DE9215553U1 - - Google Patents
Info
- Publication number
- DE9215553U1 DE9215553U1 DE9215553U DE9215553U DE9215553U1 DE 9215553 U1 DE9215553 U1 DE 9215553U1 DE 9215553 U DE9215553 U DE 9215553U DE 9215553 U DE9215553 U DE 9215553U DE 9215553 U1 DE9215553 U1 DE 9215553U1
- Authority
- DE
- Germany
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/62—Heating elements specially adapted for furnaces
- H05B3/64—Heating elements specially adapted for furnaces using ribbon, rod, or wire heater
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1581—Treating the backside of the PCB, e.g. for heating during soldering or providing a liquid coating on the backside
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Tunnel Furnaces (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH172292A CH683736A5 (de) | 1992-05-27 | 1992-05-27 | Durchlaufofen zum Reflowlöten von auf Leiterplatten montierten Bauteilen. |
Publications (1)
Publication Number | Publication Date |
---|---|
DE9215553U1 true DE9215553U1 (de) | 1993-02-18 |
Family
ID=4217076
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE9215553U Expired - Lifetime DE9215553U1 (de) | 1992-05-27 | 1992-11-16 |
Country Status (2)
Country | Link |
---|---|
CH (1) | CH683736A5 (de) |
DE (1) | DE9215553U1 (de) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4417866A1 (de) * | 1992-11-24 | 1995-11-23 | Tdk Corp | Verfahren zum Löten elektronischer Bauteile und Vorrichtung dafür |
US5526978A (en) * | 1992-11-24 | 1996-06-18 | Tdk Corporation | Method for soldering electronic components |
DE4416959C2 (de) * | 1994-05-13 | 2003-10-02 | Seho Systemtechnik Gmbh | Reflow-Lötanlage |
-
1992
- 1992-05-27 CH CH172292A patent/CH683736A5/de not_active IP Right Cessation
- 1992-11-16 DE DE9215553U patent/DE9215553U1/de not_active Expired - Lifetime
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4417866A1 (de) * | 1992-11-24 | 1995-11-23 | Tdk Corp | Verfahren zum Löten elektronischer Bauteile und Vorrichtung dafür |
US5526978A (en) * | 1992-11-24 | 1996-06-18 | Tdk Corporation | Method for soldering electronic components |
DE4417866C2 (de) * | 1992-11-24 | 2000-07-20 | Tdk Corp | Verfahren zum Löten elektronischer Bauteile und Vorrichtung dafür |
DE4416959C2 (de) * | 1994-05-13 | 2003-10-02 | Seho Systemtechnik Gmbh | Reflow-Lötanlage |
Also Published As
Publication number | Publication date |
---|---|
CH683736A5 (de) | 1994-04-29 |