U DE 9406227 U DE9406227 U DE 9406227U DE 9406227 U1 DE9406227 U1 DE 9406227U1
Authority
DE
Germany
Prior art keywords
testing device
thermal shock
shock testing
thermal
device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE9406227U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FA RUD OTTO MEYER 22047 HAMBURG DE
MEYER FA RUD OTTO
Original Assignee
FA RUD OTTO MEYER 22047 HAMBURG DE
MEYER FA RUD OTTO
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FA RUD OTTO MEYER 22047 HAMBURG DE, MEYER FA RUD OTTO filed Critical FA RUD OTTO MEYER 22047 HAMBURG DE
Priority to DE9406227U priority Critical patent/DE9406227U1/en
Publication of DE9406227U1 publication Critical patent/DE9406227U1/en
Anticipated expiration legal-status Critical
Application status is Expired - Lifetime legal-status Critical

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00Investigating strength properties of solid materials by application of mechanical stress
    • G01N3/60Investigating resistance of materials, e.g. refractory materials, to rapid heat changes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
    • G01R31/2817Environmental-, stress-, or burn-in tests
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2855Environmental, reliability or burn-in testing
    • G01R31/2872Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
DE9406227U 1994-04-14 1994-04-14 Thermal shock testing device Expired - Lifetime DE9406227U1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE9406227U DE9406227U1 (en) 1994-04-14 1994-04-14 Thermal shock testing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE9406227U DE9406227U1 (en) 1994-04-14 1994-04-14 Thermal shock testing device

Publications (1)

Publication Number Publication Date
DE9406227U1 true DE9406227U1 (en) 1995-08-31

Family

ID=6907338

Family Applications (1)

Application Number Title Priority Date Filing Date
DE9406227U Expired - Lifetime DE9406227U1 (en) 1994-04-14 1994-04-14 Thermal shock testing device

Country Status (1)

Country Link
DE (1) DE9406227U1 (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19616212A1 (en) * 1995-04-28 1996-10-31 Cascade Microtech Inc Test probe station appts. for low noise measurement of wafer formed electronic device
DE19747399A1 (en) * 1997-10-27 1999-05-06 Siemens Ag Plug-in errors detection method e.g. for component-equipped circuit boards
DE19908745A1 (en) * 1999-02-22 2000-08-24 Univ Schiller Jena Tempering increased temperatures caused by light or convection in analysis in multiwell analysis plates, especially microtitration plates, and apparatus for the method
US7656172B2 (en) 2005-01-31 2010-02-02 Cascade Microtech, Inc. System for testing semiconductors
US7688091B2 (en) 2003-12-24 2010-03-30 Cascade Microtech, Inc. Chuck with integrated wafer support
US7688062B2 (en) 2000-09-05 2010-03-30 Cascade Microtech, Inc. Probe station
US7876115B2 (en) 2003-05-23 2011-01-25 Cascade Microtech, Inc. Chuck for holding a device under test
US7898281B2 (en) 2005-01-31 2011-03-01 Cascade Mircotech, Inc. Interface for testing semiconductors
US7969173B2 (en) 2000-09-05 2011-06-28 Cascade Microtech, Inc. Chuck for holding a device under test
US8069491B2 (en) 2003-10-22 2011-11-29 Cascade Microtech, Inc. Probe testing structure
US8319503B2 (en) 2008-11-24 2012-11-27 Cascade Microtech, Inc. Test apparatus for measuring a characteristic of a device under test

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19616212A1 (en) * 1995-04-28 1996-10-31 Cascade Microtech Inc Test probe station appts. for low noise measurement of wafer formed electronic device
DE19616212C2 (en) * 1995-04-28 2002-03-14 Cascade Microtech Inc Prüfsondenstation with in addition to the thermal Aufspannisolator applied conductor layer
DE19747399A1 (en) * 1997-10-27 1999-05-06 Siemens Ag Plug-in errors detection method e.g. for component-equipped circuit boards
DE19908745A1 (en) * 1999-02-22 2000-08-24 Univ Schiller Jena Tempering increased temperatures caused by light or convection in analysis in multiwell analysis plates, especially microtitration plates, and apparatus for the method
US7969173B2 (en) 2000-09-05 2011-06-28 Cascade Microtech, Inc. Chuck for holding a device under test
US7688062B2 (en) 2000-09-05 2010-03-30 Cascade Microtech, Inc. Probe station
US7876115B2 (en) 2003-05-23 2011-01-25 Cascade Microtech, Inc. Chuck for holding a device under test
US8069491B2 (en) 2003-10-22 2011-11-29 Cascade Microtech, Inc. Probe testing structure
US7688091B2 (en) 2003-12-24 2010-03-30 Cascade Microtech, Inc. Chuck with integrated wafer support
US7898281B2 (en) 2005-01-31 2011-03-01 Cascade Mircotech, Inc. Interface for testing semiconductors
US7940069B2 (en) 2005-01-31 2011-05-10 Cascade Microtech, Inc. System for testing semiconductors
US7656172B2 (en) 2005-01-31 2010-02-02 Cascade Microtech, Inc. System for testing semiconductors
US8319503B2 (en) 2008-11-24 2012-11-27 Cascade Microtech, Inc. Test apparatus for measuring a characteristic of a device under test

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