DE9207549U1 - Lichtaussendende Diode - Google Patents
Lichtaussendende DiodeInfo
- Publication number
- DE9207549U1 DE9207549U1 DE9207549U DE9207549U DE9207549U1 DE 9207549 U1 DE9207549 U1 DE 9207549U1 DE 9207549 U DE9207549 U DE 9207549U DE 9207549 U DE9207549 U DE 9207549U DE 9207549 U1 DE9207549 U1 DE 9207549U1
- Authority
- DE
- Germany
- Prior art keywords
- base
- emitting diode
- light emitting
- electrically connected
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 239000003086 colorant Substances 0.000 description 6
- 238000000149 argon plasma sintering Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Led Device Packages (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE9207549U DE9207549U1 (de) | 1992-06-04 | 1992-06-04 | Lichtaussendende Diode |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE9207549U DE9207549U1 (de) | 1992-06-04 | 1992-06-04 | Lichtaussendende Diode |
Publications (1)
Publication Number | Publication Date |
---|---|
DE9207549U1 true DE9207549U1 (de) | 1992-08-20 |
Family
ID=6880213
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE9207549U Expired - Lifetime DE9207549U1 (de) | 1992-06-04 | 1992-06-04 | Lichtaussendende Diode |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE9207549U1 (ko) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0734077A1 (en) * | 1995-03-23 | 1996-09-25 | Iwasaki Electric Co., Ltd. | Multi-layer type light emitting device |
DE102004056705A1 (de) * | 2004-09-30 | 2006-04-06 | Osram Opto Semiconductors Gmbh | Lumineszenzdiodenanordnung und Verfahren zur Überwachung von Lumineszenzdiodenchips |
EP2151873A3 (en) * | 2004-10-25 | 2010-03-24 | Cree, Inc. | Solid metal block semiconductor light emitting device mounting substrates and packages |
-
1992
- 1992-06-04 DE DE9207549U patent/DE9207549U1/de not_active Expired - Lifetime
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0734077A1 (en) * | 1995-03-23 | 1996-09-25 | Iwasaki Electric Co., Ltd. | Multi-layer type light emitting device |
DE102004056705A1 (de) * | 2004-09-30 | 2006-04-06 | Osram Opto Semiconductors Gmbh | Lumineszenzdiodenanordnung und Verfahren zur Überwachung von Lumineszenzdiodenchips |
DE102004056705B4 (de) * | 2004-09-30 | 2012-03-15 | Osram Opto Semiconductors Gmbh | Lumineszenzdiodenanordnung und Verfahren zur Überwachung von Lumineszenzdiodenchips |
EP2151873A3 (en) * | 2004-10-25 | 2010-03-24 | Cree, Inc. | Solid metal block semiconductor light emitting device mounting substrates and packages |
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