DE9113276U1 - - Google Patents

Info

Publication number
DE9113276U1
DE9113276U1 DE9113276U DE9113276U DE9113276U1 DE 9113276 U1 DE9113276 U1 DE 9113276U1 DE 9113276 U DE9113276 U DE 9113276U DE 9113276 U DE9113276 U DE 9113276U DE 9113276 U1 DE9113276 U1 DE 9113276U1
Authority
DE
Germany
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE9113276U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EXPORT-CONTOR AUSSENHANDELSGESELLSCHAFT MBH 8500 NUERNBERG DE
Original Assignee
EXPORT-CONTOR AUSSENHANDELSGESELLSCHAFT MBH 8500 NUERNBERG DE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EXPORT-CONTOR AUSSENHANDELSGESELLSCHAFT MBH 8500 NUERNBERG DE filed Critical EXPORT-CONTOR AUSSENHANDELSGESELLSCHAFT MBH 8500 NUERNBERG DE
Priority to DE9113276U priority Critical patent/DE9113276U1/de
Priority claimed from DE4132947A external-priority patent/DE4132947C2/en
Publication of DE9113276U1 publication Critical patent/DE9113276U1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
DE9113276U 1991-10-04 1991-10-04 Expired - Lifetime DE9113276U1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE9113276U DE9113276U1 (en) 1991-10-04 1991-10-04

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE9113276U DE9113276U1 (en) 1991-10-04 1991-10-04
DE4132947A DE4132947C2 (en) 1991-10-04 1991-10-04 Electronic circuitry

Publications (1)

Publication Number Publication Date
DE9113276U1 true DE9113276U1 (en) 1992-03-05

Family

ID=25907956

Family Applications (1)

Application Number Title Priority Date Filing Date
DE9113276U Expired - Lifetime DE9113276U1 (en) 1991-10-04 1991-10-04

Country Status (1)

Country Link
DE (1) DE9113276U1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19531496C1 (en) * 1995-08-26 1996-11-14 Semikron Elektronik Gmbh Power semiconductor module with high packing density, esp. current resetter
EP0928027A2 (en) * 1998-01-05 1999-07-07 Nitto Denko Corporation Heat-conductive and pressure-sensitive adhesive sheets and method for fixing electronic parts to heat-radiating members with the use of the same
DE10335155A1 (en) * 2003-07-31 2005-03-03 Siemens Ag Arrangement of an electrical component on a substrate and method for producing the arrangement

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19531496C1 (en) * 1995-08-26 1996-11-14 Semikron Elektronik Gmbh Power semiconductor module with high packing density, esp. current resetter
EP0928027A2 (en) * 1998-01-05 1999-07-07 Nitto Denko Corporation Heat-conductive and pressure-sensitive adhesive sheets and method for fixing electronic parts to heat-radiating members with the use of the same
EP0928027A3 (en) * 1998-01-05 2000-03-15 Nitto Denko Corporation Heat-conductive and pressure-sensitive adhesive sheets and method for fixing electronic parts to heat-radiating members with the use of the same
US6194063B1 (en) 1998-01-05 2001-02-27 Nitto Denko Corporation Heat-conductive and pressure-sensitive adhesive sheets and method for fixing electronic parts to heat-radiating members with the use of the same
DE10335155A1 (en) * 2003-07-31 2005-03-03 Siemens Ag Arrangement of an electrical component on a substrate and method for producing the arrangement
DE10335155B4 (en) * 2003-07-31 2006-11-30 Infineon Technologies Ag Method for producing an arrangement of an electrical component on a substrate
US7649272B2 (en) 2003-07-31 2010-01-19 Siemens Aktiengesellschaft Arrangement of an electrical component placed on a substrate, and method for producing the same

Similar Documents

Publication Publication Date Title
DE9101110U1 (en)
DE4290032T1 (en)
DE9100911U1 (en)
DE9102196U1 (en)
DE9101419U1 (en)
DE9103971U1 (en)
DE9103122U1 (en)
DE9102470U1 (en)
DE9101162U1 (en)
DE9101352U1 (en)
DE9101880U1 (en)
DE9103100U1 (en)
DE9101746U1 (en)
DE9102903U1 (en)
DE9101497U1 (en)
DE9103736U1 (en)
DE9102450U1 (en)
DE9103336U1 (en)
DE9102614U1 (en)
DE9101806U1 (en)
DE9101047U1 (en)
DE9101079U1 (en)
DE9101530U1 (en)
DE9103623U1 (en)
DE9101228U1 (en)