DE9315056U1 - Heat sink for semiconductor components - Google Patents

Heat sink for semiconductor components

Info

Publication number
DE9315056U1
DE9315056U1 DE19939315056 DE9315056U DE9315056U1 DE 9315056 U1 DE9315056 U1 DE 9315056U1 DE 19939315056 DE19939315056 DE 19939315056 DE 9315056 U DE9315056 U DE 9315056U DE 9315056 U1 DE9315056 U1 DE 9315056U1
Authority
DE
Grant status
Grant
Patent type
Prior art keywords
heat sink
semiconductor components
semiconductor
components
sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE19939315056
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Julius & August Erbsloeh & Co 42553 Velbert De GmbH
Erbsloeh Julius & August
Original Assignee
Julius & August Erbsloeh & Co 42553 Velbert De GmbH
Erbsloeh Julius & August
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Grant date

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • H01L23/3672Foil-like cooling fins or heat sinks
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
DE19939315056 1993-10-05 1993-10-05 Heat sink for semiconductor components Expired - Lifetime DE9315056U1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19939315056 DE9315056U1 (en) 1993-10-05 1993-10-05 Heat sink for semiconductor components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19939315056 DE9315056U1 (en) 1993-10-05 1993-10-05 Heat sink for semiconductor components

Publications (1)

Publication Number Publication Date
DE9315056U1 true DE9315056U1 (en) 1993-12-16

Family

ID=6898953

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19939315056 Expired - Lifetime DE9315056U1 (en) 1993-10-05 1993-10-05 Heat sink for semiconductor components

Country Status (1)

Country Link
DE (1) DE9315056U1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997027619A2 (en) * 1996-01-27 1997-07-31 Manfred Diels Method of manufacturing cooling devices made up of several metal shaped-section elements for mounting on semiconductor components, shaped-section elements for use in the manufacture of such cooling devices and cooling devices manufactured by the method
EP0867937A2 (en) * 1997-03-26 1998-09-30 Pada Engineering - S.r.l. Sectional modular lamellar heat dissipator for electronic circuits
DE19602943C2 (en) * 1996-01-27 1998-12-24 Joachim Bayer A process for the production of heat sinks to be mounted on semiconductor devices, as well as shell profiles for manufacturing such heatsink
EP1291908A2 (en) * 2001-08-28 2003-03-12 Manfred Diels Method of fabrication of heat sinks

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997027619A2 (en) * 1996-01-27 1997-07-31 Manfred Diels Method of manufacturing cooling devices made up of several metal shaped-section elements for mounting on semiconductor components, shaped-section elements for use in the manufacture of such cooling devices and cooling devices manufactured by the method
WO1997027619A3 (en) * 1996-01-27 1997-10-23 Manfred Diels Method of manufacturing cooling devices made up of several metal shaped-section elements for mounting on semiconductor components, shaped-section elements for use in the manufacture of such cooling devices and cooling devices manufactured by the method
DE19602943C2 (en) * 1996-01-27 1998-12-24 Joachim Bayer A process for the production of heat sinks to be mounted on semiconductor devices, as well as shell profiles for manufacturing such heatsink
US6279648B1 (en) 1996-01-27 2001-08-28 Manfred Diels Method of manufacturing cooling devices made up of several metal shaped-section elements for mounting on semiconductor components, shaped-section elements for use in the manufacture of such cooling devices, and cooling devices manufactured by the method
EP0867937A2 (en) * 1997-03-26 1998-09-30 Pada Engineering - S.r.l. Sectional modular lamellar heat dissipator for electronic circuits
EP0867937A3 (en) * 1997-03-26 2000-05-03 Pada Engineering - S.r.l. Sectional modular lamellar heat dissipator for electronic circuits
EP1291908A2 (en) * 2001-08-28 2003-03-12 Manfred Diels Method of fabrication of heat sinks
EP1291908A3 (en) * 2001-08-28 2007-03-14 Manfred Diels Method of fabrication of heat sinks

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