DE9207613U1 - Electronic SMD component - Google Patents
Electronic SMD componentInfo
- Publication number
- DE9207613U1 DE9207613U1 DE9207613U DE9207613U DE9207613U1 DE 9207613 U1 DE9207613 U1 DE 9207613U1 DE 9207613 U DE9207613 U DE 9207613U DE 9207613 U DE9207613 U DE 9207613U DE 9207613 U1 DE9207613 U1 DE 9207613U1
- Authority
- DE
- Germany
- Prior art keywords
- circuit board
- component according
- component
- semiconductor chip
- carrier material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 claims description 23
- 239000012876 carrier material Substances 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 12
- 239000004020 conductor Substances 0.000 claims description 9
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 238000000926 separation method Methods 0.000 claims description 3
- 239000000975 dye Substances 0.000 claims description 2
- 238000007747 plating Methods 0.000 claims description 2
- 238000005476 soldering Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000005693 optoelectronics Effects 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49805—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/115—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/09181—Notches in edge pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
Pateiiiänwaltf karjzlei "- I - : · *. r " t o'Pateiiiänwaltf karjzlei "- I - : · *. r " to '
BERND RIEMAt^N - »a »>BERND RIEMAt^N - » a »>
&Kgr;,-Liebknecht-Straße 34 · O-1020 Berlin
Telefon: 0 (Berlin-Ost) 2342929 · Telex: 1152-371 · Telefax: (Berlin-Ost) 2342097&Kgr;,-Liebknecht-Straße 34 · O-1020 Berlin
Telephone: 0 (Berlin-East) 2342929 · Telex: 1152-371 · Fax: (Berlin-East) 2342097
OSA-Elektronik GmbH Berlin, denOSA-Elektronik GmbH Berlin, the
Berlin 02.06.1992Berlin 02.06.1992
u. Z. : GM 10/3-92AD : GM 10/3-92
Die Erfindung bezieht sich auf ein elektronisches SMD-Bauelement, welches auf einem Trägermaterial angeordnet und vielseitig anwendbar ist.The invention relates to an electronic SMD component which is arranged on a carrier material and has a wide range of applications.
Elektronische Bauelemente, die auf einem Trägermaterial angeordnet sind, sind allgemein bekannt.So ist beispielsweise aus der DE-OS 31 28 187 ein Opto-elektronisches Bauelement bekannt geworden, bei dem ein opto-elektronischer Halbleiterkörper auf einem aus Keramikmaterial bestehenden Träger angeordnet ist und der Träger zwei flächig aufgebrachte Anschlüsse aufweist. Der Halbleiterkörper und seine Verbindung mit den beiden Anschlüssen ist mit einer abdeckenden lichtdurchlässigen Schicht versehen.Electronic components that are arranged on a carrier material are generally known. For example, DE-OS 31 28 187 discloses an optoelectronic component in which an optoelectronic semiconductor body is arranged on a carrier made of ceramic material and the carrier has two flat connections. The semiconductor body and its connection to the two connections is provided with a covering, translucent layer.
Die Erfindung bezweckt eine kostengünstigere Herstellung, eine höhere Zuverlässigkeit derselben bei der Herstellung sowie ein breiteres Anwendungsspektrum des elektronischen SMD-Bauelementes .The invention aims at more cost-effective production, higher reliability during production and a wider range of applications for the electronic SMD component.
Der Erfindung liegt die Aufgabe zugrunde, ein elektronisches SMD-Bauelement bereitzustellen, welches sich rationeller fertigen
läßt und bei dem darüber hinaus die Abmessungen noch reduziert sind und gleichzeitig die Zuverlässigkeit erhöht ist.
Darüber hinaus sind neue Anwendungsgebiete zu erschließen.The invention is based on the object of providing an electronic SMD component which can be manufactured more efficiently and in which, in addition, the dimensions are reduced and at the same time the reliability is increased.
In addition, new areas of application need to be developed.
Diese Aufgabe wird bei dem elektronischen SMD-Bauelement erfindungsgemäß dadurch gelöst, daß ein oder mehrere elektroni-This task is solved according to the invention in the electronic SMD component by one or more electronic
sehe Halbleiter-Chips auf einem als Leiterplattenmaterial ausgebildeten Trägermaterial angeordnet sind und daß die flächigen Anschlüsse zum Anschluß der Halbleiter-Chips mit der Rückseite des Leiterplattenmaterials über Durchkontaktierungen elektrisch verbunden sind.see semiconductor chips are arranged on a carrier material designed as a circuit board material and that the flat connections for connecting the semiconductor chips are electrically connected to the back of the circuit board material via through-holes.
