DE9203000U1 - - Google Patents
Info
- Publication number
- DE9203000U1 DE9203000U1 DE19929203000 DE9203000U DE9203000U1 DE 9203000 U1 DE9203000 U1 DE 9203000U1 DE 19929203000 DE19929203000 DE 19929203000 DE 9203000 U DE9203000 U DE 9203000U DE 9203000 U1 DE9203000 U1 DE 9203000U1
- Authority
- DE
- Germany
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5386—Geometry or layout of the interconnection structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Geometry (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19929203000 DE9203000U1 (es) | 1992-03-06 | 1992-03-06 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19929203000 DE9203000U1 (es) | 1992-03-06 | 1992-03-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE9203000U1 true DE9203000U1 (es) | 1992-06-17 |
Family
ID=6876943
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19929203000 Expired - Lifetime DE9203000U1 (es) | 1992-03-06 | 1992-03-06 |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE9203000U1 (es) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4300516A1 (de) * | 1993-01-12 | 1994-07-14 | Abb Ixys Semiconductor Gmbh | Leistungshalbleitermodul |
EP0621635A1 (en) * | 1993-04-23 | 1994-10-26 | Fuji Electric Co. Ltd. | Power transistor module |
US5459356A (en) * | 1992-08-26 | 1995-10-17 | Eupec Europeische Gesellsch F. Leistungshalbleiter Mbh & Co., Kg. | Power semiconductor module having a plurality of semiconductor arrangements |
DE19522172C1 (de) * | 1995-06-19 | 1996-11-21 | Siemens Ag | Leistungs-Halbleitermodul mit Anschlußstiften |
DE10102359A1 (de) * | 2001-01-19 | 2002-08-01 | Siemens Ag | Schaltungsanordnung mit in Chips angeordneten Halbleiterbauelementen |
DE10333315A1 (de) * | 2003-07-22 | 2005-03-10 | Eupec Gmbh & Co Kg | Leistungshalbleitermodul |
DE102005007373A1 (de) * | 2005-02-17 | 2006-08-24 | Infineon Technologies Ag | Leistungshalbleiterbaugruppe |
EP2071626A1 (en) * | 2007-12-11 | 2009-06-17 | ABB Research Ltd. | Semiconductor module and connection terminal device |
-
1992
- 1992-03-06 DE DE19929203000 patent/DE9203000U1/de not_active Expired - Lifetime
Cited By (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5459356A (en) * | 1992-08-26 | 1995-10-17 | Eupec Europeische Gesellsch F. Leistungshalbleiter Mbh & Co., Kg. | Power semiconductor module having a plurality of semiconductor arrangements |
DE4300516A1 (de) * | 1993-01-12 | 1994-07-14 | Abb Ixys Semiconductor Gmbh | Leistungshalbleitermodul |
DE4300516C2 (de) * | 1993-01-12 | 2001-05-17 | Ixys Semiconductor Gmbh | Leistungshalbleitermodul |
US5616955A (en) * | 1993-04-23 | 1997-04-01 | Fuji Electric Co., Ltd. | Power transistor module wiring structure |
EP0809292A2 (en) * | 1993-04-23 | 1997-11-26 | Fuji Electric Co. Ltd. | Power transistor module |
EP0809292A3 (en) * | 1993-04-23 | 1998-01-28 | Fuji Electric Co. Ltd. | Power transistor module |
EP0621635A1 (en) * | 1993-04-23 | 1994-10-26 | Fuji Electric Co. Ltd. | Power transistor module |
DE19522172C1 (de) * | 1995-06-19 | 1996-11-21 | Siemens Ag | Leistungs-Halbleitermodul mit Anschlußstiften |
US5753971A (en) * | 1995-06-19 | 1998-05-19 | Siemens Aktiengesellschaft | Power semiconductor module with terminal pins |
EP0750344A3 (de) * | 1995-06-19 | 1999-04-21 | Siemens Aktiengesellschaft | Leistungs-Halbleitermodul mit Anschlussstiften |
EP0750344A2 (de) * | 1995-06-19 | 1996-12-27 | Siemens Aktiengesellschaft | Leistungs-Halbleitermodul mit Anschlussstiften |
US6940136B2 (en) | 2001-01-19 | 2005-09-06 | Siemens Aktiengesellschaft | Circuit arrangement with semiconductor elements arranged in chips |
DE10102359A1 (de) * | 2001-01-19 | 2002-08-01 | Siemens Ag | Schaltungsanordnung mit in Chips angeordneten Halbleiterbauelementen |
DE10333315A1 (de) * | 2003-07-22 | 2005-03-10 | Eupec Gmbh & Co Kg | Leistungshalbleitermodul |
DE10333315B4 (de) * | 2003-07-22 | 2007-09-27 | Infineon Technologies Ag | Leistungshalbleitermodul |
DE102005007373A1 (de) * | 2005-02-17 | 2006-08-24 | Infineon Technologies Ag | Leistungshalbleiterbaugruppe |
DE102005007373B4 (de) * | 2005-02-17 | 2013-05-29 | Infineon Technologies Ag | Leistungshalbleiterbaugruppe |
EP2071626A1 (en) * | 2007-12-11 | 2009-06-17 | ABB Research Ltd. | Semiconductor module and connection terminal device |
WO2009074454A2 (en) * | 2007-12-11 | 2009-06-18 | Abb Research Ltd | Semiconductor module and connection terminal device |
WO2009074454A3 (en) * | 2007-12-11 | 2009-08-06 | Abb Research Ltd | Semiconductor module and connection terminal device |