DE9315056U1 - Heatsinks for semiconductor devices - Google Patents

Heatsinks for semiconductor devices

Info

Publication number
DE9315056U1
DE9315056U1 DE9315056U DE9315056U DE9315056U1 DE 9315056 U1 DE9315056 U1 DE 9315056U1 DE 9315056 U DE9315056 U DE 9315056U DE 9315056 U DE9315056 U DE 9315056U DE 9315056 U1 DE9315056 U1 DE 9315056U1
Authority
DE
Germany
Prior art keywords
heatsinks
semiconductor devices
semiconductor
devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE9315056U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Erbsloeh Aluminium GmbH
Original Assignee
Julius and August Erbsloeh GmbH and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Julius and August Erbsloeh GmbH and Co filed Critical Julius and August Erbsloeh GmbH and Co
Priority to DE9315056U priority Critical patent/DE9315056U1/en
Publication of DE9315056U1 publication Critical patent/DE9315056U1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
DE9315056U 1993-10-05 1993-10-05 Heatsinks for semiconductor devices Expired - Lifetime DE9315056U1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE9315056U DE9315056U1 (en) 1993-10-05 1993-10-05 Heatsinks for semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE9315056U DE9315056U1 (en) 1993-10-05 1993-10-05 Heatsinks for semiconductor devices

Publications (1)

Publication Number Publication Date
DE9315056U1 true DE9315056U1 (en) 1993-12-16

Family

ID=6898953

Family Applications (1)

Application Number Title Priority Date Filing Date
DE9315056U Expired - Lifetime DE9315056U1 (en) 1993-10-05 1993-10-05 Heatsinks for semiconductor devices

Country Status (1)

Country Link
DE (1) DE9315056U1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997027619A2 (en) * 1996-01-27 1997-07-31 Manfred Diels Method of manufacturing cooling devices made up of several metal shaped-section elements for mounting on semiconductor components, shaped-section elements for use in the manufacture of such cooling devices and cooling devices manufactured by the method
EP0867937A2 (en) * 1997-03-26 1998-09-30 Pada Engineering - S.r.l. Sectional modular lamellar heat dissipator for electronic circuits
DE19602943C2 (en) * 1996-01-27 1998-12-24 Joachim Bayer Process for the production of heat sinks for mounting on semiconductor components and shell profiles for the production of such heat sinks
EP1291908A2 (en) * 2001-08-28 2003-03-12 Manfred Diels Method of fabrication of heat sinks

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997027619A2 (en) * 1996-01-27 1997-07-31 Manfred Diels Method of manufacturing cooling devices made up of several metal shaped-section elements for mounting on semiconductor components, shaped-section elements for use in the manufacture of such cooling devices and cooling devices manufactured by the method
WO1997027619A3 (en) * 1996-01-27 1997-10-23 Manfred Diels Method of manufacturing cooling devices made up of several metal shaped-section elements for mounting on semiconductor components, shaped-section elements for use in the manufacture of such cooling devices and cooling devices manufactured by the method
DE19602943C2 (en) * 1996-01-27 1998-12-24 Joachim Bayer Process for the production of heat sinks for mounting on semiconductor components and shell profiles for the production of such heat sinks
US6279648B1 (en) 1996-01-27 2001-08-28 Manfred Diels Method of manufacturing cooling devices made up of several metal shaped-section elements for mounting on semiconductor components, shaped-section elements for use in the manufacture of such cooling devices, and cooling devices manufactured by the method
EP0867937A2 (en) * 1997-03-26 1998-09-30 Pada Engineering - S.r.l. Sectional modular lamellar heat dissipator for electronic circuits
EP0867937A3 (en) * 1997-03-26 2000-05-03 Pada Engineering - S.r.l. Sectional modular lamellar heat dissipator for electronic circuits
EP1291908A2 (en) * 2001-08-28 2003-03-12 Manfred Diels Method of fabrication of heat sinks
EP1291908A3 (en) * 2001-08-28 2007-03-14 Manfred Diels Method of fabrication of heat sinks

Similar Documents

Publication Publication Date Title
DE59406013D1 (en) FASTENING DEVICE FOR SEMICONDUCTOR SWITCHING ELEMENTS
DE69405342T2 (en) Polishing device for semiconductor wafers
DE69425930D1 (en) Integrated semiconductor circuit
DE69323724D1 (en) Heat sink for semiconductor device
DE69400694D1 (en) Semiconductor device
FI945204A (en) semiconductor component
DE69408362D1 (en) Semiconductor integrated circuit
DE4496282T1 (en) Semiconductor device
DE69416192D1 (en) Integrated semiconductor circuit
KR950002227U (en) Sputtering device for semiconductor device manufacturing
NO954863D0 (en) Semiconductor device
DE9315056U1 (en) Heatsinks for semiconductor devices
DE69529386T2 (en) Improvements for semiconductor devices
DE69417173T2 (en) Ceramic substrate for semiconductor device
KR950007353U (en) Semiconductor manufacturing equipment
DE9421619U1 (en) Heatsink device for solid-state components
KR950028703U (en) Semiconductor devices
KR940021334U (en) Wafer cooling device
KR950021424U (en) Semiconductor devices
KR950004825U (en) Substrate semiconductor device
KR950021805U (en) Buffer for semiconductor devices
KR950012603U (en) Semiconductor Wafer Test System
KR960015587U (en) Semiconductor device manufacturing equipment
DE29700786U1 (en) Heat sink for semiconductor devices
DE69404702D1 (en) Integrated semiconductor circuit