Der bzw. die Halbleiter-Chips ist / sind mit ihren Anschlüssen von einer Abdeckschicht umschlossen.The semiconductor chip(s) and their connections are enclosed by a covering layer.
Die Leiterzüge auf dem Leiterplattenträger sind dabei so angeordnet, daß mehrere SMD-Bauelemente in X- und Y- Richtung gleichzeitig herstellbar sind.Bohrungen, die metallisiert sind, bilden die elektrische Verbindung zur Rückseite der Leiterplatte. Es entsteht damit eine Durchkontaktierung, die die Leiterbahnen der Vorderseite mit den vorgesehenen Lötflächen der Rückseite verbindet.The conductor tracks on the circuit board carrier are arranged in such a way that several SMD components can be manufactured simultaneously in the X and Y directions. Holes that are metallized form the electrical connection to the back of the circuit board. This creates a through-hole that connects the conductor tracks on the front with the intended soldering surfaces on the back.
Zweckmäßigerweise sind die Durchkontaktierungen und die Lötflächen der Rückseite verzinnt.The through-holes and the soldering surfaces on the back are tinned for practical purposes.
Am fertigen Bauelement sind die Rückseitenkontakte und die Stirnflächen ( mittig getrennte Durchkontaktierungen ) des Bauelementes für die Lötung vorgesehen.On the finished component, the rear contacts and the front surfaces (centrally separated vias) of the component are intended for soldering.
Die Erfindung bietet auch die Möglichkeit, Chips einzusetzen, bei denen die beiden Anschlußkontakte auf einer Seite liegen.In diesem Fall werden die beiden Chipkontakte mittels Leitkleber auf die Leiterzüge des Leiterplattenmaterials geklebt.Der Vorteil dieser Lösung besteht darin, daß das so bereitgestellte Bauelement besonders flach ausgeführt werden kann, da die hochgezogene Bonddrahtbrücke im Gehäuse entfällt.The invention also offers the possibility of using chips in which the two connection contacts are on one side. In this case, the two chip contacts are glued to the conductor tracks of the circuit board material using conductive adhesive. The advantage of this solution is that the component provided in this way can be made particularly flat, since the raised bonding wire bridge in the housing is no longer required.
Der Verguß des Bauelementes wird mittels Epoxidharz realisiert .The component is cast using epoxy resin.
Die auf dem Leiterplattenmaterial angeordneten Halbleiter-5 The semiconductors arranged on the circuit board material5
Chips werden durch Spezialtrennvorrichtungen vereinzelt.Chips are separated using special separating devices.
Die Herstellung der SMD-Halbleiter-Chips auf Leiterplattenträgermaterial zeigt gegenüber Lösungen bei denen die Chips beispielsweise auf einem Keramikträgermaterial angeordnet sind nachfolgende Vorteile.The production of SMD semiconductor chips on circuit board carrier material shows the following advantages compared to solutions in which the chips are arranged on a ceramic carrier material, for example.
Zwischen dem Chip und dem Leiterplattenmaterial entsteht eine gute formschlüssige Verbindung.Weiterhin ist die VerbindungA good form-fitting connection is created between the chip and the circuit board material. Furthermore, the connection
zwischen dem Trägermaterial und dem zur Verkappung eingesetz-15 between the carrier material and the capping material used-15
ten Material spannungsarm, da es sich um das gleiche Ausgangsmaterial handelt.Auch bei extremen Temperaturbelastungen weisen die gefertigten Bauelemente eine hohe Zuverlässigkeit auf.The material is stress-free because it is the same starting material. Even under extreme temperature loads, the manufactured components are highly reliable.
Ein weiterer wesentlicher Vorteil ist die Bearbeitung der Bau-20 Another significant advantage is the processing of the construction 20
elemente " im Block ".Dadurch ist es möglich, die gefertigten SMD-Bauelemente so zu vereinzeln, daß Einzelbauelemente, Reihenschaltungen, Parallelschaltungen - welche einzeln ansteuerbar sind - oder auch Kombinationen zur Verfügung stehen.elements "in a block". This makes it possible to separate the manufactured SMD components so that individual components, series circuits, parallel circuits - which can be controlled individually - or even combinations are available.
Die Bauelemente zeichnen sich durch flache Abmessungen aus, sind gut handhabbar und für eine automatische Bestückung geeignet .The components are characterized by flat dimensions, are easy to handle and suitable for automatic assembly.
Je nach Einsatzzweck und den gestellten Bedingungen an das 30Depending on the application and the requirements placed on the 30
SMD-Bauelement kann der Leiterplattenträger auch mehr als zwei flächige Anschlüsse aufweisen.SMD component, the circuit board carrier can also have more than two surface connections.
Bei der Herstellung der Bauelemente können unterschiedlicheDuring the production of the components, different
Lötverfahren, wie z.B. das Reflow-Lötverfahren, Schwallötung 35Soldering processes, such as reflow soldering, wave soldering 35
oder Kolbenlötung in den üblichen Temperaturbereichen angewendet werden.or iron soldering in the usual temperature ranges.
,4-,4-
Die Bauelemente können mit Chips der unterschiedlichsten Farben einschl. aus dem IR-Bereich bestückt werden.The components can be equipped with chips of various colors, including those from the IR range.
Die so hergestellten SMD-Bauelemente sind besonders geeignet für den Einsatz in Folientastaturen, zur Beleuchtung von Miniaturbaugruppen, für unterschiedliche Lichteinkopplungsvarianten, Hintergrundbeleuchtungen und dgl.The SMD components produced in this way are particularly suitable for use in membrane keyboards, for lighting miniature assemblies, for different light coupling variants, background lighting and the like.
Die Erfindung bietet darüber hinaus auch die Möglichkeit, das Trägermaterial als eine mit Leiterbahnen versehene flexible Folie auszubilden.The invention also offers the possibility of forming the carrier material as a flexible film provided with conductor tracks.
In einer Ausgestaltung der Erfindung ist vorgesehen, daß die Unterseite des SMD-Halbleiter-Chips mit Leitkleber flächig mit dem entsprechenden Anschluß verbunden ist.In one embodiment of the invention, it is provided that the underside of the SMD semiconductor chip is connected to the corresponding connection using conductive adhesive.
Die Oberseite des Halbleiter-Chips ist mittels Drahtbonden mit dem entsprechenden Anschluß verbunden.The top of the semiconductor chip is connected to the corresponding terminal by wire bonding.
Eine weitere Variante des SMD-Bauelementes zeichnet sich dadurch aus, daß die Anschlußkontakte des Halbleiter-Chips auf der Unterseite des Chips ausgebildet sind und diese mittels Leitkleber auf den entsprechenden Leiterbahnen kontaktierbar sind.Another variant of the SMD component is characterized by the fact that the connection contacts of the semiconductor chip are formed on the underside of the chip and can be contacted using conductive adhesive on the corresponding conductor tracks.
Nach einem weiteren Merkmal sind die Leiterbahnen der Vorderseite mittels Durchkontaktierung mit den Kontaktflächen der Rückseite des Trägermaterials verbindbar.According to a further feature, the conductor tracks on the front side can be connected to the contact surfaces on the back side of the carrier material by means of through-plating.
Vorteilhaft ist auch, daß das Trägermaterial mit dem Halbleiter-Chip durch einen Trennvorgang vereinzelbar ist und die getrennten Durchkontaktierungen als zusätzliche Kontaktflächen an der / den Stirnseiten des Trägermaterials nutzbar sind.It is also advantageous that the carrier material with the semiconductor chip can be separated by a separation process and the separated vias can be used as additional contact surfaces on the front side(s) of the carrier material.
Schließlich zeichnet sich das Bauelement auch dadurch aus, daßFinally, the component is also characterized by the fact that
die abdeckende Epoxidharzschicht transparent ist, mit Diffusor und / oder mit Farbstoffen angereichert ist.the covering epoxy resin layer is transparent, enriched with diffuser and/or dyes.
Die Erfindung wird nachfolgend anhand der Zeichnung im Prinzip beispielshalber noch näher erläutert.Es zeigen:The invention is explained in more detail below using the drawing as an example. They show:
Fig. 1 ein SMD-Bauelement in perspektivischer DarstellungFig. 1 a SMD component in perspective view
Fig. 2 mehrere Bauelemente in einer ParallelschaltungFig. 2 several components in a parallel circuit
Fig. 3 mehrere Bauelemente in einer Reihenschaltung.
15Fig. 3 several components in a series circuit.
15
Wie der Fig. 1 zu entnehmen ist, ist ein Halbleiter-Chip 1 auf einem Trägermateral, welches als Leiterplattenmaterial 8 ausgebildet ist, angeordnet.Ein auf dem Trägermaterial vorhan-As can be seen from Fig. 1, a semiconductor chip 1 is arranged on a carrier material , which is designed as a circuit board material 8. A
dener flächiger Anschluß dient zur Aufnahme des Bonddrahtes 20The flat connection is used to hold the bonding wire 20
4.Der Halbleiter-Chip 1 sowie der Bonddraht 4 sind von dem Epoxidharzverguß 3 umschlossen.Der zweite auf dem Trägermaterial vorhandene flächige Anschluß 5 ist zum Anschluß des zweiten Kontaktes des Halbleiter-Chips 1 vorgesehen.Der Leiterplattenträger 8 weist an seiner der Aufnahmefläche des Chips 2b4.The semiconductor chip 1 and the bonding wire 4 are enclosed by the epoxy resin encapsulation 3.The second flat connection 5 on the carrier material is intended for connecting the second contact of the semiconductor chip 1.The circuit board carrier 8 has on its receiving surface of the chip 2b
gegenüberliegenden Seite eine verzinnte Rückseitenkontaktierung 6, die als zusätzlicher Kontakt zur Verfügung steht, auf. Auf dem Leiterplattenträger 8 sind metallisierte Bohrungen angeordnet, die verzinnt sind und die als Durchkontaktierung 7 dienen.On the opposite side, there is a tinned rear contact 6, which is available as an additional contact. On the circuit board carrier 8, metalized holes are arranged, which are tinned and serve as a through-hole 7.
Der Verguß des Halbleiter-Chips und seiner Anschlußkontakte kann eine beliebige geometrische Form aufweisen.Vorzugsweise ist der Verguß linsenförmig ausgebildeter kann aber auch quaderförmig ausgeführt sein.The encapsulation of the semiconductor chip and its connection contacts can have any geometric shape. Preferably the encapsulation is lens-shaped but can also be cuboid-shaped.
Die geometrische Form der Kontaktbahnen auf der Vorderseite des Halbleiter-Chips ist beliebig wählbar.Dabei ist folgendeThe geometric shape of the contact tracks on the front of the semiconductor chip can be chosen arbitrarily. The following
-6--6-
Bedingung, die in einer räumlichen Trennung der LeiterbahnenCondition resulting in a spatial separation of the conductor tracks
für die Vorder- und Rückseite des Halbleiter-Chips besteht, 5for the front and back of the semiconductor chip, 5
einzuhalten.to comply with.
Fig. 2 veranschaulicht eine Ausführung des Bauelementes, welches eine Parallelschaltung einzelner SMD-Bauelemente aufweist . Vortei lhaft ist bei dieser Lösung, daß durch die Anord-10 Fig. 2 illustrates a design of the component, which has a parallel connection of individual SMD components. The advantage of this solution is that the arrangement-10
nung der Kontakte jedes parallel geschaltete Bauelement einzeln ansteuerbar ist.By switching the contacts, each component connected in parallel can be controlled individually.
Fig. 3 zeigt eine Ausführungsform, bei der die Halbleiter-Chips 1 in Reihe geschaltet sind.Fig. 3 shows an embodiment in which the semiconductor chips 1 are connected in series.
Claims (8)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE9207613U DE9207613U1 (en) | 1992-06-02 | 1992-06-02 | Electronic SMD component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE9207613U DE9207613U1 (en) | 1992-06-02 | 1992-06-02 | Electronic SMD component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE9207613U1 true DE9207613U1 (en) | 1992-08-20 |
Family
ID=6880261
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE9207613U Expired - Lifetime DE9207613U1 (en) | 1992-06-02 | 1992-06-02 | Electronic SMD component |
Country Status (1)
| Country | Link |
|---|---|
| DE (1) | DE9207613U1 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0653905A1 (en) * | 1993-11-16 | 1995-05-17 | International Business Machines Corporation | Direct chip attach module |
| EP1047291A1 (en) * | 1999-04-24 | 2000-10-25 | Diehl AKO Stiftung & Co. KG | Solder bridge |
| DE19963264B4 (en) * | 1999-12-17 | 2007-05-31 | Optotransmitter-Umweltschutz-Technologie E.V. | Carrier material for high-performance electronic components in SMD design and a high-performance electronic component produced therewith |
| DE102004015283B4 (en) * | 2003-03-27 | 2014-12-04 | Denso Corporation | IC card |
-
1992
- 1992-06-02 DE DE9207613U patent/DE9207613U1/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0653905A1 (en) * | 1993-11-16 | 1995-05-17 | International Business Machines Corporation | Direct chip attach module |
| US5471368A (en) * | 1993-11-16 | 1995-11-28 | International Business Machines Corporation | Module having vertical peripheral edge connection |
| US5570505A (en) * | 1993-11-16 | 1996-11-05 | International Business Machines Corporation | Method of manufacturing a circuit module |
| EP1047291A1 (en) * | 1999-04-24 | 2000-10-25 | Diehl AKO Stiftung & Co. KG | Solder bridge |
| DE19963264B4 (en) * | 1999-12-17 | 2007-05-31 | Optotransmitter-Umweltschutz-Technologie E.V. | Carrier material for high-performance electronic components in SMD design and a high-performance electronic component produced therewith |
| DE102004015283B4 (en) * | 2003-03-27 | 2014-12-04 | Denso Corporation | IC card |
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